Samsung Analyst Day 2013: S.LSI Namsung Woo Samsung System LSI Business

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Samsung Analyst Day 2013: S.LSI Namsung Woo Samsung System LSI Business

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Samsung Analyst Day 2013: S.LSI Namsung Woo Samsung System LSI Business

  1. 1. Samsung System LSI Business NS (Stephen) Woo, Ph.D. President & GM of System LSI Samsung Electronics 0/32
  2. 2. Disclaimer The materials in this report include forward-looking statements which can generally be identified by phrases such as Samsung Electronics (SEC) or its management "believes," "expects," "anticipates," "foresees," "forecasts," "estimates" or other words or phrases of similar implications. Similarly, such statements that describe the company's business strategy, outlook, objectives, plans, intentions or goals are also forward-looking statements. All such statements are subject to certain risks and uncertainties that could cause actual results to differ materially from those in the presentation files above. For us, particular uncertainties which could adversely or positively affect our future results include: · The behavior of financial markets including fluctuations in exchange rates, interest rates and commodity prices · Strategic actions including dispositions and acquisitions · Unanticipated dramatic developments in our major businesses including CE (Consumer Electronics), IM (IT & Mobile communications), DS (Device Solutions) · Numerous other matters at the national and international levels which could affect our future results These uncertainties may cause our actual results to be materially different from those expressed in this report. 1/32
  3. 3. System Semiconductor Industry Samsung System LSI : Now Looking Forward
  4. 4. Market of Mobile Device Smartphone Tablet (billion units) (billion units) 1.3 1.2 1.0 0.8 0.7 0.6 9% 0.4 0.5 0.3 0.5 0.2 22% 0.5 0.1 0.7 0.6 0.07 0.3 2012 0.05 2013 Premium 2014(E) 2012 2015(E) Mid + Low 0.06 0.12 2013 Premium 0.07 25% 58% 0.19 2014(E) 3/32 0.26 2015(E) Mid + Low * Source : Gartner, 2013 3Q * Source : Gartner, Strategy Analytics, 2013 3Q 0.09
  5. 5. Computing Power • New applications require higher computing/bandwidth Computing/Bandwidth Dual Camcording 1080p Video Web browsing Single Camcording Location Based Service Voice Command Resolution 4/32
  6. 6. Display Trend • Higher resolution FHD-class Display Display Resolution UHD (3,840x2,160) WQHD (2,560x1,440) FHD HD-class Display (1,920x1,080) HD (1,280x720) 2011 2013 2015(E) 5/32
  7. 7. Camera Sensor Trend • Image quality enhancement is also improving Camera Sensor Resolution 20Mp 16Mp Wide Dynamic Range 13Mp Image Stabilization 5Mp 8Mp Face Detection Wide Dynamic Range Face Detection Image stabilization 3Mp 2007 2009 2011 2013 2015(E) 6/32
  8. 8. System Semiconductor Industry Samsung System LSI : Now Looking Forward
  9. 9. Three business areas LSI SOC Foundry AP Connectivity Foundry 8/32 Image Sensor Display Driver IC Smart Card IC Power Management IC
  10. 10. Product Portfolio • Powerful CPU/GPU • Pixel Leadership • Low Power Power Sequence Control & I2C Interface Camera Sensor • World’s Best Performance • PMIC line: AP & OLED • High Efficiency • High Accuracy • Smartphone • IoT • Slim Solution PMIC WiFi/BT GPS • Low Power Consumption vt NFC • High Density e-SE Module SIM Display Driver IC • Full line up for next FHD • Lower Power solution T-Con • Fast Speed (New Architecture) eDRAM T-con Backlight control 9/32
  11. 11. 1. AP (Application Processor) • Focusing on high performance with low power consumption CPU Leadership Powerful GPU Low Power Game changing technology : Richer 3D graphics with Advanced mobile process & big.LITTLE octa core Energy efficiency design methodologies Low big High Low High LITTLE 10/32
  12. 12. Computing Power • Has been leading AP industry since 2009  Innovation in both Architecture & Silicon Technology (DMIPS) 30,000 Cortex-A15 2.xGHz Cortex-A15 Octa 1.6GHz Cortex-A9 Quad 20,000 1.4GHz Cortex-A9 Dual 10,000 ARM11 800MHz 2008 Cortex-A8 1.2GHz 1.0GHz 2009 2011 2010 * Source : Samsung Electronics Co., Ltd., ARM 2012 2013 *DMIPS : Dhrystone Million Instructions Per Second 11/32
  13. 13. big.LITTLE Architecture • Best of both worlds: high performance and low energy  Heterogeneous architecture for energy efficiency 1 2 3 4 LITTLE C-A7 big C-A15 1 2 3 4 12/32
  14. 14. big.LITTLE Architecture • 20% gain at performance and energy, respectively Performance Energy Higher is Better Lower is Better -15 ~ 20% + 20% big.LITTLE big.LITTLE Conventional *Source : Samsung Electronics Co., LTD, 2013 2Q Conventional *Source : Samsung Electronics Co., LTD, 2013 2Q *Conventional : big CPU only 13/32
  15. 15. Advanced Silicon Process • Leadership in low-power, advanced silicon process Vdd 90/65nm 45nm 32nm 28nm Strained Si 20nm m ULK 1st Gen HK/MG 1.2V Gen HK/MG 10nm 1st Gate Last HK/MG 1.1V 1.0V 14nm 2nd 1.0V 1st Gen FinFET 0.9V 2nd Gen FinFET 0.8V 2006, 2009 2010 2012 2013 * Source : Samsung Electronics Co., Ltd. *Vdd : Supplying voltage of drain 2014(E) 0.7V Process Node 14/32
  16. 16. 2. Image Sensor • Higher resolution & smaller pixel have driven sensor industry Pixel Pitch (um) Back-side Illumination Pixel 13Mp 12Mp 8Mp 5.6 ISOCELL Wide Dynamic Range 5Mp 2.8 Resolution 3Mp 2.25 1.8 VGA 1.3Mp 1.4 2Mp 1.1 Standard Mobile Imaging Architecture (SMIA) 2004 2005 2006 2007 Sub 1um 2008 2009 * Source : Samsung Electronics Co., Ltd. 15/32 2010 2011 2012 2013
  17. 17. Pixel Architecture • To increase sensitivity and decrease light loss & crosstalk Gap-less u-lens Deep PD Light-guide Increase sensitivity Reduce loss in Si Reduce metal layer reflection u-lens C/F Metal Photo-diode Conventional Without color interference Light-guide G Back-side illumination No light loss With color interference ISOCELL Remove metal layer reflection R G R Photo Photo Diode Diode Photo Photo Diode Diode Back-side illumination ISOCELL 16/32 Front-side Back-side illumination illumination
  18. 18. New Products for 2014-15 • 16Mp ISOCELL Sensor with 1.12um pixels - Main sensor for smartphones - Wide dynamic range & Auto focus • Next APS-C sensor - Sensor for mirror-less cameras 17/32
  19. 19. 3. Foundry Advanced technology and continuous capacity growth Customers One stop IP shopping and design support Best service for development and mass production Technology & Capacity IP & Design Support Partnership with customers Service 18/32
  20. 20. 14nm Achievement • World’s leading 14nm FinFET solution via collaboration Samsung : 14nm FinFET test sample & Design Infrastructure ready ARM , Cadence, Synopsys & Mentor  FinFET Design Enablement Platform  First Cortex-A7 implementation 19/32
  21. 21. Technology & Capacity Samsung IBM ISDA Giheung, KR STMicro. GlobalFoundries Austin, Texas, USA * ISDA : International Semiconductor Development Alliance 20/32 Hwaseong, KR
  22. 22. System Semiconductor : Introduction Samsung System LSI : Now Looking Forward
  23. 23. 1 “Widcon” & TSV (Through Silicon Via) 2 64-bit CPU 3 FinFET Process 22/32
  24. 24. “Widcon” with TSV • Wide connection between logic and memory  Higher bandwidth, lower power consumption Memory Stacking with TSV Short Connection with TSV Micro Bump DRAM u-bump AP Package PCB 23/32
  25. 25. Widcon in reality • World’s 1st AP using Widcon & TSV Performance Power 33% Higher is Better Lower is Better 60% 43% 14% Widcon1 LPDDR3 Widcon2 LPDDR4 Widcon1 *Source : Samsung Electronics Co., Ltd., JEDEC, 2013 1Q 24/32 LPDDR3 Widcon2 LPDDR4
  26. 26. 64-bit CPU core for Smart Devices • 2-step approach:  AP with ARM’s 64-bit core  AP with Samsung’s own 64-bit core Samsung 25/32
  27. 27. 14nm FinFET Technology • FinFET technology leadership  Lower Vdd and delay than a planar process Advantage Structure Gate Source Drain Delay FinFET 20nm Planar Less Delay Lower Vdd Vdd 26/32
  28. 28. New Business 1 ModAP (Cellular Modem + AP) 2 IoT 3 Foundry 2.0 27/32
  29. 29. 1. ModAP (Modem + AP) • Dual tracks for modem collaboration  High-end : 2-chip strategy with Tier-1 modem suppliers  Mid/low-end : ModAP using system company’s modem Additional Products Existing Products ModAP AP Modem Memory Memory AP Modem Memory 28/32
  30. 30. ModAP • System LSI’s 1st ModAP was shipped in 3Q’13 Exynos 4 Quad + System Company’s Modem 29/32
  31. 31. 2. IoT (Internet of Things) • Smart building, Smart community, . . . • Total connectivity solutions Air conditioning and Temperature control Energy Generation Energy Storage Lighting Control Control of Elevators and Escalators Total Solutions Security Control Disaster Prevention Monitoring Cameras 30/32
  32. 32. 3. Foundry 2.0 • Technical leadership … 14FF and beyond Foundry 2.0 1 Follower  Technology Leadership 2 Tier 1 only  Tier 1 + Tier 2/3 3 Silicon  Silicon + IP Provider 31/32
  33. 33. Foundry 2.0 • 10nm FinFET Leadership SRD  Schedule *SRD: Semiconductor Research & Development  Performance, power and area ISDA • Early EUV Adoption 32/32
  34. 34. Concluding Remarks • Samsung S.LSI provides total solution for connected world  Mobile AP (Application Processor)  Image Sensor  ModAP  IoT • Samsung S.LSI offers attractive foundry solution  Leading-edge technology: 14FF  Capacity 33/32

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