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Slide 1
Overview of Best Practices for
Selecting and Executing STEM
Capstone Projects – A guide for
Advisors and Mentors
Art Gooray, PhD
Formerly, Technology Commercialization Program Manager, Eastman
Kodak Co and Xerox Corp
And
Adjunct Technology Based Ventures/Innovation Professor, Wright State
University
• Technology Transfer/Technology Commercialization Focus
• Start to use Common Tools, Metrics and Requirements, in
line with R&D Scientists/Engineers and Product
Development Partners Commercialization
Capstone Project
Slide 2
Presentation Outline
• Innovation and Tech Commercialization
• Overview of the Time to Market (TTM) End to End
Commercialization Process
• Key Best Practices for Successful Capstone – Staging for
Tech Transfer
 Well developed ‘Front End’ to focus R&D - Market, Product, Strategy,
Vision (MAP with VOC, competitive benchmarking, technology and
product platform planning)
 Technology Readiness (Maturity) Requirements
 Extending the Enterprise (Partnership) Co-development Model - Core
Competencies for Integrated Platform Solution
Capstone Project
Slide 3
Ex: University Partnerships for Effective Capstone Project Execution
School of Business•VOC Analyses
•Market Size, Growth,
Trends
•Segmentation
•Competitive
•Analysis
•Core Competencies
and Partnership
Analyses
•Business case
analyses
•Entrepreneurship/inn
ovation best practices
•Value Proposition
•Vector of Differentiation
•QFD – product specs
• Product Platform
•Technology Platform
•Partnership Plans
•Supply chain plans
•Validate Economic Case
•Technology Commercialization
best practices
Market
Analyses
Technology
Solutions
Responses
MAP:
Clarity of Solution roadmap – Technology Platform and Product Platform
Deep Understanding of Market Segments
IP strategy
Initiatives to make the technology set disruptive – Creative thinking
Confirm the Business case analysis – ROI case studies
Evaluate potential issues with the TTM delivery model
Create and implement the various partnership models
All stake holders and value chain partners on the same page early
Accountability
In-depth knowledge of the business – who are the competitors and their strategies, how to gain market share, a long term
sustainable plan for growth
Develop benchmarking and performance tracking metrics – time to profitability, slip rate, market share, etc
School of Law- IP
Strategy
Capstone Project
Office of Sponsored Research
Co-Development Commercialization Partners
Schools of Engineering/Arts & Sciences
Slide 4
Benchmarking Companies – Capstone in URQ
Capstone Project
Slide 5
Elements of Capstone Team Integration –I/O/C
Team
Transf.
Function:
-Overcome
Perceptual
Gaps
-Manage focus
-Use
Understandings
-Execute PDM
Input Output
Global
Cross
functional
Incentives
Processes
Capstone Project
Slide 6
KEY INITIATIVES FOR SELECTING AND EXECUTING
CAPSTONE PILOT PROJECTS
• Market Attack Plan
• Technology and Product Platform Planning
• Technology Robustness Plan
• Licensing/Tech Transfer
• Partnership Model for Commercialization Integrated
Solution
Capstone Project
Slide 7
INNOVATION
AND TECH
COMMERCIALIZATION
Capstone Project
Slide 8
INNOVATION
To Innovate (creating new technologies), first discover things and
then figure out how to put them to good use
Innovation - finding novel solutions to important problems and
as well as the opportunity to create new products and services
Disruptive Innovation –
New applications of existing
means or technologies
R&D Organizations
excellent at the
Discovery Phase
Need to ‘co-develop’
discovery with application
Phases - MAP
Capstone Project focuses on
Successfully Navigating the
Domains
Slide 9
Commercialization Innovation
Entrepreneurship
• The creation of an enterprise or business that has
the chance of profit (or success)
• Creating Solutions for existing problems that have a
customer need, using a well disciplined process
(TTM, continuous feedback)
Technology Commercializing
• Commercialization -The process by which a new
product or service is introduced into the general
market
• Disruptive technologies introduce a set of attributes
to a marketplace different than the ones that
mainstream customers historically have valued
Capstone Project
Slide 10
Typical Capstone Design Steps
Assess Evaluate
Recomm
end
Plan/
Design
Brainstor
m
MPSV Robustness
Focus on Best Practices for:
• Market, Product, Strategy, Vision (MPSV) - MAP
• Robustness - Technology Readiness Metrics
• Tech Transfer Requirements for Commercialization –
Partnerships for Integrated Platform Solution
Transfer,
License
Capstone Project
OVERVIEW OF END TO END
INNOVATION COMMERCIALIZATION
PROCESS
- THE TIME TO MARKET (TTM) PROCESS
- CAPSTONE PROJECT FOLLOW THE TTM PROCESS
Slide 12
Typical University Commercialization Process
Capstone Project
Slide 13
slide # 18
Platform
Element
Proposals
Product
Proposals
Product
Proposals
Market
Attack
Plans
Corporate Planning
Process
Portfolio Planning,
RD&E Prioritization,
and Pipeline Management
Market
Attack
Plans
Commercialize
Select
Mature
Filter
Scan
Research Portfolio
Platform Pipeline
Product Pipeline
Deliver Value
in Global Markets
Grow Revenue &
Profits in Current
and New Markets
Delight Customers
Revenue
Tim e
$
Product
Proposals
Platform
Element
Proposals
Corp
Market
Portfolio
Strategy
Vision
Group
Market
Portfolio
Strategy
Vision
Tools / Engineering Environment / Info systems
Management Systems / Decisioning / Metrics
Voice of the Customer / MarketCapabilitiesandLearning
Company/TeamOrganization/Culture
Global Markets
GlobalEconomy
World-wide Supplier Base
AllAvailableTechnologiesCompetition
End to End TTM Phases
Core Competencies / Skills and Knowledge / Resources
Phases 1 & 2- Technology Maturity
Technology Commercialization
Capstone Project
Slide 14
Confirm
Phase 1
Key Requirements for Technology Transfer – MAP, TPP, PPP and Tech
Readiness (Phases 0, 1,2)
Product
Vision
Market Attack
Strategy
Platform Strategy
Ph 2
Ph 3 Ph 4
Product Pipeline Strategy
Launch
A
ABCD
EF
G
B
C
D
E
F
G
A
B
C
D
E
F
G
H
I
BCDEFG
HI
A
B
C
D
E
F
GA
BCDEF
G
A
BCDE
F
G
H
I
A
B
C
D
E
F
G
H
IA
Reuse
Balance &
Select
Deliver
TTM
Solution
Proposal
-MAP
Ph 5
Technology Maturity
Technology
Readiness
-Transfer
Phase 0
Slide 15
Time-To-Market Overview
Principles and Values
 The TTM Program is an empowering framework of action that brings together industry best
practices, while encouraging innovation enabling tailored implementations to be adapted to a
variety of value-added business models.
 Robust market-oriented front end for developing the Market and Product Strategy Vision and
Market Attack Plans integrated with technology and value chain strategies and plans are
fundamental to strategic management of the company
 Customer first... focused on understanding what is needed to delight customers and achieve
market success, with strong feedback linkages to the process “front end”.
 Technology and Value Chain technology elements are matured and delivered, as reusable
offering platform elements, through the use of a defined technology delivery process.
 Offering-platform-based offering development, delivery and on-going support of the offering
offerings in defined target markets over time .
 Offering Programs are to be planned at benchmark or best-in-class schedules based on the
TTM newness / complexity matrix.
 Extensive, continuous use of customer feedback in each phase of the TTM Process.
 Organizational learning and knowledge transfer is captured and applied to improve
productivity and performance over time.
Capstone Project
BEST PRACTICES CAPSTONE
PROJECT
- Market Attack Plan
- Delivering Ready Technology
- Staging for Tech Commercialization – Extended
Enterprise Partnership Planning
Slide 17
Technology Delivery/Transfer – Staging for Commercialization
Technical Reviews
Market
Attack
Plan
MPSV
Develop
MAP
Document
VOC
Prioritization
Assess
Business
Process
Change Needs
Plan Business
Process Changes
Document Gaps to
Requirements
Validate
Deployment Plan
Share Lessons
Learned
Verify
Performance
Enable
Benefits
Plan DeploymentDevelop
MPSV
Phase 1.0
Define
Phase
0
MPSV
Phase 4.0
Demonstrate
Phase 3.0 (Gate 2)
Design
Phase 2.0 (Gate 1)
Define
Phase 5.0
Deliver and Delight
Complete
Business Process
Changes
Validate
Business
Process
Changes
Perform Coherence Activities
Create Plan for
end user
Solution
Proposal Solution
Definition
Solution Design
Stability
Solution
Deployment
Readiness
Solution
Production
Readiness
Document
Customer
Business Reqs
Document Detail
Requirements
Assess
Technology
Prove
Technology
Validate
Technology
Document
Business Case
Update Business Case Validate
Business Case
Engage
Partners
Select Initial
Metrics
Update
Metrics
Commit
Metrics
Validate and
Measure
Metrics
Reliability
and Service
business
Metrics
MAP
Ready Technology Commercializing Technology
Extended Enterprise/Partnership
Slide 18
What is the Front End – MAP Output
Front End Is:
• Market-based
• Data-driven
• Integrated framework for cross-
functional planning and
execution
• Intended to deliver increased
profitable growth
• Collection of industry best
practices
• Customizable to fit different
situations/business needs
• Internally created strategy to
ensure buy-in
MAP Questions:
• What are competitors offering
• Is there an opportunity For
your Company
• What do we need to do
to take advantage of this
opportunity
• Is this a profitable business
(TTM metrics QCD’s)
Slide 19
Acquire Voice of the Customer (VOC) – Opportunity Exist?
WHO IS MY
CUSTOMER?
GOAL:
UNDERSTAND
AND FOCUS
ON THE VOICE
OF THE
CUSTOMER
Industry Analyses
Customer Profiles
Product Positioning
Market Segmentation
Managers
Engineers
Sales People
Service Representatives
HOW CAN I
LISTEN?
Competitive Product Analyses
Customers Surveys
1-on-1 Customer Interviews
Focus Group Interviews
Complaints/Failure Analyses
QFD
HOW DO I
INTERPRET?
WHO SHOULD
LISTEN?
Capstone Project
Slide 20
Three Key Items for the TTM ‘Front End’ (MPSV)
S
A
N
A
L
Y
I S
R
E
S
P
O
N
S
E
M A R K E T
STRATEGIC BU PARTNERSHIP
Customer Needs
Analysis
Size, Growth, Trends
Segmentation
Competitor
Analysis
Competency
Analysis
Economic
Case
Value Chain Plans
supply chain, channel
& marketing programs
Value Proposition
Vector of Differentiation
Capstone Project
1.Market Attack
Plan (MAP).
Includes
Partnerships
Plans
2.Technology
Platform Plan
3.Product
Platform Plan
Product Lines
& Platforms
Slide 21
Develop Upper Right Quadrants (URQs) – IP &
Business Strategies
Slide 22
Ex: Upper Right Quadrant
Capstone Project
Slide 23Capstone Project
Ex: Upper
Right Quadrant
Slide 24
Scanning SET factors Leads to POGs (Product Opportunity Gap)
Slide 25
Ex: SET Factors for Margaritaville Frozen
Concoction Maker
Slide 26
Ex: Part Differentiation Matrix (PDM) for a Vehicle
Slide 27
What is SWOT
SWOT is a summary of your
Strengths
Weaknesses
Opportunities
Threats
Internal
External
Capstone Project
Slide 28
Develop SWOT
Capstone Project
Slide 29
Develop Lean Canvas Project Name
Date:
Iteration #x
Cost Structure
Customer Acquisition costs
Distribution costs
Partnerships Integration
People, etc.
Revenue Streams
Revenue Model
Life Time Value
Revenue
Gross Margin
Problem
Top 3 problems
Solution
Top 3 features
Key Metrics
Key activities you
measure
Unique Value
Proposition
Single, clear,
compelling message
that states why you are
different and worth
paying attention
Unfair Advantage
Can’t be easily copied
or bought
Channels/Partnershi
ps
Path to customers
Customer
Segments
Target customers
PRODUCT MARKET
Capstone Project
Definitions
Product Platform Planning
The PPP is our roadmap for a set of related products with
common elements and architecture. They are a way of
organizing thoughts about products and the
technologies they contain. Product platforms provide a
meaningful level of aggregation of individual product and
technology projects.
Technology Platform Planning
The TPP is our roadmap for core technologies and
innovations required to support the PPP and the
MAP. The TPP is a set of projects and initiatives for the
development of a technology that will provide the
technical basis for building and sustaining a competitive
advantage.
Slide 31
Capstone MAP Table of Contents
Section A: Summary
Section B: Background
I. Strategic Objectives
II. Market Analysis
III. Technology Analysis
IV. Value Chain Analysis
V. Related Initiatives
Section C: Recommendations
I. Target Segments and Vector of Differentiation
II. Product Alternatives
III. Product Offerings
IV. Supporting Value Chain Strategies & Plans
V. Skills and Resources
Section D: Economic Case
Section E: Monitoring Plan
Capstone Project
Slide 32
Identify Technology Delivery
Requirements
Requirements for Technology Transfer for
Commercialization
• Technology Capability Demonstration Best
Practices
• Technology Readiness (Maturity) Best Practices
Capstone Project
Slide 33
DEVELOP TECHNOLOGY ROBUSTNESS PLAN AND
METRICS
• Identify all Failure Modes and Control Factors for Failure
Modes
• Identify Integration Requirements
• Identify Key Manufacturing Requirements
• Prototype Planning - Description of Integration
Performance Testing
Capstone Project
Slide 34
Technology Readiness /
Manufacturing Readiness
Design and Mfg.
Process Stability
Product QCDs
Productivity
Supply Assurance
3
Design
& Specify
Product
4
Demonstrate
Product
6
Delight
Customers
5
Deliver
Product
1
Define
Product
Platform &
Technology
3.3
Define
Product
2
Define
Product &
Deliver
Technology
0
MPSV
Focus:
TTM Technology Delivery Phases
R&D Portfolio Management focuses on Phases 0,
1, 2
(do not preclude concurrent activity in the
technology commercialization delivery process)
Tech Transfer for Commercialization
Capstone Project
Slide 35
Technology Delivery/Transfer – Staging for Commercialization
Technical Reviews
Market
Attack
Plan
MPSV
Develop
MAP
Document
VOC
Prioritization
Assess
Business
Process
Change Needs
Plan Business
Process Changes
Document Gaps to
Requirements
Validate
Deployment Plan
Share Lessons
Learned
Verify
Performance
Enable
Benefits
Plan DeploymentDevelop
MPSV
Phase 1.0
Define
Phase
0
MPSV
Phase 4.0
Demonstrate
Phase 3.0 (Gate 2)
Design
Phase 2.0 (Gate 1)
Define
Phase 5.0
Deliver and Delight
Complete
Business Process
Changes
Validate
Business
Process
Changes
Perform Coherence Activities
Create Plan for
end user
Solution
Proposal Solution
Definition
Solution Design
Stability
Solution
Deployment
Readiness
Solution
Production
Readiness
Document
Customer
Business Reqs
Document Detail
Requirements
Assess
Technology
Prove
Technology
Validate
Technology
Document
Business Case
Update Business Case Validate
Business Case
Engage
Partners
Select Initial
Metrics
Update
Metrics
Commit
Metrics
Validate and
Measure
Metrics
Reliability
and Service
business
Metrics
MAP
Ready Technology Commercializing Technology
Extended Enterprise/Partnership – Most important Subprocess
Slide 36
Technology Readiness
What is Technology Readiness? Do I know how to manufacture a
product capable of the required performance levels at the lowest
cost?
Not just an assessment of the goodness of a technology but also how
well is it understood, and how the understanding yields lowest cost
manufacturing methods. In other words, Technology readiness
implies that the centerline of the design capability is centered on the
manufacturing variability and the distribution of manufacturing
variability remains within the design latitude.
 Technology Readiness implies that the assessment of the problems set has been
completed and there is no indication that a solution must be invented (beyond normal
design engineering practice) for either the design or manufacturing process to achieve the
specified performance.
Manufacturing
Variability
Design Latitude that Yields
Acceptance Performance
Performance
Failure
Performance
Failure
Capstone Project
Slide 37
Tech Readiness Requirements Best Practices
CRITERIA Phase 0 –
Analysis &
Experiments
Phase 1–
Technology
Capability
Demonstrated
Phase 2a -
Technology
Maturity
Capability
Demonstrated
Phase 2b –
Technology
Robustness
Verified
LOW
RISK
CRITERIA
MET
1. Failure
Modes
Modes
Projected.
Test plans
approved
Failure modes
observed under
Nominal short-
run
test conditions
Failure modes
identified under
initial system/
subsystem
life test and stress
conditions
Failure modes
confirmed and
initial testing of
fixes completed
on Integrated
Test Rig (ITR)
Failure mode
solutions
validated
on product intent
hardware.
Criteria and
measurements
met.
2. Critical
Parameter
Development
Parameters
projected
Sensitivity
studies
and optimization
initiated
Critical parameter
first optimization and
sensitivity studies
completed. Failure
modes controlled in
design intent
integrated hardware
Critical parameter
second
optimization
completed and
fixes
to defined failure
modes confirmed.
Critical
parameter
verified on
ITR test.
Criteria and
measurements
met.
3. Latitudes Latitudes
projected
and approach
defined
Process
demonstrated
at nominal set
point
Control parameter
operating windows
defined through
test and analysis
Control parameter
latitude
demonstrated under
environmental and
life stress
conditions.
Control
parameter
latitude verified
on ITR test.
Criteria and
measurements
met.
4.
Manufacturabilit
y
-
manufacturability
confirmed with
partner
Preliminary parts
manufacturability
projected, UMC
goals
concurrence
Evaluate critical
parts
manufacturability
with partner
involvement. New
Mfg. capability
requirements
identified.
Preliminary
evaluation of
projected critical
specification
tolerances
completed.
Process capability
projected.
Tolerance and
variance analysis
of design intent
drawings
completed.
Supplier
confirmation of
manufacturability
of critical
specifications
completed.
Criteria and
measurements
met.
5. Prototype
Performance
Integrated
technology
robustness
demonstrated
Integrated
technology rig
requirements
listed. Hardware
designed.
Hardware built and
debugged.
Operability,
safety,
consumables and
environmental
plans
approved.
Initial integrated
test complete.
Architecture
stable.
Prototype layout
approved.
Integrated test.
Verification and
tolerance tests
completed under
environmental
stresses.
ITR tests & life
assessment
completed.
Criteria and
measurements
met.
Slide 38
Key Phase 1 Requirements – Technology Capability
Demonstration
•Demonstrate key product technical requirements attributes can be achieved
•Demonstrate ‘sustained performance’ with 70% confidence with typical ‘customer
applications’
•Integrated technology operating window developed
•100% of the CP’s nominal & 80% of the CP latitudes defined.
•Tolerance allocations defined for all process critical components.
•Mfg. Processes capabilities for critical components confirmed based on prototype
database.
•Life tests performed to project performance against targets.
•System integration requirements documented.
•Diagnostics for key/critical failure modes defined.
•Performance projected against quality, cost and delivery schedule requirements
•Technology operating document documented
•Extended Enterprise Partner (s) identified for specific subsystem (s).
• Integration design developed.
•Environmental, health and safety requirements documented. Serviceability assessed
•IP’s and right to use completed.
Slide 39
Technology Readiness Development Steps
1. Develop Big Picture of selected technology
set
2. Select subsystem design concepts
3. Complete failure mode analysis of each
subsystem
- Select critical parameters and noises
4. Define initial critical parameter set points for
design intent
5. Define life testing requirements, input
parameters, stress tests
6. Complete subsystem latitude development
hardware design
7. Complete design analysis and drawing audit
that demonstrates critical parameter
conformance of hardware to design intent
(Critical Parameter Drawing Audit)
8. Build latitude hardware and audit
conformance of hardware to design intent
(Critical Parameter Hardware Audit)
9. Build life testing hardware and start life
testing
10. Complete first optimization using Taguchi
latitude testing and operating windows
- Optimize S/N ratio and define CP ranges
11. Upgrade failure mode analysis and CP set
points and ranges
12. Complete integrated breadboard system design
13. Complete CP drawing audit, build. Complete CP
hardware audit
14. Upgrade subsystem latitude hardware
15. Start production intent design (using all TTM
design practices)
16. Complete system latitude testing
17. Complete second subsystem latitude
optimization
18. Continue life testing
19. Upgrade production intent design (using all TTM
design practices)
20. Upgrade failure mode analysis, CP set points and
ranges
- Final design intent
21. Complete CP manufacturability analysis
- Demonstrate CP latitudes can be enabled by
normal manufacturing process
22. Complete performance analysis
- Predict performance compared to goals
23. Performance and manufacturability analysis are
positive
- Start design phase
- If not, go back to step 12
Capstone Project
Slide 40
Use Lean Six Sigma Tools
MeasureMeasure
• Operational
Definitions
• Data Collection
Plan
• Pareto Chart
• Histogram
• Box Plot
• Statistical Sampling
• Measurement
System Analysis
• Setup Reduction
• Generic Pull
• Kaizen
• Control Charts
• Process Capability,
Cp & Cpk
AnalyzeAnalyze
• DOE Full &
Fractional Factorial
• Conjoint Analysis
• RSM
• Taguchi
• Scorecards
• Pareto Charts
• C&E Matrix
• Fishbone Diagrams
• Brainstorming
• Supply Chain
Accelerator Analysis
• Non Value-Added
Analysis
• Hypothesis Testing
• Confidence Intervals
• FMEA
• Simple & Multiple
Regression
• ANOVA
• Queuing Theory
• Analytical Batch Size
ImproveImprove
• Brainstorming
• Benchmarking
• Process
Improvement
Techniques
• Line Balancing
• Process Flow
Improvement
• Constraint
Identification
• Replenishment Pull
• Sales & Operations
Planning
• Poka-Yoke
• FMEA
• Pugh Matrix
• TRIZ
• ‘To-Be’ Process
Maps
• Piloting and
Simulation
ControlControl
• Control Charts
• Standard
Operating
Procedures
(SOP’s)
• Training Plan
• Communication
Plan
• Control Plan
• Visual Process
Control
• Mistake-Proofing
• Process Control
Plans
• Project
Commissioning
• Project
Replication
• Plan-Do-Check-
Act Cycle
* Tool Array, based on LSS for
Service by Michael George
• Value Stream
Map
• Various Financial
Analysis
• Charter Form
• Multi-Generational
Plan
• Stakeholder
Analysis
• Communication
Plan
• SIPOC Map
• High-Level
Process Map
• Non-Value Added
Analysis
• VOC and Kano
Analysis
• QFD
• Pareto Charts
• RACI & Quad
Charts
DefineDefine MeasureMeasure
• Operational
Definitions
• Data Collection
Plan
• Pareto Chart
• Histogram
• Box Plot
• Statistical Sampling
• Measurement
System Analysis
• Setup Reduction
• Generic Pull
• Kaizen
• Control Charts
• Process Capability,
Cp & Cpk
MeasureMeasure
• Operational
Definitions
• Data Collection
Plan
• Pareto Chart
• Histogram
• Box Plot
• Statistical Sampling
• Measurement
System Analysis
• Setup Reduction
• Generic Pull
• Kaizen
• Control Charts
• Process Capability,
Cp & Cpk
AnalyzeAnalyze
• DOE Full &
Fractional Factorial
• Conjoint Analysis
• RSM
• Taguchi
• Scorecards
• Pareto Charts
• C&E Matrix
• Fishbone Diagrams
• Brainstorming
• Supply Chain
Accelerator Analysis
• Non Value-Added
Analysis
• Hypothesis Testing
• Confidence Intervals
• FMEA
• Simple & Multiple
Regression
• ANOVA
• Queuing Theory
• Analytical Batch Size
AnalyzeAnalyze
• DOE Full &
Fractional Factorial
• Conjoint Analysis
• RSM
• Taguchi
• Scorecards
• Pareto Charts
• C&E Matrix
• Fishbone Diagrams
• Brainstorming
• Supply Chain
Accelerator Analysis
• Non Value-Added
Analysis
• Hypothesis Testing
• Confidence Intervals
• FMEA
• Simple & Multiple
Regression
• ANOVA
• Queuing Theory
• Analytical Batch Size
ImproveImprove
• Brainstorming
• Benchmarking
• Process
Improvement
Techniques
• Line Balancing
• Process Flow
Improvement
• Constraint
Identification
• Replenishment Pull
• Sales & Operations
Planning
• Poka-Yoke
• FMEA
• Pugh Matrix
• TRIZ
• ‘To-Be’ Process
Maps
• Piloting and
Simulation
ImproveImprove
• Brainstorming
• Benchmarking
• Process
Improvement
Techniques
• Line Balancing
• Process Flow
Improvement
• Constraint
Identification
• Replenishment Pull
• Sales & Operations
Planning
• Poka-Yoke
• FMEA
• Pugh Matrix
• TRIZ
• ‘To-Be’ Process
Maps
• Piloting and
Simulation
ControlControl
• Control Charts
• Standard
Operating
Procedures
(SOP’s)
• Training Plan
• Communication
Plan
• Control Plan
• Visual Process
Control
• Mistake-Proofing
• Process Control
Plans
• Project
Commissioning
• Project
Replication
• Plan-Do-Check-
Act Cycle
ControlControl
• Control Charts
• Standard
Operating
Procedures
(SOP’s)
• Training Plan
• Communication
Plan
• Control Plan
• Visual Process
Control
• Mistake-Proofing
• Process Control
Plans
• Project
Commissioning
• Project
Replication
• Plan-Do-Check-
Act Cycle
* Tool Array, based on LSS for
Service by Michael George
• Value Stream
Map
• Various Financial
Analysis
• Charter Form
• Multi-Generational
Plan
• Stakeholder
Analysis
• Communication
Plan
• SIPOC Map
• High-Level
Process Map
• Non-Value Added
Analysis
• VOC and Kano
Analysis
• QFD
• Pareto Charts
• RACI & Quad
Charts
DefineDefine
• Value Stream
Map
• Various Financial
Analysis
• Charter Form
• Multi-Generational
Plan
• Stakeholder
Analysis
• Communication
Plan
• SIPOC Map
• High-Level
Process Map
• Non-Value Added
Analysis
• VOC and Kano
Analysis
• QFD
• Pareto Charts
• RACI & Quad
Charts
• Value Stream
Map
• Various Financial
Analysis
• Charter Form
• Multi-Generational
Plan
• Stakeholder
Analysis
• Communication
Plan
• SIPOC Map
• High-Level
Process Map
• Non-Value Added
Analysis
• VOC and Kano
Analysis
• QFD
• Pareto Charts
• RACI & Quad
Charts
DefineDefine
Slide 41
Ex: Image Quality Variability - Root Cause Analysis
Machine -Media &
Transport
Environment -Aerodynamics
Material/Machine – Jets Within PH
Machine - Tiled JM
Overlap Method - Image Data
Algorithm
PH stitched drops fail to
meet cross track spec of
+/-10 mm
In Track
error
Media to brush
roll height
Cross Track
error
Tach
and
Cue
Drier air flow
PH airflow with image
content
Web speed
JM to JM
positioning
Neighboring
drop flight
interactions
DC servo variation
Silicon rev
Ink
concentration
control
DC airflow
with end jets
DC servo variation
JM to JM
Error in
data
collection
–
cameras,
cue
sensors,
Stitch
Correction
Algo
Nozzle diameter variation
Pressure
comp
Measurement_- Test Target,
Data collection, Analysis
Representative test
target
Image data
(pixel shift)
algorithm
Data analysis
Media
dimensional
change
BP Temp
effects
DC position variation
Ink/Media surface energy changes
Slide 42
5 Why’s
Fishbone (cause/effect) Diagram:
The fishbone diagram helps with exploring all potential or real causes that result in a single
defect or failure mode.
Once inputs are established on the fishbone, can use the 5 Whys technique to drill down to the
root causes.
The 5 Whys is a technique used in the Analyze phase of the Six Sigma DMAIC
(Define, Measure, Analyze, Improve, Control) methodology. By repeatedly asking the
question “Why” (five is a good rule of thumb), you can peel away the layers of
symptoms which can lead to the root cause of a problem.
Step 1:
Example: Long start up time for a product defines the issues (Head of the fish).
Agreement on the issue definition is needed to solve it (the various bones for the
fish).
Step2:
Ask why; what is causing that issue (the various issues on the bone of the fish).
Write down the symptom (most direct reason) for that issue and get agreement
before proceeding. Ask why again and agree on the cause of the issue. Repeat this
until you have asked why typically 5 times to get to the root cause.
Slide 43
5 Why’s
Project Name Failure Analysis for long start up
Research #4 Team Date
Issue Description
Enter the agreed upon issue description. Ex: Engine will not start when cold
1. Why is it happening?
Enter the most direct symptom/cause of the issue: Ex: Lubricant viscosity too large
2. Why is it happening?
Enter the direct symptom/cause of the answer listed in the box above
3. Why is it happening?
Enter the direct cause of the answer listed in the box above
4. Why is it happening?
Enter the direct cause of the answer listed in the box above
5. Why is it happening?
Enter the root cause of the answer listed in the box above
Slide 44
Ex: Problem Management Process (PMP) - Definition
PROGRAM ASSESSMENT MATRIX
DESCRIPTIONS
PROBLEM
SOLVING
PROCESS
1
Identifying
&
Selecting
Problem
4
Selecting
&
Planning
Solution
3
Generating
Potential
Solutions
2
Analyzing
Problem
6
Evaluating
Solution
5
Implementing
Solution
Problem identified.
No proposed solution.
Problem not understood.
Hypothesis proposed.
Problem understood.
Solution set proposed.
Solution set defined.
Verification tests incomplete.
Verification tests complete.
Solution set demonstrated
PROGRESS
Issue Category
Critical
Major
Ordinary
Impact
Show Stopper Now!
Could Become A
Show Stopper
An Annoyance
Required
Actions(s)
Issue must be resolved, replan required
Issue requires approved, corrective action plan, with an
assessment of its achieveability when integrated with other
corrective action plans into overall program plan (s)
Manageable within normal day-to-day activites
PHASE TRANSFER
IMPLICATIONS
I
M
P
A
C
T
Critical
Major
Ordinary
1 2 3 4 5 6
PROGRESS AND IMPACT
SatisfactoryDiscretionaryAdditional actions required
Capstone Project
Slide 45
Ex: Problems / Issues Severity –IJ PH
IMPACT 1. Identifying
& Selecting
Problem
2. Analyzing
Problem
3. Generating
Potential
Solutions
4. Selecting &
Planning
Solution
5.
Implementin
g Solution
6. Evaluating
Solution
Critical
(Show Stopper
“Now”)
Ink Handling
Design
Initial Fill ,
time t =0
performance
Ink Cp’s
optimization
(ES process
physics)
Major
(Potential barrier to
subsequent phase
transfer – could
become a show
stopper)
Drop
formation
CP’s
identification
& modeling
verification,
design for
energy
efficiency
Print head
packaging
design (mech.,
elect.,
fluidics)
Ordinary
(Minimal impact on
QCDs)
Capstone Project
Slide 46
P- Diagram (Input Output Constraint Transformation
Function)
OUTPUTS (O) LATITUDEINPUTS (I)
Primary
Dysfunctional
From a Subsystem or Manufacturing Process:
Failure Mode
Failure Mode
Main Function: The purpose of the subsystem / system
Primary Inputs: Any action, physical object, or energy that needs to be supplied for the main
function to perform its intended purpose
Dysfunctional Inputs: Any action, physical object, or energy which may limit or prevent the subsystem from
performing its intended purpose
The variation in all inputs are termed external noises
Primary Outputs: Measurable performance the subsystem is intended to provide. Also called the ‘Primary
Response’
Dysfunctional Output: By-products from the subsystem performance which may be Dysfunctional Inputs to
other subsystems
Constraints: Key program requirements that impact the design
Latitude : The output variation remains within the boundary of the failure modes when the
design is subjected to expected levels of input variation (from noise factors)
Failure Mode: The deficiency which occurs when the output performance no longer meets the reqmnts
CONSTRAINTS (C)
MAIN
FUNCTION
Capstone Project
Slide 47
EX: IJ Printer Maintenance Station I/O/C
MS INPUTS
From Maintenance
Vacuum pressure, 50 – 200 mm Hg
(gage)
Vacuum Dwell time, 2 – 10 s
Capping Force, 25 – 50 gF/cm
Wiper blade force, 25 - 100 gF/cm
Spitting Wave form, 100 – 150% WS
threshold
OTHER SUBSYS INPUTS
Printer:
Carriage Scan Speed, 15 – 30 IPS
Carriage Acceleration < 2 g’s
Ink:
Surface Tension, 20-45 dynes/cm
 pH 7 – 9.5
Viscosity, 1 – 2.5 CP @ 24 0 C, 50RH
Re-dissolution  2 (scale 1-5)
% Pigments, Humectants –ref. Ink
design
Print Head:
Nozzle dia 10 – 20 um
# of nozzles/col, native res – 640/1200
DPI
Ink/PH front face wetting angle, 10 – 75o
Ink tank:
Static pressure < 0.25” water vacuum
(gage)
MAIN FUNCTIONS:
Maintain Printhead health over 5year
at 4 corners temp 150C - 350C, RH
20%-80%
•Initial ink install
•Ink tank / PH replacement
•Remove clogged/crusted inks in
nozzles
•Spitting for Latency
•Wiping to maintain PH nozzle face
•Capping of print head during
standby/storage
•Waste ink management
SECONDARY FUNCTION
•Protect PH and prevent waste ink spill
after printer install
OUTPUTS:
To IQ:
Dot size back to WS spec
Drop Directionality back to WS spec
To PH :
Recover missing nozzles due to ink clogs
and crust w/ 99% confidence on first clean
operation
Recover misdirected nozzles due to front
face contamination w/ 99% confidence
Remove debris & paper fiber from PH face
To Firmware:
Ref. MS algorithms document
UNDESIRED OUTPUTS:
•MS induced cross contamination & air
bubbles
•PH front face wear
•MS induced noise <45 dB ?
•Ink spatter or aerosol in maintenance
areas
•MS ink leakage from storage areas, 0 cc
over life
MS CONSTRAINTS:
UMC < $5
Life of components ~ 5 years
Standby/storage mode - no
maintenance
Waste ink usage <15% printable ink
Waste ink diaper size < 800 cc
SYSTEM CONSTRAINTS
Ink Re-dissolution < 2 (scale 1-5)
Ink Latency > 5 sec
PH front face flatness < 0.25 mm
HSE Compliance
Contamination from Mfg. & PH usage
<5 ppm, 2 um size internal)
Slide 48
EX: Ink Subsystem Design
Inputs:
Drop Ejector Requirements
Colorant concentration ( all colors)
Surface tension
Viscosity
Density
pH
Contact Angle wrt front face
Dissolved gas
Ink Delivery (Ink tank) Requirements
Viscosity
Gas permeability
Surface Tension
Solubility
Maintenance Requirements
Solubility
Viscosity
Media Set Requirements
Photo reqmnts
Plain Paer reqmnts
Ambient Drying Requirements
Surface Tension
% water by wt
% co-solvent
Viscosity
Duplex Requirements
% water, % co-solvent
Usage conditions & Design Noise
Standby/ sleep mode
Ink supply variation during printing
Machine RH, Temperature
Ink Raw Materials variability
Outputs:
Measuring and monitoring to ensure
product goals are met.
Jettability Performance
Drop volume, velocity, Jitter, FMax
Maintainability Performance
Latency, washability, solubility,
Recoverability
IQ Perfromance
Spot size,Dmax, Dmin, Raggedness, ,
ICB, Mottle, Gamut, Cockle, Curl,
Smear (wet & dry), misting, W’fast,
L’fast
Drying Performance
Ambient Dry Time
Duplex Performance
Strike-thru
Properties Stability
Shelf Aging
Ink composition in device over time
Ink properties over time in ink
delivery subsystem
Materials life:
Components life exposed to ink
Main Functions:
 Deliver ink set that achieves
the following in Printer
System Architecture: jetting
performance, IQ
performance on media set,
acceptable life of all
materials in ink path,
acceptable print head
maintainability and
operability
Constraints:
RTU
HSE
Materials Compatibility
Properties stability at operating
temperature
Stability over life
UMC
Time To Ink Flush (design
nominal)
Manufacturability
Supply Assurance/ Quality
Slide 49
Ex: Process Physics, Drop Formation
CP’s INPUT
From Drop Formation
Amplitude. Nom +/- V
 pulse width
 # of pulses
 pulse position odd vs even
 odd-even phase shift (static &
dynamic)
From DC
•Pos excess air
•Neg air
•Catcher vacuum
From WSO
Ink pressure,
From Ink
Viscosity, ? CP @ 24 0 C, 50RH
From System
Ambient, 150C - 400C, RH 20%-
80%
DOE TO VERIFY:
Quality of catch drops and print
drops
•Small drops in catch
•Large drops exit PH
•Large drops momentum
MEASURED OUTPUT RESPONSE
Drop Formation Response
•1x
l/d , Nom 4.5, +/- 0.3 (Typically 3.9 to 4.2)
• Small Drop Merge : At 2.5 mm below the nozzle
plate, the merge rate should be less than 1 out of
1,000,000 drops
•3x
 Large Drop Formation Length ( <1200 microns)
 1x to 3x merges (no merges before 2.5 mm)
 Satellites: (Distances from Nozzle Plate)
Sat. Merge Distance (< 700 microns )
 Sat. Flight Time ( < 110 microns)
 Sat. Volume ( > 0.1 pL)
 Measurement: no satellite filter collection after 30
minutes of continuous running
 6 hour runability test
 No Print window degradation
 No Ink accumulation on Condensation Shield
Drop Control:
PW, > 1.5 inches of Water
Spits, <# 0,25 mm/1000 prints
IQ Response (Measured)
Horizontal line quality
Vertical line quality
Spot size, 56 +/- 5mm
IQ Response (Qualitative Measure)
•Pattern dependent X-talk, <? (see 1x above)
•Air flow defects
DYSFUNCTIONAL OUTPUT:
•Pepper Spray, Less than 2 per square inch at 656 ft/min
•Catcher spitting, <0.5x0.5 mm
NOISE:
From Ink
Viscosity, 1.5 +/- CP
Surface tension
% solids
pH 7, 9.5+/-?
From JM
NP hole size
From Customer Job
•Image type
•Pattern
From Mfg
•Contamination
•Parts tolerance
From Service
•Parts positioning
System Config Constraints
•Test with Condensation solution
•ASV box
•Air system
•Web at speed
•Drier set points
From Environment
•Temp range
•RH range
•Contamination
Slide 50
Ex: Critical Parameter (CP) Tracking List
CP = Critical Parameter to monitor process function not found on a drawing
CS = Critical Specification found on drawings monitored at new build or audits
CRITICAL PARAMETER DEVELOPMENT CRITICAL PARAMETER IMPLEMENTATION
S/S Parameter Description
CP or
CS
1
Units
Critical Parameter
Value
Set Range
Comment / Failure
Modes/Outlook/
Schedule/Technical
Testing Capability
Nom Range
Current
Nom/
(Date)
2
Capstone Project
Catcher film thickness CP micron
s
400 +/-20 Stray drops on media
Drop volume CP picoL 9.5 +/-0.25 White space, DD
Slide 51
• Parts variability
• Resources to qualify for IQ defects
• Correlation between test stands
• Spitting
• Parts scheduled delivery next week,
• IQ Artifact
• Tests Completed on test stand
• Analyzed Service Calls Data & Identified
Contributors to IQ
• Reviewed Manufacturing data
• Top integration issues identified
• Integration initiatives priority
o Process Physics Development
oSpitting
o IQ defects
o
• Continue Process Physics Development
• Testing of modified parts
• Fabricate and test DOE parts
• Gather more failures from customer sites
Ex: Integration Robustness MBF
Key Deliverables
Recent Accomplishments Plan (next 30 days)
Issues / Risks / Help or Decision Needed
Capstone Project
- Open Innovation Model for Tech
Transfer
Develop Strategy for Tech Transfer -
Extending the R&D Enterprise through
Partnerships
Slide 53
Extended Enterprise Relationship to other TTM Sub-
processes
Program Planning & Management
3.1 3.2 3.3 3.4 3.5 3.6
Customer Input & Validation
Platform Planning & Management
Economic & Business Case Financials
Requirements & Specifications
Technology
Systems Engineering
Integrated Testing - Internal / External
Standards & Regulatory Compliance
Globalization
Performance Metrics & Measurements
Marketing / Sales & Distribution
Manufacturing & Logistics
Third Party Arrangements (OEM and JV)
Launch
Customer Services & Support
Skills & Resource Planning
3 Customer Satisfaction & Loyalty
MPSV
3.2
Define
Product &
Deliver
Technology
3.1
Define
Market Attack
Plan &
Technology
3.3
Design
Product
3.4
Demon-
strate
Product
3.5
Deliver
Product
3.6
Delight
Customers
Market &
Product
Strategy
Vision
Sub-Processes
Core
Process
Subsystems Engineering
Extended Enterprise
7
5
1
2
4
6
8
9
10
11
12
13
14
15
16
18
19
20
17
(HW/SW, Supplies, FW/Elex)
Capstone Project
Slide 54
Extending The Enterprise -Partnership/Open Innovation
Model for R&D and Design and Manufacturing
Former approaches:
Product development has used several approaches:
•Complete build-to-print
•Sourcing to original equipment manufacturers (OEMs)
•Joint Ventures (JVs) with other manufacturers
The Extended Enterprise is . . .
•The utilization of global supplier relationships for component, subsystem, and
module design and manufacturing
•R&D Tech Transfer to enable maximum leverage of expertise and significant
improvements in product cost and TTM factors
Close existing gaps with existing enterprise:
•Engage appropriate partners
•Optimize partner value contribution
•Leverage unique product and process capabilities
•Access production and purchasing scale
•Retain ownership of proprietary technologies and critical product
development areas Capstone Project
Slide 55
Extended Enterprise Partnership
Extended Enterprise is not “outsourcing”
Extended Enterprise retains strategic internal control over:
• Areas that are critical to sustainable competitive advantage
• Product strategy, development, and execution
• Product synthesis
• Product development management
• Systems engineering and integration
Capstone Project
Slide 56
Extended Enterprise: A TTM sub-process
Extended Enterprise Deployment through out TTM
3210 54MPSV
Company defines:
• Market / business strategy
• Core competencies and
strategic enabling
technologies
• Market Attack Plans and
Product Strategies
• All sources of technology
(internal and external)
• Company specifies product (core
competencies)
• Company develops a set of strategic
partners that:
Deliver technology
Design non-strategic elements
Manufacture those elements
• Company designs strategic elements
and modules
• Company becomes world class in:
Systems Design
Systems Architecture
Systems Engineering
and Integration
Company controls (core
competencies)
• Launch
• Final integration
at Company or
non-Company sites
Company optimizes back
end Extended Enterprise
partnerships:
• Distribution
• Order fulfillment
• Service and support
Capstone Project
Slide 57
CRITERIA COMMENTSEX: PARTNER RATING FOR
SELECTION
Low
1 2 3 4
Hig
h 5
(Quantify where possible)
TECHNICAL CAPABILITIES
Device Research, Design &
Development
• Number of RD&E personnel
(researchers, engineers, technicians,
designers, etc.)
X - approximately 60-70 people working on MEMS
development at any one time (analysis, design,
prototyping, testing / characterization)
- other skilled supporting resources available
(expertise, tools, etc.)
•Skills & experience base of RD&E personnel X - MEMS capabilities include; Surface
micromachining process (SUMMit), Micromolding
(High Aspect Ratio Structures), Integrated
Electronics / Mechanics, Sealed Diaphragm,
Phtonics / MEMS
- Skills, breadth of capabilities, experience
appears very high ….. analysis, design, test and
prototype fabrication;
- Ph.D. & Master level engineers & scientists
– microelectronic & micromachining process
development
– equipment design
– materials engineering
– device physics
– chemical engineering
– failure analysis & reliability physics
– circuit design, computer science, etc.
• Development Process
- Definition & Documentation
- Cycle Time & Resource Guidelines
- Project Planning Process
- Process Flexibility
- Design & Development Practices
X Typically uses gov’t / MIL–Std type of requirements
and phased development processes, relatively high
level of documentation … appears OK but such
processes have not typically been known for
benchmark TTM resultsCapstone Project
Slide 58
Capstone Project Desired Outcome
• Carefully Manage the TTM Front end and Technology
Delivery Phases
• Monitoring Top Problems (Root Cause analysis, CA’s, etc)
 Managing for Results – Meet VOCs and QCDs
 Effective Knowledge Transfer for Licensing, Tech Transfer
and for Commercialization – Technology Readiness
Capstone Project
Slide 59
Tech Positioning- Upper Right
Quadrant (URQ)
Existing New
Market
Technology
SustainingDisruptive
Highest
Risk
Lowest
Risk
Capstone Project
Capstone
Slide 60
Summary: MAP Partnership Teams Integration –I/O/C
Team
Co-Dev
Function:
-Overcome
Perceptual
Gaps
-Focus on VOC
-Use TR
knowledge
-Execute TTM
Input Output
Global
Cross
functional
Incentives
Processes
Competition
Tech Comm Best Practices
Co-Development
4/19/2016
Slide 61
Successful Today’s Innovators – Capstone Team

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Best Practices for STEM Capstone_07_07_15

  • 1. Slide 1 Overview of Best Practices for Selecting and Executing STEM Capstone Projects – A guide for Advisors and Mentors Art Gooray, PhD Formerly, Technology Commercialization Program Manager, Eastman Kodak Co and Xerox Corp And Adjunct Technology Based Ventures/Innovation Professor, Wright State University • Technology Transfer/Technology Commercialization Focus • Start to use Common Tools, Metrics and Requirements, in line with R&D Scientists/Engineers and Product Development Partners Commercialization Capstone Project
  • 2. Slide 2 Presentation Outline • Innovation and Tech Commercialization • Overview of the Time to Market (TTM) End to End Commercialization Process • Key Best Practices for Successful Capstone – Staging for Tech Transfer  Well developed ‘Front End’ to focus R&D - Market, Product, Strategy, Vision (MAP with VOC, competitive benchmarking, technology and product platform planning)  Technology Readiness (Maturity) Requirements  Extending the Enterprise (Partnership) Co-development Model - Core Competencies for Integrated Platform Solution Capstone Project
  • 3. Slide 3 Ex: University Partnerships for Effective Capstone Project Execution School of Business•VOC Analyses •Market Size, Growth, Trends •Segmentation •Competitive •Analysis •Core Competencies and Partnership Analyses •Business case analyses •Entrepreneurship/inn ovation best practices •Value Proposition •Vector of Differentiation •QFD – product specs • Product Platform •Technology Platform •Partnership Plans •Supply chain plans •Validate Economic Case •Technology Commercialization best practices Market Analyses Technology Solutions Responses MAP: Clarity of Solution roadmap – Technology Platform and Product Platform Deep Understanding of Market Segments IP strategy Initiatives to make the technology set disruptive – Creative thinking Confirm the Business case analysis – ROI case studies Evaluate potential issues with the TTM delivery model Create and implement the various partnership models All stake holders and value chain partners on the same page early Accountability In-depth knowledge of the business – who are the competitors and their strategies, how to gain market share, a long term sustainable plan for growth Develop benchmarking and performance tracking metrics – time to profitability, slip rate, market share, etc School of Law- IP Strategy Capstone Project Office of Sponsored Research Co-Development Commercialization Partners Schools of Engineering/Arts & Sciences
  • 4. Slide 4 Benchmarking Companies – Capstone in URQ Capstone Project
  • 5. Slide 5 Elements of Capstone Team Integration –I/O/C Team Transf. Function: -Overcome Perceptual Gaps -Manage focus -Use Understandings -Execute PDM Input Output Global Cross functional Incentives Processes Capstone Project
  • 6. Slide 6 KEY INITIATIVES FOR SELECTING AND EXECUTING CAPSTONE PILOT PROJECTS • Market Attack Plan • Technology and Product Platform Planning • Technology Robustness Plan • Licensing/Tech Transfer • Partnership Model for Commercialization Integrated Solution Capstone Project
  • 8. Slide 8 INNOVATION To Innovate (creating new technologies), first discover things and then figure out how to put them to good use Innovation - finding novel solutions to important problems and as well as the opportunity to create new products and services Disruptive Innovation – New applications of existing means or technologies R&D Organizations excellent at the Discovery Phase Need to ‘co-develop’ discovery with application Phases - MAP Capstone Project focuses on Successfully Navigating the Domains
  • 9. Slide 9 Commercialization Innovation Entrepreneurship • The creation of an enterprise or business that has the chance of profit (or success) • Creating Solutions for existing problems that have a customer need, using a well disciplined process (TTM, continuous feedback) Technology Commercializing • Commercialization -The process by which a new product or service is introduced into the general market • Disruptive technologies introduce a set of attributes to a marketplace different than the ones that mainstream customers historically have valued Capstone Project
  • 10. Slide 10 Typical Capstone Design Steps Assess Evaluate Recomm end Plan/ Design Brainstor m MPSV Robustness Focus on Best Practices for: • Market, Product, Strategy, Vision (MPSV) - MAP • Robustness - Technology Readiness Metrics • Tech Transfer Requirements for Commercialization – Partnerships for Integrated Platform Solution Transfer, License Capstone Project
  • 11. OVERVIEW OF END TO END INNOVATION COMMERCIALIZATION PROCESS - THE TIME TO MARKET (TTM) PROCESS - CAPSTONE PROJECT FOLLOW THE TTM PROCESS
  • 12. Slide 12 Typical University Commercialization Process Capstone Project
  • 13. Slide 13 slide # 18 Platform Element Proposals Product Proposals Product Proposals Market Attack Plans Corporate Planning Process Portfolio Planning, RD&E Prioritization, and Pipeline Management Market Attack Plans Commercialize Select Mature Filter Scan Research Portfolio Platform Pipeline Product Pipeline Deliver Value in Global Markets Grow Revenue & Profits in Current and New Markets Delight Customers Revenue Tim e $ Product Proposals Platform Element Proposals Corp Market Portfolio Strategy Vision Group Market Portfolio Strategy Vision Tools / Engineering Environment / Info systems Management Systems / Decisioning / Metrics Voice of the Customer / MarketCapabilitiesandLearning Company/TeamOrganization/Culture Global Markets GlobalEconomy World-wide Supplier Base AllAvailableTechnologiesCompetition End to End TTM Phases Core Competencies / Skills and Knowledge / Resources Phases 1 & 2- Technology Maturity Technology Commercialization Capstone Project
  • 14. Slide 14 Confirm Phase 1 Key Requirements for Technology Transfer – MAP, TPP, PPP and Tech Readiness (Phases 0, 1,2) Product Vision Market Attack Strategy Platform Strategy Ph 2 Ph 3 Ph 4 Product Pipeline Strategy Launch A ABCD EF G B C D E F G A B C D E F G H I BCDEFG HI A B C D E F GA BCDEF G A BCDE F G H I A B C D E F G H IA Reuse Balance & Select Deliver TTM Solution Proposal -MAP Ph 5 Technology Maturity Technology Readiness -Transfer Phase 0
  • 15. Slide 15 Time-To-Market Overview Principles and Values  The TTM Program is an empowering framework of action that brings together industry best practices, while encouraging innovation enabling tailored implementations to be adapted to a variety of value-added business models.  Robust market-oriented front end for developing the Market and Product Strategy Vision and Market Attack Plans integrated with technology and value chain strategies and plans are fundamental to strategic management of the company  Customer first... focused on understanding what is needed to delight customers and achieve market success, with strong feedback linkages to the process “front end”.  Technology and Value Chain technology elements are matured and delivered, as reusable offering platform elements, through the use of a defined technology delivery process.  Offering-platform-based offering development, delivery and on-going support of the offering offerings in defined target markets over time .  Offering Programs are to be planned at benchmark or best-in-class schedules based on the TTM newness / complexity matrix.  Extensive, continuous use of customer feedback in each phase of the TTM Process.  Organizational learning and knowledge transfer is captured and applied to improve productivity and performance over time. Capstone Project
  • 16. BEST PRACTICES CAPSTONE PROJECT - Market Attack Plan - Delivering Ready Technology - Staging for Tech Commercialization – Extended Enterprise Partnership Planning
  • 17. Slide 17 Technology Delivery/Transfer – Staging for Commercialization Technical Reviews Market Attack Plan MPSV Develop MAP Document VOC Prioritization Assess Business Process Change Needs Plan Business Process Changes Document Gaps to Requirements Validate Deployment Plan Share Lessons Learned Verify Performance Enable Benefits Plan DeploymentDevelop MPSV Phase 1.0 Define Phase 0 MPSV Phase 4.0 Demonstrate Phase 3.0 (Gate 2) Design Phase 2.0 (Gate 1) Define Phase 5.0 Deliver and Delight Complete Business Process Changes Validate Business Process Changes Perform Coherence Activities Create Plan for end user Solution Proposal Solution Definition Solution Design Stability Solution Deployment Readiness Solution Production Readiness Document Customer Business Reqs Document Detail Requirements Assess Technology Prove Technology Validate Technology Document Business Case Update Business Case Validate Business Case Engage Partners Select Initial Metrics Update Metrics Commit Metrics Validate and Measure Metrics Reliability and Service business Metrics MAP Ready Technology Commercializing Technology Extended Enterprise/Partnership
  • 18. Slide 18 What is the Front End – MAP Output Front End Is: • Market-based • Data-driven • Integrated framework for cross- functional planning and execution • Intended to deliver increased profitable growth • Collection of industry best practices • Customizable to fit different situations/business needs • Internally created strategy to ensure buy-in MAP Questions: • What are competitors offering • Is there an opportunity For your Company • What do we need to do to take advantage of this opportunity • Is this a profitable business (TTM metrics QCD’s)
  • 19. Slide 19 Acquire Voice of the Customer (VOC) – Opportunity Exist? WHO IS MY CUSTOMER? GOAL: UNDERSTAND AND FOCUS ON THE VOICE OF THE CUSTOMER Industry Analyses Customer Profiles Product Positioning Market Segmentation Managers Engineers Sales People Service Representatives HOW CAN I LISTEN? Competitive Product Analyses Customers Surveys 1-on-1 Customer Interviews Focus Group Interviews Complaints/Failure Analyses QFD HOW DO I INTERPRET? WHO SHOULD LISTEN? Capstone Project
  • 20. Slide 20 Three Key Items for the TTM ‘Front End’ (MPSV) S A N A L Y I S R E S P O N S E M A R K E T STRATEGIC BU PARTNERSHIP Customer Needs Analysis Size, Growth, Trends Segmentation Competitor Analysis Competency Analysis Economic Case Value Chain Plans supply chain, channel & marketing programs Value Proposition Vector of Differentiation Capstone Project 1.Market Attack Plan (MAP). Includes Partnerships Plans 2.Technology Platform Plan 3.Product Platform Plan Product Lines & Platforms
  • 21. Slide 21 Develop Upper Right Quadrants (URQs) – IP & Business Strategies
  • 22. Slide 22 Ex: Upper Right Quadrant Capstone Project
  • 23. Slide 23Capstone Project Ex: Upper Right Quadrant
  • 24. Slide 24 Scanning SET factors Leads to POGs (Product Opportunity Gap)
  • 25. Slide 25 Ex: SET Factors for Margaritaville Frozen Concoction Maker
  • 26. Slide 26 Ex: Part Differentiation Matrix (PDM) for a Vehicle
  • 27. Slide 27 What is SWOT SWOT is a summary of your Strengths Weaknesses Opportunities Threats Internal External Capstone Project
  • 29. Slide 29 Develop Lean Canvas Project Name Date: Iteration #x Cost Structure Customer Acquisition costs Distribution costs Partnerships Integration People, etc. Revenue Streams Revenue Model Life Time Value Revenue Gross Margin Problem Top 3 problems Solution Top 3 features Key Metrics Key activities you measure Unique Value Proposition Single, clear, compelling message that states why you are different and worth paying attention Unfair Advantage Can’t be easily copied or bought Channels/Partnershi ps Path to customers Customer Segments Target customers PRODUCT MARKET Capstone Project
  • 30. Definitions Product Platform Planning The PPP is our roadmap for a set of related products with common elements and architecture. They are a way of organizing thoughts about products and the technologies they contain. Product platforms provide a meaningful level of aggregation of individual product and technology projects. Technology Platform Planning The TPP is our roadmap for core technologies and innovations required to support the PPP and the MAP. The TPP is a set of projects and initiatives for the development of a technology that will provide the technical basis for building and sustaining a competitive advantage.
  • 31. Slide 31 Capstone MAP Table of Contents Section A: Summary Section B: Background I. Strategic Objectives II. Market Analysis III. Technology Analysis IV. Value Chain Analysis V. Related Initiatives Section C: Recommendations I. Target Segments and Vector of Differentiation II. Product Alternatives III. Product Offerings IV. Supporting Value Chain Strategies & Plans V. Skills and Resources Section D: Economic Case Section E: Monitoring Plan Capstone Project
  • 32. Slide 32 Identify Technology Delivery Requirements Requirements for Technology Transfer for Commercialization • Technology Capability Demonstration Best Practices • Technology Readiness (Maturity) Best Practices Capstone Project
  • 33. Slide 33 DEVELOP TECHNOLOGY ROBUSTNESS PLAN AND METRICS • Identify all Failure Modes and Control Factors for Failure Modes • Identify Integration Requirements • Identify Key Manufacturing Requirements • Prototype Planning - Description of Integration Performance Testing Capstone Project
  • 34. Slide 34 Technology Readiness / Manufacturing Readiness Design and Mfg. Process Stability Product QCDs Productivity Supply Assurance 3 Design & Specify Product 4 Demonstrate Product 6 Delight Customers 5 Deliver Product 1 Define Product Platform & Technology 3.3 Define Product 2 Define Product & Deliver Technology 0 MPSV Focus: TTM Technology Delivery Phases R&D Portfolio Management focuses on Phases 0, 1, 2 (do not preclude concurrent activity in the technology commercialization delivery process) Tech Transfer for Commercialization Capstone Project
  • 35. Slide 35 Technology Delivery/Transfer – Staging for Commercialization Technical Reviews Market Attack Plan MPSV Develop MAP Document VOC Prioritization Assess Business Process Change Needs Plan Business Process Changes Document Gaps to Requirements Validate Deployment Plan Share Lessons Learned Verify Performance Enable Benefits Plan DeploymentDevelop MPSV Phase 1.0 Define Phase 0 MPSV Phase 4.0 Demonstrate Phase 3.0 (Gate 2) Design Phase 2.0 (Gate 1) Define Phase 5.0 Deliver and Delight Complete Business Process Changes Validate Business Process Changes Perform Coherence Activities Create Plan for end user Solution Proposal Solution Definition Solution Design Stability Solution Deployment Readiness Solution Production Readiness Document Customer Business Reqs Document Detail Requirements Assess Technology Prove Technology Validate Technology Document Business Case Update Business Case Validate Business Case Engage Partners Select Initial Metrics Update Metrics Commit Metrics Validate and Measure Metrics Reliability and Service business Metrics MAP Ready Technology Commercializing Technology Extended Enterprise/Partnership – Most important Subprocess
  • 36. Slide 36 Technology Readiness What is Technology Readiness? Do I know how to manufacture a product capable of the required performance levels at the lowest cost? Not just an assessment of the goodness of a technology but also how well is it understood, and how the understanding yields lowest cost manufacturing methods. In other words, Technology readiness implies that the centerline of the design capability is centered on the manufacturing variability and the distribution of manufacturing variability remains within the design latitude.  Technology Readiness implies that the assessment of the problems set has been completed and there is no indication that a solution must be invented (beyond normal design engineering practice) for either the design or manufacturing process to achieve the specified performance. Manufacturing Variability Design Latitude that Yields Acceptance Performance Performance Failure Performance Failure Capstone Project
  • 37. Slide 37 Tech Readiness Requirements Best Practices CRITERIA Phase 0 – Analysis & Experiments Phase 1– Technology Capability Demonstrated Phase 2a - Technology Maturity Capability Demonstrated Phase 2b – Technology Robustness Verified LOW RISK CRITERIA MET 1. Failure Modes Modes Projected. Test plans approved Failure modes observed under Nominal short- run test conditions Failure modes identified under initial system/ subsystem life test and stress conditions Failure modes confirmed and initial testing of fixes completed on Integrated Test Rig (ITR) Failure mode solutions validated on product intent hardware. Criteria and measurements met. 2. Critical Parameter Development Parameters projected Sensitivity studies and optimization initiated Critical parameter first optimization and sensitivity studies completed. Failure modes controlled in design intent integrated hardware Critical parameter second optimization completed and fixes to defined failure modes confirmed. Critical parameter verified on ITR test. Criteria and measurements met. 3. Latitudes Latitudes projected and approach defined Process demonstrated at nominal set point Control parameter operating windows defined through test and analysis Control parameter latitude demonstrated under environmental and life stress conditions. Control parameter latitude verified on ITR test. Criteria and measurements met. 4. Manufacturabilit y - manufacturability confirmed with partner Preliminary parts manufacturability projected, UMC goals concurrence Evaluate critical parts manufacturability with partner involvement. New Mfg. capability requirements identified. Preliminary evaluation of projected critical specification tolerances completed. Process capability projected. Tolerance and variance analysis of design intent drawings completed. Supplier confirmation of manufacturability of critical specifications completed. Criteria and measurements met. 5. Prototype Performance Integrated technology robustness demonstrated Integrated technology rig requirements listed. Hardware designed. Hardware built and debugged. Operability, safety, consumables and environmental plans approved. Initial integrated test complete. Architecture stable. Prototype layout approved. Integrated test. Verification and tolerance tests completed under environmental stresses. ITR tests & life assessment completed. Criteria and measurements met.
  • 38. Slide 38 Key Phase 1 Requirements – Technology Capability Demonstration •Demonstrate key product technical requirements attributes can be achieved •Demonstrate ‘sustained performance’ with 70% confidence with typical ‘customer applications’ •Integrated technology operating window developed •100% of the CP’s nominal & 80% of the CP latitudes defined. •Tolerance allocations defined for all process critical components. •Mfg. Processes capabilities for critical components confirmed based on prototype database. •Life tests performed to project performance against targets. •System integration requirements documented. •Diagnostics for key/critical failure modes defined. •Performance projected against quality, cost and delivery schedule requirements •Technology operating document documented •Extended Enterprise Partner (s) identified for specific subsystem (s). • Integration design developed. •Environmental, health and safety requirements documented. Serviceability assessed •IP’s and right to use completed.
  • 39. Slide 39 Technology Readiness Development Steps 1. Develop Big Picture of selected technology set 2. Select subsystem design concepts 3. Complete failure mode analysis of each subsystem - Select critical parameters and noises 4. Define initial critical parameter set points for design intent 5. Define life testing requirements, input parameters, stress tests 6. Complete subsystem latitude development hardware design 7. Complete design analysis and drawing audit that demonstrates critical parameter conformance of hardware to design intent (Critical Parameter Drawing Audit) 8. Build latitude hardware and audit conformance of hardware to design intent (Critical Parameter Hardware Audit) 9. Build life testing hardware and start life testing 10. Complete first optimization using Taguchi latitude testing and operating windows - Optimize S/N ratio and define CP ranges 11. Upgrade failure mode analysis and CP set points and ranges 12. Complete integrated breadboard system design 13. Complete CP drawing audit, build. Complete CP hardware audit 14. Upgrade subsystem latitude hardware 15. Start production intent design (using all TTM design practices) 16. Complete system latitude testing 17. Complete second subsystem latitude optimization 18. Continue life testing 19. Upgrade production intent design (using all TTM design practices) 20. Upgrade failure mode analysis, CP set points and ranges - Final design intent 21. Complete CP manufacturability analysis - Demonstrate CP latitudes can be enabled by normal manufacturing process 22. Complete performance analysis - Predict performance compared to goals 23. Performance and manufacturability analysis are positive - Start design phase - If not, go back to step 12 Capstone Project
  • 40. Slide 40 Use Lean Six Sigma Tools MeasureMeasure • Operational Definitions • Data Collection Plan • Pareto Chart • Histogram • Box Plot • Statistical Sampling • Measurement System Analysis • Setup Reduction • Generic Pull • Kaizen • Control Charts • Process Capability, Cp & Cpk AnalyzeAnalyze • DOE Full & Fractional Factorial • Conjoint Analysis • RSM • Taguchi • Scorecards • Pareto Charts • C&E Matrix • Fishbone Diagrams • Brainstorming • Supply Chain Accelerator Analysis • Non Value-Added Analysis • Hypothesis Testing • Confidence Intervals • FMEA • Simple & Multiple Regression • ANOVA • Queuing Theory • Analytical Batch Size ImproveImprove • Brainstorming • Benchmarking • Process Improvement Techniques • Line Balancing • Process Flow Improvement • Constraint Identification • Replenishment Pull • Sales & Operations Planning • Poka-Yoke • FMEA • Pugh Matrix • TRIZ • ‘To-Be’ Process Maps • Piloting and Simulation ControlControl • Control Charts • Standard Operating Procedures (SOP’s) • Training Plan • Communication Plan • Control Plan • Visual Process Control • Mistake-Proofing • Process Control Plans • Project Commissioning • Project Replication • Plan-Do-Check- Act Cycle * Tool Array, based on LSS for Service by Michael George • Value Stream Map • Various Financial Analysis • Charter Form • Multi-Generational Plan • Stakeholder Analysis • Communication Plan • SIPOC Map • High-Level Process Map • Non-Value Added Analysis • VOC and Kano Analysis • QFD • Pareto Charts • RACI & Quad Charts DefineDefine MeasureMeasure • Operational Definitions • Data Collection Plan • Pareto Chart • Histogram • Box Plot • Statistical Sampling • Measurement System Analysis • Setup Reduction • Generic Pull • Kaizen • Control Charts • Process Capability, Cp & Cpk MeasureMeasure • Operational Definitions • Data Collection Plan • Pareto Chart • Histogram • Box Plot • Statistical Sampling • Measurement System Analysis • Setup Reduction • Generic Pull • Kaizen • Control Charts • Process Capability, Cp & Cpk AnalyzeAnalyze • DOE Full & Fractional Factorial • Conjoint Analysis • RSM • Taguchi • Scorecards • Pareto Charts • C&E Matrix • Fishbone Diagrams • Brainstorming • Supply Chain Accelerator Analysis • Non Value-Added Analysis • Hypothesis Testing • Confidence Intervals • FMEA • Simple & Multiple Regression • ANOVA • Queuing Theory • Analytical Batch Size AnalyzeAnalyze • DOE Full & Fractional Factorial • Conjoint Analysis • RSM • Taguchi • Scorecards • Pareto Charts • C&E Matrix • Fishbone Diagrams • Brainstorming • Supply Chain Accelerator Analysis • Non Value-Added Analysis • Hypothesis Testing • Confidence Intervals • FMEA • Simple & Multiple Regression • ANOVA • Queuing Theory • Analytical Batch Size ImproveImprove • Brainstorming • Benchmarking • Process Improvement Techniques • Line Balancing • Process Flow Improvement • Constraint Identification • Replenishment Pull • Sales & Operations Planning • Poka-Yoke • FMEA • Pugh Matrix • TRIZ • ‘To-Be’ Process Maps • Piloting and Simulation ImproveImprove • Brainstorming • Benchmarking • Process Improvement Techniques • Line Balancing • Process Flow Improvement • Constraint Identification • Replenishment Pull • Sales & Operations Planning • Poka-Yoke • FMEA • Pugh Matrix • TRIZ • ‘To-Be’ Process Maps • Piloting and Simulation ControlControl • Control Charts • Standard Operating Procedures (SOP’s) • Training Plan • Communication Plan • Control Plan • Visual Process Control • Mistake-Proofing • Process Control Plans • Project Commissioning • Project Replication • Plan-Do-Check- Act Cycle ControlControl • Control Charts • Standard Operating Procedures (SOP’s) • Training Plan • Communication Plan • Control Plan • Visual Process Control • Mistake-Proofing • Process Control Plans • Project Commissioning • Project Replication • Plan-Do-Check- Act Cycle * Tool Array, based on LSS for Service by Michael George • Value Stream Map • Various Financial Analysis • Charter Form • Multi-Generational Plan • Stakeholder Analysis • Communication Plan • SIPOC Map • High-Level Process Map • Non-Value Added Analysis • VOC and Kano Analysis • QFD • Pareto Charts • RACI & Quad Charts DefineDefine • Value Stream Map • Various Financial Analysis • Charter Form • Multi-Generational Plan • Stakeholder Analysis • Communication Plan • SIPOC Map • High-Level Process Map • Non-Value Added Analysis • VOC and Kano Analysis • QFD • Pareto Charts • RACI & Quad Charts • Value Stream Map • Various Financial Analysis • Charter Form • Multi-Generational Plan • Stakeholder Analysis • Communication Plan • SIPOC Map • High-Level Process Map • Non-Value Added Analysis • VOC and Kano Analysis • QFD • Pareto Charts • RACI & Quad Charts DefineDefine
  • 41. Slide 41 Ex: Image Quality Variability - Root Cause Analysis Machine -Media & Transport Environment -Aerodynamics Material/Machine – Jets Within PH Machine - Tiled JM Overlap Method - Image Data Algorithm PH stitched drops fail to meet cross track spec of +/-10 mm In Track error Media to brush roll height Cross Track error Tach and Cue Drier air flow PH airflow with image content Web speed JM to JM positioning Neighboring drop flight interactions DC servo variation Silicon rev Ink concentration control DC airflow with end jets DC servo variation JM to JM Error in data collection – cameras, cue sensors, Stitch Correction Algo Nozzle diameter variation Pressure comp Measurement_- Test Target, Data collection, Analysis Representative test target Image data (pixel shift) algorithm Data analysis Media dimensional change BP Temp effects DC position variation Ink/Media surface energy changes
  • 42. Slide 42 5 Why’s Fishbone (cause/effect) Diagram: The fishbone diagram helps with exploring all potential or real causes that result in a single defect or failure mode. Once inputs are established on the fishbone, can use the 5 Whys technique to drill down to the root causes. The 5 Whys is a technique used in the Analyze phase of the Six Sigma DMAIC (Define, Measure, Analyze, Improve, Control) methodology. By repeatedly asking the question “Why” (five is a good rule of thumb), you can peel away the layers of symptoms which can lead to the root cause of a problem. Step 1: Example: Long start up time for a product defines the issues (Head of the fish). Agreement on the issue definition is needed to solve it (the various bones for the fish). Step2: Ask why; what is causing that issue (the various issues on the bone of the fish). Write down the symptom (most direct reason) for that issue and get agreement before proceeding. Ask why again and agree on the cause of the issue. Repeat this until you have asked why typically 5 times to get to the root cause.
  • 43. Slide 43 5 Why’s Project Name Failure Analysis for long start up Research #4 Team Date Issue Description Enter the agreed upon issue description. Ex: Engine will not start when cold 1. Why is it happening? Enter the most direct symptom/cause of the issue: Ex: Lubricant viscosity too large 2. Why is it happening? Enter the direct symptom/cause of the answer listed in the box above 3. Why is it happening? Enter the direct cause of the answer listed in the box above 4. Why is it happening? Enter the direct cause of the answer listed in the box above 5. Why is it happening? Enter the root cause of the answer listed in the box above
  • 44. Slide 44 Ex: Problem Management Process (PMP) - Definition PROGRAM ASSESSMENT MATRIX DESCRIPTIONS PROBLEM SOLVING PROCESS 1 Identifying & Selecting Problem 4 Selecting & Planning Solution 3 Generating Potential Solutions 2 Analyzing Problem 6 Evaluating Solution 5 Implementing Solution Problem identified. No proposed solution. Problem not understood. Hypothesis proposed. Problem understood. Solution set proposed. Solution set defined. Verification tests incomplete. Verification tests complete. Solution set demonstrated PROGRESS Issue Category Critical Major Ordinary Impact Show Stopper Now! Could Become A Show Stopper An Annoyance Required Actions(s) Issue must be resolved, replan required Issue requires approved, corrective action plan, with an assessment of its achieveability when integrated with other corrective action plans into overall program plan (s) Manageable within normal day-to-day activites PHASE TRANSFER IMPLICATIONS I M P A C T Critical Major Ordinary 1 2 3 4 5 6 PROGRESS AND IMPACT SatisfactoryDiscretionaryAdditional actions required Capstone Project
  • 45. Slide 45 Ex: Problems / Issues Severity –IJ PH IMPACT 1. Identifying & Selecting Problem 2. Analyzing Problem 3. Generating Potential Solutions 4. Selecting & Planning Solution 5. Implementin g Solution 6. Evaluating Solution Critical (Show Stopper “Now”) Ink Handling Design Initial Fill , time t =0 performance Ink Cp’s optimization (ES process physics) Major (Potential barrier to subsequent phase transfer – could become a show stopper) Drop formation CP’s identification & modeling verification, design for energy efficiency Print head packaging design (mech., elect., fluidics) Ordinary (Minimal impact on QCDs) Capstone Project
  • 46. Slide 46 P- Diagram (Input Output Constraint Transformation Function) OUTPUTS (O) LATITUDEINPUTS (I) Primary Dysfunctional From a Subsystem or Manufacturing Process: Failure Mode Failure Mode Main Function: The purpose of the subsystem / system Primary Inputs: Any action, physical object, or energy that needs to be supplied for the main function to perform its intended purpose Dysfunctional Inputs: Any action, physical object, or energy which may limit or prevent the subsystem from performing its intended purpose The variation in all inputs are termed external noises Primary Outputs: Measurable performance the subsystem is intended to provide. Also called the ‘Primary Response’ Dysfunctional Output: By-products from the subsystem performance which may be Dysfunctional Inputs to other subsystems Constraints: Key program requirements that impact the design Latitude : The output variation remains within the boundary of the failure modes when the design is subjected to expected levels of input variation (from noise factors) Failure Mode: The deficiency which occurs when the output performance no longer meets the reqmnts CONSTRAINTS (C) MAIN FUNCTION Capstone Project
  • 47. Slide 47 EX: IJ Printer Maintenance Station I/O/C MS INPUTS From Maintenance Vacuum pressure, 50 – 200 mm Hg (gage) Vacuum Dwell time, 2 – 10 s Capping Force, 25 – 50 gF/cm Wiper blade force, 25 - 100 gF/cm Spitting Wave form, 100 – 150% WS threshold OTHER SUBSYS INPUTS Printer: Carriage Scan Speed, 15 – 30 IPS Carriage Acceleration < 2 g’s Ink: Surface Tension, 20-45 dynes/cm  pH 7 – 9.5 Viscosity, 1 – 2.5 CP @ 24 0 C, 50RH Re-dissolution  2 (scale 1-5) % Pigments, Humectants –ref. Ink design Print Head: Nozzle dia 10 – 20 um # of nozzles/col, native res – 640/1200 DPI Ink/PH front face wetting angle, 10 – 75o Ink tank: Static pressure < 0.25” water vacuum (gage) MAIN FUNCTIONS: Maintain Printhead health over 5year at 4 corners temp 150C - 350C, RH 20%-80% •Initial ink install •Ink tank / PH replacement •Remove clogged/crusted inks in nozzles •Spitting for Latency •Wiping to maintain PH nozzle face •Capping of print head during standby/storage •Waste ink management SECONDARY FUNCTION •Protect PH and prevent waste ink spill after printer install OUTPUTS: To IQ: Dot size back to WS spec Drop Directionality back to WS spec To PH : Recover missing nozzles due to ink clogs and crust w/ 99% confidence on first clean operation Recover misdirected nozzles due to front face contamination w/ 99% confidence Remove debris & paper fiber from PH face To Firmware: Ref. MS algorithms document UNDESIRED OUTPUTS: •MS induced cross contamination & air bubbles •PH front face wear •MS induced noise <45 dB ? •Ink spatter or aerosol in maintenance areas •MS ink leakage from storage areas, 0 cc over life MS CONSTRAINTS: UMC < $5 Life of components ~ 5 years Standby/storage mode - no maintenance Waste ink usage <15% printable ink Waste ink diaper size < 800 cc SYSTEM CONSTRAINTS Ink Re-dissolution < 2 (scale 1-5) Ink Latency > 5 sec PH front face flatness < 0.25 mm HSE Compliance Contamination from Mfg. & PH usage <5 ppm, 2 um size internal)
  • 48. Slide 48 EX: Ink Subsystem Design Inputs: Drop Ejector Requirements Colorant concentration ( all colors) Surface tension Viscosity Density pH Contact Angle wrt front face Dissolved gas Ink Delivery (Ink tank) Requirements Viscosity Gas permeability Surface Tension Solubility Maintenance Requirements Solubility Viscosity Media Set Requirements Photo reqmnts Plain Paer reqmnts Ambient Drying Requirements Surface Tension % water by wt % co-solvent Viscosity Duplex Requirements % water, % co-solvent Usage conditions & Design Noise Standby/ sleep mode Ink supply variation during printing Machine RH, Temperature Ink Raw Materials variability Outputs: Measuring and monitoring to ensure product goals are met. Jettability Performance Drop volume, velocity, Jitter, FMax Maintainability Performance Latency, washability, solubility, Recoverability IQ Perfromance Spot size,Dmax, Dmin, Raggedness, , ICB, Mottle, Gamut, Cockle, Curl, Smear (wet & dry), misting, W’fast, L’fast Drying Performance Ambient Dry Time Duplex Performance Strike-thru Properties Stability Shelf Aging Ink composition in device over time Ink properties over time in ink delivery subsystem Materials life: Components life exposed to ink Main Functions:  Deliver ink set that achieves the following in Printer System Architecture: jetting performance, IQ performance on media set, acceptable life of all materials in ink path, acceptable print head maintainability and operability Constraints: RTU HSE Materials Compatibility Properties stability at operating temperature Stability over life UMC Time To Ink Flush (design nominal) Manufacturability Supply Assurance/ Quality
  • 49. Slide 49 Ex: Process Physics, Drop Formation CP’s INPUT From Drop Formation Amplitude. Nom +/- V  pulse width  # of pulses  pulse position odd vs even  odd-even phase shift (static & dynamic) From DC •Pos excess air •Neg air •Catcher vacuum From WSO Ink pressure, From Ink Viscosity, ? CP @ 24 0 C, 50RH From System Ambient, 150C - 400C, RH 20%- 80% DOE TO VERIFY: Quality of catch drops and print drops •Small drops in catch •Large drops exit PH •Large drops momentum MEASURED OUTPUT RESPONSE Drop Formation Response •1x l/d , Nom 4.5, +/- 0.3 (Typically 3.9 to 4.2) • Small Drop Merge : At 2.5 mm below the nozzle plate, the merge rate should be less than 1 out of 1,000,000 drops •3x  Large Drop Formation Length ( <1200 microns)  1x to 3x merges (no merges before 2.5 mm)  Satellites: (Distances from Nozzle Plate) Sat. Merge Distance (< 700 microns )  Sat. Flight Time ( < 110 microns)  Sat. Volume ( > 0.1 pL)  Measurement: no satellite filter collection after 30 minutes of continuous running  6 hour runability test  No Print window degradation  No Ink accumulation on Condensation Shield Drop Control: PW, > 1.5 inches of Water Spits, <# 0,25 mm/1000 prints IQ Response (Measured) Horizontal line quality Vertical line quality Spot size, 56 +/- 5mm IQ Response (Qualitative Measure) •Pattern dependent X-talk, <? (see 1x above) •Air flow defects DYSFUNCTIONAL OUTPUT: •Pepper Spray, Less than 2 per square inch at 656 ft/min •Catcher spitting, <0.5x0.5 mm NOISE: From Ink Viscosity, 1.5 +/- CP Surface tension % solids pH 7, 9.5+/-? From JM NP hole size From Customer Job •Image type •Pattern From Mfg •Contamination •Parts tolerance From Service •Parts positioning System Config Constraints •Test with Condensation solution •ASV box •Air system •Web at speed •Drier set points From Environment •Temp range •RH range •Contamination
  • 50. Slide 50 Ex: Critical Parameter (CP) Tracking List CP = Critical Parameter to monitor process function not found on a drawing CS = Critical Specification found on drawings monitored at new build or audits CRITICAL PARAMETER DEVELOPMENT CRITICAL PARAMETER IMPLEMENTATION S/S Parameter Description CP or CS 1 Units Critical Parameter Value Set Range Comment / Failure Modes/Outlook/ Schedule/Technical Testing Capability Nom Range Current Nom/ (Date) 2 Capstone Project Catcher film thickness CP micron s 400 +/-20 Stray drops on media Drop volume CP picoL 9.5 +/-0.25 White space, DD
  • 51. Slide 51 • Parts variability • Resources to qualify for IQ defects • Correlation between test stands • Spitting • Parts scheduled delivery next week, • IQ Artifact • Tests Completed on test stand • Analyzed Service Calls Data & Identified Contributors to IQ • Reviewed Manufacturing data • Top integration issues identified • Integration initiatives priority o Process Physics Development oSpitting o IQ defects o • Continue Process Physics Development • Testing of modified parts • Fabricate and test DOE parts • Gather more failures from customer sites Ex: Integration Robustness MBF Key Deliverables Recent Accomplishments Plan (next 30 days) Issues / Risks / Help or Decision Needed Capstone Project
  • 52. - Open Innovation Model for Tech Transfer Develop Strategy for Tech Transfer - Extending the R&D Enterprise through Partnerships
  • 53. Slide 53 Extended Enterprise Relationship to other TTM Sub- processes Program Planning & Management 3.1 3.2 3.3 3.4 3.5 3.6 Customer Input & Validation Platform Planning & Management Economic & Business Case Financials Requirements & Specifications Technology Systems Engineering Integrated Testing - Internal / External Standards & Regulatory Compliance Globalization Performance Metrics & Measurements Marketing / Sales & Distribution Manufacturing & Logistics Third Party Arrangements (OEM and JV) Launch Customer Services & Support Skills & Resource Planning 3 Customer Satisfaction & Loyalty MPSV 3.2 Define Product & Deliver Technology 3.1 Define Market Attack Plan & Technology 3.3 Design Product 3.4 Demon- strate Product 3.5 Deliver Product 3.6 Delight Customers Market & Product Strategy Vision Sub-Processes Core Process Subsystems Engineering Extended Enterprise 7 5 1 2 4 6 8 9 10 11 12 13 14 15 16 18 19 20 17 (HW/SW, Supplies, FW/Elex) Capstone Project
  • 54. Slide 54 Extending The Enterprise -Partnership/Open Innovation Model for R&D and Design and Manufacturing Former approaches: Product development has used several approaches: •Complete build-to-print •Sourcing to original equipment manufacturers (OEMs) •Joint Ventures (JVs) with other manufacturers The Extended Enterprise is . . . •The utilization of global supplier relationships for component, subsystem, and module design and manufacturing •R&D Tech Transfer to enable maximum leverage of expertise and significant improvements in product cost and TTM factors Close existing gaps with existing enterprise: •Engage appropriate partners •Optimize partner value contribution •Leverage unique product and process capabilities •Access production and purchasing scale •Retain ownership of proprietary technologies and critical product development areas Capstone Project
  • 55. Slide 55 Extended Enterprise Partnership Extended Enterprise is not “outsourcing” Extended Enterprise retains strategic internal control over: • Areas that are critical to sustainable competitive advantage • Product strategy, development, and execution • Product synthesis • Product development management • Systems engineering and integration Capstone Project
  • 56. Slide 56 Extended Enterprise: A TTM sub-process Extended Enterprise Deployment through out TTM 3210 54MPSV Company defines: • Market / business strategy • Core competencies and strategic enabling technologies • Market Attack Plans and Product Strategies • All sources of technology (internal and external) • Company specifies product (core competencies) • Company develops a set of strategic partners that: Deliver technology Design non-strategic elements Manufacture those elements • Company designs strategic elements and modules • Company becomes world class in: Systems Design Systems Architecture Systems Engineering and Integration Company controls (core competencies) • Launch • Final integration at Company or non-Company sites Company optimizes back end Extended Enterprise partnerships: • Distribution • Order fulfillment • Service and support Capstone Project
  • 57. Slide 57 CRITERIA COMMENTSEX: PARTNER RATING FOR SELECTION Low 1 2 3 4 Hig h 5 (Quantify where possible) TECHNICAL CAPABILITIES Device Research, Design & Development • Number of RD&E personnel (researchers, engineers, technicians, designers, etc.) X - approximately 60-70 people working on MEMS development at any one time (analysis, design, prototyping, testing / characterization) - other skilled supporting resources available (expertise, tools, etc.) •Skills & experience base of RD&E personnel X - MEMS capabilities include; Surface micromachining process (SUMMit), Micromolding (High Aspect Ratio Structures), Integrated Electronics / Mechanics, Sealed Diaphragm, Phtonics / MEMS - Skills, breadth of capabilities, experience appears very high ….. analysis, design, test and prototype fabrication; - Ph.D. & Master level engineers & scientists – microelectronic & micromachining process development – equipment design – materials engineering – device physics – chemical engineering – failure analysis & reliability physics – circuit design, computer science, etc. • Development Process - Definition & Documentation - Cycle Time & Resource Guidelines - Project Planning Process - Process Flexibility - Design & Development Practices X Typically uses gov’t / MIL–Std type of requirements and phased development processes, relatively high level of documentation … appears OK but such processes have not typically been known for benchmark TTM resultsCapstone Project
  • 58. Slide 58 Capstone Project Desired Outcome • Carefully Manage the TTM Front end and Technology Delivery Phases • Monitoring Top Problems (Root Cause analysis, CA’s, etc)  Managing for Results – Meet VOCs and QCDs  Effective Knowledge Transfer for Licensing, Tech Transfer and for Commercialization – Technology Readiness Capstone Project
  • 59. Slide 59 Tech Positioning- Upper Right Quadrant (URQ) Existing New Market Technology SustainingDisruptive Highest Risk Lowest Risk Capstone Project Capstone
  • 60. Slide 60 Summary: MAP Partnership Teams Integration –I/O/C Team Co-Dev Function: -Overcome Perceptual Gaps -Focus on VOC -Use TR knowledge -Execute TTM Input Output Global Cross functional Incentives Processes Competition Tech Comm Best Practices Co-Development 4/19/2016
  • 61. Slide 61 Successful Today’s Innovators – Capstone Team