ハードウェアメーカーならでは(笑)実機あり！ Azure IoT Edgeデバイス / Edge Server Update

2019 Lenovo Enterprise Solutions Ltd. All rights reserved.
ハードウェアメーカーならでは(笑)
実機あり！ Azure IoT Edgeデバイス /
Edge Server Update
レノボ・エンタープライズ・ソリューションズ株式会社
ソリューション・アライアンス本部
米津直樹

OSのプログラマーからITキャリアスタート。
業務開発、データセンター構築、ネットワーク技術講師、VoIP
ペイメントプラットフォーム法人営業等経験
米津直樹
NAOKI YONEZU Program Manager of Alliance / Solution & Alliance Division
Our Journey
1992
2018
2

Lenovoの沿革 - IBM PCから、多様性を持った総合ICT企業へ
3

2018 Lenovo Restricted. All rights reserved.
ThinkCentre Nanoシリーズ
一般パソコン用途
通常PC及びOffice IoT向け Edgeコンピューティング/IoT/組込み向け
ThinkCentre M90n-1 Nano ThinkCentre M90n-1 Nano IoT
4
設置場所を選ばず、豊富なマウント系オプションをご用意
Core i7, i5, i3 Core i3, Celeron
Edge IoT/組込み用途動作温度0~35℃ 動作温度0~50℃
机上スペースを最大限に確保超小型筐体約0.35L 超小型筐体約0.55L

ThinkCentre史上最小サイズ：M90n-1 Nano
88mm
179mm
23.5mm

ThinkCentre史上最小サイズ：M90n-1 Nano IoT
34.5mm
88mm
179mm
42.7mm

ThinkCentre M90n-1 Nanoシリーズ：スペック概要
製品名 ThinkCentre M90n-1 Nano ThinkCentre M90n-1 Nano IoT
プラットフォーム Intel 8th WhiskeyLake-U / ファンあり Intel 8th WhiskeyLake-U / ファンなし
動作温度 0~35℃ 0~50℃
プロセッサー Core i7 / i5 / i3 Core i3 / Celeron
Intel vProテクノロジー対応 (Core i7 / i5 vPro CPU搭載時) 非対応
メモリ(スロット) 最大16GB(1DIMM) 最大8GB(1DIMM)
セキュリティチップ H/W TPM (TCG2.0) H/W TPM (TCG2.0)
前面インターフェース USB 3.1 x2, USB-C x1, コンボジャック x1
USB 3.1 x2, USB-C x1, コンボジャック x1,
シリアルポート x2
背面インターフェース USB-C x1, DisplayPort x1, LAN x1 USB-C x1, DisplayPort x1, LAN x2
内部拡張ベイ M.2 x3 (SSD x2, WiFi x1) M.2 x4 (SSD x2, WiFi x1, LTE x1)
無線通信機能 WiFi+Bluetooth WiFi+Bluetooth / LTE(4G) / Lora
電源 65W ACアダプター 65W ACアダプター
キーボードから電源起動対応非対応
MIL-Spec (STD 810G) 対応対応
筐体サイズ幅x高さx奥行(mm)：179x22x88 幅x高さx奥行(mm)：179x34.5x88
本体質量 505g 720g

SE350 Edge Server
Azure Stack HCI認定ハードウェア
Intel Xeon Dプロセッサー（最大16コア）
最大256GBメモリ、16TB内蔵ストレージ
AI推論処理向けGPUをサポート
ワイヤレスネットワークをサポート
サイバーセキュリティ対策
省スペース設計・様々な環境に設置可能
3.75Kgの軽量設計
動作温度：0～55℃、耐衝撃性、耐振動性
新発売
エッジコンピューティング環境に最適なx86サーバー
Azure Stack HCI 2node構成で44万IOPs！

コードネーム「Hodaka」、日本人技術者が携わる製品
https://www.youtube.com/watch?v=4WQj_L_lmGk

Ignite 2019 Windows Server: What's new and what's nextにて
“This is the future of edge computing.”と紹介
https://myignite.techcommunity.microsoft.com/sessions/81704?source=sessions

Compact Footprint

SE350 Mounting Options
DIN Rail Wall Mount Bookshelf Mount
Stacking MountDesktop Stand
Ceiling Mount

SE350 Edge Server Specifications
Mechanical, Power, & Cooling
Chassis:
• 1U, ½ width, 40mm H x 214.6mm W x 376mm D
Weight:
• 3.75kg (8.26 lbs)
Mounting:
• Floor stand, DIN Rail or Wall mount
• Standard rack enclosure (1U, 2Node)
Power options
• Dual-redundant external power supplies 110-240V
AC
• Single DC supply : -48V input
Fans:
• 3x 40mm fans (non-hot swap; redundant)
Environmental, shock and vibration
Certification:
• NEBS Level 3 (1U2N Rack configuration)
• MIL-STD-810G
Operating temperature:
• 5°C up to 45°C
• 0°C up to 55°C (extended operating temp config)
Storage:
• -30°C to 60°C
Humidity:
• 95% non-condensing
Operating Shock (SATA):
• IEC 60068-2-27, 30G half sine, 11ms duration
Operating Vibration (SATA):
• IEC 60068-2-64, 3Grms random 5-500Hz 1 hr / axis
System
CPU:
• Intel Xeon-D2100
• 4, 8, 16 core and QAT and 12 core models
GPU:
• Optional NVIDIA Tesla T4
Memory:
• 4 channels per CPU
• 1 DIMM per channel
• Up to 256GB, 4x 2133/2400/2666 TruDDR4
Boot Drive (M.2 22110, RAID):
• 2x M.2 SATA (RAID) / 1x M.2 SATA
Connectors:
• Front: 1x VGA, 2x USB 3.0, 1x mini-USB
management
• Rear: 1x serial, 2x USB 2.0
Security:
• TPM 2.0
• SED, Encryption key locking on tamper/theft detect
• Locking bezel; LTE & WiFi Security
Storage & Expansion
M.2 22110 NVMe/SATA Non-RAID (NVMe in
October)
• 4x M.2 22110 NVMe/SATA drives
• 8x M.2 22110 NVMe/SATA drives (uses PCIe slot)
• Options for High temp, capacity, and endurance
• Mirroring for Data (Dec)
Expansion:
• Low profile PCIe 3.0 (x16) Up to 75W
Networking
Networking Options
• 10G SFP+ LOM Package
• 2x10GbE SFP+ via Xeon D
• 2x 10/100MB/1GbE ports via Intel i350
• 2x 1GbE management
• 10G 10-baseT LOM package (Available
December)
• 2x10G-base T via Xeon D
• 2x 10/100MB/1GbE ports via Intel i350
• 2x 1GbE management
• Wireless enabled LOM package
• 2x10GbE (SFP+), 4x 10/100/1GbE ports
(2xSFP, 2xRJ45)
• 1x 1Gb RJ45 dedicated to management
• Optional Wireless, WiFi 64/128-bits
encrypted WEP, WPA, WPA2, 802.11
a/b/g/n/ac
• Optional Cellular, LTE 3GPP Release 12
450Mbps DL/50Mbps UL
System Management & warranty
• XClarity Administrator with mobile option
• XClarity Energy & Provisioning Manager
• XClarity Essentials
• 1, 3 year base, extendable to 5 year warranty
Operating Systems
• Ubuntu 16.04, 18.04
• Windows Server 2016, 2019(Azure Stack HCI)
• RHEL 7.6, 8.0
• SLES 15
• VMware vSphere(vSAN)
Items in Grey – Post Ship Support

SE350 Available CPUs
• Intel Xeon D-2123IT Processor , 4Core, 60W, 2.2GHz
SE350 Phase II CPUs (December 2019)
• Intel Xeon D-2166NT Processor , 12Core, 85W, 2.0GHz
The Intel® Xeon® D-2100 processor brings the
advanced intelligence of the Intel® Xeon® Scalable
processor architecture into an optimized, dense,
lower-power system-on-a-chip (SoC) form factor for
environments constrained by space and power.
Intel® Xeon® D-2100 supports 4 memory channels
https://ark.intel.com/content/www/us/en/ark/product
s/series/87041/intel-xeon-d-
processor.html#@Embedded
SE350 Available Memory options
• 8GB ThinkSystem 8GB TruDDR4 2666 MHz (1Rx8 1.2V) RDIMM
• 64GB ThinkSystem 64GB TruDDR4 2666 MHz (4Rx4 1.2V) LRDIMM
4 DIMM slots, with installation sequence 1, 4, 2, 3
https://lenovopress.com/lp1021-lenovo-thinksystem-
memory-summary
SE350 Processors and Memory

10G SFP+ LOM Package
• 2x dedicated 1Gb RJ45 BMC Management ports
• 2x 10Gb SFP+ (Intel CPU Embedded LAN)
• 2x 10/100/1GbEthernet RJ45 (Intel i350)
• 2x USB 3.0/2.0
• 1x D-Sub VGA port
• SFP+ port, can configured as shared NIC port
Wireless enabled LOM Package
• 1x dedicated 1Gb RJ45 for BMC Management port
• 2x 10Gb SFP+ (Intel CPU Embedded LAN)
• 2x 10/100/1GbEthernet RJ45 (Intel i350)
• 2x USB 3.0/2.0
• 1x D-Sub VGA port
• 4x External SMA Antenna ports
• Requires Wi-Fi + LTE
• Wireless port can be XCC management port
• 4G is supported at Launch, 5G planned late 2020
SE350 Networking LOMs

SE Storage – Boot Drives
SE350 M.2 boot enablement kit is optional
– System boots first available data drive when boot drives not
present
SE350 M.2 boot enablement kits
– Single M.2 enablement kit supporting one M.2 boot drive
– Dual M.2 enablement kit, supporting one or two M.2 drives,
with or without RAID controller (Sept 12th)
Available boot drive options
– ThinkSystem M.2 128GB SATA 6Gbps Non-Hot Swap
– ThinkSystem M.2 Industrial A600i 100GB SATA SED SSD
– ThinkSystem M.2 Industrial A600i 480GB SATA SED SSD
– ThinkSystem M.2 Industrial A600i 480GB SATA SSD

SE350 – Storage & I/O
Two types of riser cages to support storage and I/O
– M.2 Riser cage
- Select one or two ThinkSystem SE350 M.2
SATA/NVMe 4-bay Data Drive Enablement Kit
- At least one drive is required
- SATA cable is required with SATA drive
– PCIe Riser cage
- Supports an optional Low Profile PCIe
• NVIDIA Tesla T4 GPU
• Multiple LP PCIe I/O networking cards
- Requires one ThinkSystem SE350 M.2
SATA/NVMe 4-bay Data Drive Enablement Kit
- At least one drive is required
- SATA cable is required with SATA drive
Note: PCR in progress to enable open cage requirement

SE350 – Storage Options
Micron
5100
PRO
SED* ThinkSystem M.2 480GB 5100 Pro SATA SED SSD
SED ThinkSystem M.2 960GB 5100 Pro SATA SED SSD
SED ThinkSystem M.2 1.92TB 5100 Pro SATA SED SSD
Non SED ThinkSystem M.2 5100 480GB SATA 6Gbps Non-Hot Swap SSD
Non SED ThinkSystem M.2 5100 960GB SATA 6Gbps Non-Hot Swap SSD
Non SED ThinkSystem M.2 1.92TB 5100 Pro SATA SSD
ATP
A600i
SED ThinkSystem M.2 Industrial A600i 480GB SATA SED SSD
SED ThinkSystem M.2 Industrial A600i 800GB SATA SED SSD
Non SED ThinkSystem M.2 Industrial A600i 480GB SATA SSD
Non SED ThinkSystem M.2 Industrial A600i 800GB SATA SSD
Intel
P4511
SED ThinkSystem M.2 650GB P4511 NVMe SED High Endurance SSD
SED ThinkSystem M.2 1TB P4511 NVMe SED SSD
SED ThinkSystem M.2 2TB P4511 NVMe SED SSD
Non SED ThinkSystem M.2 650GB P4511 NVMe SED High Endurance SSD
Non SED ThinkSystem M.2 1TB P4511 NVMe SSD
Non SED ThinkSystem M.2 2TB P4511 NVMe SSD
• Industrial drives support operating temperatures of 0-55C
• Intel NVMe drives have limitation on shock and vibration support
• Non-SED NVMe and RAID options available December 2019
*SED drives not available in restricted countries: Armenia, Azerbaijan, Belarus, China,
France, Georgia, Israel, Kazakhstan, Russian Fed., Turkmenistan, Ukraine, Uzbekistan.

SE350 Power Options
Dual 12VDC Input Power Adapter
• System can support maximum of 350Watts
• Each power adapter is 210-240Watts
• When power budget exceeds a single adapter capacity, power is drawn
from second adapter
• Example configurations power budget is likely to exceed a single adapter
capacity (two adapters are required)
• GPU is selected
• 16C CPU is selected
• >= 4 NVMe drives are selected
• 64GB TruDDR4 2666 MHz (4Rx4 1.2V) LRDIMM selected
• In case of failure of a single power adapter, system will throttle if power
budget is above a single adapter capacity
3-pin -48VDC Input Power Adapter
• Input Range from -40.8VDC to -72 VDC @ 8.4A
• Single Power Adapter Input
• Target Telco and Utilities use cases
• NEBS-L3 pending with target Feb 2020

ThinkSystem SE350 Activation
• User activates using own mobile device
• Other Activation methods available:
– Internet activation (user connects SE350 to network)
– Manual activation (using keyboard & mouse)
• Tamper events will lockdown system and re-activation is
required.
Mobile Activation
leverages mobile
connectivity to securely
activate SE350
Activation procedure is required

SE350 Activation and SED Drives
• The SED Activation Key (AK) is stored on planar security chip.
• SE350 activation procedure is required to provision SED AKs
• Using sets of key pairs, ThinkShield activation procedure unlocks
SE350 and provisions SED AKs in one step.
21
SED
Public
Tamper event
Private
Private
Public
XCC

SE350 Physical Security
Tamper detection event can be detected by XCC
• Removal of top cover (Chassis Intrusion Detection)
• Motion Detection
Re-activation is required once an event is triggered
• Kensington lock physical position allows customer to
manually set chassis detection security setting.
• The Kensington lock kit is optional

Environmental Configurations
• Limitation when operating at temperature between 45-55C
– No GPU support, only support max 25W PCIe card in Hodaka SPP
– No Micron M.2 for data drive
– No Liteon M.2 for boot drive
– No 1U2N Enclosure for 12VDC AC adapter heats up behind the node.
• Dust filters are located on the locking bezel that is part of the node sleeve:
Locking bezel with
dust filter

ThinkSystem SE350 Machine Types
• Mainstream Compact Edge Server, 1U height, ½ width, short depth
Single Node dimension:
40mm (tall) x 214.6mm
(wide) x 376mm (deep)
2U2N short depth with two
side-by-side SE350 Nodes
stacked power supplies
1U2N Rack Chassis to
support two side-by-side
SE350 Nodes
ThinkSystem SE350 - 1yr Warranty 7Z46
ThinkSystem SE350 - 3yr Warranty 7D1X
ThinkSystem SE350 - 3yr Warranty (India) 7D27
ThinkSystem Enclosures 7D1R

「ThinkSystem SE350発表記念キャンペーン」
表示価格はエンドユーザー向けキャンペーン価格となります。
ThinkSystem SE350の発表を記念してキャンペーンを行います。
キャンペーンモデルは以下の２モデルとなります
SE350 7D1XA00AJP 7D1XA008JP
Network 有線(SFP+) 無線(WiFi/LTE)
CPU Xeon D-2123IT
Memory 8GB (DDR4) x 1
M.2 drives 480GB A600i SATA x 1
電源 2 / 2 (Full)
標準価格 368,000 478,000
キャンペーン価格 238,000 318,000
割引率 35.3%off 33.5%off
参考価格：4XB7A39423 TS Indust A600i 480GB SATA M.2 SSD
標準価格・・・・・・・・・・68,000円
キャンペーン価格・・・約45,000円
https://www.lenovojp.com/business/campaign/105/

ハードウェアメーカーならでは(笑)実機あり！ Azure IoT Edgeデバイス / Edge Server Update

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ハードウェアメーカーならでは(笑)実機あり！ Azure IoT Edgeデバイス / Edge Server Update