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Similar to 9000 wedge-bonder overview (20)
9000 wedge-bonder overview
- 2. WIRE SIZES (Au & Al)
• Au 17.5μm to 75μm (0.7mil to 3mil)
• Al 17.5μm to 75μm (0.7mil to 3mil)
RIBBON SIZES (Au)
• 12.7μm x 50.8μm up to 25.4 x 254μm
(0.5mil x 2mil up to 1mil x 10mil)
WIRE FEED ANGLE
• 45 to 60 degree (Standard 45/60 clamp)
• 90 degree (Optional clamp)
www.palomartechnologies.com 2© Palomar Technologies, Inc.
9000 Wedge Bonder At a Glance
- 3. www.palomartechnologies.com 3© Palomar Technologies, Inc.
9000 Wedge Bonder At a Glance
CYCLIC RATE
• Up to 6 wires per second
• Up to 10 loops per second
LOOPING
• 70μm to 20mm lengths
• Standard forward and reverse
• Constant wire length
• Jumpers
• Chain wires (bond – loop – bond – loop – bond)
• Orthogonal bonding (B1 and B2 with separate bond foot angles)
- 5. www.palomartechnologies.com 5© Palomar Technologies, Inc.
9000 Wedge Bonder At a Glance
2mil Al Wire Length: 60-75 mils / Wire Pitch: 7.25-15.3mils / Length 60-75mil
Fan Out Fan Out + Orthogonal Bond 1
- 6. www.palomartechnologies.com 6© Palomar Technologies, Inc.
9000 Wedge Bonder At a Glance
2mil Al Wire Length: 60-75 mils / Wire Pitch: 7.25-15.3mils / Length 60-75mil
Fan Out Fan Out + Orthogonal Bond 1
(To Fit on fine pitch die pads)
- 10. PRECISION
• 1μm, 3σ, repeatability1
• High-precision touchdown without time delay*
*Programmable search speed and touch sense threshold values similar to the
8000 Wire Bonder. The system will search from the search tolerance above the
part at the programmed search speed until the tool touches the surface
according to the programmed threshold. There is no delay between sensing
touch and continuing the rest of the bond and wire sequence.
• Precise control of bond force (voice coil)
www.palomartechnologies.com 10© Palomar Technologies, Inc.
9000 Wedge Bonder At a Glance
HIGH THROUGHPUT
• Continuous bond technology (CBT)
• 2+ smaller bond stations for
efficient handling of smaller
products or substrates, eliminating
indexing time and maximizing
throughput
1 Vision Test
- 11. 9000 Wedge Bonder
At a Glance
i2GI (Intelligent Interactive Graphical Interface)
• Interactive wedge bond control via Program Tree
Display (PTD)
• Video Graphic Display (VGD), Man-Machine
Interface (MMI) and Part Graphic Display (PGD)
• Cognex 8500 Series Vision Processing engine for
real-time video
• Loop process view camera on Ѳ rotary enabling side
view of wire at all times (390-degree max Ѳ rotation)
(view wire formation)
• Set-up wizards for simplified calibration, setup, and
programming
• Microsoft® Windows 7® software platform
www.palomartechnologies.com 11© Palomar Technologies, Inc.
- 12. 9000 Wedge Bonder
At a Glance
QUALITY CONTROL
• Real-time bond monitoring and process
control software
• Robust, low maintenance voice coil bond
head
BOND DATA MINER™ - comprehensive
and centralized data management
and analysis system
• Aggregates run data and timestamp data
sets
• Process tool analysis
• Machine and process trends monitoring
for increased yields and predictive
maintenance
www.palomartechnologies.com 12© Palomar Technologies, Inc.
- 13. View Cameras
VISION TARGETING
• Programing and Rework Target
• Runtime referencing
• Operator wire inspection
PROCESS VIEW
• Operator Real-time bond
viewing of wires
• Quick check for wire in tool
without a microscope
• Operator rethread guide
www.palomartechnologies.com 13© Palomar Technologies, Inc.
- 14. 25+ Years of Legacy Wedge Bond
Technology
www.palomartechnologies.com 14© Palomar Technologies, Inc.
90002470-V2470-III2470-II2470-I 3470-I 3470-II
- 15. Unique, Versatility and Flexibility
www.palomartechnologies.com 15© Palomar Technologies, Inc.
9000
Wedge
Bonder
Large Work
Area
Factory
Automation
Advanced
User
Control
(i2GI )
Bond Data
Miner
High-Speed
Wire Feed
Clamp
Versatility
High-
Precision
- 16. Large Work Area with
Unobstructed Accessibility
www.palomartechnologies.com 16© Palomar Technologies, Inc.
- 17. 9000 Wedge Bonder
At a Glance
LARGE BONDING AREA
• 305 x 150 mm (12” x 6”)
AUTOMATED ASSEMBLY
• Material handler options
available for full production
line assembly
• Unheated and heated work
stages available
www.palomartechnologies.com 17© Palomar Technologies, Inc.
- 18. Large Bonding Area = More Flexibility
305mm x 150 mm (12” x 6”): X-Y bond area minimizes index time and
improves throughput time
Large area ideal for:
• Large parts
• Multiple parts
• Wafers
• Low wire counts
www.palomartechnologies.com 18© Palomar Technologies, Inc.
12”
6”
- 19. Three Work Area Access Points
1: Front Access Door
• Designed as dominant entry
• Load and unload parts
(manual process)
• Wire threading
(possible with use of process
camera)
• Tooling change
www.palomartechnologies.com 19© Palomar Technologies, Inc.
- 20. Three Work Area Access Points
2: Hood
Unobstructed access to entire
work envelope
• Microscope
• Tooling change
• System maintenance
• Wire threading
(also possible with use
of process camera
or microscope)
www.palomartechnologies.com 20© Palomar Technologies, Inc.
- 21. Three Work Area Access Points
3: Bottom Door
• Access to tools and
bonding stage(s)
• More rarely used, but
available for flexibility
in accessibility of
entire large work area
www.palomartechnologies.com 21© Palomar Technologies, Inc.
- 22. Ergonomics
• The keyboard and
monitor move a unit
together in Z
• The keyboard height is
adjusted from 32.3” to
47.2” from the floor
• Microscope glides easily
for viewing
www.palomartechnologies.com 22© Palomar Technologies, Inc.
- 24. Wire Specifications
• Materials: Au & Al
• Wire Type Sizes
– Wire: 17.5µm – 75µm (0.7mil – 3mil)
• Ribbon: 12.7μm x 50.8μm up to 25.4μm x 254μm
(0.5mil x 2mil up to 1mil x 10mil)
• Feed Angles
– 45 °to 60°
– 90°deep access
www.palomartechnologies.com 24© Palomar Technologies, Inc.
- 25. Bond Head
At a Glance
www.palomartechnologies.com 25© Palomar Technologies, Inc.
The de-spooler rides on theta
so that wire and ribbon will not
get twisted during bonding.
This is unique to Palomar
Technologies.
- 26. Bond Head
At a Glance
• Bond force is applied
using a robust, low
maintenance voice coil
bond head
Force range:
3 gram to 200 gram
• Maximum Ѳ rotation
range: 390 degree
www.palomartechnologies.com 26© Palomar Technologies, Inc.
Axis Resolution
• XYZ are all 0.1um
• Theta 0.01125 degree
- 27. Process View Camera
• Used for many different functions since it rides on theta which
is carried by Z-coarse
• View the bond tool at all theta angles
• Simply check the wire and tail position under the tool without
the need for a microscope
• Although, we do have a microscope, it is much more efficient
and faster to just look in the process view camera
• Other functions
– Watching loop formation during bonding
– Viewing wires from an angle to see wire profile, and
inspecting wires at backside orientations that a microscope
cannot see
www.palomartechnologies.com 27© Palomar Technologies, Inc.
- 28. Process View Camera
• Example of the lookdown
targeting camera on the left and
the process view camera on the
right
• These two images are
available at the same time
and allow the operator to
inspect the bonds from the top
down using the targeting
camera and to also see if the
wire is in the tool using the
process view camera
• Note: The process view camera
can also be used to thread the
tool. The image shows the wire
just after rethreading
www.palomartechnologies.com 28© Palomar Technologies, Inc.
- 29. Changing Clamp Angles
No need for an expensive bond head change! Simply
change the clamp.
• Loosen screw for angle adjust and adjust
for position of clamp relative to tool
• The rest of the bond head remains the
same
www.palomartechnologies.com 29© Palomar Technologies, Inc.
- 30. Wire Clamp Clearance - 60°
www.palomartechnologies.com 30© Palomar Technologies, Inc.
* inches
*750mil tool
- 35. Wire Clamp Clearance - 45°
www.palomartechnologies.com 35© Palomar Technologies, Inc.
* inches
*750mil tool
- 36. Close-up Tool View
Left of Tool – 45-Deg Feed Left of Tool – 60-Deg Feed
www.palomartechnologies.com 36© Palomar Technologies, Inc.
- 37. The 9000 0.472” clearance near
the 0.750” wedge tool and 0.446
to bottom of head..
A 1.078” tool will allow .780”
clearance.
Wire Clamp Clearance - 90°
www.palomartechnologies.com 37© Palomar Technologies, Inc.
- 38. Common Applications
• RF-SOE
• Disk Drives
• Large Complex Hybrids
• RF and Microwave Devices
• COB
• Compact Hybrids
• Fine Pitch Devices
• High Frequency Passive and
Active Components
• MCM Power Connections
• Fine Pitch Devices
• Running Stitch Interconnects (die-to-die)
• Ribbon Bonding
• Low Profile Wire Bonds
*partial list
www.palomartechnologies.com 38© Palomar Technologies, Inc.
- 42. The World’s FIRST
Interactive Wedge Bonder
i2GI (Intelligent Interactive Graphical Interface)
Touch-Screen Computer Screen
Process Camera
Programming Specifications
www.palomartechnologies.com 42© Palomar Technologies, Inc.
- 43. 9000 Tool Kit
• Windows 7®
• Intuitive Touch-Screen
Graphical User Interface
• Bond Data Miner™
• Repair and Maintenance
Statistics (RAMS)
• Process Control Software
• Cognex® On-Screen
Video for real-time viewing
• PC Back-Up & Recovery
• Auto Bond-Set Layout for
bond pad programming
efficiency
• CAD Interface
• Adaptive Bond
Deformation
• Auto Focus for material
variances and bond height
compensation = high
quality & high throughput
www.palomartechnologies.com 43© Palomar Technologies, Inc.
- 44. i2GI Enables Intuitive & Interactive
Wedge Bond Control
• Program Tree Display
– Hierarchal tree controls
– Intuitive wizards simplify calibration, set-up, and
programming
– Parent-child relationship of the build program and materials
• Natural navigation flow and intuition
• Interactive live graphical display
• Man-Machine Interface for familiar jog and program capabilities
for 8000 Wire Bonder users
**Operator experiences real-time bonding and quality
validation
www.palomartechnologies.com 44© Palomar Technologies, Inc.
- 45. Part Tree Display
(PTD)
• Familiar hierarchal tree infrastructure
displaying parent-child part
relationships
• “Who caries who” – clear
understanding of which
materials/wires/bond pads are
dependent upon others
• Intuitive wizard to simplify calibration,
set-up and programming
• New element are graphically
displayed in real-time on the Part
Graphic Display
www.palomartechnologies.com 45© Palomar Technologies, Inc.
- 46. www.palomartechnologies.com 46© Palomar Technologies, Inc.
Part Graphical Display
(PGD)
• “You are here” aspect of
the program and build
design
• True, graphical
representation of build
• Excellent reference
for a manufacturing
document
Ex: export number
or wires in seconds
rather than manual
counting from tree
structure
• Interactive approach to
ease the reference points
between program tree
structure and MMI
Can toggle between
PGD to
corresponding wire
in tree structure
“Lock” view to zoom
in/out
Highlight
parent-child
related parts
- 47. www.palomartechnologies.com 47© Palomar Technologies, Inc.
• Video Graphical Display (VGD) is an overlay on
the Man-Machine Interface (MMI) view from the
Cognex Vision System
• Graphical representation of the build based
upon the Part Tree Display
• Images/elements are to-scale within this
view
• Program creation support and accuracy check
– Program set-up assistance
– Ability to lay graphics on top of live video to
double check, for example, on correct bond
pad
– “Step Mode” step through program check
• Master reference between PTD and PGD
• Familiar jogging capabilities for 8000 Wire Bonder
users
Video Graphical Display
(VGD)
- 48. Touch Screen
• i2GI supports both traditional track-
ball control and a bright, large touch
screen
• Glove-touch compatible
• Crisp, clear high fidelity graphics in
multiple dynamic panes in a single
view
• Vertical orientation
– Enhances user control
– Minimizes need for archaic hardware,
such as joysticks
– Efficient, clean and reduced machine
footprint
– 22 to 24” diagonal monitor
www.palomartechnologies.com 48© Palomar Technologies, Inc.
- 49. Program Compatibility
• 8000 programs can be transferred to the 9000 operating platform
– The parts with references and bond sets are direct mapping matches
– The user then creates wedge wire sets with proper bond and loop
parameters
• For example, a program may have many components in a package that share
die that have both ball bond and wedge bond wires on the same die
– This would mean that you could generate a program structure with all of
the parts
– This program could then be used as a starting point for the 8000 and 9000
– On each machine, the process engineer would then add bonds sets and
wire sets specific to the machine—there would be no reason to then share
the programs across machines any longer
Process Development Consulting offers in-house process advancements and
decades of expertise in machine, process and materials for seamless program
transfers
www.palomartechnologies.com 49© Palomar Technologies, Inc.
- 50. Bond Data Miner
TM
“Smart” Bonder
• Monitors machine and process
trends providing yields and
predictive maintenance
• Links together system and
bonding parameters
• Proven improvement of yield,
process development time, and
repair time
• Familiarity for 8000 Wire Bond
users
• Three levels of capability
through BDM software system
Level 1: Data collection, archiving
& analysis
– Traceable data
Level 2: Process monitoring
– Set upper & lower control
limits
Level 3: Closed-loop automatic
process control
– “Smart” system
www.palomartechnologies.com 50© Palomar Technologies, Inc.
- 51. BDM = The Ultimate Analytical Tool
• BDM collects electrical and robotic data from extensive array
of sensors
– Analyzes, time-stamps and archives data
– Provides clear picture of process, machine performance
and stability
– Allows traceability of bond parameters and system state
for individual bonds
– Data can be viewed across multiple systems and
platforms, including third-party equipment
• Powerful tool to improve yield and utilization
www.palomartechnologies.com 51© Palomar Technologies, Inc.
- 52. BDM = Unparalled Process Control
www.palomartechnologies.com 52© Palomar Technologies, Inc.
RAM Statistics
Wedge-Off Monitoring
Bond Deformation Monitoring
(process control)
Adaptive Bond Deformation
Bond Data Miner (BDM)
Data Acquisition & Analysis Tool
Third-Party
Equipment BDM
Level 1
Level 3
Level 2
Calibration & Validation Data
Factory BDM
Trending
- 53. Repair and Maintenance Statistics (RAMS)
www.palomartechnologies.com 53© Palomar Technologies, Inc.
• Tracks uptime statistics per SEMI E10-0701 & E58-0301
• Tracks accumulated bond statistics
- 54. Process Control Software
www.palomartechnologies.com 54© Palomar Technologies, Inc.
• Collects real-time
Bond 1 / Bond 2
deformation data
• User can set upper &
lower deformation
control limits
– Bonder stops
bonding if limits
exceeded
– Prevents yield loss
- 55. Production Line Automation
& Handler Options
Full Production Lines
Inline and Small Islands of Automation
Solutions for Phased Approach to Production Ramping
www.palomartechnologies.com 55© Palomar Technologies, Inc.
- 56. SMEMA Compatible
• SMEMA compatible inline factory integration
(production line automation solution)
• Compact design promotes efficient clean
room layout in stand-alone installation or
integrated into a full line
• Innovative handling systems eliminate
indexing to create non-stop bonding
(zero-wait state)
www.palomartechnologies.com 56© Palomar Technologies, Inc.
- 57. Handler Options for Factory Automation
Inline Configuration
www.palomartechnologies.com 57© Palomar Technologies, Inc.
• 1 = preheat, 2 = bond site, 3 = cooling (output buffer)
• Design to handle Auer boat (12” x [2.95, 3.1, 4.3, 5.4”])
or substrates with similar size
1 2 3
- 63. Summary
www.palomartechnologies.com
63
© Palomar Technologies, Inc.
• Modern wedge bond requirements demand an
automated, large bonding area system with
scalability to increase production capacity without
limiting performance
• Programmers and operators should experience
real-time build and production feedback to
increase efficiency and decrease costs
• Lab managers should have peace of mind that
their bonder is fully supported by a highly trained
team of field service and process development
consultants
• Precision, reliability and consistency should be
inherent to the system’s capabilities
- 65. Anatomy of a Wedge Bond Sequence
www.palomartechnologies.com© 2011 Palomar Technologies, Inc.
- 66. Anatomy of a Wedge Bond
www.palomartechnologies.com© 2011 Palomar Technologies, Inc.
- 67. Anatomy of a Wedge Bond
www.palomartechnologies.com© 2011 Palomar Technologies, Inc.
- 68. i2Gi & MMI & Process camera &
Microscope
Technology Overview 1
- 69. Process Inspection
www.palomartechnologies.com 69© 2011 Palomar Technologies, Inc.
Combination Camera Views
• Minimize Microscope use
• Minimize cover opening
• Maximize operator efficiency
Inspection
• Targeting camera checks
– Wire / bonds on package
• Process View Camera
– Wire in tool & under foot
– Wire loop formation real time
Targeting View Process View
- 71. Bond Deformation
www.palomartechnologies.com 71© 2011 Palomar Technologies, Inc.
Deformation & Height Tracking per bond
• Time stamped for every bond
• Accessible with bond data miner
• Process inputs / Machine Cal Tracked
Monitor using Process Control per Bond (Missing Wire Detect)
• Deformation Limit UCL & LCL
• Bond Height Limit UCL & LCL
Deformation Control (Adaptive Bond Deformation)
• Deformation Target UCL & LCL
• Bond Time Target UCL & LCL
- 72. Bond Deformation
www.palomartechnologies.com 72© 2011 Palomar Technologies, Inc.
Process Setup
• Start with baseline bond parameters for wires
• Capture deformation data (Max, Min, Avg)
• Set Process Control Limits (Missing Wire Detect)
• Validate missing detection
Optional Deformation Control (Adaptive Bond Deformation)
• Deformation Target UCL & LCL
• Bond Time Target UCL & LCL
- 74. 1mil Au Wire
www.palomartechnologies.com 74© 2011 Palomar Technologies, Inc.
BOND 1 Deformation
Process Limit UCL
Process Limit LCL
ABD Limit UCL
ABD Limit LCL
Machine prompts
operator if outside
Process Limits
Adaptive Bond
Deformation (ABD)
tries to control
deformation to
within ABD Limits
- 75. 1mil Au Wire
www.palomartechnologies.com 75© 2011 Palomar Technologies, Inc.
BOND 2 Deformation
Process Limit UCL
Process Limit LCL
ABD Limit UCL
ABD Limit LCL
Machine prompts
operator if outside
Process Limits
Adaptive Bond
Deformation (ABD)
tries to control
deformation to
within ABD Limits
- 77. 2mil Al Wire
www.palomartechnologies.com 77© 2011 Palomar Technologies, Inc.
c c
Process Limit UCL
Process Limit LCL
Double Bond or other Errors
Missing Wires
Over bonding
above UCL can
occur if bonding
over another wire.
Under bonding
below LCL
generally
indicates a
missing wire.
- 80. Loop Modes – LM0, LM1, LM2, LM3, LM4
Tail Modes – TM0, TM1, TM2 (Tuck)
Loop formation views per wire (Examples
images of loop motions)
Orthogonal bonding
Technology Overview 4
- 81. Loop Modes
• LM0 – Simplified up-over-down
• LM1 – Formed loop with clamp open
• LM2 – Formed loop with clamp close
• LM3 – Constant wire length
• LM4 – Low jumps (Very fast)
www.palomartechnologies.com 81© 2011 Palomar Technologies, Inc.
- 82. www.palomartechnologies.com 82© Palomar Technologies, Inc.
Loop Mode 2 and 3
2mil Al Wire Length: 55-200 mils / Wire Pitch: 6.3 mils / 188 wires
LM2 LM3 Constant Wire Length
Loop Height 17 to 40 mil Loop Height 10-26 mils
- 84. www.palomartechnologies.com 84© Palomar Technologies, Inc.
Fan Out & Orthogonal Bonding
2mil Al Wire Length: 60-75 mils / Wire Pitch: 7.25-15.3mils / Length 60-75mil
Fan Out Fan Out + Orthogonal Bond 1
(To Fit on fine pitch die pads)
- 88. 2mil Al Wire 45 Degree
www.palomartechnologies.com 88© Palomar Technologies, Inc.
4.2.1
LM1
Parallel Wires Forward Bonding
Ordinal Directions
12 wires per side
Wire Pitch: 7.25 mils
Wire Length: 60 mils
Direction: Forward
Typical layout for small
packages.
- 89. 2mil Al Wire 45 Degree
www.palomartechnologies.com 89© Palomar Technologies, Inc.
4.2.2
LM1
Parallel Wires Reverse Bonding
Ordinal Directions
12 wires per side
Wire Length: 60 mils
Direction: Reverse
Wire Pitch: 7.25 mils
Reverse bonding is used
where the package edge is too
close to allow normal tear-off
motions.
- 90. 2mil Al Wire 45 Degree
www.palomartechnologies.com 90© Palomar Technologies, Inc.
4.2.3
LM1
Fanned Wires, All Angles
Wire Length: 60 - 75 mils
Wire Pitch: 7.25 mils/ 15.3 mils
12 wires per side
Bonding Direction: Forward
- 91. 2mil Al Wire 45 Degree
www.palomartechnologies.com 91© Palomar Technologies, Inc.
4.2.4
LM1O
Short Fanned Orthogonal B1
Fanned Wires, All Angles,
Orthogonal B1
Wire Length: 60 - 75 mils
Wire Pitch: 7.25 mils/15.3 mils
12 wires per side
Bonding Direction: Forward
- 92. 2mil Al Wire 45 Degree
www.palomartechnologies.com 92© Palomar Technologies, Inc.
4.2.9
LM2
LM3
Chain
RFSOE Vertical
Demonstrates chain wires,
loop control, and bond
placement critical in high
frequency applications.
- 93. 2mil Al Wire 45 Degree
www.palomartechnologies.com 93© Palomar Technologies, Inc.
4.2.16 Varying Wire Span LM1 keeps loop height consistent
Wire Length: 55-200 mils
Wire Pitch: 6.3 mils
188 wires
- 94. 2mil Al Wire 45 Degree
www.palomartechnologies.com 94© Palomar Technologies, Inc.
4.2.15 Varying Wire Span LM2 keeps loop height consistent
Wire Length: 55-200 mils
Wire Pitch: 6.3 mils
188 wires
- 95. 2mil Al Wire 45 Degree
www.palomartechnologies.com 95© Palomar Technologies, Inc.
4.2.14 LM3 Constant Wire Length causes varying Wire Span to vary height
Wire Length: 55-200 mils
Wire Pitch: 6.3 mils
188 wires
Loop height from 10-26 mils
- 96. 2mil Al Wire 45 Degree
www.palomartechnologies.com 96© Palomar Technologies, Inc.
4.2.17 LM4 Row Wires are fast and low loop for jumpers
Link Length: 50 mils
Wire Pitch: 8 mils
648 wires per row
- 97. 2mil Al Wire 45 Degree
www.palomartechnologies.com 97© Palomar Technologies, Inc.
4.2.18 LM4 Chain Wires
Link Length: 50mils
Wire Pitch: 8mils
27 wires per chain
- 98. 2mil Al Wire 45 Degree
www.palomartechnologies.com 98© Palomar Technologies, Inc.
Segment 12 – Shrinking Spiral LM2
Wire Length: 30-95 mils
40 wires per side
Direction: Forward
- 99. 2mil Al Wire 45 Degree
www.palomartechnologies.com 99© Palomar Technologies, Inc.
Segment 13 – Shrinking Spiral LM3 Constant length
Wire Length: 30-95 mils
40 wires per side
Direction: Forward
- 100. Height Learning and Adaptation
Optical Autofocus
Real-time Touching
Adaptive Search Tolerance
Technology Overview 5
- 101. Height learning and running
• Height learning – Competitors have to touch onto
the die surfaces to measure the expected heights
during programming or editing. (Customers do not
like this)
• Palomar learns height automatically when
focused
• Runtime automatic touching and search tolerance
optimization
• Autofocus and part height update adjust expected
height based on a autofocus
www.palomartechnologies.com 101© 2011 Palomar Technologies, Inc.