1. The document discusses quality control issues and improvement activities at a manufacturing plant over the period of July 2016 to June 2017. Various problems are described such as defective parts from suppliers, issues detected during the manufacturing process, and customer complaints.
2. Corrective actions taken to address the problems included modifying processes, improving inspections, working with suppliers to resolve issues with incoming parts, and monitoring results of the improvements. Meetings were held with suppliers to ensure proper corrective actions were implemented.
3. Key metrics like defect rates and trends are presented in charts and tables to demonstrate the impact of the improvements. The summary focuses on high level issues, actions taken, and monitoring of results without including excessive detail from the document
This document summarizes the development of a robust SMT process for placing 03015 components, which are only 0.3mm x 0.15mm in size. Through testing different solder pastes and stencil materials, the author developed a process using a laser-cut fine grain stainless steel stencil with an electro polish and nano coating that achieved over 80% transfer efficiency. Taguchi experiments were used to optimize print parameters. Initial tests achieved placement of 03015 components with 0 defects out of 36,000 placements. The printing process achieved a DPMO of 15. Further work is still needed to optimize the process for thinner stencils required by smartphones.
(Company profile)ykt pcb manufacturer_in_korea_2019_1st_halfPark Jin Young
Now, the U.S. and China traded war is getting worse and worse.
It is time to re-consider your PCB supply chain in order to overcome the unforeseeable global trading circumstance.
If you are looking for a reliable PCB manufacturer in Korea, we guarantee that we can be your alternative option for your Business Continuity Management Plan.
If you are interested in purchasing PCB from Korea, please do't hesitate to contact me.
An experimental study on factors affecting Cold Extrusion of steelsIRJET Journal
This document summarizes an experimental study on factors affecting cold extrusion of steels. The study used Design of Experiments to test different combinations of punch diameter, punch depth, and material thickness. Experiments were conducted using 5T hand press, 40T mechanical press, and 30T hydraulic press. The results show that punch diameter has the greatest effect on pip height, followed by material thickness. Slower presses like hand and hydraulic presses allow better material flow, producing taller pips than faster mechanical presses. Overall, the study establishes relationships between process parameters and pip formation to provide guidance for optimizing the sheet metal extrusion process.
Keywords: six sigma; foundry SMEs; small and medium-sized enterprises; design of experiments; DOE; measurement system analysis; MSA; failure mode and effects analysis; FMEA; non-conforming products; cost of poor quality; hypothesis testing; defects per million opportunities; DPMO; process capability; DMAICS; analysis of variance; ANOVA; India; make-to-order foundries; scrap reduction; productivity.
The document summarizes a student's summer industrial training project analyzing surface cracks in steel grades used for cold forging. The student:
1) Collected data on surface rejections of steel coils from January to April and found the highest rejection rates were in larger diameter coils around 23mm.
2) Analyzed rejection trends and identified specific heat numbers with abnormal rejection rates across all studied steel grades of 10B21, 15B25, and 15B41.
3) The project involved observing steel production processes, data analysis to identify problematic grades, sizes, and heats, and examination of cracks under microscopes.
1. The project aimed to reduce sealing open rejection rates in film capacitors from 1.3% to 0.03% at Vishay componenets India pvt ltd, a manufacturer of semiconductor and passive components.
2. Data collection found the highest sealing open rejection rate of 1.28% was on Stella Romeo winding machines. Analysis identified loose compression springs causing the sealing pencil to become misaligned as the root cause.
3. Testing of different spring materials found Inconel X750 maintained its properties at operating temperatures. Implementation on all winding machines and standardization reduced the sealing open rejection rate to an average of 0.35%, meeting the project goal and saving $1.6 million
FYOU PMEC is a leading supplier of threading and gauging solutions in China. They offer a one stop shop for oil country tubular goods threads, ANSI threads, and custom threads. Their products are used widely in oil and gas, aerospace, and other industries. FYOU PMEC aims to provide high quality threading and gauging solutions, service, and on-time delivery through continual investment in technology and employee training. They supply a complete line of API and ANSI thread ring gauges, plug gauges, and other products.
This document summarizes the development of a robust SMT process for placing 03015 components, which are only 0.3mm x 0.15mm in size. Through testing different solder pastes and stencil materials, the author developed a process using a laser-cut fine grain stainless steel stencil with an electro polish and nano coating that achieved over 80% transfer efficiency. Taguchi experiments were used to optimize print parameters. Initial tests achieved placement of 03015 components with 0 defects out of 36,000 placements. The printing process achieved a DPMO of 15. Further work is still needed to optimize the process for thinner stencils required by smartphones.
(Company profile)ykt pcb manufacturer_in_korea_2019_1st_halfPark Jin Young
Now, the U.S. and China traded war is getting worse and worse.
It is time to re-consider your PCB supply chain in order to overcome the unforeseeable global trading circumstance.
If you are looking for a reliable PCB manufacturer in Korea, we guarantee that we can be your alternative option for your Business Continuity Management Plan.
If you are interested in purchasing PCB from Korea, please do't hesitate to contact me.
An experimental study on factors affecting Cold Extrusion of steelsIRJET Journal
This document summarizes an experimental study on factors affecting cold extrusion of steels. The study used Design of Experiments to test different combinations of punch diameter, punch depth, and material thickness. Experiments were conducted using 5T hand press, 40T mechanical press, and 30T hydraulic press. The results show that punch diameter has the greatest effect on pip height, followed by material thickness. Slower presses like hand and hydraulic presses allow better material flow, producing taller pips than faster mechanical presses. Overall, the study establishes relationships between process parameters and pip formation to provide guidance for optimizing the sheet metal extrusion process.
Keywords: six sigma; foundry SMEs; small and medium-sized enterprises; design of experiments; DOE; measurement system analysis; MSA; failure mode and effects analysis; FMEA; non-conforming products; cost of poor quality; hypothesis testing; defects per million opportunities; DPMO; process capability; DMAICS; analysis of variance; ANOVA; India; make-to-order foundries; scrap reduction; productivity.
The document summarizes a student's summer industrial training project analyzing surface cracks in steel grades used for cold forging. The student:
1) Collected data on surface rejections of steel coils from January to April and found the highest rejection rates were in larger diameter coils around 23mm.
2) Analyzed rejection trends and identified specific heat numbers with abnormal rejection rates across all studied steel grades of 10B21, 15B25, and 15B41.
3) The project involved observing steel production processes, data analysis to identify problematic grades, sizes, and heats, and examination of cracks under microscopes.
1. The project aimed to reduce sealing open rejection rates in film capacitors from 1.3% to 0.03% at Vishay componenets India pvt ltd, a manufacturer of semiconductor and passive components.
2. Data collection found the highest sealing open rejection rate of 1.28% was on Stella Romeo winding machines. Analysis identified loose compression springs causing the sealing pencil to become misaligned as the root cause.
3. Testing of different spring materials found Inconel X750 maintained its properties at operating temperatures. Implementation on all winding machines and standardization reduced the sealing open rejection rate to an average of 0.35%, meeting the project goal and saving $1.6 million
FYOU PMEC is a leading supplier of threading and gauging solutions in China. They offer a one stop shop for oil country tubular goods threads, ANSI threads, and custom threads. Their products are used widely in oil and gas, aerospace, and other industries. FYOU PMEC aims to provide high quality threading and gauging solutions, service, and on-time delivery through continual investment in technology and employee training. They supply a complete line of API and ANSI thread ring gauges, plug gauges, and other products.
Why clients will like the simple bulkhead/OYSTER light
Are you boring to install the bulkhead in Multiple components?
Are you worry damage the led chips when install it?
That why Sundopt bulkhead arise.
Six sigma - dmr tilt table - matthew huntMatthew Hunt
This document describes a problem solving project to improve the DMR tilt tables used in the Kansas City Integrated Stamping Plant. The project team designed and built new tilt tables that allow 360 degree rotation and multiple tilt positions for optimal part positioning. This will improve ergonomics and reduce nonconforming parts. The document also details analyses and improvements made to inspection processes, die changeover capabilities, press automation, and adding error proofing at the die shop to control quality.
This document describes a project to analyze quality issues in products manufactured by an automotive parts company. It aims to identify the root causes of defects seen in rims, including root line defects, sheet faults, and side and root pits. Fishbone diagrams will be used to sort out the key issues. The document provides background on the company and analyzes defect data and trends over time. It identifies potential causes for grinding marks on rims, such as misaligned grinding equipment, worn parts, untrained workers, and excessive workload. Solutions proposed include automation of grinding and setting performance standards. A previous fishbone diagram for seam openings is also presented.
The document summarizes the quality innovation plan and review for 2014. Key points discussed include reducing defects from 2013, setting targets for reducing specific defect rates in 2014, and action plans for improving processes related to defects like door melting, leakage, loose connectors, and more. Metrics are provided on defect categories and rates from 2013 along with targets for reducing rates in 2014 through process changes, tooling updates, and enhanced inspection checkpoints.
Wind Turbine Components Case Study - Dragon SourcingDragon Sourcing
The document provides information from a case study on wind turbine components sourcing. It summarizes the screening process for 34 potential gear component suppliers, inviting 3 to quote. It also details the screening of 39 casting and C-parts suppliers, with 12 responding. Tables profile the invited suppliers and provide quotation comparisons for 2 gear components. The agenda outlines next steps in the sourcing process.
This document provides guidelines for PCB layout and design at iPCB Circuits Limited. It includes rules for V-cut and stamp layout, component placement distance from edges, fiducial mark design, pad design for SMT components down to 0201 size, and guidelines for text marking on silkscreen layers. The purpose is to standardize the design process to enable high efficiency, easy assembly and high quality manufacturing.
The document provides inspection details for a green color double net chop saw across 4 trials. Key parameters inspected include thickness, weight, fiber distribution, bore size, straightness of rotation, out of balance, and vibration. Results are reported for each trial as well as min, max, and mean values. Overall, the saw performed well with minimal variation across trials and parameters meeting or close to specifications.
This document summarizes a quality improvement project to address low first-time yield (FTY) percentages in the PVI-3KW production area of Power-One Italy. Data from October 2012 shows an FTY of 88.8%, with the two biggest sources of failure being issues with manual testing processes and low efficiency rates on the 3000W model. Root cause analysis identified factors like low illumination, complicated manual phases, and wiring/connector issues as contributing to failures during manual testing. Statistical analysis of efficiency data showed a non-normal distribution with outliers below the minimum specification. The project aims to increase the FTY rate to 93% by addressing these key causes of failure.
A continuous improvement activity focused on eliminating the top 2 rejections claimed by customer in the year 2016. The tools used may not have utilised all of the 7 QC tools but in retrospect, the goals set was achieved.
2.Improvement of plant MTBF by reducing repeating failure - 23.05.2023.pptxMangalGhosh
The document outlines a maintenance project to improve machine time between failures (MTBF) by reducing repetitive failures. The project charter establishes a plan to analyze failure data, identify root causes, and implement action plans from May 2022 to September 2022. Specific actions included upgrading bush and connector materials, improving fixtures, adding interlocks, and modifying visualizations. Results showed improved MTBF, fewer breakdowns, better KPIs, and increased machine availability meeting the goals of the project.
The document summarizes the key processes involved in PCB fabrication from start to finish. It begins with inner layer processing like cutting, drilling, and developing circuit patterns. Then it describes mass lamination to combine inner layers and copper foil. Following lamination are drilling, copper plating, and outer layer development. Later steps include solder mask and silkscreen printing, followed by finishes like HASL, OSP, or immersion silver. Quality control tests and any repairs are done prior to final packaging and shipping. The document provides detailed process flow charts and photos to illustrate each manufacturing stage.
This document provides an overview of standoff improvement for engineering in 2023. It discusses the current status of standoff part numbers and PCBs using standoffs. Various standoff soldering methods are analyzed, including their advantages and disadvantages. Formulas for calculating solder paste volume are detailed. Key metrics for stencil printing like area ratio and transfer efficiency are explained. Guidelines for stepping stencil design are provided. Finally, an example calculation of standoff soldering parameters is shown.
The document contains a list of drawings for a project titled "Penhouse Thu Thiem". It includes 12 drawings, with technical data and specifications for the electrical panel layout. Key information includes the project name, number of drawings, technical specifications covering construction, electrical ratings, wiring, and component details. The document provides an overview of the engineering drawings and technical specifications for the electrical panel of the Penhouse Thu Thiem project.
20220927 Analyze Contamination Metal On Cap.pptxArifPuguhNugroho
The document summarizes an investigation into metal contamination found inside plastic caps during production. Testing determined:
1) Small metal contaminants ranging from 0.3-0.6mm were found randomly located inside caps from injection unit 1. Further testing found increasing amounts of contamination over multiple cycles.
2) Trials using different plastic materials and process changes like removing movement still produced contamination, indicating the source was upstream.
3) Inspection of the melt found possible metal particles, and previous sample retains dating back months also contained contamination, suggesting a chronic issue with the material supply.
The root cause appears to be metal contamination entering the process upstream, possibly during material storage or feeding, and consistently contaminating production
FYOU PMEC is a leading supplier of threading and gauging solutions based in Suzhou, China. They offer a one stop shop for oil country threads gauges, ANSI/ASME thread gauges, and custom threading solutions. Their products are used widely in oil and gas, aerospace, shipbuilding and other industries. FYOU PMEC aims to provide high quality products and service to customers on time through continual investment in technology and employee training.
The document describes the manufacturing process for printed circuit boards. It involves several steps: 1) Pre-production engineering like file inspection and drill data generation. 2) CNC cutting and drilling of copper clad laminate. 3) Wet processing like direct plating system and electroplating to deposit copper. 4) Photo imaging and developing to transfer circuit images. 5) Etching and inspection to remove unwanted copper.
The document provides an overview of DTK Group of Industries' manufacturing facilities in Aurangabad and Pune, India. It details the company's vision, facilities, workforce, equipment, processes, quality systems, major customers, and products. Key points include: DTK has over 60,000 square feet of manufacturing space across four facilities, employs over 125 people, and has a wide range of pressing, welding, and machining equipment. The company aims to be a preferred supplier of sheet metal and machined components through continually upgrading its technology and processes.
Why clients will like the simple bulkhead/OYSTER light
Are you boring to install the bulkhead in Multiple components?
Are you worry damage the led chips when install it?
That why Sundopt bulkhead arise.
Six sigma - dmr tilt table - matthew huntMatthew Hunt
This document describes a problem solving project to improve the DMR tilt tables used in the Kansas City Integrated Stamping Plant. The project team designed and built new tilt tables that allow 360 degree rotation and multiple tilt positions for optimal part positioning. This will improve ergonomics and reduce nonconforming parts. The document also details analyses and improvements made to inspection processes, die changeover capabilities, press automation, and adding error proofing at the die shop to control quality.
This document describes a project to analyze quality issues in products manufactured by an automotive parts company. It aims to identify the root causes of defects seen in rims, including root line defects, sheet faults, and side and root pits. Fishbone diagrams will be used to sort out the key issues. The document provides background on the company and analyzes defect data and trends over time. It identifies potential causes for grinding marks on rims, such as misaligned grinding equipment, worn parts, untrained workers, and excessive workload. Solutions proposed include automation of grinding and setting performance standards. A previous fishbone diagram for seam openings is also presented.
The document summarizes the quality innovation plan and review for 2014. Key points discussed include reducing defects from 2013, setting targets for reducing specific defect rates in 2014, and action plans for improving processes related to defects like door melting, leakage, loose connectors, and more. Metrics are provided on defect categories and rates from 2013 along with targets for reducing rates in 2014 through process changes, tooling updates, and enhanced inspection checkpoints.
Wind Turbine Components Case Study - Dragon SourcingDragon Sourcing
The document provides information from a case study on wind turbine components sourcing. It summarizes the screening process for 34 potential gear component suppliers, inviting 3 to quote. It also details the screening of 39 casting and C-parts suppliers, with 12 responding. Tables profile the invited suppliers and provide quotation comparisons for 2 gear components. The agenda outlines next steps in the sourcing process.
This document provides guidelines for PCB layout and design at iPCB Circuits Limited. It includes rules for V-cut and stamp layout, component placement distance from edges, fiducial mark design, pad design for SMT components down to 0201 size, and guidelines for text marking on silkscreen layers. The purpose is to standardize the design process to enable high efficiency, easy assembly and high quality manufacturing.
The document provides inspection details for a green color double net chop saw across 4 trials. Key parameters inspected include thickness, weight, fiber distribution, bore size, straightness of rotation, out of balance, and vibration. Results are reported for each trial as well as min, max, and mean values. Overall, the saw performed well with minimal variation across trials and parameters meeting or close to specifications.
This document summarizes a quality improvement project to address low first-time yield (FTY) percentages in the PVI-3KW production area of Power-One Italy. Data from October 2012 shows an FTY of 88.8%, with the two biggest sources of failure being issues with manual testing processes and low efficiency rates on the 3000W model. Root cause analysis identified factors like low illumination, complicated manual phases, and wiring/connector issues as contributing to failures during manual testing. Statistical analysis of efficiency data showed a non-normal distribution with outliers below the minimum specification. The project aims to increase the FTY rate to 93% by addressing these key causes of failure.
A continuous improvement activity focused on eliminating the top 2 rejections claimed by customer in the year 2016. The tools used may not have utilised all of the 7 QC tools but in retrospect, the goals set was achieved.
2.Improvement of plant MTBF by reducing repeating failure - 23.05.2023.pptxMangalGhosh
The document outlines a maintenance project to improve machine time between failures (MTBF) by reducing repetitive failures. The project charter establishes a plan to analyze failure data, identify root causes, and implement action plans from May 2022 to September 2022. Specific actions included upgrading bush and connector materials, improving fixtures, adding interlocks, and modifying visualizations. Results showed improved MTBF, fewer breakdowns, better KPIs, and increased machine availability meeting the goals of the project.
The document summarizes the key processes involved in PCB fabrication from start to finish. It begins with inner layer processing like cutting, drilling, and developing circuit patterns. Then it describes mass lamination to combine inner layers and copper foil. Following lamination are drilling, copper plating, and outer layer development. Later steps include solder mask and silkscreen printing, followed by finishes like HASL, OSP, or immersion silver. Quality control tests and any repairs are done prior to final packaging and shipping. The document provides detailed process flow charts and photos to illustrate each manufacturing stage.
This document provides an overview of standoff improvement for engineering in 2023. It discusses the current status of standoff part numbers and PCBs using standoffs. Various standoff soldering methods are analyzed, including their advantages and disadvantages. Formulas for calculating solder paste volume are detailed. Key metrics for stencil printing like area ratio and transfer efficiency are explained. Guidelines for stepping stencil design are provided. Finally, an example calculation of standoff soldering parameters is shown.
The document contains a list of drawings for a project titled "Penhouse Thu Thiem". It includes 12 drawings, with technical data and specifications for the electrical panel layout. Key information includes the project name, number of drawings, technical specifications covering construction, electrical ratings, wiring, and component details. The document provides an overview of the engineering drawings and technical specifications for the electrical panel of the Penhouse Thu Thiem project.
20220927 Analyze Contamination Metal On Cap.pptxArifPuguhNugroho
The document summarizes an investigation into metal contamination found inside plastic caps during production. Testing determined:
1) Small metal contaminants ranging from 0.3-0.6mm were found randomly located inside caps from injection unit 1. Further testing found increasing amounts of contamination over multiple cycles.
2) Trials using different plastic materials and process changes like removing movement still produced contamination, indicating the source was upstream.
3) Inspection of the melt found possible metal particles, and previous sample retains dating back months also contained contamination, suggesting a chronic issue with the material supply.
The root cause appears to be metal contamination entering the process upstream, possibly during material storage or feeding, and consistently contaminating production
FYOU PMEC is a leading supplier of threading and gauging solutions based in Suzhou, China. They offer a one stop shop for oil country threads gauges, ANSI/ASME thread gauges, and custom threading solutions. Their products are used widely in oil and gas, aerospace, shipbuilding and other industries. FYOU PMEC aims to provide high quality products and service to customers on time through continual investment in technology and employee training.
The document describes the manufacturing process for printed circuit boards. It involves several steps: 1) Pre-production engineering like file inspection and drill data generation. 2) CNC cutting and drilling of copper clad laminate. 3) Wet processing like direct plating system and electroplating to deposit copper. 4) Photo imaging and developing to transfer circuit images. 5) Etching and inspection to remove unwanted copper.
The document provides an overview of DTK Group of Industries' manufacturing facilities in Aurangabad and Pune, India. It details the company's vision, facilities, workforce, equipment, processes, quality systems, major customers, and products. Key points include: DTK has over 60,000 square feet of manufacturing space across four facilities, employs over 125 people, and has a wide range of pressing, welding, and machining equipment. The company aims to be a preferred supplier of sheet metal and machined components through continually upgrading its technology and processes.
We are pleased to share with you the latest VCOSA statistical report on the cotton and yarn industry for the month of March 2024.
Starting from January 2024, the full weekly and monthly reports will only be available for free to VCOSA members. To access the complete weekly report with figures, charts, and detailed analysis of the cotton fiber market in the past week, interested parties are kindly requested to contact VCOSA to subscribe to the newsletter.
We are pleased to share with you the latest VCOSA statistical report on the cotton and yarn industry for the month of May 2024.
Starting from January 2024, the full weekly and monthly reports will only be available for free to VCOSA members. To access the complete weekly report with figures, charts, and detailed analysis of the cotton fiber market in the past week, interested parties are kindly requested to contact VCOSA to subscribe to the newsletter.
Discovering Digital Process Twins for What-if Analysis: a Process Mining Appr...Marlon Dumas
This webinar discusses the limitations of traditional approaches for business process simulation based on had-crafted model with restrictive assumptions. It shows how process mining techniques can be assembled together to discover high-fidelity digital twins of end-to-end processes from event data.
Codeless Generative AI Pipelines
(GenAI with Milvus)
https://ml.dssconf.pl/user.html#!/lecture/DSSML24-041a/rate
Discover the potential of real-time streaming in the context of GenAI as we delve into the intricacies of Apache NiFi and its capabilities. Learn how this tool can significantly simplify the data engineering workflow for GenAI applications, allowing you to focus on the creative aspects rather than the technical complexities. I will guide you through practical examples and use cases, showing the impact of automation on prompt building. From data ingestion to transformation and delivery, witness how Apache NiFi streamlines the entire pipeline, ensuring a smooth and hassle-free experience.
Timothy Spann
https://www.youtube.com/@FLaNK-Stack
https://medium.com/@tspann
https://www.datainmotion.dev/
milvus, unstructured data, vector database, zilliz, cloud, vectors, python, deep learning, generative ai, genai, nifi, kafka, flink, streaming, iot, edge
Open Source Contributions to Postgres: The Basics POSETTE 2024ElizabethGarrettChri
Postgres is the most advanced open-source database in the world and it's supported by a community, not a single company. So how does this work? How does code actually get into Postgres? I recently had a patch submitted and committed and I want to share what I learned in that process. I’ll give you an overview of Postgres versions and how the underlying project codebase functions. I’ll also show you the process for submitting a patch and getting that tested and committed.
Open Source Contributions to Postgres: The Basics POSETTE 2024
170614. Annual Report Finish.pptx
1. Prepared Checked Approved
12 June 2017
Contents :
AGENDA
1 IQC lot ratio
2 IQC objective and throughout process
3 History problem and CPAR (main issue)
4 Improvement Activity
5 Management Set Up Plan
6 Performance Conclusion
Annual Report
Agung Yoke B
Juni 2017
Periode : July 2016 – June 2017
2. 2.IQC LOT ACCEPTANCE RATIO
Month
2016 2017
Q1 Q2 Q3 Q4 Q1 Apr May
LOT Accept 100.00% 99.97% 100.00% 99.87% 99.74% 99.81% 100.00%
Target 100.00% 100.00% 100.00% 100.00% 100.00% 100.00% 100.00% 100.00% 100.00% 100.00% 100.00% 100.00%
99.00%
99.20%
99.40%
99.60%
99.80%
100.00%
Q1 Q2 Q3 Q4 Q1 Apr May Jun Jul Aug Sept Oct
2016 2017
LOT Accept
Target
IQC LOT Acceptance Trend Chart
2017
3. 2. Objects of Incoming Quality Control
Establishing Quality
Standard
Smooth Production
Processs
Detecting Deviation
in production process
• Raw Material
• Function Part
• Model change
• Shorted
• In line Reject
• Material Rejected
• Measurement part
Responsibility for Quality Control
- The standard(s) to which the construction or assembly of a
building component has been incorporated into the project’s
design. (QC)
- Is all those planned and systematic actions necessary to provide
adequate confidence that an entity will fulfill requirements for
quality. (QA)
5. RAW
MATERIAL,PARTS
AND SUPPLIES
PROCUCTION
PROCESSESS
PRODUCT AND
SERVICES
CONTROL CHARTS
AND ACCEPTANCE
PLANS
CONTROL CHARTS
CONTROL CHARTS
AND ACCEPTANCE
PLANS
INPUTS CONVERSION OUTPUTS
QUALITY OF
INPUTS
QUALITY OF
PARTIALLY
PROCESSED
PRODUCTS
QUALITY OF
OUTPUTS
IQC THROUGHOUT PRODUCTION SYSTEM
2. Objects of Incoming Quality Control
9. Mar-16 Apr-16 May-16 Aug-16 Sep-16 Oct-16 Nov-16 Dec-16 Jan-17 Feb-17
Braket(1004
5-18751)
Holder Lead
Wire
Holder Lead
Wire
Holder Lead
Wire
Braket
(10045-
18751)
Braket A
(K15)
Braket A
(K15)
Case
sensor 1
Case
Sensor 1
Holder lead
wire
Koito Mitsuba Mistuba Mistuba Koito Koito Koito Mitsuba Mitsuba Mitsuba
Short Mold
NG 5 / 1000
(1%)
Burry
NG 5/1000
(0,5%)
Broken
NG 2/1000
(0,2%)
Broken
NG 12/1750
(0,69)
Broken
NG 3/2217
(0,14%)
Dimension
NG 9/250
(3,6%)
Short Mold
NG 4/250
(1,6%)
Short Mold
NG 4/100
(4%)
Burry
NG 9/100
(9%)
Deformation
NG 7/40 (17,5
%)
Holder Lead
Wire
Holder lead
wire
Case sensor
Holder
Lead Wire
Braket B Holder Lead
wire
Holder lead
wire
Mitsuba Mitsuba Mistuba Mitsuba Koito Mitsuba Mitsuba
Crack
NG 3/2217
(0,14%)
Burry
NG 5/1000
(1%)
Broken
NG 5/8000
(0.06%)
Broken
NG 1/4000
(0,03%)
Melting
NG 3/200
(1.5%)
Short Mold
NG 14/100
(14%)
Broken
NG 2/40
(5%)
Bracket
(10057-
18690)
Holder Lead
Wire
Case
sensor
Bracket X-43
Koito
Model : X43
Mitsuba Mitsuba Koito
Short mold
NG 2/250
(0,8%)
Melting
NG 3/100
(3%)
PCB cannot
Insert
Diameter hole
over
NG 262/433
(60,5%)
Holder Lead
Wire
Mitsuba
Burry
NG 35/100
(35%)
CPAR : IMC
3. History Problem and CPAR (main issue)
10. Aug-16 Sep-16 Oct-16 Nov-16 Jan-17 Feb-17 Mar-17 Apr-17 May-17 Jun-17
Lens
Bending
NG Step 40
(Knop
lighting)
> 2300
NG Step
39
(NG >
22300)
NG Step 15 Foreign
Material
NG Step 36
Spec : 1200
Act : - 1180
- 960
NG Dented
Switch Assy
Spec : 1200
Act : 1180
IQC
On prod.
Process
On Prod
process
On Prod
process
On prod.
Process
On process
IQC
On prod.
process
Qty NG :
1/208
Qty NG:
2 /128
Qty NG :
4/128
Qty NG :
2/128
Qty NG :
2/128
Qty NG :
2/128
Qty NG :
3/144
Qty NG :
1 / 128
Knob no
white line
NG Scratch
/
Dented
NG Dented Peel Off NG Crack
IQC IQC On IQC IQC ON Proses
NG : 1/208 Qty NG :
3/544
Qty NG :
1/128
Qty NG 1/
144
Qty NG :
1/28
Lens Broken NG Peel Off
IQC IQC
NG : 1/120 Qty NG :
23/936
Lens NG
IQC
NG : 6/224
CPAR : SSI
3. History Problem and CPAR (main issue)
11. Aug’16 Sep’16 Okt’16 Nov’16 Dec’16 Jan’17 Feb’17 Mar’17 Apr’17 May’17
Panel Assy Panel assy
Panel
Instrument
Panel Assy Panel Assy Panel assy
Panel
Instrument
IQC In process IQC On prod.
Proses
IQC IQC IQC
Scrath :
5/160
Scratch
1 / 176
Dented
1 / 128
Scrath :
1/128
No Printing :
6 /128
Scratch :
1/256
Short mold ;
1/128
Panel Assy
IQC
Scrath :
10 / 144
CPAR : EATI
3. History Problem and CPAR (main issue)
13. Okt’16 Nov’16 Dec’16 Jan’17 Feb’17 Mar’17 Apr’17 May’17 Jun’17
PCB K15G PCB D22D PCB D22D PCB Sharp PCB D22D
PCB
JACKAMP
PCB : HT502,
HT507
Koito Cust : AJI Cust : AJI Cust: Sharp Cust : AJI Cust : RolandSankyo
No Printing :
32/ 1500
No Hole :
2/200
NG Pad :
5/200
NG Dirty :
4/1500
NG
Dimension :
23
Scratch :
96 / 300
Abormal
PCB D22D PCB K15G
Cust : AJI Koito
Cutting NG :
8/200
No Printing :
4/ 500
CPAR : Kyosha
3. History Problem and CPAR (main issue)
14. Okt’16 Nov’16 Dec’16 Jan’17 Feb’17 Mar’17 Apr’17 May’17 Jun’17
PCB Bare
X53
PCB A9839 PCB 03F
Koito Mitsuba Koito
NG : 150/150 Broken : 5 / 25
sheet
Differernt color
: 270
Scrath : 22
Dirty : 6
Smlal Crack :
18
CPAR : CMK
3. History Problem and CPAR (main issue)
15. 4. Improvement Activity
Define problem Control and result
Measurement and Improvement Activity
Analysis
Case sensor ( IMC )
Short Mold On Case Sensor 1 (28-Des-2016) Happen in Production Line Mitsuba
16. 4. Improvement Activity
Define problem Control and result
Measurement and Improvement Activity
Analysis
Customer Claim ( Koito )
Base on Information from Koito Indonesia 20 December 2017, has problem with glue not full
From wire harness with supplier Onamba (Cord Assy C – K53)
1. Revision Working Instruction
Additional Glue MUST cover all the
hole bushing
2. Improvement methode Change
Direction after add glue at process
drying
3. Revision Standar Visual
Checking Additional
glue on gromet hole MUST
full
4. Make Sample part &
Limit Sample Of
Additiional Glue
17. 4. Improvement Activity
Define problem Control and result
Measurement and Improvement Activity
Analysis
10/6 during trial, the wire harness assembly process (hand soldering) any problem on pcb hole.
The harness assembly
(terminals) do not fit tightly
against the holes but easily
fall off.
NG
Can not effectively control
lead protrusion after solder
Max 2 +0 / -0.5。
Compare with sample original
Change spesification hole pcb
D22D Cord Assy Holes -- 3 holes diameter
18. 4. Improvement Activity
Define problem Control and result
Measurement and Improvement Activity
Analysis
Missing Printing – Kyosha K15G
Based on pdrf from production, IQC check raw material and finding problem
Missing printing on PCB, this is problem original from supplier.
Pne Panel has 16pcs, defect board has 32pcs, equal to 2 Panels.
One board side has no silk component mark, defect happened at
silk screen workshop.
After investigation, we found operators need use left hand to take
out board printed and use right hand to
deliver the boards before silk printing to print at the same time.
When we print the 10th board, we need to full inspect the board to
avoid misregistration. The printing table has
one pending printing board, operators take out this board to rack
by mistake when visual inspection.
and then lead to the defect that no-silk print board.
Problem : process methode
Missing silk screen printing can be
found by AVI, escaping reason is no
separating it after inspected.
During printing, it is requested that there is no need for
operators to put next pending board in machine before
10th self-inspection board. It is to avoid missing
printing for 2 different status board on hand at the
same time
During printing, it is requested
that there is no need for
operators to put next pending
board in machine before
10th self-inspection board. It is to
avoid missing printing for 2
different status board on hand at
the same time.
Permanent Corrective Action :
1、We send the defect picture to
operators, re-inspect the 275pcs
storage, but don't find the same
defect.
2、We add special defect board
location at AVI table to identify
different status.
Poor silk
screen board
buffering area
2016/10/19
19. 4. Improvement Activity
Define problem Control and result
Measurement and Improvement Activity
Analysis
Harness Problem ( 6D1 HL HARNESS ASSY )
SEK line finding abnormal terminal pin cable, condition terminal pin has done soldered
Qty : 1pcs./250pcs.
Date : 17 November
2016
Supplier : Onamba
Problem : harness can’t
insert
Problem cause any part
abnormal
Flow out to SEK.
The pin can’t detected
by operator. 1. Add quality reminder
2. Reeducation
3. Blind test to find skill performance
inspector.
1. Sortir stock in SEK
result : 0/400pcs.
2. Sortir all stock
in onamba.
result : 0/ 2000pcs
Corrective action :
1. Make new point check.
2. Monitoring 1 month
to know effect from action
20. 4. Improvement Activity
Define problem Control and result
Measurement and Improvement Activity
Analysis
Harness D22D
When 1st M/P we found problem on harness D22d cause problem 1. Pcb hole and 2. harness
pin terminal....(oktober 2016)
10% problem cause
The harness can’t insert
( difficult to insert pcb)
Date : 28 oktober 2016
Model : D22D
Supplier : Banshu
Problem
wing of
terminal too
open
So make
problem on
pcb hole
As for Permanent Improvement:
• Banshu will modify Crimping Mold (Awaiting
proposal from supplier – Req. < 1.65mm for
E2 distance)
• Drawing part E2 distance 1.75 +/-0.15mm,
actual raw material measure around
1.88~1.89mm.
even its under spec but we need <
1.65~1.60 for easy insert to holes.
After improvement
from supplier to :
1. Control length
wings
2. IQC make new
inspection for this
part.
The problem can
reduce until 0 ppm.
21. 4. Improvement Activity
Define problem Control and result
Measurement and Improvement Activity
Analysis
Kojima LCD Holder
On september 16, has found NG LCD pin broken original in line Kojima.
Problem suspected :
1. Handling delivery
2. Packing Methode
Supplier Polymatech
Trend NG ( LCD Holder )
1. 8 Sept = 5681ppm
2. 27 sept = 2000ppm
3. 5 oktober = 1500ppm
Main improvment :
1. Supplier change qty / box
before : 200pcs 180 pcs
2. SEK request change packing
before : Up – Down (vertical)
after : Side by side
After action we don’t find NG
again In IQC or Kojima Line
Decesion :
Improvment has been
Good effect.
Close
Saving Cost :
Benefit / Month :
246,240.00
Rp
Benefit / Year :
2,954,880.00
Rp
22. 4. Improvement Activity
Define problem Control and result
Measurement and Improvement Activity
Analysis
B/E Defect Trend BY PPM Base on
Customer
Have any problem on line cause sound abnormal for dec W1. 2016, customer Kawai and
rejected 7239 ppm
Kawai KKB - 40
Cause of Occurrence:
Sound abnormal Caused by
original material.
Because :
1. After analyze there are did
not found solderability
abnormal.
2. There are did not found
component
damage/broken
Picture of problem rubber dirty from polymatech
C/A of Flow Out:
1.IQC check rubber using microscope with
AQL level 0.65
2.Check using jig kaci-kaci to reduce NG
slow return
Polymatech :
1. Sortir all stock related last production
2. Add vacum to reduce foreign particle.
Result :
1. For 1st lot : 100% ok
iqc check : 0/ 2000pcs
2. IQC will monitoring until
1 month production
Action plan :
1. Make audit vendor to
monitoring actual
problem.
2. Conduct vendor
meeting for know detail
action.
Control
23. 4. Improvement Activity
Define problem
Saving
Control and result
Measurement and Improvement Activity
Analysis
Methode Inspection Up
Any problem in line defect cause pcb cannot insert cause hole case sensor problem in dimention
Some cavity in case sensor
Have problem with
Spesification.
Problem cavity can’t
control in IMC
Qty : 275pcs/3500
To reduce problem in line
IQC must check before
Used process.
Current check only visual
PROBLEM
Jan 20 '2017 have problem at Mitsuba line casue PCB can't insert .
Defect : 150.000ppm.
Control Case sensor
Change Inspection methode supplier sortir and IQC sampling Jan 2017
Result:0 PPM
Benefit / Month :
2,332,800.00
Rp
Benefit / Year :
27,993,600.00
Rp
Saving cost :
Jan ‘17
Close
24. 4. Improvement Activity
Define problem Control and result
Measurement and Improvement Activity
Analysis
There any suspected problem pcb warpage cause process ( smt process ).
Customer : Tokai Rika
75H228 – 7011C
To know the related SMT process
with PCB warpage we make
Some analysis.
Date : 8 Dec 2016.
Pic : Agung (IQC)
Model : 75H228
Qty : 30pcs
METODE PENGUKURAN
SIDE A, POSISI ATAS (HURUF T)
DI UKUR DARI A KE B
A
B
Before SMT : Check
SMT 1 Check
SMT 2 Check
SMT process has
effect with warpage
No pallet
With pallet
Decesion :
To reduce warpage pcb
Cause process, the process
Will using pallet when production
Pic : Ms. Dian
Mr. Boni
Pallet.
25. 4. Improvement Activity
Define problem Control and result
Measurement and Improvement Activity
Analysis
PANEL ASSY, INSTR CLUSTER FINISH happened on IQC lot inspection (dec 16)
Kojima : EATI
Appereance problem
cause scratch handling.
IQC lot incoming = NG
Qty : 6pcs
Supplier : EATI
Problem : scratch on cover
Why Defect Occured
Why 1. Scratch
Why 2. Occurs when
the process of painting,
process using a jig
Why 3. Operators do
not clean
the jig before painting
Why 4. Operator simply
focus on the process of
painting and just check
the part surface area
Why 1. The Inspector was not able to detect the
defect no knob assy
Why 2. Inspector missed a check point appeareance
and function part
Why 3. Inspector only glimpsed part & conditions
give no warranty marking process according
to the standard checks
Why 4. Inspector always hurry hurry when the check
ahead of time to rest and time to go home so
the process does not check up
Conclusion Why Send
1.Sorting all stock in
PT.EATI Qty = 128 pcs,
OK = 128 Pcs, NG = 0
Improvement Activity
1.Make a schedule and
maintenance rules cleaning
jig
2.Retraining operator
related cleaning jig before
use for painting
3.Retraining inspector
associated standardization
work according to SOP
IQC change AQL
Before : 100%
To AQL
28. 4. Debit Note and replcement 2016-2017
Based on history problem we make debit note and replcement to supplier.
No Company Price (usd ) Date
1 Kyoei NBC Electric (thai) 127.33 09/16
Kyoei NBC Electric 4257.00 12/16
2 Siix Nagoya (japan) 59.62 02/17
3 IMC Tekno (lokal) 260 02/17
4 Nichia Corporation 1248.00 05/17
5 CMKS 1440.00 05/17
6 Banshu 1241.00 06/17
7 Leos Circuit 190.45 06/17
8 Nichia kagaku 2386.20 06/17
9 EIKEI 5944.92 06/17
T O T A L 16154.52
Rp. 216,470,568.00
29. 5.IQC Management Set UP 2017 Plan
To optimaze man power skill and related main issue in line, IQC structure and rule
Must take action for solved the problem
Before
Additional focus :
1. Material PDRF
2. Supplier Performance
3. Inventory (RTV-Claim)
Reguler Inspection
IQC lot Incoming
NCP
After
30. 5.IQC Management Set UP 2017 Plan
Visual Management Board
Bertugas Hari ini
Sr.SPV and SPV
Bertugas Hari ini
Inspector
And Location table
Emergency and
Stop call wait.
Off team / other shift
Focus : Disipline
and responsibility
31. 2.IQC Management Set UP 2017 Plan
Supplier Performance Board
QUALITY AUDIT AND FOLLOW UP
Prior to writing auditing report,
auditor explains the observations to
auditee
Corrective actions to be taken are
proposed
Audit report are written in standard
format which contain area audited,
dates of audit, persons contacted,
commendable features and
recommendations.
The report must contain status of
implementation of pending corrective
measures as per previous audit.
1. Daily Performance Monitoring.
2. Montly Performance.
3. Issue / Action.
4. Remarks
Main part Bare PCB, Molding /plastic, Wire
32. Incoming will change the methode of sampling, we will study and application to some part
This is extension of double sampling plan
At each stage of sampling the cumulated results are analysed to take decision of
accepting/rejecting the lot
If no final decision can be taken at anyy stage, then another sample is drawn to take further
decision.
5.IQC Management Set UP
33. 5.IQC Management Set UP
RTV-S Monitoring Board
Issue : when IQC has done final judment material NG and must return the part. We need regulation and
standard must be follow like exim standard and custom.
Focus : Make sure in – out material is 100%
correct and related document and
payment ( purchasing – accounting )
34. 5.IQC Management Set UP
Material deffective management controlled, to make sure the problem must be inform
To supplier. Decesion for material problem scrap, debit note or RTV-s.
Before After
Saving Cost :
USD 21,212.31
Rp. 284,244,917.82
24 930
3717
usd
35. IQC management skill up with Supplier Control Audit System (SCA)
The Principle Inspector IQC (PI) will determine that the supplier complies with purchase
order and/or quality requirements.
5.IQC Management Set UP
Evaluates the outside sources’ (e.g.
supplier) system to control parts,
materials, supplies, and services.
The SCA determines that the supplier
complies with purchase order and/or
quality requirements, including any
statistical sampling that may be
utilized.
IQC with SCA will have regulation to
Audit supplier with audit schedule or
Accident problem.
How are the process of an SCA 2017. What are the results of an SCA
1. SCA will describes each of the
identified nonconformances.
2. SCA will make clear about debit
note/replcement from SEK to Vendor.
3. SCA need supplier quality agrement
(SQA) to make sure solve the
problem.
4. Reducing risk management with
preventive action in supplier.
36. Incoming Quality will using some steps of data assessment
Preventive
Define
• Review the objectives and sampling design
• Supplier performance monitoring
Analysis
Measurement
• Select the statistical method
• Verify the assumptions of the statistical method
Improvement
Solution
• Draw conclusions from the data
• DOE analysis report
• Six Sigma Projects
5.IQC METHODE PROCESS
37. 6. Performance Conclusion 2017 Plan
CONCLUSION
Quality is a never ending prospect.....
Increase in quality, increases production, decreases
cost and increases profits
Thus quality control and inspection form an integral
part of a company’s management.