The document discusses how heat dissipation during wafer exposure in a lithography process can cause deformations in the wafer and underlying table. A finite element model is developed to simulate the thermal expansion and resulting mechanical deformations, with the goal of understanding and reducing overlay errors between subsequent exposures on the wafer to within a tolerance of 1 nm. Simulation results show temperature distributions and deformations in the wafer, table, and chuck after exposing the first and last fields on the wafer.
Clean production in an industrial environmentThemadagen
This document discusses clean production in an industrial environment. It outlines a systematic approach to assessing contamination risks that involves 1) understanding the products and production process, 2) identifying potential contaminant sources, and 3) implementing controls through prevention, cleaning, and detection/qualification. The document emphasizes that cleanliness standards must be clearly defined and tailored to each application to balance costs and ensure functionality is not hindered.
This document discusses several topics related to manufacturing, technology trends, and Advantech's position as a market leader. It covers shifts in manufacturing as a percentage of GDP across nations, emerging industries like the Internet of Things, demographic changes, the future of software, green technology, transportation, and communication networks. It emphasizes that Advantech provides complete solutions through components, software, services and partnerships. In the final section, it provides an overview of Advantech as a leading industrial computing company with worldwide employees and sales broken down by product lines.
The document discusses how heat dissipation during wafer exposure in a lithography process can cause deformations in the wafer and underlying table. A finite element model is developed to simulate the thermal expansion and resulting mechanical deformations, with the goal of understanding and reducing overlay errors between subsequent exposures on the wafer to within a tolerance of 1 nm. Simulation results show temperature distributions and deformations in the wafer, table, and chuck after exposing the first and last fields on the wafer.
Clean production in an industrial environmentThemadagen
This document discusses clean production in an industrial environment. It outlines a systematic approach to assessing contamination risks that involves 1) understanding the products and production process, 2) identifying potential contaminant sources, and 3) implementing controls through prevention, cleaning, and detection/qualification. The document emphasizes that cleanliness standards must be clearly defined and tailored to each application to balance costs and ensure functionality is not hindered.
This document discusses several topics related to manufacturing, technology trends, and Advantech's position as a market leader. It covers shifts in manufacturing as a percentage of GDP across nations, emerging industries like the Internet of Things, demographic changes, the future of software, green technology, transportation, and communication networks. It emphasizes that Advantech provides complete solutions through components, software, services and partnerships. In the final section, it provides an overview of Advantech as a leading industrial computing company with worldwide employees and sales broken down by product lines.
The document discusses agile manufacturing and its key characteristics. It notes that agile manufacturing allows production systems to be reconfigured quickly in response to changing demands through the use of flexible, reconfigurable systems enabled by information technology. Examples of agile manufacturing approaches that enable varying levels of product variety are presented, including racing/lizard enterprises that focus on a single product and dinosaur/mule enterprises that can produce a wide range of products. The document concludes that trends point to an increasing role for information technology and intelligent machines to support less location-bound agile production systems of the future.
This document discusses micro-machining of ceramic components. It provides an overview of machining technologies for ceramics including electrical discharge machining, laser machining, water jet machining, and milling. It also describes the University of Leuven's activities in developing new ceramic materials and machining processes for ceramics. Examples of micro-machined ceramic components are given for different materials and processes.
Niels van Marle - Pezy Product InnovationThemadagen
Microcentrum themadag Dutch Design provides various design and manufacturing services including:
- Front-end exploration, design strategy development, and concept creation.
- Identity creation, function development, engineering design, and prototyping.
- Design for manufacturing, tool development, production engineering, and quality management.
- Program management, production ramp up, tool making, mold management, production, and assembly.
Their services help clients from ideation through industrialization and manufacturing support.
The document describes the Production4μ project which aims to develop ultra precision production technologies for optics manufacturing. It has a total budget of 15.43 million euros and involves multiple partners across the optics production process chain, from design to assembly. Key aspects covered include the precision glass moulding technology, the full process chain from tool making to glass preform production, and the development of new ultra low transition temperature glass materials suitable for the moulding process.
The document discusses the challenges of integrating electronics for complex systems as semiconductor technology advances according to Moore's law. It describes how Electronic Development addresses this challenge through an organizational structure of functional clusters, building blocks, and platforms to manage complexity and enable parallel development. The goal is fast and predictable integration through well-defined interfaces and early integration testing to reduce problems during system realization.
The document summarizes the latest developments in biopolymers from Wageningen University and Research Centre. It discusses the Biobased Performance Materials Programme (BPM) which aims to create an internationally appealing program to conduct dedicated research into biobased performance materials. The BPM funds proposals from industrial partners across the biobased materials value chain, from raw material producers to end users. Selected proposals include developing novel renewable polyamides, modifying semi-crystalline polyesters, generating biobased composite resins, and synthesizing acrylic and styrenic monomers from biomass.
This document provides an introduction to the book "Enterprise Mobility For Dummies". It discusses how enterprise mobility has changed with many more mobile options available today that may never connect to the corporate network. It notes challenges around knowing all mobile devices accessing the network, their applications, and managing devices of vendors and contractors. The introduction emphasizes that this book will serve as a guide for application development and deployment, management, and security for mobile devices not tied to wired networks, like laptops, tablets, and smartphones.
G. Leelakrishnan is seeking assignments in design and detail engineering in instrumentation. He has a Bachelor's degree in Instrumentation and Control Engineering from R.V.S College of Engineering. He has over 3 years of experience as an Instrumentation Engineer at Vetri Engineers in Coimbatore, India. Some of his responsibilities include design and documentation, developing vendor sources, and coordinating with clients and subcontractors on projects in oil and gas and water treatment. He is proficient in various engineering software and has participated in industrial automation and VLSI design workshops.
Business commerce is complex with many disconnected processes between internal functions and external partners. While companies have invested in technologies to streamline internal operations, commerce between businesses remains inefficient, costing an estimated $650 billion annually. Technology alone is not the solution as collaboration is also vital to improve how businesses buy, sell, and manage cash. Cloud-based collaborative commerce solutions aim to address these challenges by enabling easier access to resources and facilitating partnerships.
The document discusses agile manufacturing and its key characteristics. It notes that agile manufacturing allows production systems to be reconfigured quickly in response to changing demands through the use of flexible, reconfigurable systems enabled by information technology. Examples of agile manufacturing approaches that enable varying levels of product variety are presented, including racing/lizard enterprises that focus on a single product and dinosaur/mule enterprises that can produce a wide range of products. The document concludes that trends point to an increasing role for information technology and intelligent machines to support less location-bound agile production systems of the future.
This document discusses micro-machining of ceramic components. It provides an overview of machining technologies for ceramics including electrical discharge machining, laser machining, water jet machining, and milling. It also describes the University of Leuven's activities in developing new ceramic materials and machining processes for ceramics. Examples of micro-machined ceramic components are given for different materials and processes.
Niels van Marle - Pezy Product InnovationThemadagen
Microcentrum themadag Dutch Design provides various design and manufacturing services including:
- Front-end exploration, design strategy development, and concept creation.
- Identity creation, function development, engineering design, and prototyping.
- Design for manufacturing, tool development, production engineering, and quality management.
- Program management, production ramp up, tool making, mold management, production, and assembly.
Their services help clients from ideation through industrialization and manufacturing support.
The document describes the Production4μ project which aims to develop ultra precision production technologies for optics manufacturing. It has a total budget of 15.43 million euros and involves multiple partners across the optics production process chain, from design to assembly. Key aspects covered include the precision glass moulding technology, the full process chain from tool making to glass preform production, and the development of new ultra low transition temperature glass materials suitable for the moulding process.
The document discusses the challenges of integrating electronics for complex systems as semiconductor technology advances according to Moore's law. It describes how Electronic Development addresses this challenge through an organizational structure of functional clusters, building blocks, and platforms to manage complexity and enable parallel development. The goal is fast and predictable integration through well-defined interfaces and early integration testing to reduce problems during system realization.
The document summarizes the latest developments in biopolymers from Wageningen University and Research Centre. It discusses the Biobased Performance Materials Programme (BPM) which aims to create an internationally appealing program to conduct dedicated research into biobased performance materials. The BPM funds proposals from industrial partners across the biobased materials value chain, from raw material producers to end users. Selected proposals include developing novel renewable polyamides, modifying semi-crystalline polyesters, generating biobased composite resins, and synthesizing acrylic and styrenic monomers from biomass.
This document provides an introduction to the book "Enterprise Mobility For Dummies". It discusses how enterprise mobility has changed with many more mobile options available today that may never connect to the corporate network. It notes challenges around knowing all mobile devices accessing the network, their applications, and managing devices of vendors and contractors. The introduction emphasizes that this book will serve as a guide for application development and deployment, management, and security for mobile devices not tied to wired networks, like laptops, tablets, and smartphones.
G. Leelakrishnan is seeking assignments in design and detail engineering in instrumentation. He has a Bachelor's degree in Instrumentation and Control Engineering from R.V.S College of Engineering. He has over 3 years of experience as an Instrumentation Engineer at Vetri Engineers in Coimbatore, India. Some of his responsibilities include design and documentation, developing vendor sources, and coordinating with clients and subcontractors on projects in oil and gas and water treatment. He is proficient in various engineering software and has participated in industrial automation and VLSI design workshops.
Business commerce is complex with many disconnected processes between internal functions and external partners. While companies have invested in technologies to streamline internal operations, commerce between businesses remains inefficient, costing an estimated $650 billion annually. Technology alone is not the solution as collaboration is also vital to improve how businesses buy, sell, and manage cash. Cloud-based collaborative commerce solutions aim to address these challenges by enabling easier access to resources and facilitating partnerships.
Heel wat erfgoedverenigingen en erfgoedvrijwilligers zijn geïnteresseerd in het digitaliseren en online publiceren van hun documentaire collectie. Maar hoe begin je daaraan? Er wordt een beknopte introductie gegeven in hoe je je documenten het best kunt organiseren en digitaliseren. Vervolgens zien we ook hoe je de digitale bestanden kunt archiveren en ontsluiten. Hierbij komt ook de technische kant aan bod. Een basiskennis in het gebruik van een computer is vereist.
De kracht van een vraaggestuurde geïntegreerde supply chain waarbij we alleen focussen op de uitzonderingen en er geen verspilling is van tijd of grondstoffen
Waarom modulair bouwen de enige manier is om goeie marges te maken
Waarom u horizontaal over uw assortiment moet denken, en niet verticaal
Hoe koppel je vraag en toeleverketen aan elkaar
Hoe door verkoopkansen middels een configurator rechtstreeks te koppelen aan modulevarianten en stuklijsten het mogelijk wordt een voorspelling te doen van de benodigde materialen.
Hoe door uw leveranciers vervolgens via Tradecloud inzicht te geven in deze verkoopkansen en bijbehorende materiaal behoeftes zij kunnen anticiperen op wat komen gaat. Extreem korte levertijden zullen het resultaat zijn.
The document discusses adhesive bonding as an alternative joining method to welding, soldering, mechanical fasteners, and other techniques. It covers bonding theory, surface treatment methods, adhesive types, design considerations, examples of bonding applications, and trends in the industry. Success in bonding projects requires close collaboration between the customer, adhesive manufacturer, and equipment suppliers from the initial design phase.
The document discusses achieving reliable micro interconnections with long lifetime expectations. It describes common failure mechanisms for solder and adhesive micro interconnects, such as fatigue, creep, corrosion and brittle fracture. It also discusses how to improve interconnect design through careful material selection, understanding failure mechanisms, analyzing stress conditions, improving product design with modeling, and exploring new technologies like laser-induced forward transfer. The goal is to create systems with enhanced lifetimes through optimized interconnect design and technology.
Benjamin Mehlmann - Fraunhofer InstituteThemadagen
This document discusses laser micro joining processes and applications in research and development. It outlines laser beam sources and beam manipulation strategies used for micro joining applications in energy storage, electronics, and lightweight construction. Current approaches in research include welding copper with spatial and temporal power modulation to increase weld depth and quality. Developments aim to enable precision melt engineering through dynamic beam manipulation and modeling of laser micro joining processes.
This document discusses organic photovoltaic (OPV) technology and the Solliance OPV Program. The program aims to develop a complete technology toolbox for OPV to improve efficiency, lifetime, and lower costs. Current status shows efficiencies over 10% in the lab but lower efficiencies in modules. The program focuses on both solution processing and evaporated OPV using scalable printing and coating techniques. The goal is to achieve over 13% cell efficiency, 5% module efficiency, and manufacturing costs below €0.50/Wp by 2015.
This document provides an overview of a presentation on organic and printed electronics. The presentation covers topics such as OLED lighting and its potential market impact if OLEDs capture 10% of the lighting replacement market. It also discusses flexible OLEDs and OPVs, noting their potential applications in rollable, wearable, and easily integrated devices. The presentation reviews roll-to-roll manufacturing processes for these applications and the importance of techniques like slot die coating to enable low-cost, large-area production. It emphasizes the need for strict contamination control in OLED manufacturing. Finally, it provides a high-level summary and introduces the Holst Centre's work on large-area printing and coating technologies.
The document provides an introduction to organic and printed electronics. It discusses several societal challenges such as an aging population, increasing costs of healthcare, food waste, and energy needs. Organic and printed electronics offer advantages like low cost production using printing processes, flexibility, and lower environmental impact. Examples of applications mentioned include flexible displays, plastic solar cells, RFID tags, and electronic textiles. The market for printed electronics is predicted to grow substantially over the coming years across various industries such as healthcare, consumer packaging, and displays.
The document discusses research on smart materials for conformable electronics and photonics being conducted by Holst Centre. Holst Centre is an independent research organization co-founded by IMEC and TNO that focuses on creating generic technologies for flexible electronics. The presentation provides an overview of Holst Centre's work on organic light-emitting diodes (OLEDs) including applications, lifetime considerations, conformable technology approaches, and a vision for conformable electronic and photonic systems featuring wearable and stretchable designs.
Avantes is a developer and manufacturer of compact spectrometers, light sources, fiber optics, and accessories. It has sold over 17,000 spectrometers since 1994 and has annual worldwide sales of 10 million euros. Avantes uses its core spectrometer technology across multiple markets including life sciences and health, industrial processes, optical diagnosis spectroscopy and imaging, safety and security, agriculture and food, and green energy and environment. The document provides examples of spectroscopy applications for Avantes' products in areas such as LED measurements, solar panel measurements, thin film measurements, blood analyses, and food quality analysis.
The document describes the development of a low-cost ammonia sensor called the miniDOAS that uses UV spectrometry. It was created to address the need for more affordable ammonia monitoring by adapting the established Differential Optical Absorption Spectroscopy (DOAS) technique using less expensive components. Testing showed it can measure ammonia concentrations comparably to the research-grade RIVM DOAS system, but at a fraction of the cost. Further development aims to commercialize the miniDOAS for wider air quality monitoring and research applications.
1) Additive manufacturing (AM) opens revolutionary opportunities for high tech equipment development by enabling new and innovative mechatronic system designs.
2) AM can help address challenges for high tech equipment like improving accuracy, productivity, and reducing costs by providing ultimate design freedom and integration capabilities.
3) For high tech systems, AM enables new solutions like lightweight, integrated, and freeform designs which conventional manufacturing cannot achieve. AM moves manufacturing from "design for manufacturing" to "manufacturing for design."