Niels van Marle - Pezy Product InnovationThemadagen
Microcentrum themadag Dutch Design provides various design and manufacturing services including:
- Front-end exploration, design strategy development, and concept creation.
- Identity creation, function development, engineering design, and prototyping.
- Design for manufacturing, tool development, production engineering, and quality management.
- Program management, production ramp up, tool making, mold management, production, and assembly.
Their services help clients from ideation through industrialization and manufacturing support.
This document discusses several topics related to manufacturing, technology trends, and Advantech's position as a market leader. It covers shifts in manufacturing as a percentage of GDP across nations, emerging industries like the Internet of Things, demographic changes, the future of software, green technology, transportation, and communication networks. It emphasizes that Advantech provides complete solutions through components, software, services and partnerships. In the final section, it provides an overview of Advantech as a leading industrial computing company with worldwide employees and sales broken down by product lines.
Clean production in an industrial environmentThemadagen
This document discusses clean production in an industrial environment. It outlines a systematic approach to assessing contamination risks that involves 1) understanding the products and production process, 2) identifying potential contaminant sources, and 3) implementing controls through prevention, cleaning, and detection/qualification. The document emphasizes that cleanliness standards must be clearly defined and tailored to each application to balance costs and ensure functionality is not hindered.
The document discusses how heat dissipation during wafer exposure in a lithography process can cause deformations in the wafer and underlying table. A finite element model is developed to simulate the thermal expansion and resulting mechanical deformations, with the goal of understanding and reducing overlay errors between subsequent exposures on the wafer to within a tolerance of 1 nm. Simulation results show temperature distributions and deformations in the wafer, table, and chuck after exposing the first and last fields on the wafer.
This document discusses micro-machining of ceramic components. It provides an overview of machining technologies for ceramics including electrical discharge machining, laser machining, water jet machining, and milling. It also describes the University of Leuven's activities in developing new ceramic materials and machining processes for ceramics. Examples of micro-machined ceramic components are given for different materials and processes.
Niels van Marle - Pezy Product InnovationThemadagen
Microcentrum themadag Dutch Design provides various design and manufacturing services including:
- Front-end exploration, design strategy development, and concept creation.
- Identity creation, function development, engineering design, and prototyping.
- Design for manufacturing, tool development, production engineering, and quality management.
- Program management, production ramp up, tool making, mold management, production, and assembly.
Their services help clients from ideation through industrialization and manufacturing support.
This document discusses several topics related to manufacturing, technology trends, and Advantech's position as a market leader. It covers shifts in manufacturing as a percentage of GDP across nations, emerging industries like the Internet of Things, demographic changes, the future of software, green technology, transportation, and communication networks. It emphasizes that Advantech provides complete solutions through components, software, services and partnerships. In the final section, it provides an overview of Advantech as a leading industrial computing company with worldwide employees and sales broken down by product lines.
Clean production in an industrial environmentThemadagen
This document discusses clean production in an industrial environment. It outlines a systematic approach to assessing contamination risks that involves 1) understanding the products and production process, 2) identifying potential contaminant sources, and 3) implementing controls through prevention, cleaning, and detection/qualification. The document emphasizes that cleanliness standards must be clearly defined and tailored to each application to balance costs and ensure functionality is not hindered.
The document discusses how heat dissipation during wafer exposure in a lithography process can cause deformations in the wafer and underlying table. A finite element model is developed to simulate the thermal expansion and resulting mechanical deformations, with the goal of understanding and reducing overlay errors between subsequent exposures on the wafer to within a tolerance of 1 nm. Simulation results show temperature distributions and deformations in the wafer, table, and chuck after exposing the first and last fields on the wafer.
This document discusses micro-machining of ceramic components. It provides an overview of machining technologies for ceramics including electrical discharge machining, laser machining, water jet machining, and milling. It also describes the University of Leuven's activities in developing new ceramic materials and machining processes for ceramics. Examples of micro-machined ceramic components are given for different materials and processes.
The document describes the Production4μ project which aims to develop ultra precision production technologies for optics manufacturing. It has a total budget of 15.43 million euros and involves multiple partners across the optics production process chain, from design to assembly. Key aspects covered include the precision glass moulding technology, the full process chain from tool making to glass preform production, and the development of new ultra low transition temperature glass materials suitable for the moulding process.
The document discusses agile manufacturing and its key characteristics. It notes that agile manufacturing allows production systems to be reconfigured quickly in response to changing demands through the use of flexible, reconfigurable systems enabled by information technology. Examples of agile manufacturing approaches that enable varying levels of product variety are presented, including racing/lizard enterprises that focus on a single product and dinosaur/mule enterprises that can produce a wide range of products. The document concludes that trends point to an increasing role for information technology and intelligent machines to support less location-bound agile production systems of the future.
The document discusses the challenges of integrating electronics for complex systems as semiconductor technology advances according to Moore's law. It describes how Electronic Development addresses this challenge through an organizational structure of functional clusters, building blocks, and platforms to manage complexity and enable parallel development. The goal is fast and predictable integration through well-defined interfaces and early integration testing to reduce problems during system realization.
The document summarizes the latest developments in biopolymers from Wageningen University and Research Centre. It discusses the Biobased Performance Materials Programme (BPM) which aims to create an internationally appealing program to conduct dedicated research into biobased performance materials. The BPM funds proposals from industrial partners across the biobased materials value chain, from raw material producers to end users. Selected proposals include developing novel renewable polyamides, modifying semi-crystalline polyesters, generating biobased composite resins, and synthesizing acrylic and styrenic monomers from biomass.
The document discusses adhesive bonding as an alternative joining method to welding, soldering, mechanical fasteners, and other techniques. It covers bonding theory, surface treatment methods, adhesive types, design considerations, examples of bonding applications, and trends in the industry. Success in bonding projects requires close collaboration between the customer, adhesive manufacturer, and equipment suppliers from the initial design phase.
The document discusses achieving reliable micro interconnections with long lifetime expectations. It describes common failure mechanisms for solder and adhesive micro interconnects, such as fatigue, creep, corrosion and brittle fracture. It also discusses how to improve interconnect design through careful material selection, understanding failure mechanisms, analyzing stress conditions, improving product design with modeling, and exploring new technologies like laser-induced forward transfer. The goal is to create systems with enhanced lifetimes through optimized interconnect design and technology.
Benjamin Mehlmann - Fraunhofer InstituteThemadagen
This document discusses laser micro joining processes and applications in research and development. It outlines laser beam sources and beam manipulation strategies used for micro joining applications in energy storage, electronics, and lightweight construction. Current approaches in research include welding copper with spatial and temporal power modulation to increase weld depth and quality. Developments aim to enable precision melt engineering through dynamic beam manipulation and modeling of laser micro joining processes.
This document discusses organic photovoltaic (OPV) technology and the Solliance OPV Program. The program aims to develop a complete technology toolbox for OPV to improve efficiency, lifetime, and lower costs. Current status shows efficiencies over 10% in the lab but lower efficiencies in modules. The program focuses on both solution processing and evaporated OPV using scalable printing and coating techniques. The goal is to achieve over 13% cell efficiency, 5% module efficiency, and manufacturing costs below €0.50/Wp by 2015.
This document provides an overview of a presentation on organic and printed electronics. The presentation covers topics such as OLED lighting and its potential market impact if OLEDs capture 10% of the lighting replacement market. It also discusses flexible OLEDs and OPVs, noting their potential applications in rollable, wearable, and easily integrated devices. The presentation reviews roll-to-roll manufacturing processes for these applications and the importance of techniques like slot die coating to enable low-cost, large-area production. It emphasizes the need for strict contamination control in OLED manufacturing. Finally, it provides a high-level summary and introduces the Holst Centre's work on large-area printing and coating technologies.
The document provides an introduction to organic and printed electronics. It discusses several societal challenges such as an aging population, increasing costs of healthcare, food waste, and energy needs. Organic and printed electronics offer advantages like low cost production using printing processes, flexibility, and lower environmental impact. Examples of applications mentioned include flexible displays, plastic solar cells, RFID tags, and electronic textiles. The market for printed electronics is predicted to grow substantially over the coming years across various industries such as healthcare, consumer packaging, and displays.
The document discusses research on smart materials for conformable electronics and photonics being conducted by Holst Centre. Holst Centre is an independent research organization co-founded by IMEC and TNO that focuses on creating generic technologies for flexible electronics. The presentation provides an overview of Holst Centre's work on organic light-emitting diodes (OLEDs) including applications, lifetime considerations, conformable technology approaches, and a vision for conformable electronic and photonic systems featuring wearable and stretchable designs.
The document describes the Production4μ project which aims to develop ultra precision production technologies for optics manufacturing. It has a total budget of 15.43 million euros and involves multiple partners across the optics production process chain, from design to assembly. Key aspects covered include the precision glass moulding technology, the full process chain from tool making to glass preform production, and the development of new ultra low transition temperature glass materials suitable for the moulding process.
The document discusses agile manufacturing and its key characteristics. It notes that agile manufacturing allows production systems to be reconfigured quickly in response to changing demands through the use of flexible, reconfigurable systems enabled by information technology. Examples of agile manufacturing approaches that enable varying levels of product variety are presented, including racing/lizard enterprises that focus on a single product and dinosaur/mule enterprises that can produce a wide range of products. The document concludes that trends point to an increasing role for information technology and intelligent machines to support less location-bound agile production systems of the future.
The document discusses the challenges of integrating electronics for complex systems as semiconductor technology advances according to Moore's law. It describes how Electronic Development addresses this challenge through an organizational structure of functional clusters, building blocks, and platforms to manage complexity and enable parallel development. The goal is fast and predictable integration through well-defined interfaces and early integration testing to reduce problems during system realization.
The document summarizes the latest developments in biopolymers from Wageningen University and Research Centre. It discusses the Biobased Performance Materials Programme (BPM) which aims to create an internationally appealing program to conduct dedicated research into biobased performance materials. The BPM funds proposals from industrial partners across the biobased materials value chain, from raw material producers to end users. Selected proposals include developing novel renewable polyamides, modifying semi-crystalline polyesters, generating biobased composite resins, and synthesizing acrylic and styrenic monomers from biomass.
The document discusses adhesive bonding as an alternative joining method to welding, soldering, mechanical fasteners, and other techniques. It covers bonding theory, surface treatment methods, adhesive types, design considerations, examples of bonding applications, and trends in the industry. Success in bonding projects requires close collaboration between the customer, adhesive manufacturer, and equipment suppliers from the initial design phase.
The document discusses achieving reliable micro interconnections with long lifetime expectations. It describes common failure mechanisms for solder and adhesive micro interconnects, such as fatigue, creep, corrosion and brittle fracture. It also discusses how to improve interconnect design through careful material selection, understanding failure mechanisms, analyzing stress conditions, improving product design with modeling, and exploring new technologies like laser-induced forward transfer. The goal is to create systems with enhanced lifetimes through optimized interconnect design and technology.
Benjamin Mehlmann - Fraunhofer InstituteThemadagen
This document discusses laser micro joining processes and applications in research and development. It outlines laser beam sources and beam manipulation strategies used for micro joining applications in energy storage, electronics, and lightweight construction. Current approaches in research include welding copper with spatial and temporal power modulation to increase weld depth and quality. Developments aim to enable precision melt engineering through dynamic beam manipulation and modeling of laser micro joining processes.
This document discusses organic photovoltaic (OPV) technology and the Solliance OPV Program. The program aims to develop a complete technology toolbox for OPV to improve efficiency, lifetime, and lower costs. Current status shows efficiencies over 10% in the lab but lower efficiencies in modules. The program focuses on both solution processing and evaporated OPV using scalable printing and coating techniques. The goal is to achieve over 13% cell efficiency, 5% module efficiency, and manufacturing costs below €0.50/Wp by 2015.
This document provides an overview of a presentation on organic and printed electronics. The presentation covers topics such as OLED lighting and its potential market impact if OLEDs capture 10% of the lighting replacement market. It also discusses flexible OLEDs and OPVs, noting their potential applications in rollable, wearable, and easily integrated devices. The presentation reviews roll-to-roll manufacturing processes for these applications and the importance of techniques like slot die coating to enable low-cost, large-area production. It emphasizes the need for strict contamination control in OLED manufacturing. Finally, it provides a high-level summary and introduces the Holst Centre's work on large-area printing and coating technologies.
The document provides an introduction to organic and printed electronics. It discusses several societal challenges such as an aging population, increasing costs of healthcare, food waste, and energy needs. Organic and printed electronics offer advantages like low cost production using printing processes, flexibility, and lower environmental impact. Examples of applications mentioned include flexible displays, plastic solar cells, RFID tags, and electronic textiles. The market for printed electronics is predicted to grow substantially over the coming years across various industries such as healthcare, consumer packaging, and displays.
The document discusses research on smart materials for conformable electronics and photonics being conducted by Holst Centre. Holst Centre is an independent research organization co-founded by IMEC and TNO that focuses on creating generic technologies for flexible electronics. The presentation provides an overview of Holst Centre's work on organic light-emitting diodes (OLEDs) including applications, lifetime considerations, conformable technology approaches, and a vision for conformable electronic and photonic systems featuring wearable and stretchable designs.
Avantes is a developer and manufacturer of compact spectrometers, light sources, fiber optics, and accessories. It has sold over 17,000 spectrometers since 1994 and has annual worldwide sales of 10 million euros. Avantes uses its core spectrometer technology across multiple markets including life sciences and health, industrial processes, optical diagnosis spectroscopy and imaging, safety and security, agriculture and food, and green energy and environment. The document provides examples of spectroscopy applications for Avantes' products in areas such as LED measurements, solar panel measurements, thin film measurements, blood analyses, and food quality analysis.
The document describes the development of a low-cost ammonia sensor called the miniDOAS that uses UV spectrometry. It was created to address the need for more affordable ammonia monitoring by adapting the established Differential Optical Absorption Spectroscopy (DOAS) technique using less expensive components. Testing showed it can measure ammonia concentrations comparably to the research-grade RIVM DOAS system, but at a fraction of the cost. Further development aims to commercialize the miniDOAS for wider air quality monitoring and research applications.
1) Additive manufacturing (AM) opens revolutionary opportunities for high tech equipment development by enabling new and innovative mechatronic system designs.
2) AM can help address challenges for high tech equipment like improving accuracy, productivity, and reducing costs by providing ultimate design freedom and integration capabilities.
3) For high tech systems, AM enables new solutions like lightweight, integrated, and freeform designs which conventional manufacturing cannot achieve. AM moves manufacturing from "design for manufacturing" to "manufacturing for design."
1. 0
Themadag: Corrosie (roest) voorkomen is beter dan genezen
Maintenance & Corrosie
Ir. Jacko Aerts / 26 oktober 2010
TU Delft, Metaalkunde (1986)
p
DSM: - Materiaal & Corrosie competence
- Maintenance Studiekern Corrosie
DSM Corporate Operations & Responsible Care
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Ir. Jacko Aerts, Competence Leader Materials & Corrosion
Relatie maintenance en corrosie 1
• Maintenance Æ waarborgen van integriteit
• Integriteit Æ functionaliteit, esthetisch, veiligheid
• Bedreigingen Æ corrosie en andere faalmechanismen
• Waarborgen Æ inspecteren, evalueren, repareren
• Inspecteren: waar, wanneer, hoe?
• Evalueren: begrijp ik het? incident of systematisch?
het?,
• Repareren: nu of later?, hoe?, vervangen?
• Vereist: Kennis van corrosie (en andere faalmechanismen)
• Welke vorm van corrosie
• Waar kun je die verwachten
• Hoe snel verloopt de corrosie
• Wat kun je ertegen doen
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2. Corrosiepreventie in drie stadia 2
• Preventie op de tekentafel
• Design
• Uitvoeringsdetails
g
• Materiaalkeuze
• Goede uitvoering in praktijk
• Materialen juist behandelen
• Controle op lassen / montage / ophanging
• Controle op stralen / conserveren / isoleren
• Juiste bedrijfsvoering
• Beheersing van temperatuur / flow / batchtijden
• CIP-procedures
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Integriteit 3
• Waarom? Æ VEILIGHEID !!!
Onthoud:
Er bevinden zich meestal maar enkele mm’s
materiaal tussen jou en een vloeistof / g die
j gas
giftig / brandbaar / verstikkend /
kankerverwekkend / bijtend /
heet / koud / nat / zwaar
is.
is
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3. Integriteit 4
Onthoud:
• W
Waarom? Æ VEILIGHEID !!!
? Er bevinden zich meestal maar enkele mm’s
materiaal tussen jou en een vloeistof die
giftig / brandbaar / verstikkend /
kankerverwekkend / bijtend /
Integriteit heet / koud / nat / zwaar
is.
33% Uniform Corrosion
Faalmechanismen 11% Corrosion Fatigue
19% Transgranular SCC
6% Intergranular SCC
2% H-embrittlement
>80% corrosie 1% H2 - attack
5% Pitting
(
(Bron: BASF)
) 4% Intergranular corosion
6% Mechanical (w ear, erosion, cavitation
3% High temperature
10% other corrosion forms
DSM Corporate Operations & Responsible Care
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Theorie van corrosie (1) 5
• Definitie van corrosie:
Corrosie is de ongewenste verwijdering van
materiaal door (elektro-) chemische reactie met het
medium waaraan het is blootgesteld.
• Chemische reactie: sneller als T stijgt
• “Elektro-” : transport van elektronen / ionen
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4. Theorie van corrosie (2) 6
O2
O2 Fe + 2OH Î Fe(OH)2
++
4Fe(OH)2 + O2 + 2H2O Î 4Fe(OH)3
2Fe(OH)3 Î Fe2O3 .H2O + 2H2O
O2 H2O
O2
Fe(OH)3
O2 O2
O2 O2
O2 O2 Fe(OH)2 O2
OH- Stream OH-
of ions
Fe2+
electrons
e- e-
Fe Fe
Anode Cathode
Cathode
Fe Î Fe2+ + 2e-
O2 + 2H2O + 4e Î 4OH
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Theorie van corrosie (3) 7
Passiviteit Galvanische reeks
Goud
• Beschermend, dicht oxidelaagje Edel /
Grafiet
Kathodisch
• Z
Zeer dun, transparant
d t t Titanium
• Sterk hechtend Hastelloy C
Monel
• Zelfherstellend Koper
K
• Corrosieresistent Lood
• Slijtvast CrNi 18.8
13Cr staal
Staal
Aluminium
Cadmium
Onedel /
Zink
Anodisch
Magnesium
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5. Corrosievormen op basis van uiterlijk 8
1. Gelijkmatige corrosie
2. Galvanische corrosie
3. Putvormige corrosie (“pitting”)
4. Spleetcorrosie
4 S l t i
5. Interkristallijne corrosie
6.
6 Spanningscorrosie (“stress corrosion cracking = SCC”)
( stress SCC )
7. Erosie-corrosie
8. Microbiologische corrosie (“MIC”)
En andere vormen…
Corrosie onder isolatie (= atmosferische corrosie)
C-staal: zie 1.
Roestvast staal: zie 6.
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Gelijkmatige corrosie 9
• Meest voorkomende vorm van corrosie
• Chemische of elektrochemische reactie
• Het metaal wordt wordt dunner en bezwijkt uiteindelijk door
j j
overbelasting
• Vaak minder bedreigend doordat de resterende levensduur
nauwkeurig bepaald kan worden
• Maintenance:
• Wanddiktemetingen
• Coatings
metaal
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6. Gelijkmatige corrosie 10
Melassetank, Delft (1999)
, ( )
DSM Corporate Operations & Responsible Care
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Voorkomen van: Gelijkmatige corrosie 11
• Corrosie kan worden voorkomen of verminderd door:
• Juiste materialen, meer Cr en Mo
• Coatings
• Inhibitors
• Kathodische bescherming
• Goed werkende afsluiters
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7. Coatings en de zwakste schakel 12
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Leidingbrug goed geconserveerd? 13
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8. Galvanische corrosie 14
• Een potentiaalverschil (verschil in edelheid) tussen twee verschillende
metalen i een corrosief milieu veroorzaakt elektronentransport.
t l in i f ili kt l kt t t
• Corrosie van het minder edele metaal wordt versterkt doordat hier
vooral de anodische reactie verloopt.
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Voorkomen van: Galvanische corrosie 15
• Kies combinaties van metalen zo dicht
mogelijk bij elkaar in de galvanische
reeks
• Vermijd kleine anodische en grote
kathodische oppervlakken
• Zorg voor elektrische isolatie
• Pas een coating toe
Let op: schilder altijd 5-10 cm van het
edele metaal mee: kathodische reactie
beperken
b k
• Ontwerp eenvoudig te vervangen
anodische delen, of pas een derde deel
toe d anodisch i ten opzichte van d
dat di h is i h de
twee andere (opofferingsanode)
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9. Kathodische bescherming 16
• Kathodische bescherming is het ervoor zorgen dat het staal de kathode
is in de corrosie reactie
• Gegalvaniseerd staal: zink is anodisch t.o.v. staal en zal preferent
corroderen
• Magnesium anodes verbonden met een ondergrondse pijpleiding
beschermen deze tegen corrosie
• Onder porositeiten in tin- of chroom-lagen zal staal preferent
corroderen omdat het onedeler is (anodisch)
tin zink
staal staal
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Putvormige corrosie 17
• Locale aantasting resulteert in gaten / holtes
• Doorbraak van de passieve laag
• Start vaak bij oppervlaktedefecten / dikke oxidelagen
DSM Corporate Operations & Responsible Care
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10. Voorkomen van: putvormige corrosie 18
• Pitting Resistance Equivalent Number (PREN)
PREN = %Cr + 3.3%Mo + 16%N
• X2CrNi 18 9 (304L; 1.4307)
stenter
• X2CrNiMo 17 13 2 (316L; 1.4404)
• X2CrNiMoN 22 5 3 (duplex; 1.4462)
( p ; )
Resis
• X2NiCrMoCu 31 27 4 (1.4563)
• Vermijd chlorides
• Verwijder oxidelagen als gevolg van lassen
• Zorg voor gladde en schone oppervlakken
• Voorkom stilstaande media (vermijd afzettingen)
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Voorkomen van: putvormige corrosie 19
Ter plaatse van
p
aanloopkleuren is
RVS gevoeliger voor
chlorides;
Oplossing:
1.
1 goed schuren
2. beitsen
En de binnenkant?
DSM Corporate Operations & Responsible Care
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11. Interkristallijne corrosie 20
Heat affected zone
“Lasbederf”
Cr-carbides
500°C 800°C
-Vorming van Cr carbides op
Vorming Cr-carbides
korrelgrenzen in 800 – 500°C zone
-V
Verarming van C i matrix naast d
i Cr in ti t de
carbides Æ verlies van corrosie
resistentie
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Spanningscorrosie 21
• Combinatie effect van corrosief milieu en trekspanning
• Zeer fijne, vertakte scheuren in verder nauwelijks aangetast metaal
• Scheuren lopen dwars door de korrels, of volgen de korrelgrenzen
p , g g
• Scheuren groeien relatief snel Æ hoog risico op lekkage
Transkristallijn Interkristallijn
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12. Spanningscorrosie (SCC) 22
Interkristallijne SCC
Transkristallijne SCC
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Spanningscorrosie – invloed temperatuur 23
• chloride - SCC in austenitisch roestvast staal: > 50°C
50 C
• NO3- - SCC in C-staal: > 50°C (up to 240°C)
( p )
• Loog - SCC in C-staal: > 50°C
• Loog - SCC in austenitisch roestvast staal:
• 304L: > 100 to 120°C
120 C
• 316L: > 130 to 150°C
• NH3- SCC in messing: omgevings temperatuur
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13. Spanningscorrosie 24
Chloride-SCC in RVS LFK-koppelring
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Spanningscorrosie 25
RVS koppelring van p p
pp g pomphuis
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14. Voorkomen van: spanningscorrosie 26
SCC doordat pakking met lijm is Nummer 357 geschreven op pijp.
bevestigd.
Lijm, inkt, etc. bevat chlorides !
DSM Corporate Operations & Responsible Care
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Ir. Jacko Aerts, Competence Leader Materials & Corrosion
Corrosie onder isolatie 27
• Onder natte thermische isolatie
• Lange tijd verborgen achter isolatiebeplating
• C-staal + water + zuurstof + … (gelijkmatige corrosion)
(g j g )
• RVS + water + chlorides + … (pitting, SCC)
• Preventie (“houdt het droog”)
• Houdt isolatiebeplating waterdicht / afwaterend
• Coaten van C-staal (QA/QC tijdens voorbehandelen + applicatie)
• Al-folie wikkelen rond RVS (kustgebieden)
( g )
• Inspecteer critische locaties regelmatig (inspectie programma)
• Niet isoleren als het niet nodig is
• Gebruik ‘gesloten cel’ isolatiemateriaal (b v foam glass)
(b.v.
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15. Voorkomen van: corrosie onder isolatie 28
Kritische lokaties
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Voorkomen van: corrosie onder isolatie 29
• Corrosie onder isolatie van C-staal
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16. Steun van vat: toestand onder isolatie? 30
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Voorkomen van: COI – door goed ontwerp 31
insulation
AI
sheeting
g
Reactor wall
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17. Bescherming tegen corrosie 32
Ontwerp
Electrochemisch:
anodische/kathodische
bescherming
Materiaal CORROSIE Milieu
Vervangen / aanpassen isoleren Veranderen / aanpassen
Beschermende l
B h d lagen
Legeren - metallisch Inhibitie
warmtebehandelen - coatings waterbehandeling
DSM Corporate Operations & Responsible Care
Functional Excellence Manufacturing
Ir. Jacko Aerts, Competence Leader Materials & Corrosion
Inspectie 33
• Wat kan er gebeurd zijn
• Proces + materiaal + historie Æ faalmechanismen
• Waar moet er gezocht worden
• Kritische lokaties (bochten, lassen, ontwerp details)
• Hoe moet er gezocht worden
• Visueel, Niet-destructief, on-line monitoring, anders
• Beperkingen
p g
• Inwendig
• Van buitenaf
• Tijd / kosten
DSM Corporate Operations & Responsible Care
Functional Excellence Manufacturing
Ir. Jacko Aerts, Competence Leader Materials & Corrosion
18. Vormen van Niet-Destructief Onderzoek
Niet- 34
• Penetrant scheuronderzoek
• Magnetisch scheuronderzoek
• Ultrasone (
Ult (wanddikte) metingen (
ddikt ) ti (o.a. “B tl ”)
“Beetle”)
• Radiografisch onderzoek (Röntgen, isotoop)
• Wervelstroom onderzoek
W l t d k
• Magnetische inductie (tankbodems)
• Infrarood Thermografie
I f d Th fi
• Acoustische emissie
• …
DSM Corporate Operations & Responsible Care
Functional Excellence Manufacturing
Ir. Jacko Aerts, Competence Leader Materials & Corrosion
NDO afhankelijk van faalmechanisme 35
Invloed op Niet-destructieve
integriteit test methode Reference:
gelijkmatige corrosie - / ++ (V) UT X ++ = very serious
+ = serious
putvormige corrosie O V UT X
O = moderate
spleetcorrosie - (V) UT X - = minor
V = visual
galvanische corrosie + V UT X
UT = ultrasonic
interkristallijne corrosie + (V) UT X EC X = rontgen
erosie - corrosie O V UT X EC = eddy-current
M = magnetic
spanningscorrosie ++ (V) PT M UT X EC
PT = penetrant
microbiologische corrosie + (V) UT X
DSM Corporate Operations & Responsible Care
Functional Excellence Manufacturing
Ir. Jacko Aerts, Competence Leader Materials & Corrosion
19. Enkele opmerkingen tot slot 36
• Materialen zorgen voor integriteit; ga er zorgvuldig mee om
• Corrosie is de belangrijkste bedreiging voor integriteit
(
(belangrijkste faalmechanisme)
g j )
• Preventie en beheersing van corrosie start al bij het
ontwerp (
p (van pproces en installatie)
)
• Herken corrosie als het optreedt
• Weet waar, wanneer en hoe te inspecteren
, p
• Bij twijfel: schakel een deskundige in!
DSM Corporate Operations & Responsible Care
Functional Excellence Manufacturing
Ir. Jacko Aerts, Competence Leader Materials & Corrosion
