Outstanding thermal dissipating films for portable or wearable devices.

1. Heat dissipation technology
exchange report
Suzhou Enbrightech Co., Ltd.
cheng.zhang
2015/05/02

2. 1
3
Topic
Thermal Material Introduction
2
Discussion exchange
Application mode and case
Contents

3. 3
Multifunctional Nano-dissipating material
The application of the principle of multi-fu
nctional nano-materials are coating nano h
eat dissipation layer on a metal substrate
by heat conduction, heat exchange and the
rmal radiation way to achieve fast, efficient
cooling.
1）Artificially synthesized high thermal conductive nano particles and high radiation
nano particles, the use of coating process and metal matrix composite , Achieve high
efficiency cooling.
2）Product along with shielding, insulation, heat multiple functions , which can replace
the 1 models of raw materials 3 materials, the same performance, the cost can be
saved about 30%.
Technical innovations
Material structure
Multifunctional nano material Surface microstructure Core particle
Enlarged image Enlarged image

4. 4
Core technology
1）A unique thermal conductive coatings formulation is synthesized using high thermal
conductive nano particles and high radiation nano particles.
2) Increasing the heat conduction rib on the multi functional nano thermal material surface can
improve the performance of the 20% surface heat dissipation.
Core technology
High thermal conductive nanoparticlesHigh radiation nanoparticles
表面结构图
Sectional view of the second generation
Heat conduction rib
＋
3) High thermal conductivity of nano network: formed by the high conductive nanoparticles
conduction path and thermal Network Alliance, to achieve efficient thermal conductivity of
nano-coating.
4）Surface insulation resistance reaches 1010, high pressure test 5KV
=
coating
Cooling coating
Metal substrate
Sectional view of the first generation
Cooling coating
Metal substrate

5. 5
Performance parameters
Project Performance standard test
X-Y Thermal conductivity
800 W/M.K ASTM D5470
Z Thermal conductivity
35 W/M.K ASTM D5470
Surface Insulation
Resistance >1.9*1010 ASTM D257-07
The main performance parameters of multifunctional Nano-dissipating material ：
Comparative data can be seen from the heat multifunctional nano materials and
Matsushita artificial graphite flakes in the practical application of the test,
multifunctional nano-dissipating material temperature is low 10%, 40% lower price.

6. Uniform heat sink of application and field
Handheld display device Entertainment device Large-screen display High power lighting
No
heat
sink
Heat
sink

7. Graphite Multifunctional nano cooling film
Poor toughness, easy
pulverization, easy to fold,
needs to be covered with
plastic film wrapping
Nano radiating film has
the advantages of
simple structure, no
film wrapping process,
and surface insulation
Graphite piece
processing technology is
complex, generally need
5 production processes
Processing technology
is simple, punching
molding
1 .High cost, an average of 260 yuan / square
2 .the performance of X-Y reach to1400W/M.K，
the performance of X-Y reach to Z 9.5W/M.K
1. Cost savings of more than 30%
2. Performance compared to graphite sheets
can enhance more than 10% 7
Advantages
Advantages compared to artificial graphite sheet ：
PET
Off filmDouble glue
graphite Nano thermal material
Off film
Processing production line Processing machine
The use of Nano thermal film on mobile phoneThe use of graphite sheets on mobile phones
graphite
Nano thermal film

8. 8
1 Automatic quantitative spraying technology
2 Precision coating process
Production equipment and technology
The thickness ≥0.1mm
adopt spraying process
The thickness ≤0.1mm
adopt precision coating
process

9. kinds of heat sink material
Our target：To provide efficient heat dissipation and
insulation Integrated Solutions

10. 1
3
Topic
Thermal Material Introduction
2
Discussion exchange
Application mode and case
Contents

11. Tradition AL Pin Type Heat Sink TECH
Through TEC technology, TECH product can improve
the cooling effect of raw material , May not require th
e appearance of extruded aluminum ，Reach:
1、Reduce the material cost (maximum reduction of
70%),
2、Reduce extrusion processing, reduce processing c
osts
Good workability, can be bent, punching, by ch
anging shape to increase the cooling area, whil
e meeting the organization is limited.
TECH Heat dissipation principle ：
The use of high thermal conductivity material heat conductivity from critical components
(Ceramic, Al) .Use processing characteristics, dissipating area, enhance the cooling effect.
Heat dissipation material using method

12. 12
Brand customer application
1) replace the original magnet
insulation material, the
temperature decreased by
15%
2) reduce the cost of 20% than
the original structure of the
use of heat insulation film
1）Multifunctional nano heat
radiating sheet instead of the
original Qi
2）The heat conduction effect
is quite, the thickness is only
10%, the cost is reduced by
40%
TCL reduce the cost schemeSHARP highlight module scheme
Customer case
Customer cost reduction program, by
increasing the LED current to enhance
the module brightness, heat dissipation
problems through the nano material.
1）Cost reduction 15%
2）Heat dissipation effect 20%
Customers originally used 3M
graphite sheet to cooling
1) After using nano thermal material,
heat dissipation performance is
improved by 10%, and the price is
reduced by 30%.
Asus laptop Yee sheet alternatives
Hisense 58-inch TV Thermal Applications
Nano thermal material
Nano thermal material
Nano thermal material

13. 13
Millet mobile phone application
Multifunctional Nano Thermal material testing replaced comparison chart on millet 4,
detailed as follows:
PCB back material replacement
A B
Graphite thickness：
0.08mm
HM heat sink
thickness 0.05mm
Use graphite sheet cover
High temperature52.9℃
Using nano materials cooling cover
High temperature46.4℃
1）Use heat dissipation film cooling efficiency by 11
percent over the graphite sheet
2）Use heat dissipation film cost less than about
30% graphite flakes
3）Heat dissipation film has been verified in millet
OK, batch validation.

14. 40
M
M
1
2
3
4
5
6
inside of the
backplate
Outside
of the
backpla
te
140M
M
30MM
12
10
11
7
8
9
Test Case –Sharp_42 inch
Back glass
Glass facade

15. Test Case –Sharp_42 inch
www.themegallery.com LOGO
Terminal No. Terminal Location
No heat sink（℃ / H）
Production heat sink
（℃ / H）
HM heat sink （℃/ H）
3M heat sink
（℃ / H）
Measured
temperature
average
cooling
Measured
temperature
average
cooling
Measured
temperature
average
cooling
Measured
temperature
average
cooling
1
Glass back
UP 44
0
41
2.9
40.4
3.5
40.3
3.572 IN 45.1 41.5 40.9 41
3 down 38.9 36.8 36.2 36
4
Glass facade
UP 40.3
0
38.6
1.77
37.3
2.53
37.2
2.85 IN 41.4 39.4 38.9 38.4
6 down 37.5 35.9 35.4 35.2
7
Outside of
backplate
UP 52.1
0
50
2.47
48.4
3.67
46.7
4.338 IN 50.3 47.2 45.4 46.6
9 down 48.5 46.3 46.1 44.6
10
Inside of
backplate
UP 38.6
0
35.8
2.7
34.9
3.5
36.3
2.5711 IN 37.7 35.7 34.9 34.9
12 down 39.5 36.2 35.5 36.9
TOTAL 0 2.46 3.3 3.32
As can be seen by the customer feedback information, HM heat sink is better than soaking sheet
production, and the same as 3M soaking sheet, but the HM soaking sheet prices are more competitive. So
HM heat sink import in this aircraft.

16. Samsung TV Applications
Test Conditions ：
1 Room temperature 27 degrees
2 5W LED using as an analog source, detect positive and negative points LED temperature
3 Test equipment: thermocouple temperature tester, constant current source
4 Thickness of graphite sheet sample is 1mm, and the thickness of nano thermal film is 0.2mm
Test method ： Test data ：
Samsung graphite HM nano thermal film
54
54.6
55.1 55.3
54.9 55.1
51
51.5
52.3
52.7 52.6 52.7
48
49
50
51
52
53
54
55
56
5min 10min 15min 20min 25min 30min
石墨片样品 匀热片样品
Conclusion: 0.2T foil substrate cooling effect than the effect of the graphite sheet promotion 1.0T 4%

17. 21.5 inch highlight module application
Temperature test data ：
Room temperature：15°Electric current：420ｍＡ 30 minutes
after the back of the back surface data
Test point data for LED side back panel：
38.6 38.5 38.0 37.6 37.0 36.2 35.6 34.8 33.8
39.1 38.9 38.4 37.8 37.2 36.7 35.9 34.7 33.9
43.0 42.8 42.3 41.6 40.9 40.0 38.9 38.0 36.8
39 38.6 38.2 37.5 36.9 36.3 35.9 34.8 33.9
Room temperature：15°Electric current：420ｍＡ 30 minutes
after the back of the back surface data
Test point data for LED side back panel：
33.3 33.7 35.1 34.6 34.3 33.7 33.6 33.1 33.0
34.2 34.6 35.5 35.3 35.2 34.8 33.9 33.7 33.3
38.7 37.8 37.3 36.7 35.8 35.5 34.8 34.5 34.3
35.9 34.1 34.0 33.4 33.0 32.3 32.1 32.0 31.6
Attached heat
Sink module
Original module
Conclusion: the temperature of the side of the side plate is reduced by 4.5
degrees, about 15% than no using heat sink.

18. 1
3
Topic
Thermal Material Introduction
2
Discussion exchange
Application mode and case
Contents

19. SECC backplane instead of aluminum backplate increase the structural strength:
1）For small and medium size modules insufficient structural strength problem, SECC
can be used to replace the aluminum plate and the heat dissipation performance is
more than 10%.
2）Mainly used in industrial LCD module highlighting
SECC alternative solution
aluminum plate
The back plate uses SECC material to spray the
heat dissipation coating
Spraying treatment on the surface of SECC , Enhanced structure strength of LCD module.
Backplane overall spraying

20. LCD module backplane as the product of a whole radiator member ：
1）Currently mobile phones and other consumer electronics products common have
cooling problems, the program adopted spraying or attaching a heat sink material at
the back of the LCD module , so that heat source through the LCD module for cooling.
2）Mainly used in mobile phones, tablet computers and other consumer electronic
products.
LCD module overall cooling solution
Graphite attached to the
surface of backing plate
Back surface coating
insulation cooling layer
The program can directly Cost Down graphite sheet cost of the whole plant,
but also to improve the overall thermal performance.

21. Bright LCD module cooling solution ：
For module brighter than 1000nit, if the heat of back LCD module can not
meet the requirements of the situation, it can be employed to increase the heat
sink on the back to reduce the temperature of LED PIN angle.
Bright LCD module cooling solution
The program uses flexible way, it can determine the heat sink attached to the
area and position according to the actual LED PIN angle temperature test
results, do not affect the structural design .
original module Backplane Attaching heat sink module backplane

22. Aluminum extrusion and spray SECC experimental comparison data
time
samples Coating SECC Conditions 1.2A
9 10 11 12 13 14 15 16
5min 31.2 34.9 44.4 46.5 27.2 29.4 34.1 41.1
10min 32.5 35.4 46.8 49.4 27.7 30.6 36 43.3
15min 32.8 35.7 47.5 51.6 28 31.1 36.8 44.3
20min 33.2 35.6 48.4 53.6 28.2 31.5 37.4 45.2
25min 33.4 35.7 49.3 54.5 28.2 31.8 38.1 46.1
30min 33.7 35.7 49.9 55.5 28.2 31.9 38.4 46.5
35min 34.1 36.1 50.2 55.7 28.5 32.3 38.7 46.9
40min 34.1 36.2 50.4 56 28.5 32.3 38.9 46.8
45min
time
samples
Uncoated aluminum
extrusion
Conditions 1.2A
9 10 11 12 13 14 15 16
5min 32.7 35.9 44.8 50.9 30.3 34.4 42.1 43.4
10min 34.6 38.3 48.0 54.7 32.6 36.7 45.0 45.3
15min 35.0 38.1 46.7 53.8 32.6 36.1 44.8 45.0
20min 36.0 39.2 49.9 57.0 33.8 38.8 47.2 47.6
25min 36.3 40.9 51.2 58.1 34.6 38.9 48.2 48.9
30min 37.0 40.4 51.3 58.4 35.2 39.7 48.8 49.5
35min 37.3 40.7 51.7 59.3 35.4 39.9 49.3 49.9
40min 37.3 40.9 52.0 59.3 35.7 40.2 49.8 50.5
45min
Conclusion: compared with the aluminum extrusion PIN LED angle temperature, the SECC
with coating can be reduced by 4.7 degrees, which is about 10%.

23. Exchange and discussion