1. Capabilities - NextPCB
Item
Process
Capability
Remarks
Max. Layers 16 Layers
Batch process capability: 1-12 L Prototype process capability: 1-
16 L
Max. Dimension 500*500mm
Only allowed to accept 500*500mm temporarily. Exception
please contact customer service
Min. Line
Width/Space
3/3mil
4/4 mil (finished copper thickness 1OZ),, 5/5 mil (finished
copper thickness 1.5OZ ), 6/6 mil (finished copper thickness
2OZ), Suggest increase line width /spacing if condition allow
Min. Hole Size
(Mechanical
drilling)
0.2mm
Min. aperture of mechanical drilling is 0.2 mm. If conditions allow
suggest enlarge to 0.3 mm or above
Hole Tolerance
(Mechanical
drilling)
±0.07mm The tolerance of mechanical drilling hole is ±0.07mm
Hole Tolerance
(Laser drilling)
±0.01mm The tolerance of Laser drilling hole is ±0.01mm
Via single-side
Annular ring
3mil
Min. Via is 3mil. Min. Components Hole is 5mil. Increasing via
Annular ring is good for overcurrent.
Effective Circuit
bridge
6mil
Effective Circuit bridge is the connecting line width between two
pieces of copper in the circuit.
Finished External
Copper Thickness
35--140um The thickness of the board including External plating and finishes
Finished Internal
Copper Thickness
17-35um The thickness of the board including Internal plating and finishes
Soldermask Type Photosensitive ink White, Black, Blue, Green, Yellow and Red and so on.
Min. Letter Width ≥0.15mm
If the Min. Letter width is less than 0.15mm, the letters on the
boards may not be clear because of design.
2. Item
Process
Capability
Remarks
Min. Letter Height ≥1mm
If the Min. Letter height is less than 1mm, the letters on the
boards may not be clear because of design.
Letter Aspect Ratio 1:05
The more suitable the Aspect Ratio is, the more convenient for
fabrication is.
Surface Treatment HASL, HASL Leadfree, ENIG and OSP(for mass production).
Board Thickness
Range
0.4--3.0mm
Conventional board thickness: 0.4/0.6/0.8/1.0/1.2/1.6/2.0 mm,
3.0mm for mass production.
Board Thickness
Tolerance
±10% The Tolerance of the board thickness.
Min. Slot Mill 0.65mm
The minimum of the slot mill having copper is 0.65mm, without
copper is 0.8mm.
Space between
Routing and Outline
≥0.25mm(10mil)
Min. Plated Slot Width is 0.65mm. Min. Nonplated Routing Slot is
0.8mm.
Min. Half-hole 0.6mm Half-hole is a special technology.
Array Space
(without gap):
0mm space Panel, the space between boards is 0mm.
Array Space
(without gap)
1.6mm
The gap should not less than 1.6mm. Otherwise, it would be
difficuit for routing.
Peel Strength ≥2.0N/cm
Flammability 94V-0
Impedance control
Tolerance
±10%
Impedance control
Bridge
≥5mail
Pads Manufacturer
Copper Pour Type
Hatch
Manufacturers adopt Hatch to pour copper. The customers use
Pads design PCB please do pay attention to this item.
3. Item
Process
Capability
Remarks
Draw Slot in Pads
Software
Use Drill Drawing
Layer
If there are many non-metallic chemical slots on the boards,
please draw on the Drill Drawing Layer
Solder-mask Open
layer in Protel/dxp
software
Solder Layer
Few engineers mistakenly put this into paste layer. While
Huaqiang PCB would not deal with paste layer.
Protel /dxp Outline
Layer
Use Keepout Layer
or Machanical
Layer
Please note: there are only one outline layer allowed in one file,
two outline layers is not permitted. Please remove the useless
outline layer. That’s to say, just choose either Keepout Layer or
Machanical Layer to draw outline.
Special Surface
Treatment
Solder mask is green ink as usual said. Huaqiang PCB can not do S/M Bridge
temporarily.
Material Type
FR - 4, High-frequency plate, Rogers, huaqiang FR4 double-sided PCB boards are
made from A-class Jiantao material and the Multilayers boards are from Shengyi
Material.
Contact
GUO Chun
HUAQIANG JUFENG NETWORK TECHNOLOGY(HK)LIMITED
Factory Add: No.6 Shatou Yumin Rd. Shajing Town, Bao An Dist. Shenzhen 518000 China
Skype: uubc_1
www.nextpcb.com/?tid=7
Email: guochun@nextpcb.com