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                                   Aluminum PCB Manuf acturing Capacity Workmanship
   PCB Process
                                   Aluminum PCB Manufacturing Capacity Workmanship
   PCB Material

   PCB Application                    Techno lo gy capability fo r rigid bo ards


   PCBA
                                   AI PCB Manuf act uring Capacit y Wo rkm anship

Contact Us
                                   类别Type                                          项目It e m s                    加工能力Pro ce ssing capacit y
Te l: 0 0 8 6 -0 755-27348 0 8 7
                                                                                                                 OSP、化学沉银、化学沉金、喷纯锡、喷铅
Fax: 0 0 8 6 -0 755-2738 9 6 25
                                                                                   表面处理工艺 (Surface finish) 锡(OSP、Immersio n Ag ,ENIG ,HAL-
E-m ail: Sales@raypcb.co m
                                                                                                                                                            PDFmyURL.com
LF,HAL)
MSN: Raypcb@ho tmail.co m
                                                                        铝基、铁基、铜基(Aluminum,iro n and
Skype : Raypcb                              板材类型(Laminate type)
                                                                        co pper iso latio n base)
Quality                                     常规板材尺寸(Dimensio n)          50 0 *6 0 0 MM 457*6 10 MM

                                            常规板材厚度(Scale o f bo ard 0 .6 MM、0 .8 MM、1.0 MM、1.2MM、

                             板材Lam inat e   thickness)                  1.6 MM、2.0 MM、2.5MM、3.0 MM

                                            板厚铜箔厚度(co pper fo il)       0 .5-10 OZ

                                            板材厚度公差(to lerance o f
                                                                        ± 0.1MM
                                            bo ard Thickness)

                                            介质层厚度(Dielectric
                                                                        0 .0 75-0 .15MM
 PTH pre-scrubbing machine                  thickness)

                                            铝基厚度(Thickness o f
                                                                        0 .5-3.2MM
                                            Aluminum laminate)

                             层次                                         1-4 Layers

                                            最小线宽(Min trace width)       5MIL

                                            最小间距(Min trace space)       5MIL
                             线路
                                            线宽线距公差(To lerance o f
                                                                        ±15%
                                            trace width/space)

                                            内、外层铜厚(Internal and
                             铜厚                                         0 .5-10 OZ
                                            external)

                                            钻孔孔径(Drilling ho le size)   0 .6 -6 .0 MM


                                            成品孔径(Finished ho le size) 0 .6 -6 .0 MM

                                            孔径公差(Ho le to lerance)      ±0 .0 75 MM
                             孔径
                                            孔位公差(To lerance o f ho le
                                                                        ±0 .1 MM
                                            po sitio n)


                                            板厚孔径比(Aspect ratio )        5 :1

                                                                                                      PDFmyURL.com
最小阻焊桥(Min so lder
阻焊                                                                  4 MIL
                                      bridge)

                                      外型尺寸公差(To lerance o f
尺寸                                                                  ±0 .1 MM
                                      o utline dimensio n)

                                      最大生产尺寸(Max                    长方向:120 0 MM,短方向
 
                                      dimensio n)                   :30 0 MM (Length:120 0 MM,Width:30 0 MM)

                                      阻抗公差(Impedance
阻抗                                                                  ±10 %
                                      to lerance)

                                      低导热 1.0 -1.5(Lo w heat co nductio n 1.0 -1.5)

导热系数(He at co nduct io n m o dulus)     中导热 1.5-1.8 (Middle heat co nductio n 1.5-1.8 )

                                      高导热 2.0 -3.0 (High heat co nductio n 2.0 -3.0 )

抗剥离强度(Pe e l st re ngt h)             ≥ 1.8 N/MM


表面电阻率(Surf ace re sist ance )         ≥ 1*10
                                               5M


体积电阻率(Vo lum e re sist rivit y)       ≥ 1*10 6   M

击穿电压(Bre akdo wn vo lt ag)            ≥ 2 KV/MM


耐腐焊性(So lde r f io at )               26 0 ℃,10 Min 不起泡,不分层(26 0 ℃,10 Min ,No layerig,No sparkling)


介电常数(Pe rm it t ivit y)               ≤ 4.4


介质损耗因子(Disspat io n f act o r)        ≤ 0 .0 3



生产能力 Pro duct io n capacit y



每月铝基板产量:20 0 0 M
                          2,日产铝基板:80M2.


                                                                                                               PDFmyURL.com
Mo nthly yield o f AI PCB:20 0 0 M 2,Daily   yield:80M2.

                                       交货周期 Le ad T im e


                                       普通样板2-3天,加急样板:24小时,批量:5-8 天.

                                       Ordinary sample:2-3 days,Pro mpt sampling :24 Ho urs,Lo t pro ductio n:5-8 days.



                                       Source from PCB manufacturer: http://www.raypcb.com
                                       Keywords:PCB,printed circuit boards,China PCB,PCB manufacturing,Fast PCBs,PCB manufacturers

                                       Mo re abo ut RayMing :


                                              Co nt act RayMing

                                              Te chno lo gy capabilit y
                                              Qualit y Assurance

                                              Equipm e nt



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Copyright Rayming all Rights Reserved.




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Aluminum pcb manufacturing capacity workmanship

  • 1. Home About Us Equipment Technology Quality Testimonials News Contact Us Ho ts: PCB Manufacture | Rigid Bo ard | Fast PCBs | PCB Pro to types | Printed Circuit Bo ard | >> Ho me >> News Products Category PCB By Layer Aluminum PCB Manuf acturing Capacity Workmanship PCB Process Aluminum PCB Manufacturing Capacity Workmanship PCB Material PCB Application Techno lo gy capability fo r rigid bo ards PCBA AI PCB Manuf act uring Capacit y Wo rkm anship Contact Us 类别Type 项目It e m s 加工能力Pro ce ssing capacit y Te l: 0 0 8 6 -0 755-27348 0 8 7 OSP、化学沉银、化学沉金、喷纯锡、喷铅 Fax: 0 0 8 6 -0 755-2738 9 6 25 表面处理工艺 (Surface finish) 锡(OSP、Immersio n Ag ,ENIG ,HAL- E-m ail: Sales@raypcb.co m PDFmyURL.com
  • 2. LF,HAL) MSN: Raypcb@ho tmail.co m 铝基、铁基、铜基(Aluminum,iro n and Skype : Raypcb 板材类型(Laminate type) co pper iso latio n base) Quality 常规板材尺寸(Dimensio n) 50 0 *6 0 0 MM 457*6 10 MM 常规板材厚度(Scale o f bo ard 0 .6 MM、0 .8 MM、1.0 MM、1.2MM、 板材Lam inat e thickness) 1.6 MM、2.0 MM、2.5MM、3.0 MM 板厚铜箔厚度(co pper fo il) 0 .5-10 OZ 板材厚度公差(to lerance o f ± 0.1MM bo ard Thickness) 介质层厚度(Dielectric 0 .0 75-0 .15MM PTH pre-scrubbing machine thickness) 铝基厚度(Thickness o f 0 .5-3.2MM Aluminum laminate) 层次   1-4 Layers 最小线宽(Min trace width) 5MIL 最小间距(Min trace space) 5MIL 线路 线宽线距公差(To lerance o f ±15% trace width/space) 内、外层铜厚(Internal and 铜厚 0 .5-10 OZ external) 钻孔孔径(Drilling ho le size) 0 .6 -6 .0 MM 成品孔径(Finished ho le size) 0 .6 -6 .0 MM 孔径公差(Ho le to lerance) ±0 .0 75 MM 孔径 孔位公差(To lerance o f ho le ±0 .1 MM po sitio n) 板厚孔径比(Aspect ratio ) 5 :1 PDFmyURL.com
  • 3. 最小阻焊桥(Min so lder 阻焊 4 MIL bridge) 外型尺寸公差(To lerance o f 尺寸 ±0 .1 MM o utline dimensio n) 最大生产尺寸(Max 长方向:120 0 MM,短方向   dimensio n) :30 0 MM (Length:120 0 MM,Width:30 0 MM) 阻抗公差(Impedance 阻抗 ±10 % to lerance) 低导热 1.0 -1.5(Lo w heat co nductio n 1.0 -1.5) 导热系数(He at co nduct io n m o dulus) 中导热 1.5-1.8 (Middle heat co nductio n 1.5-1.8 ) 高导热 2.0 -3.0 (High heat co nductio n 2.0 -3.0 ) 抗剥离强度(Pe e l st re ngt h) ≥ 1.8 N/MM 表面电阻率(Surf ace re sist ance ) ≥ 1*10 5M 体积电阻率(Vo lum e re sist rivit y) ≥ 1*10 6 M 击穿电压(Bre akdo wn vo lt ag) ≥ 2 KV/MM 耐腐焊性(So lde r f io at ) 26 0 ℃,10 Min 不起泡,不分层(26 0 ℃,10 Min ,No layerig,No sparkling) 介电常数(Pe rm it t ivit y) ≤ 4.4 介质损耗因子(Disspat io n f act o r) ≤ 0 .0 3 生产能力 Pro duct io n capacit y 每月铝基板产量:20 0 0 M 2,日产铝基板:80M2. PDFmyURL.com
  • 4. Mo nthly yield o f AI PCB:20 0 0 M 2,Daily yield:80M2. 交货周期 Le ad T im e 普通样板2-3天,加急样板:24小时,批量:5-8 天. Ordinary sample:2-3 days,Pro mpt sampling :24 Ho urs,Lo t pro ductio n:5-8 days. Source from PCB manufacturer: http://www.raypcb.com Keywords:PCB,printed circuit boards,China PCB,PCB manufacturing,Fast PCBs,PCB manufacturers Mo re abo ut RayMing : Co nt act RayMing Te chno lo gy capabilit y Qualit y Assurance Equipm e nt Related Content Related Content Do ubled Sided PCB Doubled Sided PCB PCB By Layer PCB By Layer About Us Abo ut Us 4 Layers PCB 4 Layers PCB Abo ut us | Co ntact us | Certificate | SiteMap | Copyright Rayming all Rights Reserved. PDFmyURL.com