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Resonant Tunnelling Devices
GUIDED BY:
PROF. DR. K. ANUSUDHA
PONDICHERRY UNIVERSITY
DEPARTMENT OF ELECTRONICS
AND COMMUNICATION
ENGINEERING
PRESENTED BY
CHAITANYA (21304016)
CMOS Scaling has been key
to performance increase
 CMOS scaling gives us three things:
 Higher clock
 More components
 Same cost
 We are currently at 90nm
 65nm in 2006
 Everybody’s favourite line: Moore’s law will hit a
wall (so far all false)
 Some technology will eventually replace CMOS
 What is that technology?
Research idea: Find the next
CMOS
 So many post-CMSO proposals
 Quantum computing
 Molecular electronics
 DNA computing
 … (countless)
 Hear about “breakthroughs” everyday
 Yet we’re still using silicon transistors
 So are we really?
How things fit
 Plain CMOS scaling will carry us to 10nm (and maybe
more)
 That means at least another 10-15 years before we
must switch to a new tech
 But it might make sense to switch ealier
 Key theme: below 100nm, two options are available:
 Smaller CMOS
 Quantum-effect based devices
What about all the
“breakthroughs”?
Why Resonant Tunnelling
Devices?
 Works at room temperature!
 Extremely high switching speed (THz)
 Low power consumption
 Well demonstrated uses
 Logic gates, fast adders, ADC etc.
 Can be integrated on existing processes
 In one word: Feasible
What we’ve been using:
The MOSFET
Resonant Tunnelling Diodes
Resonant Tunnelling Diodes
 Fundamentally different
operating principle
 Quantisation
 Quantum tunnelling
 Computation comes from
Negative Differential
Resistance (NDR)
Negative Differential Resistance
Need high peak to
Valley Current Ratio
(PVCR)
PVCR of 2-4
desirable
Example Circuit: TSRAM
Example Circuit: Shift Register
Problem
 Up until now, all usable circuits made using III-V
compound semiconductors
 Eg. GaAs, InP
 Good PVCR and current density
 Good for high frequency switching applications
 CMOS incompatible
 Need a silicon solution before any chance of mass
uptake
Silicon based RTDs
 Prior to 1998, Si based
RTD displayed no usable
NDR
 In 1998, Rommel et al
produced first Si/SiGe/Si
RITD with NDR at room
temperature
 RITD exhibits better PVCR
Integration with CMOS
 In 2003, monolithic
integration with CMOS
demonstrated
 Performance comparable
to discrete RITD
Integrated FET/RITD
What does it mean for
architecture?
 CMOS / RTD hybrid circuits
 Factor of reduction in component complexity
 Higher operating frequency
 Lower power consumption
 TSRAM
 1 transistor SRAM with DRAM density on chip
 Greatly reduced power consumption
 More design options with eDRAM
A Roadmap to RTDs?
Take home message
 CMOS scaling will continue, one way or another
 Double Gate MOSFET will get us to 10nm
 Plenty of new options
 The transistor of the future will exploit quantum
effects
 SET, QD, Molecular, Spin transistor
 Silicon RTDs can now be integrated with CMOS
 Excellent for extending CMOS
 Good chance they will be the first quantum effect
devices to become mainstream

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resonant tunneling devices

  • 1. Resonant Tunnelling Devices GUIDED BY: PROF. DR. K. ANUSUDHA PONDICHERRY UNIVERSITY DEPARTMENT OF ELECTRONICS AND COMMUNICATION ENGINEERING PRESENTED BY CHAITANYA (21304016)
  • 2. CMOS Scaling has been key to performance increase  CMOS scaling gives us three things:  Higher clock  More components  Same cost  We are currently at 90nm  65nm in 2006  Everybody’s favourite line: Moore’s law will hit a wall (so far all false)  Some technology will eventually replace CMOS  What is that technology?
  • 3. Research idea: Find the next CMOS  So many post-CMSO proposals  Quantum computing  Molecular electronics  DNA computing  … (countless)  Hear about “breakthroughs” everyday  Yet we’re still using silicon transistors  So are we really?
  • 4. How things fit  Plain CMOS scaling will carry us to 10nm (and maybe more)  That means at least another 10-15 years before we must switch to a new tech  But it might make sense to switch ealier  Key theme: below 100nm, two options are available:  Smaller CMOS  Quantum-effect based devices
  • 5. What about all the “breakthroughs”?
  • 6. Why Resonant Tunnelling Devices?  Works at room temperature!  Extremely high switching speed (THz)  Low power consumption  Well demonstrated uses  Logic gates, fast adders, ADC etc.  Can be integrated on existing processes  In one word: Feasible
  • 7. What we’ve been using: The MOSFET
  • 9. Resonant Tunnelling Diodes  Fundamentally different operating principle  Quantisation  Quantum tunnelling  Computation comes from Negative Differential Resistance (NDR)
  • 10. Negative Differential Resistance Need high peak to Valley Current Ratio (PVCR) PVCR of 2-4 desirable
  • 13. Problem  Up until now, all usable circuits made using III-V compound semiconductors  Eg. GaAs, InP  Good PVCR and current density  Good for high frequency switching applications  CMOS incompatible  Need a silicon solution before any chance of mass uptake
  • 14. Silicon based RTDs  Prior to 1998, Si based RTD displayed no usable NDR  In 1998, Rommel et al produced first Si/SiGe/Si RITD with NDR at room temperature  RITD exhibits better PVCR
  • 15. Integration with CMOS  In 2003, monolithic integration with CMOS demonstrated  Performance comparable to discrete RITD
  • 17. What does it mean for architecture?  CMOS / RTD hybrid circuits  Factor of reduction in component complexity  Higher operating frequency  Lower power consumption  TSRAM  1 transistor SRAM with DRAM density on chip  Greatly reduced power consumption  More design options with eDRAM
  • 18. A Roadmap to RTDs?
  • 19. Take home message  CMOS scaling will continue, one way or another  Double Gate MOSFET will get us to 10nm  Plenty of new options  The transistor of the future will exploit quantum effects  SET, QD, Molecular, Spin transistor  Silicon RTDs can now be integrated with CMOS  Excellent for extending CMOS  Good chance they will be the first quantum effect devices to become mainstream