1. NATIONAL CONFERENCE ON
LATEST DEVELOPMENTS IN POLLUTION CONTROL AND
PREVENTION TECHNIQUES
PAPER TITLE
ADVERSE EFFECT OF SEMICONDUCTOR
INDUSTRY ON ENVIRONMENT AND ITS
REMEDIES
Presented by:
MD MUSTAFA KAMAL
DEPTT.OF ELECTRICAL ENGINEERING
NITTTR ,CHANDIGARH

2. CONTENT
 Introduction
 Effect of semiconductor industries on environment
 Remedies
 Conclusion

3. INTRODUCTION

4. INDIAN SEMICONDUCTOR INDUSTRY
GROWTH RATE

5. PFC GASES USED IN DIFFERENT
PROCESS
 Perfluorocompounds (PFCs) are used extensively
by the semiconductor industry in etch processes
and chemical vapor deposition (CVD) chamber
cleans and the vapor testing process .Common
PFCs used in these processes include
perfluoromethane (CF4), perfluoroethane (C2F6),
trifluoromethane (CHF3), perfluoropropane (C3F8),
perfluorocyclobutane (C4F8), and
perfluorocyclopentene (C5F8).

6. ABSORPTION SPECTRA OF PFC
GASES

7. LIFE -TIME OF PFC GASES
Compound Atmospheric Global warming potential
Lifetime (years) (100-years)
CO2 variable 1
C2F6 10,000 12,200
CF4 50,000 7,390
SF6 3,200 22,800
NF3 740 17,200
CHF3 270 11,700
C3F8 2,600 8,830
C-C4F8 3,200 10,300
CFC-11 55 3400
CFC-12 116 7100

8. 
May 1992: UN FCCC establishes framework
for containing global warming.
 Dec 1997: Following intense negotiations in
Kyoto (Japan), a protocol is agreed upon by
over 100 countries.
 Feb 2005: 141 countries, including EU,
Japan, Canada, and Russia sign the Kyoto
Protocol and it gets ratified w.e.f. 16-Feb-05
– The US remains a key non-signatory

9. 
The Kyoto Protocol sets legally binding
targets for reducing green house gases
(GHGs)
– Developed countries have a target to reduce
GHG emissions by 5.2% below 1990 levels, by
year 2012
– EU members committed to reduce their
average emissions by 8 %
– India, China, and Brazil are classified as
emerging countries and hence exempted from
this protocol

10. KYOTO PROTOCAL
Target level and date Gas(es)
Party Date proposed
(reductions from 1990) covered
30% by 2020
CO2, CH4, N2O 28 May 1997
Brazil (differentiated)
3% by 2010,
Canada All GHGs 2 December 1997
additional 5% by 2015
5% by 2005,
Czech Republic CO2, CH4, N2O 27 March 1997
15% by 2010
Democratic
10% by 2005,
Republic of the
15% by 2010, All GHGs 23 October 1996
Congo
20% by 2020
(Zaire)
at least 7.5% by 2005, 19 June 1997,
EU CO2, CH4, N2O
15% by 2010 4 March 1997
7-10% in
average per capita
France All GHGs 6 December 1996
emissions by 2010
(differentiated)
10% by 2005,
Germany CO2 26 March 1996
15-20% by 2010
at least 7.5% by 2005,
CO2, CH4, N2O
G-77 and China 15% by 2010, 22 October 1997
(gas-by-gas)
an additional 20% by 2020
Stabilization by 2005
Hungary et al. plus pledging of CO2, CH4, N2O 27 March 1997

11. KYOTO PROTOCOL
Target level and date Gas(es)
Party Date proposed
(reductions from 1990) covered
15% (CO2) by 2005,
see previous
Peru 15-20% (all GHGs) 7 March 1997
column
by 2010
20% by 2005,
Philippines All GHGs 25 March 1997
20% by 2010
Stabilization by 2010
plus additional
Russian Federation All GHGs 26 February 1997
differentiated targets
for "Annex B" Parties
10% by 2010
Switzerland All GHGs 29 November 1996
(differentiated)
UK 5-10% by 2010 All GHGs 16 April 1996
Return to 1990
USA All GHGs 23 October 1997
by 2008-2012

12. REMEDIES (METHOD OF REDUCTION OF
PFC GASES)
 Process optimization-PFC gases can be reduced
by using better optimization .better technology
need for better optimization.
 Substitution-search alternative of PFC gases.
 Capture and reuse-reuse the emitted gases
again in the manufacturing process.
 Abatement-abatement is the process in which
large plant are operate with substantially
reduced emission of PFC gases. by using carbon
abatement process we can reduce the emission by
90%.

13. CONCLUSION
 Semiconductor industries which are used various
PFC gases in its different manufacturing process
which are very dangerous and responsible for
heating of earth ,result global warming .by using
better optimization technique, better abatement
method ,better substitution we can reduce these
at optimum level.