The environments in which cable assemblies and the electronics associated with the transmission of the signal through those assemblies is becoming harsher. This in part is being caused by the realization that electronics can be used in locations that in the past were considered beyond the realm of what the electronics and terminations could withstand. Advances in compounds and termination methods have allowed this expansion to happen, but technical expertise in the area of molding has taken this advancement to the next level. In this webinar we investigate what possibilities exist for electronics in harsh environments as well as the manufacturing techniques used to allow this happen. For more information on our cable assembly solutions visit http://www.epectec.com/cable-assemblies/.

1. Manufacturing That Eliminates Risk & Improves Reliability
Combining Various Electronics
Into Your Cable Assembly
04.28.17

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Agenda
 Current Situation
 Types Of Environments Cable Assemblies Can Be Used In
 Techniques Employed To Protect Electronics
 Examples Of Successful Electronics Incorporation
 What Does The Future Hold?
“The performance of a cable assembly is based on its reliability, durability, and ability
to maintain signal integrity regardless of the mechanical, electrical, and environmental
stresses surrounding it.”

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Current Situation

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Current Situation
 Usually The Last Component Considered When Designing Electronic System
 Assemblies Are A Systems Lifeline
– Chain Is Only As Strong As Its Weakest Link
– If Assembly Fails Entire System Fails
 Usually Designed With “Good Enough” Mentality
– Minimal Understanding Of Environmental Factors
– Minimal Concern For Performance
– Try To Use “Off-The-Shelf” Components
 No Understanding Of Total Cost Of Ownership
 No Understanding Of Electronics Involved

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Types of Environments
Cable Assemblies Can Be Used In

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Extreme Environmental Concerns
 Shock And Vibration
 Temperature Extremes
 Temperature Cycles
 Small As Possible
 Light Weight
 Space/Radiation Exposure
 Fluids
– Water/Moisture/Petroleum/Chemicals
 Particulates/Dust
 Abrasion
 Physical Impact
 EMI/RFI
 Extensive Flexing

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Techniques Employed to
Protect Electronics

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Use Over-Molding To Protect Electronics
 Water-Proof Seal
 Mechanical Protection Of Connector And Electronics
 Strain Relief Protection Of Terminations
 Resistance To Chemical Exposure
 No Exposure To Metal Parts Causing Wear Damage
 Tamper Proof
 Far Superior To Boots/Backshells
 Excellent Isolation Of Components
 No Stress To Terminations Or Conductor Insulation
Like Cable Clamps

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Examples of Successful
Electronics Incorporation

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Marriage of Assembly and Electronics
 Situation:
– Assembly To Be Used In Marine Environment
 Requirements:
– No Fungal Growth Allowed
– Watertight
• Pressure Test For Water Penetration
– Electronics Included
• PCBs
– Had To Be Flexible
• No Memory Of Cable Coil
– No Impact From Temperature Extremes

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No Fungal Growth Allowed
 Inhibitor Added to Compounds
 Tested to ISO 16869
– The test for fungal growth for life saving appliances is that the
assembly gets sprayed with a suspension of mold spores and
is then paced in a mold growth chamber.
– The chamber maintains a temperature of 29°C +/- 1°C with a
relative humidity of not less than 95%.
– The assembly remains in the chamber for a period of 28 days
and after the incubation period is inspected for mold/fungal
growth.
– A passing assembly would display little or no mold growth.

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Water Tightness
 Pressurized Tank
 Test Cycle 20 Minutes At 35 PSI
 Conductivity Measured Before And After Test

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Embedded Electronics
 Two PCBs
 No Movement Allowed
 Used Pogo Pins To Control Downstream Circuits
 Watertight
 Rib Between PCBs
 Solid Baseplate

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Cable Flexibility
 No “Coil” Memory Of Cable
 Strain Relief - Watertight Regardless Of Bend
 No Impact Due To Temperature
 Adhere To PCB Baseplate

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Customized Pins
 Center Spacing Critical
 “Friction” Retention
 Watertight Seal
 Inner/Outer Molds

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Result
 No Fungal Growth
– ISO 16869 Compliant
 Watertight
– “The cable assembly has been submerged in water under the pressure of 35 PSI
for 20 minutes which is equivalent to a depth of 80 Feet of Water.”
 Flexible At Any Temperature

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What Does the Future Hold?

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What Does the Future Hold?
 Assemblies With Electronics More Reliable
 Withstand Almost Any Environment
 Space Savings
– What Can Be Included:
• RFID
• Eprom
• Battery Charging Electronics
• PCBs
• LEDs
• “Smart Cables”

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Summary
 Including Electronics In Cable Assemblies:
– Improves Reliability
– Potentially Frees Up Real Estate
– Allows Electronics to Be Protected For Use in
Almost Any Environment
 As Assembly Performance Increases More
Electronics Will Be Used

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Our Products
Battery Packs Flex & Rigid-Flex PCB’s User Interfaces
Fans & Motors Cable Assemblies Printed Circuit Boards

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Design Centers & Technical Support
 Battery Pack & Power Management – Denver, CO
 User Interfaces – Largo, FL
 Fans & Motors – New Bedford, MA & Wales, UK
 PCB’s – New Bedford, MA & Shenzhen, China
 Flex & Rigid Flex – Toronto, Canada
 Cable Assemblies – Largo, FL
 Our Engineering and Design teams are ready to help our
customers create world class and cost effective product
solutions.

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Q&A
 Questions?
– Enter any questions you may have
in the Control Panel
– If we don’t have time to get to it, we
will reply via email

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Thank You
Check out our website at www.epectec.com.
For more information email sales@epectec.com.
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