The VI Chip Bus Converter Module (BCM) is a Sine Ampltitude Converter that offers superior performance, the highest efficiency, and highest power density in the smallest package available.

1. VI Chip BCM® Bus Converter Module
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2. VI Chip Bus Converter Module (BCM)
› Isolated Sine Amplitude Converter (SAC) topology
› Fixed, high frequency (>1 MHz)
› Efficiency up to 96%
› Fixed Ratio Converter (VOUT = VIN x K)
– Commercial:
› Input voltage (nom): 48 V, 270 V, 350 V, 380 V
› Output voltage (nom): 2 – 48 V (range), 11 V, 12 V, 44 V, 48 V
› Output power: 120 – 325 W Full-chip: 1.28” x 0.87” x 0.265”
Half-chip: 0.65” x 0.87” x 0.625”
– MIL-COTS:
› Input voltage: 240 – 330 V
› Output voltage: 30 – 41.3 V (K = 1/8), 38.3 – 55 V (K = 1/6)
› Output power: 235 W, 270 W
› Usage
– Stand alone Intermediate Bus Converter (IBC) for downstream point-of-load converters
– Voltage divider / current multiplier
– Safety isolation (4,242 V or 2,250 V) input-output
– Input capacitor multiplier
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3. Value Proposition: Power Density
› High power density enables:
– More functions (Gbps, ports, flops, capacity) in the same space
– A more powerful system without a larger power supply
– A more powerful system without a heavier power supply
› VI Chip power density enables:
– Systems that would be impossible with conventional approaches
– Systems that would be too large, too heavy or not cost effective with a
conventional approach
› VI Chips decrease power footprint by 40% today
› Power density increase of 25% every 2.5 years
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4. Value Proposition: Efficiency
› High efficiency enables:
– Smaller, cooler, quieter systems
– Energy cost savings for end user
– High performance systems with minimal total cost of ownership
› VI Chip architectures reduce hidden power losses
– A “whole system approach”, not just a focus on one conversion stage
› VI Chip technology continues to raise the efficiency standard
– IBC has half the power loss compared to industry IBC average
– Alternative solutions are at the technological limit with respect to
efficiency improvements
– New Vicor products cut losses by 20% every 2.5 years
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5. Value Proposition: Flexibility
› Flexibility enables:
– Re-use of power components
in multiple products
– Fewer SKUs, higher volume,
lower cost
– Fast time to market
– Reduced development effort
› VI Chip technology reduces the need
for custom power systems
– Power component paradigm
› Expanding portfolio of products
increases flexibility over time
– More options, more configurability,
less complexity, shorter design time
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6. VI Chip Technology
› Advanced engines
– Enable high efficiency and superior power density
– Maximize efficiency of power silicon
› HV Adaptive Cell topologies cut VI requirements
› LV Current Multipliers cut Vds requirements:
– Buck regulators operating from 12 V bus require 20 V rated MOSFET to supply 0.8 V
– VTM require 3 V rated MOSFET to supply 0.8 V
› Advanced architecture (FPA) minimizes power distribution loss
– Dense, efficient energy storage at 48 V
– No Bulk Caps at the PoL
– Highest current density at the PoL frees up precious real estate
› Superior modular product line
– Substantial IP portfolio covers architectures, topologies, internal components, control, etc…
› From the AC Wall Plug (or HV Bus) to the PoL (LV, high current)
› AC-DC and DC-DC
› “Young” technology continues to raise the efficiency and density bars
– Power loss cut by 25% every 2 years
– Power density increased by 25% every 2 years
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