ST Developers Conference 2016 - Smart Industry

1. October 4, 2016
Santa Clara Convention Center
Mission City Ballroom
Smart Industry
Natale Testa

2. Smart Industry 2
ST is enabling smarter, safer and more efficient factories and workplaces
Product
• Factories that produce in a more efficient manner
• More flexibility and customization possibilities in
the supply chain
• More sustainable production with less waste and
less energy used
• Safer working environments for people
• Better man-machine cooperation in the work place
• Optimized usage of machines and tools
What Smart Industry means

3. Industrial
robots
Factory
automation
Industrial
lighting
Motion
control
Power
Management
Smart
manufacturing
How does ST enable this? 3Power Discretes &
Modules
Smart power
Connectivity &
Communication
Microcontrollers
& Secure solutions
Sensors & actuators
Analog &
Signal conditioning

4. What are the enablers for Smart Industry? 4
More Connected
More Intelligent
& AwareMore efficient
Machines are connected inside the factory,
to the larger supply chain and to the cloud
• Real-time communication down to the
lowest level (sensor & actuator)
• All communications must be secure
Sensors collect information about every
machine and distributed local processing
allows data to be turned into information
• Safe & Secure real-time processing
• Products contain the instructions for
their manufacturing
• Machines are aware of the humans
around them and provide easier and
safer interactions
Higher efficiency at all points in power
usage
• Power conversion & energy harvesting
• Power Management
• Power storage
• Motion Control

5. Enabling Technologies
More Efficient
5
Motor drivers Gate drivers
AC-DC
Conversion
IGBTs &
Power
MOSFETs
Power
management
Power &
Discrete
Modules
SiC
MOSFETs &
Rectifiers
Display and
LED controllers
More efficient

6. Motor Drivers
ICs for Motion Control across power ratings and motor types
6
Leading integration, performance, efficiency
Ideal for
Factory Automation, Motion Control, Office Automation, 3D-Printer, Stage Lighting,
Medical, Security, ATM, Vending, POS, 3D Printers, Portable, Battery Powered
• Monolithic Drivers
• Controllers
• System-in-Package Drivers
A Complete offering

7. Motor Drivers 7
Leading integration, performance, efficiency
System-in-package drivers:
POWERSTEP01
L6470, L6472
L6474
L622x
L620x
Monolithic drivers
50 W 100 W10 W 350 W
Portable, Battery Powered Medical, Security, ATM, Vending,
3D Printers, Domotics
Industrial, Factory AutomationStage Lighting
Monolithic low voltage drivers
STSPIN220, STSPIN230,
STSPIN240
Controllers:
L6480, L6482

8. 8
powerSTEP
First System-in-package for Stepper motor applications
• System in package integrating 8x 10 A
MOSFETs for stepper applications up to 85 V
• Dual H-Bridge with RDS(ON) 16 mΩ for 10 A
• Fully digital programmable microstepping
controller with smoothness and precision up
to 1/128 micro-steps
• Motion profiles with acceleration/
deceleration/ ramps/ velocity and position
programmable through SPI
• Extensive set of diagnostic features and
protections, including thermal, low bus
voltage, non-dissipative overcurrent and
motor stall
Applications
High-power bipolar stepper motors
Compact, Powerful, Accurate
X-NUCLEO-IHM03A1
Using the powerSTEP up to 67% in
space saving thanks to its integrated
circuitry like microsdtepping controller
and N-channel power MOSFETs
EVLPOWERSTEP01

9. Galvanically isolated
STGAP
Low and high voltage, single and multiple channel:
L649 family
L639 family
L638 family
TD35 family
MOSFET / IGBT Gate Drivers 9
A future-proof portfolio for a wide range of applications
1 kW 4 kW
≈
50 W 200 W
Factory
automation
Compressors
Electric/ Hybrid
vehicles
1200 V inverters
Solar
Server, UPS
White goods
Auto HEV/EV
E-bikes

10. Galvanically Isolated 10
Outstanding robustness, noise immunity and design flexibility
Up to 1500 V high voltage rail
5 A sink / source driver current capability
Negative gate driving
Output 2-level turn-off
Active Miller and VCE clamping
IGBT Desaturation detection
± 50 V / ns transient immunity
100 ns in-out propagation delay
SPI programmability and digital diagnostics
+
+
+
+
+
+
+
+
+

11. M series IGBTs
650 V and 1200 V IGBTs for Motor Control
11
650 V – “M series”
• TJmax = 175 °C
• Current capability 4 ÷ 120 A
• Short-circuit withstand time of 10 µs
• VCE(sat) = 1.55 V (typ.)
• Low switching losses
• Tight parameters distribution
• Low thermal resistance
• Soft and fast recovery antiparallel diode
• Positive VCE(sat) derating to easy paralleling
• Switching frequency up to 20 kHz
Up to 200 A current rating available
as bare die option
MAX-247 LL
TO-247/TO-247 (LL)
TO-220
TO-220FP
DPAK/D2PAK
1200 V – “M series”
• TJmax = 175 °C
• Short-circuit withstand time of 10 µs
• VCE(sat) = 1.85 V (typ.)
• Low switching losses
• Soft switching waveforms for excellent
EMI behavior
• Soft and very fast recovery antiparallel
diode
• Positive VCE(sat) derating to easy
paralleling
• Switching frequency up to 20 kHz

12. 650 V 2nd Generation SiC MOSFETs 12
ST SiC MOSFET shows lowest RDS(on) increase at high temperatures
ST is the only supplier to
guarantee Tjmax as high as 200 °C
• RDS(on) @ 25 °C: 20 mΩ
• RDS(on) @ 200 °C: 26 mΩ
Device VDSS (V) / RDS(on) typ. (mΩ) Package Remark
SCTW100N65G2 650 / 20 HiP247 Best RDS(on) Option for Inverter
SCTW90N65G2V
SCTH9065G2V-7
650 / 25
HiP247
H2
PAK-7L rated 175 °C
Low Qg Option for Charger /
HF Converters
SCTH35N65G2V-7
SCTW35N65G2V
650 / 65
H2
PAK-7 @ 175 °C
HiP247 @ 200 °C
Low Qg Option for Charger / HF
Converters

13. SiC diodes
Low VF and High surge (H series) diodes
13
High reliable products with high
performances and robustness
Many part numbers in the low VF and in the high IFSM diodes’ range
Up to 40 A / 650 V SiC diodes
t
- +
Bypass diode
SiC Boost diode
6 ÷ 20 A / 1200 V SiC diodes
• 1200 V High voltage SiC technology
• Negligible reverse recovery characteristics
• Based on new design to improve VF / IFSM
trade-off
New Technology
• Specification of Peak surge forward
over pulse time duration in the
datasheet
• High forward and reverse surge
robustness
• Low leakage current for higher reliability
Designer’s corner
• For higher power density and
efficiency performances
• Reduction of case temperature in the
application, for increased life time
expectations.
Low VF
High IFSM SiC diodes survive to Lightning tests (IEC61000-
4-5), Line drop out event (EN 61000-4-11), and fast start-up
/ inrush current.
Ideal in PFC for applications connected to mains
Designer’s corner

14. SLLIMM-nano 2nd series BV ICN (25 °C)
STGIPQ3H60T-HZ/L(S)
600
V
3 A
STGIPQ5C60T-HZ/L(S) 5 A
STGIPQ8C60T-HZ 8 A
SLLIMM 2nd series DBC(B)
Small Industrial
Inverter and Pumps
Package A/C
Room A/C
Washing machines
Refrigerators
300 W 1 kW 2 kW 3 kW
Small Pumps
Power Tools
SLLIMM 2nd series
Full Molded (F)
SLLIMM nano
2nd series
SLLIMM 2nd series BV ICN (25 °C)
STGIF5CH60TS-L
600 V
8 A
STGIF7CH60TS-L 10 A
STGIF10CH60TS-L 15 A
STGIB8CH60TS-L 12 A
STGIB10CH60TS-L 15 A
STGIB15CH60TS-L 20 A
STGIB20M60TS-L 25 A
STGIB30M60TS-L 35 A
SLLIMM nano BV
ICN
(25 °C)
Max
RDS(on)
IGBT
based
STGIPN3H60
(A)(T)-(H)
600 V 3 A -
MOSFET
based
STIPN2M50T-
H(L) 500 V
2 A 1.7 Ω
STIPN1M50T-H 1 A 3.8 Ω
SLLIMMTM Product Portfolio
Intelligent Power Modules
14

15. ACEPACK™
Adaptable Compact Easier plastic Power Modules
15
Part Number Topology BVCES IC rating Lead option
Mass
Production
A2C25S12M3
CIB 1200 V
25 A
Solder wk 36 ’16
A2C35S12M3 35 A
A2C25S12M3-F 25 A
Press-fit wk 41 ‘16
A2C35S12M3-F 35 A
ACEPACK™ 1
Part Number Topology BVCES IC rating Lead option
Mass
Production
A1P25S12M3
Six-pack 1200 V
25 A
Solder wk 36 ’16
A1P35S12M3 35 A
A1P25S12M3-F 25 A
Press-fit wk 41 ‘16
A1P35S12M3-F 35 A
ACEPACK™ 2
body 33.8 x 48 mm
body 48 x 56.7 mm
PIM / CIB + NTC
Six-Pack + NTC

16. Distributed Control Solutions
SPIMD20 2 kW shuttle module
16
• Minimizing cabling systems and installation cost
• Control panel optimization from rack to the
equipment
• Flexibility of automation architecture
• Works mounted on motor up to 100 °C and 800 VDCbus
• RT connectivity with Industrial Ethernet, Ethercat® and CANopen® DS402
• Safe Torque Off
• Dual microcontroller architecture
• 2-Mbit Flash memory
• IGBT technology (1200 V, 40 A)
• Logic customizable on board
• Ready for safety standards
• Compact dimensions (165 x 60 x 26 mm, <0.5 kg)
• Customizable solution
SPIMD20 – 2 kW drive with industrial Ethernet connectivity for electric motors
Key Features
STEVAL-SPIMD20V1

17. DC-DC Conversion ICs 17
The 61 V series (L7987/L) has been designed to provide
maximum reliability in fail-safe applications.
ST’s DC-DC converters for industrial buses offer a wide choice of input voltage ranges
(VIN(max) 38 ÷ 61 V) and features
Synchronous and Asynchronous buck-converter ICs are available

18. L7987L and L7987
High input voltage for fail-safe systems
18
• Wide input voltage range 4.5 ÷ 61 V to fit a wide variety of applications
• High switching frequency up to 1.5 MHz and adjustable current limitation to minimize
the size of external components
• Pulse-by-pulse current sensing with digital frequency fold-back provide excellent
protection in a wide range of load conditions
• Output voltage sequencing and synchronization improve noise reduction when using
multiple ICs
• 61 V input voltage range buck regulators
• 2 A - L7987L
• 3 A - L7987
• Designed to meet Fail Safe requirements
• Ideal for 24 and 48 VDCBUS applications, like PLCs
STEVAL-ISA152V1

19. More Intelligent
& Aware
Enabling Technologies
More Intelligent and Aware
19
MCUs
Secure
MCUs
Environmental
sensors
Motion
MEMS
Ranging
sensors
Signal
Conditioning
Analog
& Digital
inputs
Isolation
Intelligent
Power
Switches

20. STM32 Platform
Key Benefits
20
600+ compatible devices and high portfolio granularity
powered by ARM® Cortex®-M cores
9 series
Low Cost
High-performance
Ultra-low-power
16k to 2M Flash
20 to 216 pin
packagesTest & Benchmark MCUs

21. STM32F7 Product Lines 21
Note: * Only STM32F756, STM32F777 and STM32F779 are the Hardware Crypto / hash devices
ARM®Cortex®-M7–216MHz
ACCELERATION
• ART Accelerator™
• L1 cache: data and instruction
cache
• Chrom-ART Accelerator™
• Floating Point Unit
CONNECTIVITY
• 2 x USB2.0 OTG FS/HS
• SDIO (x2 on F76x & F779*)
• USART, UART, SPI, I²C
• CAN2.0
• HDMI-CEC
• Ethernet IEEE 1588
• FMC
• MDIO slave (on F76x and F77x)
• Camera I/F
• Dual mode Quad-SPI
AUDIO
• I²S + audio PLL
• 2 x SAI
• 2 x 12-bit DAC
• SPDIF-RX
OTHERS
• 16- and 32-bit timers
• 3 x 12-bit ADC (2.4Msps)
• Low voltage 1.7 to 3.6V
• 85 °C and 105 °C range
Product
line
FCPU
[MHz]
L1 cache
[I/D]
FPU
FLASH
[bytes]
RAM
[KB]
JPEG
codec
CAN DFSDM
TFT LCD
controller
MIPI®-DSI
STM32F7x9* 216 16K+16K
Double
Precision
1M to 2M
(RWW)
512K (incl.128K DTCM) +
16K ITCM + 4K backup
 3   
STM32F7x7* 216 16K+16K
Double
Precision
1M to 2M
(RWW)
512K (incl.128K DTCM) +
16K ITCM + 4K backup
 3  
STM32F7x6* 216 4K+4K
Single
Precision
512K to 1M
320K (incl.64K DTCM) +
16K ITCM + 4K backup
2 
STM32F7x5
765
216 16K+16K
Double
Precision
1M to 2M
(RWW)
512K (incl.128K DTCM) +
16K ITCM + 4K backup
3 
745 216
4K+4K
Single
Precision
512K to 1M
320K (incl.64K DTCM) +
16K ITCM + 4K backup
2

22. STM32 Hardware Tools
from ST
22
Feature highlight, prototyping
Discovery Kits
Full features evaluation
Evaluation BoardsSTM32 Nucleo Boards
Fast agile prototyping

23. SIL Safety Design Package
For STM32
23

24. STM32 Built-in Safety Features 24
Cortex-M cores also have built-in safety enabling features (dual stack pointer,
fault exceptions and debug module)
*: Depending on device

25. MEMS and Sensors
Portfolio overview
25
Gyroscope
Magnetometer
Accelerometer
6-axis & 9-axis
inertial module
Optical image
stabilization
Temperature
Pressure
UV index
Humidity
Microphone
Gyroscope
Accelerometer
6-axis inertial
module
Hi-g
Accelerometer
Hi-g
WFR Wafer Foundry For Medical
IIS328DQ
12-bit
±2/±4/±8g
T = -40 to 105 °C
24-lead 4x4x1.8mm QFN package
IIS2DH
12-bit
±2/±4/±8/±16g
T = -40 to 85 °C
FIFO
12-lead 2x2x1mm LGA package
I3G4250D
16-bit
±245/±500/±2000 dps
T = -40 to 85 °C
FIFO
16-lead 4x4x1mm LGA package

26. STM32 ODE Tools for sensing
BLUEMICROSYSTEM
26
Rapid and flexible prototyping environment for any applications
Sensors
BLE
STM32
NFC
Proximity
& Light
Carrying Position Activity Recognition
Sensor Fusion
Bluetooth SMART BlueNRG
X-NUCLEO-IDB04A1
Proximity/ ALS VL6180X
X-NUCLEO-6180XA1
Motion + Environmental
X-NUCLEO-IKS01A1
M24SR expansion board
X-NUCLEO-NFC01A1

27. Signal Conditioning
Analog products are everywhere 27
MCU
Analog
Sensor
ADC
Temp
Sensor
ResetSupervisor
RTC
AUDIO
amplification
RS232
RS485
SMARTCARD
INTERFACE
USB
CONNECTIVITY
SUPERVISORS
RESETS
WATCHDOGS
OP-AMP
COMPARATORS
ANALOG
SWITCHES
CURRENT SENSE
GPIO
INTERFACES
Analog
Sensor
OP-AMP
Shunt
SIGNAL CONDITIONING

28. CLT Product Family
Key Advantages
28
Power Dissipation is
significantly reduced
Input current is precisely limited thanks
to the embedded current generators 
Extremely robust and
protected against EMC
Large TransilTM protection diodes
integrated at each process pin 
Flexibility and high speed
data rates
Sharp thresholds & high integration
with digital filtering, LED driving, SPI 
To interface the signals from industrial sensors matching input characteristic according to IEC61131-2

29. CLT Product Family
Family portrait
29
* Through LEDx outputs
SCLT3-8B
• Input datarate @ 400kbps
• Scalable (daisy chain)
• Thermal Alarm
• OverVoltage Alarm
• Under Voltage Alarm
• SPI interface
• CMOS interface
• (Opto-)Coupler interface
• Programmable current
• Digital filter
• Reverse polarity
• Surge & ESD protection
• Current limiter
• Number of channels
• Characteristic, IEC61131-2
• Type 1
• Type 2
• Type 3
CLT3-4B
PCLT-2A
24 8
HTSSOP38
CLT01-38S4
8
Quad Quad
*
QFN 7x7 QFN 7x7
New New
*
HTSSOP38
TSSOP14
TSSOP20
Output
Immunity
Diagnostics

30. CLT Evaluation Boards 30
Product # Channels Input type Documentation Evalboard order code
CLT3-4BT6 4 1 & 3 AN1608 STEVAL-IFP008V1
PCLT-2A 2 1, 2 & 3 AN2482 STEVAL-IFP004V1
SCLT3-8BT8 8 1, 2 & 3
AN2846
AN3031
STEVAL-IFP007V1
SCLT3-8BQ7 8 1, 2 & 3 DB2782 STEVAL-IFP030V1
CLT01-38S4 8 1, 2 & 3 AN4625 STEVAL-IFP023V1
CLT01-38SQ7 8 1, 2 & 3 DB2777 STEVAL-IFP031V1
CLT01 + VNI8200XP 8 1, 2 & 3
DB2622
UM1918
X-NUCLEO-PLC01A1
STEVAL-IFP008V1
STEVAL-IFP004V1 STEVAL-IFP007V1
X-NUCLEO-PLC01A1

31. Intelligent Power Switches
Core Products
31
Single Channel Dual Channel Quad Channel Octal Channel
< 0.7A
L6362A L6360
VNQ860
0.7A
IPS161H VNI4140K VN808(CM)
VNI8200XP
ISO8200B
ISO8200BQ
1A
VNI2140J VNI4140K-32 VN808(CM)-32
VNI8200XP-32
> 2A
VN540
VN751
IPS160H
IPS4260L
(Low-Side)
Development
Low RDSON 80 mΩ typ.
Qualification
New
New
New

32. IPS160H: Highest Supply Voltage 32
New single channel IPS
for safe outputs
Supply voltage range
up to 65 V
CONTROL
LOGIC
UNDERVOLTAGE
LOCKOUT
IN
DIAG
VCC
GND
OUT
CURRENT LIMITATION
& CUT-OFF
OPEN-LOAD
DIAGNOSTICS
OVER-TEMPERATURE
CUT-OFF
DELAY
OUTPUT CLAMP
VCC CLAMP
CCOD
Low RDSON = 60 mΩtyp
High output current
up to 2.5A*
High demagnetization
energy capabilities
~1J at 1A
Rich diagnostics:
open load in off state,
thermal and cut-off
CUT-OFF function with
adjustable delay
Compact package: PowerSSO-12
* 0.7A option with
IPS161H coming soon
Single high-side switch with protections and diagnostics for SIL2 and SIL3 compliant systems
STEVAL-IFP028V1

33. System Benefits
• Reduced component count
• Higher reliability
• Reduce System Level Losses
• Safe Operation
ISO8200B Octal HSD (110mΩ) 33
New package ISO8200BQ
9 x 11 mm
only!
New
PowerSO36
pin compatible
with VN808
STEVAL-IFP015V2
8-channel IPS with embedded galvanic isolation

34. VNI8200XP(-32) Octal HSD (110mΩ)
With selectable interface SPI / Parallel
34
System Benefits
• Reduced component count
• Reduced amount (&cost) of isolators
• Reduced power losses
• Safe Operation
• Less amount of control signals
Current capabilities: 0.7A and 1A (-32) per channel
PowerSSO-36
10x10 mm New
Amount of isolated channels is reduced rapidly thanks to the SPI bus
Octal High Side Switch with SPI

35. Build Your Own PLC With ST
PLC programming has never been so easy
35
What you need:
1) Nucleo-L053/F401RE: microcontroller board based on STM32L053R8 (STM32F401RE)
2) X-NUCLEO-IDW01M1: expansion board with SWPF01SA WiFi module
3) X-NUCLEO-PLC01A1: PLC expansion board integrating CLT01-38SQ7 for Digital Input and
VNI8200XP for Digital Output
Nucleo-L053R8/F401RE X-NUCLEO-IDW01M1
X-NUCLEO-PLC01A1
Plug all these parts in
stacked configuration

36. Build Your Own PLC
PLC programming has never been so easy
36
• The easiest way to evaluate the ST industrial I/Os
• Build your stacked PLC prototype
• Get the X-CUBE-PLC1 software from st.com
• Download the app for your Android device
• Run the nice Ladder programming tool to set-up IO
configurations or get ICs diagnostics

37. Wi-Fi
module
Sub-GHzBluetooth
IO-Link Fieldbus
NFC
Enabling Technologies
More Connected
37
ESD & EMI
Protection
More Connected
RFID
MCU
companion
chips

38. IO-Link
Point-to-point communication
38
Example of system architecture with IO-Link
• Universal
• IO-Link corresponds to the international standard IEC 61131-9
• Smart
• IO-Link offers digital data communication to the last meter
between field devices and the machine control
• Easy
• IO-Link is Plug & Play – compatible with existing machinery
and systems
Three reasons why IO-Link is simple
IO-Link get your system ready for Smart Industry communication
Industry 4.0 utilizes
Ad-hoc-communication
Predictive maintenance
Data analytics

39. IO-Link
Point-to-point communication
39
IO-Link uses industry’s standard communication plugs
ST covers the complete value chain with the L6360 (Master), L6362A (Device) and MCUs hosting the stack
Three transmission rates (baud rates) are
specified in IO-Link Specification v. 1.1:
• COM 1 = 4.8 kbaud
• COM 2 = 38.4 kbaud
• COM 3 = 230.4 kbaud (optional
according to Specification v. 1.0)
Pin assignment is specified
according to IEC 60974-5-2:
• 1: 24 V
• 3: 0 V
• 4: Switching and
communication line (C/Q)

40. L6360
Single port Master PHY for IO-Link and SIO mode
40
LINEAR
REGULATOR
I2C
INTERFACE
CONFIGURATION
CONTROL and DIAGNOSTIC
LED
CONTROL
BIAS
Config.
Digital
Filter
VCC
L+
C/QI
C/QO
L-
I/Q
UNDER
VOLTAGE
VDD SELVH Rbias
Config.
Digital
Filter
OVER-TEMP
PROTECTION
DIGITAL
INTERFACE
LED2
LED1
SA1
SA0
SA2
IRQ
RST
SCL
SDA
OUTI/Q
OUTC/Q
INC/Q
ENC/Q
ENL+
Miniaturized package: QFN
3.5 x 5 x 1 mm 26L
Digital interface to
9 internal register
for chip
programmability
& diagnostics
Direct access to
line drivers /
receivers for
transparent
operation
LED Drivers +
sequence
generators
embedded
Additional digital
input with digitlal
filter & current sink
Configurable line
driver with very low
RDSON=2 Ω max
Configurable power
switch
with very low
RDSON=2 Ω max
Receiver with
digital filter and
very precise
configurable
current sink
Tiny package:
STEVAL-IFP016V2

41. L6362A
Transceiver Device for IO-Link and SIO mode
41
DFN 3x3 – 12L
Reverse Polarity and Surge
protections on chip
+
+
+
+
Up to 400 mA output Current with
Overload and Cut-OFF protections
5 V or 3.3 V / 8 mA selectable
Linear Regulator
Configurable Output stage : High
Side, Low Side, Push-Pull
STEVAL-IFP017V2

42. Fieldbus Offering at ST
Industrial communication solutions with STM32 MCUs
42
Solutions are also available with the 8-bit STM8
family MCUs

43. Interface Protections
Overview
43
A-
A+
SMM4F33A
ESD with +/- 30kV contact
ASI Interface
Actuator & Sensor Interface
DATA
CLK
V+
COM
SHIELD
Seriplex Interface
ESDA14/25xx
ESD protection in SOT666/ 323/ 23
RxD
TxD
GND
CTS
RTS
RS232 Interface
ESDA6V1/ 14/ 25xx
ESD protection in SOT666/ 323/ 23
RS422 / RS485 Interface
ESDA6V1/ 14/ 25xx
ESD protection in SOT666/ 323/ 23
RxD+
TxD+
GND
RTS-
CTS+
RTS+
RxD-
TxD-
CTS-
CAN Interface
ESDA5V1L/ 6V1L/
ESDALC6V1
ESD protection in SOT663 / SOT23
CAN_H
CAN_L
Driving Circuits
Sensing Circuits
Cable
STM8x TDE1707/08,
L6362A
Control
Part
Driver
Pro-
tection
SPT01-335
Protection for
Proximity Sensor
QFN (3x3)
SPT01-335
Triple Transil
SPT02-236DDB
Dual transil with Vbr >36V
Sensor standard EN60947-5-2

44. Connectivity Modules for Smart Industry
• Machine to Machine communication
• Plug & Play solution
• Easy to use
• RF Certified solution
• Robust design
• Evaluation tools and documentation on web
• Wi-Fi modules
• Bluetooth 3.0 Class II and Class I modules
• Sub-GHz modules
All ST modules are FCC and CE certified.
44

45. Sub-GHz Modules
• SPI host interface
• Output power up to +11.6 dBm
• Rx: 9 mA, Tx: 21 mA @ +11 dBm
• CE compliant and FCC certified
• Air data rate up to 500 kbps
• Receiver sensitivity: -118 dBm
• Shut Down: 2.5 nA
• Operating temperature: -40 ÷ 85 °C
SPIRIT1 transceiver and BALF-SPI-01D3 balun/filter
SP1ML-868 (868 MHz)
SP1ML-915 (915 MHz) • AT Command
• Output power up to +11.6 dBm
• CE compliant and FCC certified
• Air data rate up to 500 kbps
• Modulation schemes: 2-FSK, GFSK, MSK, GMSK, OOK,
• 1.8 ÷ 3.6 V supply
• Operating temperature: -40 ÷ 85 °C
SPIRIT1 transceiver, STM32L1 MCU and BALF-SPI balun/filter
11,5 x 13,5 mm
SPSGRF-868 (868MHz)
SPSGRF-915 (915MHz)
SPIRIT1 is a sub-GHz transceiver intended for RF wireless-sensor node applications
45

46. Wi-Fi Modules
• 2.4 GHz IEEE 802.11 b/g/n transceiver
• STM32 ARM Cortex-M3 microcontroller
• Integrated antenna or U FL connector
• Pre-Certified RF (FCC, IC, CE)
• 1.5 MB or 512 kB Integrated Flash memory
• Integrated TC/IP and Application Layer Functions
• Easy interface to host Microcontroller through UART and AT commands set
• System Modes: Mini-AP and Station
• Built-in Application: Sockets, Web Server, Rest API
• TLS/SSL for End to End security
• Over The Air firmware update
• Easy provisioning (SSID, PWD) in miniAP
• Up to +18 dBm output power
• Small form factor: 26.92 x 15.24 x 2.35 mm
Main features
SPWF01Sx: Plug&Play solutions for IoT and Smart Industry applications
SPWF01SA
Integrated antenna
SPWF01SC
Integrated U.FL connector
Wi-Fi is based on the IEEE 802.11 family of
standards operating in the 2.4 GHz (IEEE
802.11b/g/n) and 5 GHz (IEEE 802.11a/n/ac)
unlicensed bands available worldwide
46

47. Bluetooth Modules
Bluetooth Low Energy
SPBT2632
B3 SPP/iAP
Bluetooth Classic Modules
BLE 4.1
BlueNRG
SPBTLE-RF
11.5 mm x 13.5 mm
x 2.0 mm
BALF-CC25-02D3
Offer of Bluetooth Classic and Bluetooth Low Energy Modules
• Compliant with latest Bluetooth Classic 3.0 version
• Embedded FW, including BT stack and profile, SPP and iAP*
and a simple, easy to use interface AT command set
• RF certified according to:
• CE, FCC, IC, TELEC
• Low-power mode supported
• Smart cable and remote mode supported
• Based on BlueNRG-MS (without MCU)
• Host interface: SPI
• BlueNRG-MS embeds all the Bluetooth Smart 4.1
protocol stack
• CE, FCC, IC certified
• Output power +4 dBm (up to + 8dBm)
• Receiver sensitivity -88 dBm
• Supply voltage from 1.7 ÷ 3.6 V
47

48. Evaluation tools for Connectivity Modules
Connectivity Modules
Evaluation Boards
Evaluation tools for Connectivity modules
STEVAL-SPBT3ATV3
STEVAL-SPBT4ATV3
USB dongle for Bluetooth V3.0 classic modules
STEVAL-SPBT3DP USB dongle for new Bluetooth V3.0 classic modules
X-NUCLEO-IDB05A1
STEVAL-IDB006V1M
Expansion board and USB dongle for SPBTLE-RF module
STEVAL-IDW001V1
STEVAL-PCC018V1
Daughter Board for WiFi modules usable with STEVAL-PCC018V1 or with the STM32F0-Discovery
STEVAL-SP1ML915
STEVAL-SP1ML868
USB dongle for SP1ML modules
X-NUCLEO-IDS01A5 (4)
STEVAL-IDS01V5M (4M)
STM32 Nucleo Expansion board and USB dongle for SPSGRF modules
48

49. NFC and RFID in Smart Industry
ST Contactless technologies
49
Dynamic NFC/RFID Tag use cases
Dynamic NFC / RFID tags with ST25, M24SR, M24LR and ST95HF
ST25TA
SRi / LRi
EEPROM
NFC phone
RFID reader
EEPROM
M24SR
M24LR
I2C and
Interrupt
Dynamic NFC/RFID tags
ST25 NFC / RFID tags

50. NFC and RFID for Automation
Evaluation boards
50
X-NUCLEO-NFC01A1
STM32 Nucleo Expansion board
based on M24SR
 M24SR64-Y Dynamic NFC/RFID tag IC
 31 x 30 mm, 13.56 MHz 2-layer inductive
NFC antenna etched on the PCB
(ANT14)
 Compatible with STM32 Nucleo
 Arduino UNO R3 connector
M24LR-DISCOVERY
Discovery kit for M24LR04E
Dual Interface EEPROM with
energy harvesting
 M24LR04E-RMN6T/2 Dual
Interface EEPROM with I2C and
ISO/IEC 15693 RF interfaces, 4
Kbits EEPROM and password
protection in SO8N package
 STM8L152C6T6 8-bit MCU, with 8
Kbytes of Flash memory
 STTS751-0WB3F, low-voltage
digital temperature sensor
 20 x 40 mm inductive antenna
etched on the PCB
M24SR-DISCOVERY
Discovery kit for the M24SR
series - Dynamic NFC/RFID tag
 31 x 30 mm 13.56 MHz 2-layer
inductive antenna etched on the PCB
(ANT14)
 STM32F103RGT6 64LQFP 32-bit
MCU, with 1Mbytes Flash memory
 LCD Color Screen (320x200 pixels)
 Joystick for menu selection
X-NUCLEO-NFC02A1
STM32 Nucleo Dynamic NFC tag
expansion board based on M24LR
 STM32 expansion board based on
the M24LR04E-RMN6T/2 Dynamic
NFC/RFID tag
 Up to 4 Kbit memory with NDEF
support
 30 x 30 mm 13.56 MHz double layer
inductive antenna etched on the PCB

51. Thank You