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HP_summary_slides
- 1. Β© Copyright 2014 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.
MECOP Experience
Trent Smith
2nd Internship
Mechanical Engineer, OSU
- 2. Β© Copyright 2014 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.2
Laser welding development
β’β― Goal: optimize laser welding process for assembly that will
guide decisions to increase weld strength and resistance to
environmental stress cracking.
β’β― Variables:
β’β― Line energy (laser power, speed, cycle time)
β’β― Weld collapse and clamping force
β’β― Material properties
β’β― Process: design experiments and collect data to
create a model characterizing optimal weld
parameters and guiding material selection
decisions
β’β― Knowledge gained: DOEs, statistical modeling
experience, plastic/polymer interactions, thermal-
induced stresses, environmental stress cracking
and resistance
- 3. Β© Copyright 2014 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.3
Quantitative Stress Analysis Using
Birefringence
β’β― Goal: characterize stress distribution in transparent molded parts
β’β― Background:
β’β― When viewed in cross polar, stressed transparent materials display colored fringe
patterns β termed birefringence
β’β― A calibrated wedge compensator can be used to calculate wavelength retardation
which correlates to stress
β’β― Knowledge gained: alternative stress analysis
techniques, designing for reduced residual mold
stress, impact of laser welding on stresses and ESCR
- 4. Β© Copyright 2014 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.4
Determining the Stress-Optical Coefficient
Coupon
Clamps
Load Cell
Threaded rod
Load-inducing nut
- 5. Β© Copyright 2014 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.5
Mold parameter optimization
β’β― Characterizing and comparing residual mold
stresses allows for better mold specifications
β’β― Analysis allows for quick comparison between
parts & processes as well as opportunity for
quantitative data
- 6. Β© Copyright 2014 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.6
Impact of Knit Lines and Cold Welds on
Performance
Cold weld
region (POI)
- 7. Β© Copyright 2014 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.7
Product Engineering
β’β― Product engineers support the line and ensure that processes remain stable
β’β― Responsibilities:
β’β― Yield tracking and improvements
β’β― Contamination analysis and prevention
β’β― Cycle time studies & reduction
β’β― Gauge repeatability & reproducibility
β’β― Design Support
β’β― Knowledge gained: tool validation,
manufacturing processes and control, FTIR
applications, manufacturing line team work
