Vlsi is the core course of eee engineering.

1. EEE 3217
VLSI
LECTURE 1
1
Md. Roisul Ajom Ruku
Lecturer
Dept. of EEE,BAUET

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REFERENCEBOOKS:
•BASICVLSIDESIGN…
…D
O
U
G
L
A
SA
.P
U
C
K
N
ELL
•CMOSVLSIDESIG
N…
…D
A
V
IDH
A
RRIS
•F
U
N
D
A
M
EN
T
ALSO
FM
O
D
E
R
NVLSIDEVICES…T
A
KH
.N
IN
G
•DIGIT
ALIN
T
E
G
R
A
T
E
DCIRCUITS….JANM
.RABAEY

3. V
acuumtubes
Thesedevices would control
theflowof electronsin
vacuum.
Pointcontact Germanium
transistor
Thepoint-contact transistor was
thefirst typeof transistor tobe
successfully demonstrated. It was
developedbyresearchscientists
JohnBardeenandW
alter Brattain
at Bell Laboratories inDecember
1947.
BipolarJunction
T
ransistor(BJT)
In1950, Shockley
developedthefirst
Bipolar Junction
Transistor (BJT)
FirstIntegrated
Circuit
In1958, Jack Kilbyof
T
exasInstruments
connectedtwobipolar
transistorsonasingle
pieceof silicon,
therebyinitiatingthe
“SiliconAge”
A BRIEF HISTORY:

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INTRODUCTIONTOVLSI:
Very-large-scale integration (VLSI) is the process of creating an IC by
combining thousands of transistors into a single chip.
VLSI began in the 1970s when complex semiconductor and communication
technologies were being developed. The microprocessor is a VLSI device.
Before the introduction of VLSI technology most ICs had a limited set of
functions they could perform. An electronic circuit might consist of a CPU, ROM,
RAM and other glue logic. VLSI lets IC makers add all of these into one chip.

5. The idea of glue logic is to provide a
means by which two digital
electronic circuits (two “logic”
circuits) that don’t share a common
interface can be “glued” together.
** Glue logic is a special form of digital
circuitry that allows different types of
logic chips or circuits to work together by
acting as an interface between them.
5
GLUE LOGIC:
The circuitry typically used to create the glue logic is a device
known as a Field Programmable Gate Array or FPGA. This is a type
of digital circuit whose logical function can be configured,
or programmed.

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• VLSI deals with designing new integrated circuits (IC)
• Embedded system is an application built using integrated circuits
(Microcontrollers)
For example :
Designing new Microcontroller like atmega16 is VLSI
Making an application using Atmega16 is embedded system
VLSI- How to develop a chip
EMBEDDED- How to use the chips to produce an efficient system.
DIFFERENCEBETWEEN VLSI &
EM
BEDDEDSYSTEM:

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IC(S) & SCALE INTEGRATION:
THE INTEGRATED CIRCUIT
The Integrated Circuit consists of one chip, where all the passive and active components are placed. Initially, only
a few transistors were being put on an IC. With the advance in technology, however, more and more components
had to place on the IC.
The devices became complex, the number of circuits became more confusing and bulky. A new technology
called the Integration Technology came into existence which helped in maintaining the physical size of the IC,
but also include more and more components. The IC’s were classified depending on the number of components
it could hold. They are:
SSI (SMALL SCALE INTEGRATION) – Around a maximum of 100 transistors can fabricate on one single chip.
Gates and flip-flops are prime examples of SSI’s.
MSI(MEDIUMSCALE INTEGRATION) – 100-1000 transistors could now accommodate on one single chip,
microprocessors for example.
LSI (LARGE SCALE INTEGRATION) – Around 10000 transistors can place on a single chip, for example, RAM,
ROM, 8-bit Microprocessors.
VLSI(VERYLARGESCALE INTEGRATION)– Devices like 16-32 bit microprocessors can have up to 1 million
transistors on a single chip.
ULSI(ULTRALARGE SCALE INTEGRATION)AND GLSI (GIANT LARGE SCALE INTEGRATION) – For special
purpose registers and embedded systems.

8. EVOLUTIONOF SCALE INTEGRATION:
8

9. 1
0
VLSI DESIGNFLOW:
SYSTEM SPECIFICATION:
The first step of any design process is to lay down the
specifications of the system. The factors to be considered in this
process include: performance, functionality, and physical
dimensions (size of the chip). The fabrication technology and
design techniques are also considered.
ARCHITECTURAL DESIGN:
The basic architecture of the system is designed in this step.
This includes, such decisions as RISC (Reduced Instruction Set
Computer) versus CISC (Complex Instruction Set Computer),
number of ALUs, floating point units, number and structure of
pipelines, and size of caches among others.

10. 1
1
VLSI DESIGNFLOW:
FUNCTIONAL DESIGN:
In this step, main functional units of the system are identified. This also
identifies the interconnect requirements between the units. The area, power,
and other parameters of each unit are estimated.
The behavioral aspects of the system are considered without implementation
specific information. For example, it may specify that a multiplication is
required, but exactly in which mode such multiplication may be executed is
not specified.
LOGIC DESIGN:
In this step the control flow, word widths, register allocation, arithmetic
operations, and logic operations of the design that represent the functional
design are derived and tested.

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2
VLSI DESIGNFLOW:
representation. This geometric representation of a circuit is called
a layout. Layout is created by converting each logic component (gates,
transistors etc) into a geometric representation (specific shapes in multiple
layers), which perform the intended logic function of the corresponding
component. Connections between different components are also expressed as
geometric patterns typically lines in multiple layers.
CIRCUIT DESIGN:
The purpose of circuit design is to develop a circuit representation based on the
logic design. The Boolean expressions are converted into a circuit representation
by taking into consideration the speed and power requirements of the original
design. Circuit Simulation is used to verify the correctness and timing of each
component.
PHYSICAL DESIGN:
In this step the circuit representation is converted into a geometric

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3
VLSI DESIGNFLOW:
FABRICATION:
After layout and verification, the design is ready for fabrication. Layout data
is converted (or fractured) into photo-lithographic masks, one for each
layer. Masks identify spaces on the wafer, where certain materials need to
be deposited, diffused or even removed. Silicon crystals are grown and
sliced to produce wafers. Extremely small dimensions of VLSI devices
require that the wafers be polished to near perfection. The fabrication
process consists of several steps involving deposition, and diffusion of
various materials on the wafer. During each step one mask is used. Several
dozen masks may be used to complete the fabrication process
PACKAGING & TESTING:
Finally, the wafer is fabricated and diced into individual chips in a fabrication
facility. Each chip is then packaged and tested to ensure that it meets all the
design specifications and that it functions properly.

13. ADVANTAGES
OF VLSI:
13
•Reduced size for circuits.
•Increased cost-effectiveness for devices.
•Improved performance in terms of the operating speed of
circuits.
•Requires less power than discrete components.
•Higher device reliability.
•Requires less space and promotes miniaturization.

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APPLICATIONS OF VLSI:
• Defense
• Aerospace
• Wireless & wireline communication
• Consumer electronics
• Bio electronics
• Medical electronics
• Electronic design optimization

15. • In 1965 Gordon
Moore(Intel cofounder)
initiated a law named
Moore’s Law.
• M
OORE'S LAW
: The
number of transistors in a
dense integrated
circuit will be doubled
about every two years.
INTEGRATION & M
OORE’S
LAW:
INTEGRATION
LEVELS
SSI:
M
SI:
LSI:
10 GATES
1000 GATES
10,000 GATES
VLSI: > 10KGATES

16. INTEGRATION & M
OORE’S LAW:
16

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