1. IEEC Database for Electronic Packaging Materials
Wayne E. Jones Jr.a, Peter Borgesenb, Junghyun Choc
Sam Mahin-Shirazib, Linyue Tonga
a) Department of Chemistry and Materials Science Program, Binghamton University, Binghamton, NY 13902
b) Department of Systems Science and Industrial Engineering, Binghamton University, Binghamton, NY 13902
c) Department of Mechanical Engineering, Binghamton University, Binghamton, NY 13902
The database of properties of industrial electronic
packaging materials (EPMs) has been maintained
and expanded in order to provide a wide range of
information for various electronic packaging
materials by utilizing chemical, mechanical,
physical and thermal testing methods. The
obtained information from the tests can provide a
basis for decision making on new products as well
as a foundation on which new materials can be
evaluated.
Introduction
Test Descriptions for Tools
By reviewing the description, the members will be
able to have a general idea about the capabilities of
the tools and their general application. The purpose
of the tools description is to address the following:
• What are the tool and its application
• One/two picture(s) of the tool
• An example of the result that can be obtained from the
tool
• A link to the tool for more details if there is any online
information for further information, staff members that
are responsible for that specific tool and some other
technical specifications.
Contact Information
If you want to add new materials to the database please contact:
Sam Mahin-Shirazi at smahins1@binghamton.edu
To discuss materials and data feel free to email:
Sam Mahin-Shirazi at smahins1@binghamton.edu
Linyue Tong at ltong1@binghamton.edu
Dr. Peter Borgesen at pborgese@binghamton.edu
1) IEEC Materials Submission Form
The online form is now available for members with
both secured access to the website and through a
link which has been sent to all the members.
Comparison of the measured and predicted plots for the
creep compliance of Hysol QMI519.
Continues lines are the predicted and dashed lines are the real data
Where 𝐷 𝑡 = 𝜀(𝑡)
𝜎0
𝐷 𝑡 is the creep compliance function which is a material
property that characterizes creep behavior
𝜀(𝑡) is the time-varying strain at a constant load 𝜎0
is the mean retardation time. The smaller this value the
more rapid is the creep
Some of the tests have been reorganized and
some of them are recently added to the list
.
Available Tests
Chemical Structure
and Composition
Analysis
Mechanical Testing
• Universal Testing Machine
• Nanoindentation Testing
• Transmissionelectronmicroscopy(TEM)
• Scanning Electron Microscopy (SEM)
• X-ray Diffraction (XRD)
• Optical Microscopy (OM)
• Atomic Force Microscopy (AFM)
• Small-angle X-ray scattering (SAXS)
• IR Microscope
• Sample Preparation tools
 Argon Ion Cross Section Polisher
 Multiprep Tools
• Spectroscopic Ellipsometry
• Moisture analysis in Polymer
 Weight Gain
 Moisture Swelling
 CoefficientHygroscopicSwelling(CHS)
Microstructure Analysis
and Characterization
• Flash Diffusivity
• Thermal Conductivity
• DifferentialScanningCalorimetry(DSC)
• TGA-MS
• Thermo-MechanicalAnalyzer(TMA)
• DynamicMechanicalAnalyzer(DMA)
• Rheological Characterization
Thermal Analysis
Electrical Properties
• Electrical Conductivity
• Electrical Resistivity
• X-Ray Imaging
• ScanningAcousticMicroscopy(C-SAM)
Non-destructive Structural
Characterization
• FourierTransformInfraredSpectroscopy
• Energy/Wavelength-Dispersive
X-ray Spectroscopy
• X-RayPhotoelectron spectroscopy(XPS)
IEEC Website
Pleaseenterthefollowinginformation
IfOther
Chooseclass
o Encapsulants
o Adhesives
o ThermalInterfaceMaterials
o PolymerUnderfillMaterials
o PolymerCompositesw/CNT's
o Solders
o BarrierLayers
• Other
Name
CompanyName
Pleaseenteryouremailid
NameofMaterial
Submit
Property/Data Available Value TDS Value
MSDS
TDS
Tg (CTE Data)
Coefficient of Thermal
Expansion (CTE)
Storage Modulus
Stress Relaxation / TTS Data
Elastic Region Stress-Strain
Curve
Moisture Uptake
Outgassing
Coefficient of Hygroscopic
Swelling (CHS)
0.0021 %ε/%C
1.03% @ 100 0C
90 0C
63.63 ppm/0C (<Tg),
177.26 ppm/0C (>Tg)
3.3 wt.%, @ 85°C/85°RH
90 0C
54 ppm/0C (<Tg),
206 ppm/0C (>Tg)
516,912 psi
EPO-TEK 353 ND
Optical Adhesives
2) New Standard Template
We designed Template to include TDS values for easy
access to further information on the materials.
- Included values where necessary for different types of
preparation of the materials
- Included links to PDF copies of both the TDS/MSDS
Differential scanning calorimetry (DSC)
DSC is the most popular thermal analysis technique, which measures the sample
compared to a reference material, usually air, to determine heat flow as a function of
temperature through exo or endothermic reactions. It can be used to characterize
polymers, pharmaceuticals, food; biologicals, organic chemicals and inorganics, and
yield thermal stability data or heat capacity depending on how the experiment is set
up. The information of glass transition, melting, crystallization, curing and cure
kinetics, onset of oxidation and heat capacity can be analyzed from the DSC result.
DSC Q200 from TA Instruments
As shown in the Figure 1 A) and B) we see no glass transition (Tg) since these
epoxies start in a psudo liquid state, however the first exothermic process would
indicate the melt point (Tm) which relates the thermal cure point. Figure 1 C) and D)
are calibrated to measure heat Cp for the underfill materials.
• For detailed tool information from the ADL click here
Figure 1. DSC (a) and MDSC (b) of underfill epoxy Hysol QMSI519. DSC under different
curing conditions (c and d).
A)
C) D)
B)A)
C)
B)
A New Section for Online Modeling tools
We are creating a new section of the packaging
materials database that we post modeling tools that
are available online. One example is the creep model.
We can predict the creep behavior of epoxy adhesives
such as die attach adhesive, Hysol QM1519 in a wide
range of stresses by using the provided equations.
Sumitomo G700E (Mold Compounds)
Sumitomo G700Y (Mold Compounds)
Sumitomo G600 (Mold Compounds)
Sumitomo G700l-Y (Mold Compounds)
Hysol CE3103 (Optical Adhesive)
Hysol CE3920 (Optical Adhesive)
Ablecoat 8006NS (Die Attach Adhesive)
New Materials
IEEC
Integrated Electronics Engineering Center