20101216 玻璃製造及加工技術 (NXPowerLite)

AUO Proprietary & Confidential
玻璃製造及加工技術
RDAA4
2010/06/04

Cover glass flow

LCD
3D
Touch
Cover Lens
Future Structure
Mother Glass
Process
Gen size cutting
Beveling
CNC cutting Polish及Thin Tempered Barrier coating
AR/AG/AF/AS Print Lamination

Cover glass w/ AR Cover glass w/o AR Cover glass + TP
Plastic cover i-Pad Gorilla cover

Glass technology summary
Application
Mother
glass
Glass process Lamination
Soda lime
Gen size
cutting
Beve
ling
CNC
cutting
Polish
Temper
ed
Barrier
coating
AR/AG
/AF/AS
Print Lamination
3D PR V V V X X X X X X V
3D switch V V V X V X V X X V
Touch V V V X X V V? V X V
Cover glass V V V V X V X V V V
TFT-LCD V V V X V X V X X X
Mother glass
process
Gen size cutting
Beveling
CNC cutting Polish及Thin Chemical strengthen Barrier coating
AR/AG/AF/AS Print Lamination

PCT Stack Structure v.s Size
CF (0.5 mm)
Sensor
TFT (0.5 mm)
LC
In-cell
Touch
panel
FPC
PF
Protect Film 4H
In-cell + Protect film
15.6” 24”10.1”
LCD
Sensor glass ( ~0.7mm )
Sensor
OCA
FPC
On-cell
Touch
panel
PF
CF (0.5 mm)
Sensor
TFT (0.5 mm)
LC
OCA
Cover lens ( 1 mm )
In-cell
Touch
panel
FPC
PF
In-cell + Cover
w/i Direct Bound
Sensor
OCA
Cover lens ( 1 mm )
LCD
PF
On-Cover
Touch
Panel
Sensor
OCA
Cover lens ( 1mm )
On-cell
Touch
Panel
LCD
PF
Air gap (0.5mm)
LCD
Sensor
OCA
On-cell
Touch
panel
PF
Protect Film 4H
On-Cell + Cover
On-Cell

Glass Process

Glass Ingredients
SiO2 Na2O CaO MgO Al2O3 Fe2O3 K2O TiO2
70-73% 13-15% 7-12% 1-4.5% 1-2% 0.1% 0.03% 0.02%
PDP Glass (CGC)
TFT LCD Glass (Asahi)
SiO2 Na2O CaO MgO Al2O3 Fe2O3 K2O TiO2 BaO ZrO2
53-56% 3-5% 6-9% 2-4% 8-11% X 7-9% X 8-10% 0-4%
SiO2 Na2O CaO MgO Al2O3 Fe2O3 K2O TiO2 B2O3 SrO
60% < 0.1% 4% 3% 17% X X X 8% 8%
Soda-Lime Glass
Main SiO2 amorphous solid state
 Based on the local tetrahedral periodic structure
Minor substance
 Interact with SiO2 to strengthen main structure
 Improve property and stability. Independent to SiO2,
and easy to effuse alkali ions

C/S Glass surface
K+ Na+

Components of glass
分類名稱
氧化矽(SiO2) 可使玻璃比重降低
增加玻璃熔製時溫度、增
加化學穩定性及熱穩定
性、增加機械強度
氧化鋁(Al2O3) 降低玻璃析晶性
增加玻璃熔製溫度韌性及
增加化學穩定性及玻璃機
械強度
氧化硼(B2O3)
降低玻璃熔製時的溫度、
減少玻璃析晶
增加化學穩定性與耐熱穩
定性並可增加玻璃光澤
酸性氧化物
(物玻璃主要內含物)
對玻璃組成的影響
氧化鈣(CaO)
加入太多會降低玻璃熱穩
定性
增加玻璃硬度、增加化學
穩定性及玻璃機械強度
氧化鎂(MgO)
降低析晶性及韌性增加玻璃耐熱性及化學穩
定與機械強度
氧化鉛(PbO)
降低玻璃熔製時的溫度、
加多會使化學穩定性降低
增加玻璃比重、折射率、
增加玻璃光澤
氧化鋇(BaO)
降低玻璃熔製溫度及降低
化學穩定性
增加玻璃比重、折射率、
增加玻璃光澤
氧化鋅(ZnO)
降低熱膨脹係數及降低玻
璃熔製溫度
增加熱穩定性、化學穩定
性
鹼土族金屬及其他
二價金屬氧化物
PS:鹼土族氧化物族群中,氧化鋅(ZnO)及氧化鉛(PbO)具有良好的助熔材料,
可加速玻璃溶解速度和澄清玻璃膏溶液(去除氣泡);三氧化二硼(B2O3)可減
少熔解時間和澄清所需時間;二氧化鈦(TiO2)在許多玻璃批料配方中添加作
為成型劑,故鹼金屬氧化物被視為一種助熔性物質原料

平面顯示器目前所用的玻璃大致分為三大類:
1.鈉鈣矽玻璃(Soda-lime Glass):一般建築.汽車用,及TN.STN, Cover Glass用
2.“無鹼玻璃”:意指glass 內的無鹼金類氧化物(如:Na.K.Li….)含量,目前只有TFT產業完全使用
3.PDP Glass
Components of glass
SiO2 Na2O CaO MgO Al2O3 Fe2O3 K2O TiO2
70-73% 13-15% 7-12% 1-4.5% 1-2% 0.1% 0.03% 0.02%
PDP Glass (CGC)
TFT LCD Glass (Asahi)
SiO2 Na2O CaO MgO Al2O3 Fe2O3 K2O TiO2 BaO ZrO2
53-56% 3-5% 6-9% 2-4% 8-11% X 7-9% X 8-10% 0-4%
SiO2 Na2O CaO MgO Al2O3 Fe2O3 K2O TiO2 B2O3 SrO
60% < 0.1% 4% 3% 17% X X X 8% 8%
Soda-Lime Glass

Glass process introduce
目前為止,生產平板玻璃有三種技術:
1.浮流式玻璃技術(Float tech.);
2.下抽式或開口下拉引技術(Down Draw)
3.溢流熔融技術(overflow fusion tech.)

Asahi 製程簡圖(float glass process)
浮流式玻璃技術(Float tech.)製程簡介說明
玻璃從玻璃熔爐中流出進入錫床,玻璃將剛進錫床玻璃帶(Ribbon)冷卻至700℃,黏度108P,
再以邊緣滾輪(Edge Rolls)拉住浮於液態錫上的玻璃膏,並向外展拉後,再將玻璃加熱到850
℃,黏度106P 時,並配合滾輪施加外力拉引而成

冷卻玻璃帶
700℃,108P
重新加熱玻璃帶
850℃,106P 展拉玻璃帶
輸送帶滾輪
邊緣滾輪
浮流式製程俯視圖及側視圖

下抽式或開口下拉引技術(Down Draw)
下引速度
溫度
溫度
流孔開口
冷卻裝置
流孔下抽引式是利用從熔爐內經流孔流出,經冷卻裝置及滾輪的拉引垂直下拉
目前TFT用玻璃並無以此製程作生產

溢流熔融技術(overflow fusion tech.)
採用一長條型的熔融幫浦(Fusion Pump),將熔融的玻璃膏輸送到熔融幫浦中心,
再利用溢流的方式,將兩股向外溢流的玻璃膏於熔融幫浦下方處在結合成超薄平
板玻璃

製程技術的關鍵

Glass property and defects

Physical Properties

TFT , soda-lime , CS glass composition

Glass physical characteristics
Working point (104 Pa‧s) 1321℃ 2410℉
Softening point (107.6 Pa‧s) 985 ℃ 1805℉
Annealing point (1013 Pa‧s) 722 ℃ 1332℉
Strain point (1014.5 Pa‧s) 666 ℃ 1231℉
Corning EAGLE XG

Strain Point
Tf

Young’s Modulus and Sag

AUO OA-10 bare glass stress mura
上光箱BLU
下光箱BLU
Bare glass – one (slot 5 )of 5 has serious mura phenomena (斜紋mura )

Spec.: ≦0.05 um/ 20mm

Defect analysis and explain
Glass defect type:
1.inclusion(bubble . Stone..)
外觀特徵:
1.位置:玻璃內,不固定點
2.規格:100um
3.型狀:bubble呈現圓形
stone 呈現不規格形
4.透射目視:bubble呈現透明狀
stone呈現不透明狀
5.判定方式:調整focus往玻璃內部越清楚

Glass defect type:
2.cullet
外觀特徵:
1.位置:玻璃內及表面,不固定點
2.規格:100um
3.型狀:呈現不規格形
4.透射目視:呈現透明狀
5.判定方式:調整focus往玻璃內部越清楚

Glass defect type:
3.Scratch
外觀特徵:
1.位置:玻璃表面,不固定點
2.規格:1500Lux 反射光不可見
3.型狀:呈現線性居多
4.透射目視:呈現狀
5.判定方式:以1500Lux 反射光不可見

Cutting, Grinding, Beveling
Cutting Grinding
Grinding
Beveling
•Grinding
使用杯形輪，在輸面上裝設研磨用之鑽石和磨石
•Beveling
擦光輪磨方式之研磨方法，使用由雙旋轉軸拉開旋轉之研磨用皮帶的外周面。以羊
皮形成之皮帶研磨，當進行此研摩之際，利用澆CeO2之水溶液於被研磨部分上而
實施研磨
•Cutting
使用刀輪做XY軸切割，和Cell 裂片方式相同

CNC cutting

Glass Polish and Thinning Process

保護膜塗佈工程・・・在電極上塗上保護膜(揮發型樹脂溶劑)
・表面維持研磨後
的粗糙度
断面
游離研磨粒子
液晶面板
Carrier
Lap工程・・・將大部分的厚度磨掉
断面
游離研磨粒子
液晶面板
Carrier
PU PAD
Polish工程・・・完成鏡面處理
保護膜剝離
Ra=0.007～0.01μm
Ra=0.3～0.4μm
Mechanical Thinning Process

Mechanical Thinning Process

Chemical Thinning Process

Chemical Thinning Process
 Method : immersion / spray (high throughput)
 Etchant: HF / fluoride-base chemical (GLET-30) NH4HF2+α+β
 Good thickness variation and surface roughness control.
 Dimple issue (no mura after PF )

Ra = 0.6nm
No thinner
Ra = 1.961nm
Glass Thinning Process
Ra: 1.11nm
After HF etching
w/o 2nd polish
After Machine Thinning
w/o 2nd polish

Mechanical Chemical
Yield Rate 95% 99%
Strength Strongest (Polishing) Stronger
Surface Roughness Roughless (Polishing) Average
Thickness Uniformity NO YES
Solution Infiltration by Slurry by HF
Patterns damage NO May be
Scratch Less May be
Chipping Easy less
Micro-crack Easy less
Residual glue on OLB Chip --> YES Chip --> YES
Polishing Request Definitely Suggest
Environment Safe Danger
Equipment Size Largest Small
Equipment Cost High Low
Process amount Depend by tool size Depend by tank size
Material Consumption Slurry / 鑽石鋌 / 研磨砂 HF
Wastage & Cost Low High

Introduction to Cover lens and C/S Glass

Outline
• Introduction glass chemical strengthening and Important Parameters
• Testing in AUO Lab. (SIMS, Glass 荷重, 4-Point Bending, Pencil
Hardness Test)
• Glass Vender
• Cover lens and C/S glass wish spec

Introduction to C/S glass and Important Parameters
From AGC

C/S Glass surface
K+ Na+
鈉玻璃欲往深層, Na+ 離子被K+交換比例會減少, 但交換到達一極限時,
深層的鈉離子diffuse到玻璃表面會再度把鉀離子置換出來, 造成
玻璃表面強度變差 !
錫離子面
強化後玻璃的變化

From 坤輝

From AGC
一般soda-lime glass強化深度和的compress stress關係

From AGC

AUO Proprietary & ConfidentialFrom AGC

Vickers hardness

Introduction to glass chemical strengthening and
Important Parameters
From NEG

Summary
Item
Corning
Gorilla
Non CS 坤輝宏益
清惠
有做R角
CS 特性
Mother Glass Corning CG CG CG CG
Chemical
Strengthening
KNO3 NA KNO3
KNO3
先切後化
KNO3
先化後切
KNO3
CS 662.08 NA 400 507.88 480.52 520.26
DOL 40.93 NA 17 10.75 10.75 10.67
4 Point Bend
(Kgf)
>13.16
至機台極限
未破裂
7.8 12.30 12.27 6.02 10.67
Ring on Ring
(Kgf)
200以上 40.18 113.38 77.59 85.45 78.95
未鍍膜
Transmittance
%
92.22
90.86
(0.5t)
92.72 93.16
AR特性
Transmittance
%
NA NA 100.17
AR
93.617
AG
33.597
NA
Reflectance % NA NA 1.01 < 0.5 % 1.18 NA
Pencil Hardness NA NA NA
Print 外框百格測試
Pass
(利科代工）
Na Pass Pass Pass

CS and DOL
Item
Corning
Gorilla
坤輝
宏益
先切後化
宏益
先化後切
清惠
有做R角
CS
(Mpa)
662.08 400 507.88 480.52 520.26
DOL
(um)
41.31 17 10.75 10.75 10.67
CS and DOL
0
100
200
300
400
500
600
700
CorningGorilla
坤輝
宏益先切後化
宏益先化後切
清惠
CS(Mpa)
0
5
10
15
20
25
30
35
40
45
DOL(um)
CS
DOL

CS and 4 Point Bending
Item
Corning
Gorilla
Non CS 坤輝
宏益
先切後化
宏益
先化後切
清惠
有做R角
CS
(Mpa)
662.08 0 400 507.88 480.52 520.26
4 Point
Bend (Kgf)
>13.16
至機台極限
未破裂
7.8 12.30 12.27 6.02 10.67
CS and 4PB
0
2
4
6
8
10
12
14
CorningGorilla
NonCS
坤輝
宏益先切後化
宏益先化後切
清惠
4PB(Kgf)
0
100
200
300
400
500
600
700
CS(Mpa)
4 Point Bend
CS
NB a=1吋
Monitor a=2吋
TV a=3吋

CS and 4 Point Bending
Item
Corning
Gorilla
Non CS 坤輝
宏益
先切後化
宏益
先化後切
清惠
有做R角
CS
(Mpa)
662.08 0 400 507.88 480.52 520.26
Ring on
Ring (Kgf)
200 40.18 113.38 77.59 85.45 78.95
CS and Ring on Ring
0
50
100
150
200
250
CorningGorilla
NonCS
坤輝
宏益先切後化
宏益先化後切
清惠
RingonRing(Kgf)
0
100
200
300
400
500
600
700
CS(Mpa)
Ring on Ring
CS

Barrier and outer surface coating technology

Outline
• Sol-gel technology
• PVD technology
• CVD technology

Sol-gel technology

Dip coating

Spin coating process
Fluid dispense Spin up Fluid dispense evaporation

PVD technology
Ground shield
Floating Mask
Cooling water
Target
Mask
磁鐵
水冷板
基板
Susceptor
Heater
Backing Plate
Cooling Water
DC Power Supply
1.在低壓中導入工作氣體(Ar)及電子，經電場的加速作用下使之具有足夠能量並碰撞中性原子而產生正離子
2.正離子經陰極暗區電場作用加速後撞擊靶材使原子逸出，同時產生二次電子
3.逸出靶材表面之原子飛濺至基板表面
4.產生之二次電子再經電場加速具有能量後與工作氣體中性原子再碰撞產生正離子，正離子撞擊靶材表面並在
釋放出二次電子
Process chamber top view
利用磁場使電子在target表面作螺旋運動，增加與Ar碰撞的機會，使target的電流密度增加；
磁鐵控制薄膜之均勻度

CVD technology
To Dry
Pump
Showerhead
13.56 MHz RF
(Deposition Only)
Glass Substrate
Slit
Valve
Gas In
Remote
Plasma Source
(Clean Only)
Deposition:
SiN, Si, SiO2, …etc
Plasma Cleaning:
NF3 → N2 + .F
.F + Si → SiF4
Diffuser控制薄膜之均勻度
Diffuser與Substrate的間距愈小Plasma越往外擴，間距愈大產生的Film越鬆散
Spacing會影響膜質(織密程度)、Dep. Rate以及Uniformity

Sol-gel tech. vs PVD / CVD tech. comparison
Sol – gel technology PVD / CVD
Equipment investment fee Low High
Coating method Spin , dipping , spray , slit Thin film coating
Solvent Organic solvent vacuum
Baking tunnel or furnace 200 C ~ 400 C for 30~60min Not necessary
hardness Strong Worse than sol gel method
Residue on glass Sol-gel aggregation Thin film particle
material TEOS , TEOTi  hydrolysis Target / gas
Material storage Sol – gel  -20 C is better Target  room temp
Chemical resistance Good Worse than sol gel method
G6 G7 G8 or more Difficult Easy
U% - Multi-layer > 3 layers Not good Good
Na+ , K+ blocking Depend on baking temp Good

Introduction to outer surface coating

Outline
• AR coating – anti - reflection coating
• AG coating - anti - glare coating
• AS coating – anti – smudge coating ( 防污抗指紋 )
• AS coating - anti – static coating

AR Glass=Anti-Reflective Glass
高穿透抗反射光學鍍膜玻璃

AR coating principle
在基板上鍍上薄膜，利用波峰波谷相抵消的方式，將反射光降到最小
利用控制薄膜厚度造成光程差的方式，讓二次反射光的波谷對應到一次反射光的波峰。
例：入射光波長550 nm，薄膜厚度要控制在137.5 nm。

Multi – Layers AR coating

AG coating – Anti-Glare coating
在玻璃表面製造粗糙不平整面，光入射到這不平整面後會造成散射，光因散射到不同
方向因此不會集中在特定方向此為抗眩。
但由於光會散射，散射嚴重時會影響畫面品質。

AS/AF coating – anti – smudge coating ( 防污抗指紋 )
在表面塗佈上疏水基的材料(一般為含氟材料）就可達到抗污的功用

Print
IR cut printing, Color printing, Icon and logo printing
印刷玻璃是將無機色釉通過絲網印刷機印在玻璃表面，再經過烘烤、高溫燒結，使色釉永久附著
於玻璃表面。

Lamination

3M OCA

2010 FPD show
David 20100611

富晶通 thin TP + cover glass

Multi-touch + cover

CPT cover Lens AG coating

CPT cover Lens ARAS coating

CPT cover Lens technology - AGARAS

CPT new touch – Electromagnetic coating

Cover glass spec

宏益代工

宏益 sol gel dip coating

宏益 sol gel dip AR coating for cover glass

宏益 sol gel dip AR coating for window

可見光全波長的AR 鍍膜

3D glass

20101216 玻璃製造及加工技術 (NXPowerLite)

20101216 玻璃製造及加工技術 (NXPowerLite)

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