https://amditis.iccs.gr/~i-sense/retired-sites/www.fabric-project.eu/www.fabric-project.eu/images/Presentations/ITS_Bordeuax_2015_PR09_Ombach_Qualcom.pdf

1. Qualcomm Technologies, Inc.
Current status and outlook of stationary and
dynamic wireless electric vehicle charging
Dr. Grzegorz Ombach, VP Engineering
Qualcomm Europe Inc.
22.09.2015
Qualcomm HaloTM WEVC technology is licensed by Qualcomm Incorporated. Prototype charging systems are
products of Qualcomm Technologies, Inc.

2. 2
Vision for EV
Charging
1
Complete
System Solution
2
Interoperability
Key Factors
3
Agenda
Conclusions
4

3. 3
A Vision for EV Charging - WEVC

4. 4
Global urbanisation
70% of world’s population
will live in cities by 2050
(World Health Organization 2014)
Infrastructure strain
Total global vehicles
increasing from 1.1bn
today to 2.5bn by 2050
(OECD Report 2012)
Air pollution
Legislation and fines
for pollution
(Environmental Protection Agency –
European Commissions)
Health costs
Urban outdoor air pollution is
estimated to cause 1.3 million
deaths worldwide per year
(World Health Organization)
Overview of Societal Trends

5. 5
Charging Ubiquity
Infrastructure Lag
Charging Posts
Trailing Cables
Vandalism
Challenges
Lack of Standards
Limited Range
Time to Charge
Ease of Charging
Benefits
Better energy economy
Non-polluting
Less noise
Clean Streets
EVs a Solution but with Barriers to Mass Adoption

6. 6
Charging impact on battery size or/and range

7. 7
• Wireless EV Charging for a better driver experience
• Simple, effortless & convenient
• Automatic hands-free charging
• No cord to unplug, or steal
• Unaffected by Water, Ice & Snow
• Simple to package on EVs
• Multiplicity of charging opportunities
• Charge little, often and everywhere
• Simple to Deploy, no street clutter
• Encourages intensive charging infrastructure
• Reduce battery size and EV cost
Interoperability is Key to Adoption and EV growth

8. 8
Complete System Solution

9. 9
Our Complete Solution – All in one
IPT Magnetics&
Power Electronics
Auxiliary: FOD, LOP,
Positioning
Communication
Regulatory Compliance
Standard
Application -
System integration

10. 10
Power Range
Output Power
Single Phase Single / Three Phase Three PhasePower Input
Vehicle Pad Size Small Small-Medium Large
Base Pad Size LargeMedium - LargeSmall - Medium
Each system is fully integrated into the vehicle
3.7 kW 7.4 kW 20+ kW

11. 11
Standardization

12. 12
Standards Overview
IEC (TC69)
International Electrotechnical
Commission
IEC 61980
 Qualcomm are involved in ISO and IEC to cover
both the infrastructure and the vehicle standardization
ISO (TC22/SC21)
International Standardization
Organization
ISO 19363
Vehicle Side
Infrastructure Side
SAE
SocietyofAutomotiveEngineers
SAEJ2954

13. 13
Interoperability – Key Factors

14. 14
Standardization Areas and Constraints
SAFETY CONSTRAINTS –
Thermal and RF
- Foreign Object Detection
- Living Object Protection
- Circuit protection layers
- System control
COEXISTENCE –
RF and EMC regulations
- Vehicle Systems
- Implantable Medical Devices
- Communication Services
PERFORMANCE
- Power Levels (3.7, 7.4, 22kW)
- Efficiency
- Air gap (absolute and range)
[Z1, Z2, Z3}
- Alignment tolerance
- Stationary, Semi-dynamic, Dynamic
INTEROPERABILTY REQUIREMENTS–
- Common Operating Frequency
- Magnetic interoperability between vehicle assembly (VA) and ground
assembly (GA)
- Vehicle to charger communications
- Default alignment mechanism
- Agreement on VA and GA positioning in parking bay

15. 15
Magnetic Designs

16. 16
Comparison of Pad Magnetic Architecture
Circular
+ Low field emissions
− Large diameter for z-gap
− Low x/y tolerance
Solenoid
− High emissions
− Shielding required
Solenoid
+ Good coupling
− High emissions
− Shielding required
Double D / DDQ
+ Low field emissions
+ High Coupling
+ Superior z- gap
+ Superior x/y tolerance
z
x
y
Actual flux path
Desired flux path
Intra-pad flux
Pole face
Ferrite
Flux Pipe
Leakage
Φip = Φab+ Φba
Coil a
Coil b
Φal
Φbl
Sections of coils contributing to Φip
Current flow direction
Pad length Px
Flux path height hz
Flux Pipe Length (Fl)
Return portion of coil b
y
x
z
DD
Quad

17. 17
Universal Base Pad

18. 18
Bi-polar Base Pad - Qualcomm Halo™ WEVC Magnetics
Interoperable with circular/square coil, solenoid and Double D secondary pads
• Low field emissions
• Good coupling
• High coupling
• Superior z- gap range
• Superior x/y tolerance
• Interoperability with single coil pads
Confidential and Proprietary – Qualcomm Technologies, Inc.

19. 19
Different Magnetic Pad Designs Must be Supported
Circular/Square Coil
Secondary Vehicle Pad
Bi-Polar Primary Base Pad
Double D & DD Quadrature
Secondary Vehicle Pads
Single Coil Solenoid
Secondary Vehicle Pad

20. 20
Test Conditions – 3.7 and 7.4 kW Pad Topologies
X Y
0 50 100 150
0
50
75
100
150
765x575mm
Circular (CR) Double D (DD)
Vehicle
Pad
Base
Pad
3.7kW@250x250mm
7.4kW@400x400mm
Bi-Polar
3.7kW@250x250mm
7.4kW@400x400mm
7.4kW@340x270mm
Solenoid (Sol)
3.7kW@250x250mm
7.4kW@400x400mm

21. 21
Test Result Summary
0
1
2
3
4
5
6
7
8
9
10
Power (0,0; meas) / W
Power (75,100; meas) / W
Power (100,150; meas) / W
Primary ampturns (100,
150; meas) / A
Efficiency magn. (0, 0; sim)
Efficiency system (0, 0;
meas)
EMF (0, 0; meas) / µT
EMF (100, 150; meas) / µT
Coupling (0, 0; sim)
Coupling (100, 150; sim)
Z1 max (DD250x250)
Z1 max (Sol250x250)
Z1 max (CC250x250)
3.7kW@Z1max=160mm 7.4kW@Z2min=160mm
40% smaller 7.4 kW Double D Vehicle Pad performs as well as larger Circular Vehicle Pad

22. 22
3.7 & 7.4 kW Magnetic Pad Options
About 40% reduction in DD pad size for same performance as Circular pad
3.7 kW: 250mm x 190mm 7.4 kW: 340mm x 270mm

23. 23
Semi dynamic and dynamic

24. 24
Evolution from Stationary to Semi and Dynamic
Stationary (*) Semi&Dynamic (**)
Frequency 85 kHz 85 kHz
Power Classes 3.7 / 7.4 / 22 kW 10/ 20 / 40 / 200 kW
Offset Tolerance (x/y) ±75 / ±100 mm Not relevant / ±200 mm
Magnetics (vehicle side)
…………
(*): Based on worldwide standardization
(**): Proposal for FABRIC project (currently, there are no standards specifying requirements for dynamic charging)

25. 25
Conclusions

26. 26
Bipolar base pad can fulfill requirements as interoperable solution for infrastructure
Future semi dynamic and dynamic systems should be interoperable with stationary solutions
The testing demonstrated that a single universal primary base pad could effectively transfer
power to different kinds of secondary vehicle pads, different power levels and different Z
heights.
It was possible to reduce the Double D Vehicle Pad size by more than 40% and still reach
better performance than the Circular VP
Conclusions

27. 27
Driving adoption
of new technologies
for EVs:
Qualcomm HALO WEVC
Enhancing
the connected
fan experience

28. 28
For more information on Qualcomm, visit us at:
www.qualcomm.com & www.qualcommhalo.com
Thank you
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