The document discusses advanced CFD modeling of various electronics cooling design options for air management. It analyzes a VME card configuration with dual PMC positions and a high-density memory daughter card. Various heat sink designs are modeled including a baseline aluminum design, an enhanced copper design, and a design using heat pipes. The CFD modeling shows the impact of the different designs on processor junction temperatures under different power and airflow scenarios.

1. ADVANCED
CFD
M
ODELING
ELECTRONICS
COOLING
DESIGN
OPTIONS
FOR
AIR
M
ANAGEM
ENT
Don Blanchet
3B Associates
02/01/2016

2. MODEL – VME CARD HIGH POWER PMC STUDY
Processor (s)
Heat sink
Air flow
30 watts
Total board Power = 130 watts
Optional
Heat spreader/
Stiffener
PMC position #2
PMC position #1

3. DUAL PMC CONFIGURATION WITH BASELINE HEAT SINK

4. DETAIL – HIGH DENSITY MEMORY DAUGHTER CARD
FPGA
Memory
assembly

5. BASELINE ALUMINUM HEAT SINK DESIGN

6. ALUMINUM HEAT SINK DESIGN – BOTTOM VIEW

7. ENHANCED HEAT SINK DESIGN - COPPER

8. ENHANCED HEAT SINK DESIGN COPPER – BOTTOM VIEW

9. DETAIL OF – PWB REMOVED – WITH HEAT SINK
FPGAFPGA
Baseline Heat sink

10. MECHANICAL DESIGN HEAT PIPE IMPLEMENTATION
Heat
spreaders
Heat Pipes
Processor
Heat sink

11. HEAT PIPE ENHANCED DESIGN
Main Processor
Heat sink
Heat Pipes integrated with main
Processor heat sink
FPGA

12. HEAT PIPE ENHANCED DESIGN – PMC PWB REMOVED
FPGA
Heat Pipes

13. HEAT PIPE ENHANCED DESIGN – PMC PWB REMOVED
FPGA
FPGA
Spreader

14. RESULTS – WITH BASELINE ALUMINUM HEAT SINK
Tj =85 C
40 C
Processors
Tj =78 C
Air flow

15. RESULTS – WITH BASELINE ALUMINUM HEAT SINK – MEMORY ARRAY
Processors
Tj =78 C
40 C

16. RESULTS – WITH ENHANCED COPPER HEAT SINK
40 C
Tj =80 C

17. RESULTS – WITH HEAT PIPES & SPREADER
Tj =78 C
40 C

18. RESULTS – BASELINE HEAT SINK DUAL PMC CONFIGURATION
40 C
Tj =85 C Tj =112 C Processors
Tj =92 C

19. RESULTS – BASELINE HEAT SINK DUAL HIGH POWER PMC
CONFIGURATION
40 C
Tj =90 C Tj =117 C Processors
Tj =93 C

20. RESULTS – BASELINE HEAT SINK DUAL PMC CONFIGURATION
MAX POWER = 22W PER PMC
40 C
Tj =78 C Tj =98 C

21. ENHANCED COPPER HEAT SINK DESIGN

22. BASELINE VS. ENHANCED HEAT SINK

23. BASELINE ALUMINUM VS. ENHANCED COPPER @ 25W EACH
Slot module air flow 20CFM 40C @ 10K feet
Tj =108 Tj =95

24. CFD TOOL – ORIGIN U.K.
The tool used has been customized for electronics cooling applications
over 20+ years.
Unfortunately it is lease only and VERY expensive $$$$$$$.
Looking forward to cloud rental options being more economical. ??