展望未來，竹科雖然已在完整紮實的聚落中建立了強近的創新優勢，卻也仍需持續克服無可迴避的嚴峻挑戰；這個挑戰的核心議題是：如何因應政府組織再造的架構中持續創新治理，從而使園區能以更大的開放、更包容的理性、更快的速度，支持聚落成員們推陳出新的突破，進而落實科技、生活、文化相調和的「台灣矽谷」。

3. 1
2
1. 3
1.1 4
1.2 6
1.3 10
1.4 12
1.5 13
1.6 14
1.7 15
2. 17
2.1 18
2.2 20
2.3 22
2.4 23
3. 25
3.1 27
3.2 32
3.3 33
3.4 34
3.5 37
3.6 38
3.7 39
3.8 42
3.9 45
3.10 48
4. 49
4.1 51
4.2 55
4.3 58
4.4 61
4.5 64
4.6 65
4.7 67
4.8 70
4.9 72
5. 75
30 78
GRI 94
Independent Assurance
Opinion Statement 100

4. 1
2010
2010 2010 1 1 12 31
2010
The Global
Reporting Initiative, GRI GRI G3.1
GRI G3.1
BSI GRI
GRI
GRI G3.1 B+ BSI
2011 12
2013 8
30016 2
03 577-3311 2330
03 579-8340
http://www.sipa.gov.tw/index.jsp

5. 2010 30
1980
30
30 477
136,548 2008
2010 11,869
8.7%
2 3 30
MEMS LED
4C
30
2

6. 1
3

7. 4
1 -1
1980 12 15
6 1,342
1980 9
2
223
1.
2.
3.
4.

8. 5

9. 1 -2
6
2010
477 13.7
2010 11,869
68% 8,008
2,439 2
3 762
351
223 52
1 -2-1
TFT
LCD
SiP
8
2013
2012
2010

10. 1 -2-2
7

11. 1 -2-3
5
6 5 3
357.77
123 74.43
106.94
51.29 39
2
22.28
5 2
349.75
100.49
12.3
2010
29.6
2010 9 8
3 8 . 1
24
2011 5
71 22
8

12. 1 -2-4
7
8
1
1973
5
6
3
4
60
300
9

13. 1 -3
10
1 -3-1
6
5
The Wharton
School of the University of Pennsylvania, USA
MBA
HTI High Technology
Industry

14. 1 -3-2 1 -3-3
2010
10 4 8
11

15. 1 -4
12
O n e - S t o p
Service
2010
46 1 1

16. 1 -5
03-577-2528
0 3 - 5 7 7 - 2 5 2 8
ethics@sipa.gov.tw
2010 6
2010
47
13
2010
76.2%
97.6%
34.4%
55.6%
11.6%
32.8%
2010
13
2010.10.20
2010.05.26

17. 14
2010
392
NBIA
2010 2 ISO 14001
3
2010 5
2010 8
ISO 27001
2010 8 ISO
27001
2010 12 Call Center
ISO 20000
ISO 20000
1 -6

18. 1 -7
15
/

19. 16

20. 2
17

21. 2 -1
2 -1-1
2010 223
115
82 26 119
104 53%
47%
2010 7
3%
18

22. 19
2 -1-2
2 -1-3
15 15 16
16
2 -1-4
2010 15 6
9 18 8%
1 1
50 59 38.9%

23. 2 -2
2 -2-1 2 -2-2
20

24. 2 -2-3
11
40 2 1
3,500 1
2
1 1
e-mail
2010 12
90 4
2 2
A B
1,200
10
124
2001
24
2 -2-4
2 -2-5
21

25. 22
2010.08.12
2 -3
2010 3
2010

26. 2 -4
2 -4-1
2 -4-2
2 -4-3
2010
ECFA
2
117
1,136
8
603
23

27. 2 -4-4
2010
7
2 -4-5
24
2010 11 ASPA

28. 3
25

29. 26
2010
20
35
% 175%
2010 35
250.9 175%
IC LED
9,360
11,869
% 127%
2010 11,869 2009 8,835
34.3%
75
78.33
2010 438 411
78.33 2009 2010
0.81
2.05 2009
76.54 2010 78.59
2.47 2009 77.74 2010 80.21
2 2008
75.29 2009 77.52
8
12
% 150%
8 88.1
SPE Solid Polymer Electrolyte MEA
4
10.8

30. 3 -1
3 -1-1 2010
Bio Taiwan 2010
5
2010 12
2011
27
2010
Bio Taiwan 2010

31. 3 -1-2
2010 20
2010 5
2010
6
9
AURP
UOP
PCTEL 3M Medtronics Vidasym
11
20 11
2010 MIPIM ASIA
2010 35
250.9
28
Medtronics
2010
23 116.3 421
4 42.8 39
2 55 8
3 5.8 4
3 31 5
35 250.9 477
AURP
PCTEL Mr.
Tony Kobrinetz Mr. Rod
Bothwell Mr. James C.
Giacobazzi Mr. Brandon Johnson
2010

32. 3 -1-3
30
Cluster
2010
IC
Fabless
LED
29

33. 3 -1-4
68%
IC
3C
LED
LED
LED
LED
10
2010
55 762
30

34. LED
IC TFT-LCD LED
Solar
FDA
31

35. 2010 136,548
2009 4,387
2008
2010 3 13 7 10
2010
37 50 4,500
10,000 9,500
3 -2
32
2010

36. IASP AURP
ASPA
13 24
2003
7
3,549 2010 30
4
2010 12,700
ASPA
5
ASPA
30
2-3
IASP
AURP
ASPA
3 -3
33
10
FAIS
2010.11.25 Eindhoven

37. 3 -4-1
1986
2007
2009
733 15.82
46.17 61.99
25.52%
1986 2009
240 5.74 24.72
166 2.87 11.21
127 2.54 10.15
95 2.43 9.21
48 1.04 3.25
57 1.2 3.45
733 15.82 61.99
3 -4-2
2008
4.5 2009
2009
5 2010 4
2009 10 2010 9
291
95 61
2.87 868
307
15 24.6%
18 29.5%
10 16.4%
8 13.1%
7 11.5%
3 4.9%
61 100.0%
3 -4
34
2010.11.10

38. 3 -4-3
2010
30
2010 33
1.42
538
197
3 -4-4
2010
5,102
2010
70 4,596
9 27.3%
7 21.2%
5 15.2%
5 15.2%
4 12.1%
3 9.0%
33 100.0%
http://e-learning.sipa.gov.tw/edu/
35
2010
20 6 560 405
16 6 591 399
20 5 843 693
17 10 556 451
12 2 488 235
8 1 361 207
107 1,023 250
3 1 353 94
3 2 327 61
70 4,596 210
9,698 3,005

39. 3 -4-5
2005
2010
18 1,160
36
2010
cGMP CMC 667,350
800,000
850,000
500,000
875,100
865,000
650,000
600,000
190,000
Linux 804,500
193,300
RFID 800,000
600,000
725,000
661,250
500,000
720,000
598,500
11,600,000

40. 3 -5
3 -5-1
1985
50
2010 273 2010 11
550
3 -5-2
2003
2010 21
2010 5
250 8
37
8
2010
MT7110 WiMAX
3D
7 RTL8367M
38GHz
ZEV
DSP
Getac V100

41. 3 -6-1
30
2010 66
46 20
3 -6-2
2010
8
800 460
540
3 -6
38
2010.05.26 99
2010.08.05 99

42. 3 -7-1
1980 9
2007 8 23 9
2010
www.gov.tw
5
3 1
e-mail
12
3 e-mail
ISO 20000
3 -7
39

43. 3 -7-2
e
G2B
2010 86.52
2010 6 30
38
10
2011
40
e
24

44. 3 -7-3
2010
2,350
425
392
IC 59
8 2
2010
500
3 -7-4
88.8%
SOC
40 2
27 7
3 2
1,200
NBIA
S o f t - L a n d i n g
Incubation Center 2010 12 8
2011 1 1
3 -7-5
2010
78.33
2 2008 75.29 2009
77.52
571
41
NBIA

45. 3 -8
3 -8-1
2005 2007
3
6,000 9,000
10,000
3 -8-2
2007 2010
400
42

46. 3 -8-3
2010
1,046
3 -8-4
2010
3,870
2,655 CO2e
43

47. 3 -8-5
2009
5.82
2007
2010
20
2
44

48. 3 -9
3 -9-1
1983 8
1 102
2,900
3 -9-2
45

49. 46
2010.06.19
2010.12.21
2010.12.16
3 -9-3
2010
2010
3 -9-4

50. 3 -9-5
3,178
4
2,205
411
3 -9-6
2010
3,402
4,158
47

51. 3 -10
75%
48

52. 4
49

53. 50

54. 4 -1
4 -1-1
2010 1.07
2007 2007
1.49 2010 2007 28%
2010 8,831 2007 11,975
2007
2010 2007 26%
2010 9.49 2007 22.83
2007
2010 2007 58%
2010 8.58
2009 11.66 2007
2010 2009 26%
51

55. 4 -1-2
2010 8,380
2009 7,202 16%
2009 0.82 2010
0.71
13.1 2.1
2010
1,195 2009 1,039 2010
2009 15%
2009 0.12 2010 0.10
52

56. 4 -1-3
2010
4 -1-4
160,001 CMD
13,636 CMD
185,000 CMD 24,999 CMD
43,000
CMD 60,000
CMD 56,500 CMD
13,500 CMD
53
2010 12
338.00 103.72 12.97 168.00 0.37 0.04
631.80 73.60 11.32 257.00 25.93 0.35
1,101.00 262.15 17.48 449.00 17.50 0.78
351.00 168.67 71.09 172.00 10.62 0.32
135.00 28.04 1.19 50.00 22.74 0.13
428.00 117.63 13.58 145.00 1.83 0.87
4,613.40 187.90 49.81 3,075.00 10.88 1.98
1,500.00 764.65 168.38 1,012.00 372.60 51.33
-- -- -- 1,246.00 24.99 3.20

57. 4 -1-5
31
2 0 1 0
110,591
37,551 148,142
4 -1-6
1 2
3
2010
721.3 CO2e 90%
3.23
54

58. 4 -2-1
2010
2010
4 -2-2
2010
2010
2010 7
3
4 -2
55
184 Leq

59. 4 -2-3
2010
2010
4 -2-4
2010
2010
2010
56

60. 4 -2-5
7 9
17 20 A C
2010 5 1 2
A B 2010 6
3 B
A
57

61. 1992
1997 2005
4 -3-1
1995
69kV 161kV
22.8kV
4 -3-2
2008 6 5
2 2015 2005
20% 2050 2000
50% 2010
99
15 33,083
CO2e
4 -3
58

62. 4 -3-4
2010
1,023
26 28
LED
20
20 25
40 55%
2
2
4
1 2008
4 -3-3
2010 5
59
2010.10.14

63. 300W
1/2
29
161
521 CO2e
50KW
26 28
2010 5
60

64. 4 -4-1
2010
788 284
4 -4-2
1980
1986
2002 3
2004
20,000 CMD 2006
185,000
CMD
105,000
CMD 100%
1,650 mm
4 -4
61

65. 60,000 CMD
20,000 CMD
40,000 CMD 2003
2,308 CMD
2010 18,858 CMD
8
5,975m
1,200mm 1,650mm
2010
SS 3.8 9.9 mg/L 8.1
mg/L 30 mg/L COD
11.9 39.8 mg/L 30.8 mg/L
100 mg/L BOD5
3.8 14.8 mg/L 11.9 mg/L
30 mg/L
5 2010
61
3
2010
2000 3
ISO 14001
2001
DNV ISO 14001
ISO 14001
ISO 14001
62 2010 COD

66. 4 -4-3
0.8
2.5
2010
2,865 349
15,463
1,380 52
2,467
4 -4-4
2
63

67. 4 -5-1
2 0 1 0
110,591 91,518
82.8% 2010
37,551 26,996
71.9%
148
70% 5
19% 67 8%
2004 2010 2004
2008 2008
2009
2010
2010 82.8
2004 103,967 54.1%
2005 108,894 57.4%
2006 113,049 68.3%
2007 114,925 70.2%
2008 129,923 70.9%
2009 87,551 82.1%
2010 110,591 82.8%
4 -5-2
2004 2010
105 96
9 2010
32 30 2
4 -5-3
1
2
4 -5
64

68. 4 -6-1
2010
2010 3
4 -6-2
2010
3 30 4 8 31
4 -6
65
2010.04.29
2010.03.30
11 17
3 29 30
4 8 4 20 4 27 4
29
9 13 16
15 17 2010

69. 4 -6-3
24
33
2010
10 4
24
209
23 2010 95
2011
66
24

70. 4 -7
67
1979 1986
13.1 2.1
4 -7-1 1 2 3 1999
85%
70% 70% 2005
3
F12P4

71. 4 -7-2
1995
2002
111 7,757
4 -7-3
2010 99
10
69.6
CO2 144.1
4 -7-4
68

72. 30 M3
8,500 M
3
3,000 M
3
3,000 M
3
100 M
3
69

73. 1%
2004
2010
2011-2016
2011-2016
EEWH_EC
4 -8
70
m2
479.49
51,212.9
4,239.68
2010

74. CMP 2007
F12P4 12
EEWH LEED
CMP
71
EEWH LEED
F12P4
LEED

75. 2010
4 -9
72

76. 1,500
73

77. 30
74

78. 2011
1.
2.
1. 4C
2.
1.
2.
1.
2.
75
5

79. 76

80. 77

81. 78
30
1973.6.12-1981.3
9.2
1491 3.15 1.20 210
12.26
7.27
1976 1977 1978 1979

82. 79
9.1
12.15 6.19
1980 1981
5.27
8.2
8.26 14 7 :
9. 1 1 7,000
1.20
1.23
VD-MOS

83. 80
30
2.11
8.1
9.5
1982 1983
1.10 7 4
2.9
3.5 -MICE
ELECTRONIC PRODUCTS 1981
4.15 2 8
3.31
6.30
DSD-E(DC SERVO MOTOR DRIVER) E
8.9
8.15 8 IC
9.8
10.14 16

84. 81
6.15 8.30
1984 1985 1986
8.1 2 16K SRAM
VLSI
VLSI
11.1
DCS 570 16
11.22 1.5
CMOS
64K DRAM
VLSI
12.31 MS-200
12.31
4.10 1.5
256K CMOS DRAM
7.16
1.30
3.20
6.5
12.1 IBM 32
12.31
7

85. 82
30
7.23
16
9.1 11.14
1987 1988 1989
2.15 5ESS
2.21
7.15
8.26 Intel
CPU
9.1 Multitech
Acer
4.1 IC
7.27
11.14
12.31
6.15
TCS-LITE
9.15 6
9.18 TI
DRAM
10.5
12.31 128 mm
GS-600/200 dpi Working
Sample 800 dpi
GS-780 SCSI BOX
MAC ScanLink Working Sample
12.31 100

86. 83
6.15 6.21 526 11.1 IC/DV
1990 1991
3.15 CMOS SRAM
5.10 0.6 Class 1 VLSI
7.15
TFT-LCD 4
12.1
12.31
2.20
7.15 1.2
9.10
9.15 PORTABLE SCSI CARD
10.14 CPU
ChipUp Technology
10.21 V.32 bis 14400bps
11.15 4 MB DRAM
12.1

87. 84
30
3.12 Tours
12.1
12.16 British Columbia, Canada
1992 1993
1.20 IC
2.15
4.22
8.15 DSP
10.15 4 0 0 4 M b I C F l a s h
Memory
11.1 19,200bps
11.12
U-1496
11.30 8
8
11.30 Fujitsu ODM
ODM
4.15 TFT-LCD 4 TFT-LCD
5.15 16 MB DRAM
6.15 0.8 0.6
9.20 10
12.31 330
12.31 1,000 13

88. 85
7.6 88
7.15 ATM
NII
10.23 Sophia Antipolise
11.22
1994 1995
3.15 IC(MPEG)
5.2
6.30
9.26 8 8
12.5
10
12.20
1.1
1.1 I S D N
5.1 1,000
9.1 8 8
7-9 11 IC
11.15 64 MB DRAM
5-12 8
8

89. 86
30
1.20
7.23
6.6 Tri-City Technology Park
10.2 San Jose City
1996 1997
1.15 0.35
2.9
3.5 Intel IBM
5.11 NAS-
DAQ
6.18 500 Acer Basic
6.20 3 PDP
9.15 ISO9002 IC
9.15 ISDN
9.15 PPP/MP NAT
11.9 ISDN NT1 ISDN
NT1
11.26 TSIA
12.11
12.31 200
2.15 PBGA
Substrate
3.15 SUA Single User Account
4.17 64M DRAM 8 0.35
6.15
6.15 16MB SGRAM
10.3 0.25
11.1
11.26 CamPrint
12.31 4,000

90. 87
2.24
7.6 Mjardevi
Science Park
6.30 118 7 25
12.1
6.30 Ansan
Techno-Park)
10.11 California State
University
12.11-15 20
1998 1999 2000
3.15 VPN Virtual
Private Network
Prestige 128
Prestige 100MH
6.15 3 5 0 K
SPCA500 0.35 m
DSC IC
7.31 19
17
10.30 0.25
12.31 5,000
12.31
4.15 3.5 TFT-LCD 3
42"PDP CeBIT
9.21 729 921
100
10.15
12.12 12
12.15
0.175 256M DRAM
12.31 6,509 43%
1.3
3.15
Base Internet Phone Box
3.16 0.15
DNV
OHSAS 18001
3.22
5.12 0.13
IC
6.13
2001 9
6.15

91. 88
30
1.20
3.16
4.16 ISO 14001
7.17
10.17
3.19
4.22
5.1
9.3
2001 2002
2.25 LTPS LCD
3.13
7.9 : ABW Acer Benq Wistron
Acer Wistron
7.31 7 CRT
8.23 12
9.3
11.15
3.24 8
6.15 SIP
12.8

92. 89
2003 2004 2005
1.17
2.14
3.28
1.28
5.15
8.26
Sandia Science & Tech. Park the
Science & Tech Park at the Univ.of New
Mexico the Arrowhead Science Park
12.2
12.15
1.21
1.31 34
18
5.23
9.1
IASP
12.14 25
6.8
Low-K IBM
7.1
2003
7
9.15 8
10.22
2004 cGMP
11.14
Contract Manufacturing Organization
CMO
12.22
2.26 IC
4.8 3 12 8
12
4.30
12.30
1.26 32 LCD
3.1 12
6.15
LED UV LED LED
LED
LED
7.1 IBM TFT Array 170
8.26 IEEE

93. 90
30
6.30
10.2
10.3 1 324B
1.5 3
4.19 Asian Science Park Association - ASPA
8.23
12.12 e
2006 2007
7.31 7.5 42 TV
8.25 IC
9.26
LED
10.1
11.13 15%
12.28 18.5 2.6
PBDS 49% PLDS
1.8 WiMAX
Alvarion WiMAX
1.8 12 50
5.3 1 2007 10%
10.2 InvenSense
10.26

94. 91
3.6
5.14 23
5.20
10.25
12.11 2009 SIPP
SIPP
2008
4.7 IC 20%
4.15 ODM 10% GPS DSC
4.21 Foundry 2.0 Foundry
Intel
7.15 cGMP CARBAPENEM
8.13 700-800 MWp
10
8.24
8.29
9.15 Oualcomm Mirasol
12.1
12.15 World Economic Forum 2009

95. 92
30
2009
2.9 Amazon kindIe 2 E-Ink6
6.2 E-Ink
SONY eBOOK
READER Amazon Kindle
6.15
FDA 11
12
8.4 3 2
9.24
DRAM
9.29 IMEC SEMATECH
10.15 2011
36 /
10.16
TEL
10.29
10.29
11.9
11.10 LED
11.20
3 1
12.1 Edge-Core
12.3
12.10 64
20%
12.26
Gold Bumping
COF 57% 36%
1.9
3
83 105
1.22
1.23
2.18 2007
5.17
7.11 2009
32 2,200
2
10.2
10.15
11.25 2009 ASPA
IASP
18 300
12.30
AEO
12.31 31

96. 93
2010
1.8 28 2012 22
22
3.30 Multi-Finger
Elan ITC
Apple,Inc.)
4.28
6.17 Stion ClGS
VentureTech Alliance 21%
6.18
6.18
8.20 20
9.1 STB
9.6 GMP
9.21 LED Toyoda Gosei
1.1
1/4
3.10
3.13 2010 38
4,500
7.10 2010 50
1
7.19 31

97. 94
GRI Global Reporting Initiative G3.1

98. 95

99. 96
GRI Global Reporting Initiative G3.1

100. 97

101. 98
GRI Global Reporting Initiative G3.1

102. 99

103. 100
Independent Assurance Opinion Statement

104. 2010
30016 2
03-5773311
03-5776222
http://www.sipa.gov.tw
100 12 2011.12