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Position Applied Mechanical Engineer
Name
Tel
E-mail
Date of Birth
Education
Language
楊居政, Yang, Chu-Cheng
+886 934060375(Taiwan)
+86 15995677433 (China)
mk_young@msn.com
1981/07/29
National Tsing Hua University, Taiwan
Master of Power Mechanical Engineering 2003/09~2005/07
Tangkang University, Taiwan
Bachelor of Aerospace Engineering 1999/09~2003/06
Fluent in Chinese
Average in English
Computer skill Pro-E, AutoCAD
Certifications N/A
Summary
About 9 years Mechanical design experience for Electric products.
2 years handheld product design experience.
7 years Notebook product design experience.
Promoted to Project Leader for V580/B580 mechanical project leader.(2011/04).
Good communication ability able to work independently or as a team.
RFI (request for information) stage. According to customer request to purpose
information to customer. (form factor, stacking, key component assessment). Try to
meet requirements of customer.
RFQ (request for quotation) stage. in the stage, we provide mechanical RFQ proposal
to customer.
Form factor.
Material information
2. Placement.
Key component assessment.
X, Y, Z stacking.
Weight analysis
Assembly method.
Risk assessment.
Reliability analysis
ID analysis. (ID shape, parting line, hinge design, bottom design, screw
position…etc).
Suggestion of special request.
Project Detail design:
MB placement design.
Component position fix.
Lead team member to design the structure of housing.(3d drawing design)
Tolerance analysis.
Tooling review.
Mock up review and debug.
2d drawing design.
Make BOM list.
Pilot run stage:
Tooling try out.
Dimension and deformation analysis.
Tolerance review.
Pilot run casing and review.
Mechanical testing.
Debug(overview issue, structure issue, operation issue, assembly issue, testing
issue, and customer request…etc)
MP stage:
Maintain MP casing.
Lesson learn and overall review.
Handover with plant.
Mechanical patent research. (patent filing)
Work Experience
2007/4~Present Wistron Corp.
Mechanical Design Engineer
Notebook mechanical design Project Leader
3. Company Product
ODM manufacturing.
Supplying information and Communication Technology Product.
Responsibilities
Take responsibilities on ODM project with Notebook product.(Lenovo)
Achievements
WISTRON 銀質特別獎- Lily LAB57 Team(2011)
Patent (Taiwan)
1, 固定座及其與電子裝置的組合 (patent number: M341387)
2, 易於組裝之可攜式電腦裝置 PORTABLE COMPUTER WITH EASY
ASSEMBLY (patent number: 201115303)
Patants.
1,Click to edit patent title 腳墊機構及具有腳墊機構的可攜式
電子裝置(台灣、中國, 2013)
2, SPEAKER MODULE AND RELATED ELECTRONIC DEVICE(U.S.,
Taiwan, 2015)
3, PORTABLE ELECTRONIC DEVICE AND BATTERY FIXING
MECHANISM(U.S., Taiwan, China, 2015)
4, Holder, and assembly of the holder and an electronic device(U.S.,
Taiwan, China, 2011)
4. Product
Medion GoPal X5535, P5435 and P5235 SERIES
Medion’s personal navigation devices (PNDs),including GoPal P5235, P5435 and X5535. All the three
navigators utilize AuthenTec’s small form factor AES1510 fingerprint sensor for user identification.
GoPal P5235 - 5-inch touchscreen display, live traffic info and speech recognition.
GoPal P5435 - 5-inch touchscreen display, live traffic info, speech recognition and BT.
GoPal X5535 - 5-inch touchscreen display, live traffic info, speech recognition, BT and gyrometer
5. LENOVO IdeaPad V360 2010/4
13.3” Notebook, Metal housing design。
Lenovo commercial notebook
Using metel housing on A,C cover.
6. LENOVO IdeaPad V570/B570 2011/1
15.6” Notebook.
V570 is commercial notebook by Lenovo(China)
B570 is cost down version.(all material is plastic)
10. LENOVO IdeaPad Flex 2 Pro-15 2014/10
15.6” Notebook.
Lenovo ultrabook for best buy(t = 19.9mm)
Hinge is 300 degree design
Touch notebook, OGS + directing bonding touch glass.
All metal housing design
Lan connector door design(keep id shape without bump)
