Lau Wan Hui is a 34-year-old Malaysian citizen seeking a new position. He has over 10 years of experience in semiconductor testing and engineering. Currently he is a Senior Staff Product Test Engineer at NXP Semiconductor Malaysia, where he leads a team and has received recognition for test improvement projects. Previously he worked at STATSChipPac Malaysia and ON Semiconductor Malaysia in testing and maintenance roles. He has a B.Eng in Communication & Electronic Engineering and is proficient in English, Malay, and Mandarin.

1. RESUME
PERSONAL PARTICULARS
Name : Lau Wan Hui
Mailing Address : No.22, Jalan Oasis 2, Taman Oasis, Cheras Utama, 56000 Kuala Lumpur
Contact Numbers : 012-9918283
E-mail : wanhui.lau@hotmail.com
Age : 34
Gender : Male
Race : Chinese
Nationality : Malaysian
NRIC No. : 820410-05-5447
Date of Birth : 10th
April 1982
EDUCATION QUALIFICATION
1. B. Eng (Hons) Communication & Electronic Engineering
Name of Institution : UCSI University
Field of Study : Engineering Studies
Major : Communication & Electronic Engineering
Graduation Date : 2009
2. Diploma in Communication & Electronic Engineering
Name of Institution : TAFE College Seremban
Major : Communication & Electronic Engineering
3. Sijil Pelajaran Malaysia (SPM)
Name of Institution : SM Methodist (ACS) Seremban
Field of Study : Science Studies

2. EMPLOYMENT
Current:
Company Name : NXP Semiconductor Malaysia, formerly Philip Semiconductor
Position : Senior Staff Product Test Engineer / Section Head of Product Test group / Project
Engineer
Department : Central Process Engineering, BackEnd Final Test Department
Date joined : 25 March 2013 till current
Position/Level : Senior Engineer (25Mar2013 till 2Jun2014)
Staff Engineer (2Jun2014 till Sept2015)
Senior Staff Engineer (Oct2015 till current)
Current base salary : RM8961 per month
Job Description and Specialization
 Main task was to handle daily production testing issue, lot on hold disposition & test program
debugging which causing low yield during product testing.
 Expertise in yield analysis, by determining product related, test equipment and test program
issues.
 Lead a group consist of 4 product test engineers and 23 technicians as Product Test section head.
 Lead of test yield improvement that work on test program improvement to reduce contact losses,
developing parallel testing (for dual-dies products) for SOT363 devices and 3leads test programs
using UParset tester platform to improve test time reduction/UPH/yield.
 Close work with Innovation team for new product releases, test program development, yield
analysis and report compilation.
 Successfully support the transferring of PowerMOS product in LFPak SOT669 package from
NXP Philippine plant to Malaysia, currently on ramping up mode.
 Successfully developed IPA pre-test cleaning project for SOT363 which resulting in 2.3% of final
test yield improvement and gained about 2% in overall package SO1 (operation first pass) yield.
Currently working to proliferate on remaining plant major packages.
 Worked with supplier in designed vacuum suction cup on Ismeca & ASM FT-Mini test handlers
for collecting UTD (untested dies) as part of plant yield improvement.
Awards & Recognitions :
1) GM Recognition for “Parallel testing methodology for test time reduction, improve UPH and saved annual
Capex of USD460K”
2) GM Recognition for “Kelvin yield improvement for modifying test programs for plant wide devices with
extra retest”
3) GM Recognition for “Colour coding implementation and error proof to prevent swap test head, improve
quality”
4) GM Recognition for “Extra effort to support Micropak RFSS products delivery and quality to key customer
of NXP”

3. ==================================================================================
Previous 1:
Company Name : STATSChipPac Malaysia
Position : Staff Engineer, Product Test Engineering
Department : IC Test Engineering Department
Last Basic Salary : RM5500 per month
Position/Level : Engineer II – fresh entry (June2009 till August2010)
Engineer I (August2010 till April2011)
Senior Engineer (April2011 till Aug2012)
Staff Engineer (Sept2012 till Mar2013)
Job Description and Specialization
 Worked as Test Improvement and Product Engineering team lead.
 Lead the engineering team to work on test improvement on highly demanded products, solving
testing issue to increase productivity.
 Capable of doing data crunching and analysis in view to improve test yield (first pass yield) and
QA screen issue.
 Able to work on test program (mainly Visual C++) and test hardware debugging.
 Flexible to work on both Eagle ETS364 and Teradyne Flex testers (Integra and Micro).
 Participated in Customer Quality Incident (CQI) as well as 8D report writing.
 Understand tester resources and capable to do tester diagnostic, calibration and troubleshooting
(ETS364 and Flex testers)
==================================================================================
Previous 2:
Company Name : ON Semiconductor Malaysia
Position : Maintenance (Shift technician)
Department : ISMF, Wafer Fabrication
Date Joined : July 2004 till August 2006
Job Description and Specialization
 Process the knowledge of maintaining, servicing and electrical/electronic troubleshoot on Varian’s
160XP (high current), 300XP and 350D Ion Implanters.
 Also worked on wafer laser marker, oxide thickness measurement equipments.
 Capable of doing both scheduled/unscheduled equipment issues eg preventive maintenance and
major equipment hard-down.
PERSONAL TRAITS
 Fast learner, adapts easily to condition changes
 Able to work independently with minimum supervision
 Analytical mind, competent in problem solving skill
 Able to lead a team on project and technical report writing
 Good teamwork, capable to communicate and work well with other teams
 Willing to take extra steps and continuously strive for self improvement

4.  Self-driven to complete tasks ahead of schedule
 Result oriented and able to lead/drive team to achieve goal
Communication Skill
 Written : English, Bahasa Melayu and Mandarin
 Spoke : English, Bahasa Melayu and Mandarin
SALARY
Current Monthly Salary : RM8961
Expected New Monthly Salary : RM11,000 (negotiable)
REFERENCE
1. Mr. Hew Wei Kong
Deputy Director of IC Test Operation
IC Test Department
STATSChipPAC Malaysia
Tel : 012-2022490
2. Mr. Prembaj Janardanan
Former VP of IC Test Dept. and General Manager
STATSChipPAC Malaysia
Tel : 012-3311719
3. Mr Gan Chee Kiat
Section Test Manager
Backend Final Test Department
NXP Semiconductor Malaysia, formerly Philips Semiconductor
Tel : 012-2869066