Final RP Paper

Examining the Behavior of Epoxy Filler Composites
A Research Paper
Presented to the
Science Department
Eleanor Roosevelt High School
In Partial Fulfillment
Of the Requirements for
Research Practicum
By
Amir Baiyina
May, 2013

Abstract: Examining the Behavior of Epoxy Filler Composites
Amir Baiyina May, 2013
Epoxy is a widely used potting material in electronics. With the technology era
evolving, this material is a necessity for electronic components to be efficiently used and
examined. Protection is important to both the developers and the consumers.
In this current experiment, the curing behavior of Allied High Tech Products, Inc.
Epoxy was tested at various distributions using glass filler. Strain and temperature change
were the primary variables being tested in order to determine which distribution yielded
the most suitable environment for a sample of silicon. The three trial groups comprised:
no filler, 30% filler, and 50% filler. In order to formulate the epoxy, a resin and hardener
were combined and stirred uniformly for each filler distribution. The strain and
temperature were measured using strain gauges and thermocouples. The results showed
that as the filler distribution increased, there was an apparent decrease in strain and
temperature change.
i

Acknowledgements
I would like to give special thanks to CALCE and UMD for the internship
opportunity. To Bhanu Sood, I would like to humbly thank you for your great patience
and guidance throughout this past year. For finding an awesome, interesting project, I am
appreciative. I also give many thanks to Swapnesh Patel for his unwavering willingness
to always lend a helping hand with my project whenever it was needed. In addition, I
thank Giovanni Flores for taking me under his wing and familiarizing me with the lab
equipment. I give great thanks to the entire CALCE family.
ii

Biographical Outline
Personal Data:
Name: Amir I. Baiyina
Date of Birth: January 31, 1995
Place of Birth: Cheverly, MD
City of Residence: Greenbelt, MD
College Attending: University of Pennsylvania, The Wharton School of Business
Major: Finance, Economics
Academic Achievements:
• Cumulative GPA: 4.0+
• ERHS Science Fair Third Place, Chemistry
• AP Scholar with Honor
Activities:
• National Honor Society
• Spanish Honor Society
• Varsity Basketball Team
• Dem’ Raider Boyz Step Team
• Our Town Lead Actor
• Coffee House Performer, Vocalist
iii

Table of Contents
Abstract.................................................................................................................................i
Acknowledgements..............................................................................................................ii
Biographical Outline...........................................................................................................iii
List of Tables and Figures....................................................................................................v
Chapter One.........................................................................................................................1
Chapter Two.........................................................................................................................5
Chapter Three.....................................................................................................................13
Chapter Four......................................................................................................................16
Chapter Five.......................................................................................................................22
References..........................................................................................................................25
Appendix............................................................................................................................27
iv

Chapter One
The Problem and Its Setting
Introduction to the Problem
Epoxy (polyepoxide) is a staple in the world of modern technology. It is typically
molded and used to protect vital circuits and chips that control operation. Protection of
the motherboard can lead to a longer life for the electronic. With technology’s evolution,
people have become accustomed to instant gratification. Additionally, functionality and
durability are critical to electronics’ success in the market. Because of this great demand,
it is essential that the hardware responsible for electronics existence is protected.
Being that epoxy is a “thermosetting polymer,” it can be cured. There are two
common epoxies: the one-part and the two-part. One-part epoxies are usually cured when
the resin (epoxide) is put under certain temperature conditions (usually high), which
activate an internal chemical reaction. Contrarily, two-part epoxies can usually be cured
at room temperature by means of mixing the resin with a hardener. Electronics
experience various stresses and perform under different conditions throughout its
lifetime. Therefore, the hardware must be able handle these situations. (May, 1973)
Statement of the Problem
The purpose of this experiment is to determine which epoxy filler composite
produces the most effective molds while maintaining optimum performance for the
component. Three different filler distributions will be tested: no filler, 30% filler, and

50% filler. A silicon substrate will serve as the component that is being molded.
2

Hypothesis
If filler distribution affects the strain and temperature during an epoxy’s cure, then
higher filler distributions will yield lower strain and temperature changes and provide the
most appealing environment for the silicon substrate.
Variables and Limitations
Independent variables.
1. Allied High Tech Products, Inc. Epoxy
a. Epoxy Resin
b. Epoxy Hardener
2. Glass filler: two size distributions
a. 30% filler
b. 50% filler
Dependent variables.
1. Temperature
2. Strain/Pressure
Control treatments.
1. No filler
Regulated conditions.
1. Size of fillers
2. Filler type
3. Number of epoxy combinations: 3
4. Use of the same strain and temperature gauges.
3

Research was conducted in the Center for Advanced Life Cycle Engineering
(CALCE) at the University of Maryland in College Park, MD under the supervision of
Bhanu Sood.
Limitations.
1. Not being able to control the consistencies of the various epoxy brands
and filler types.
Assumptions
1. The strain and temperature gauges are fully functional and working properly.
2. Epoxy and filler measurements are exact throughout the experiment.
3. The curing process will not be affected by any outside sources.
Statistical Analysis
In order to accumulate statistics, a t-test will be performed on the strain and
temperature data collected throughout the experiment. The p-value recovered from the t-
tests will determine if the following tests wither accepted or rejected the null hypothesis.
Definition of Terms and Abbreviations
1. Curing: the toughening or hardening of a polymer material by cross-linking
polymer chains - chemical additives, ultraviolet radiation, electron beam or heat.
2. Epoxy: a thermosetting polymer that reacts with itself or something else in
order to create a solid mold.
3. Thermosetting polymer: polymer material that irreversibly cures.
4

Chapter Two
The Review of the Related Literature
Introduction
Computers have undoubtedly proven their worth in the modern world, especially
within the last decade. Several major societies’ fast paced operations have become
particularly dependent on the use of these devices. In the digital age, computers are
critical to everyday devices such as automobiles, cell phones, and portable tablets. The
compactness of modern computers has made that possible.
Also, the presence of these products allows for work to get done effectively and
efficiently. However, computers were not always so convenient. The first computer,
ENIAC (Electrical Numerical Integrator and Calculator), occupied a gigantic room. In
the 1950’s, there were two devices that evolved the computer: the transistor and the
vacuum tube. Now, the majority of society carries around compact cell phones that have
a plethora of capabilities. Within a great number of these devices, epoxy resins play a
vital role in maintaining their operation. (Augarten, 1984)
Motherboards and their Significance
A motherboard is the major circuit board found internally within electronics.
There are various optical drives and disks that are connected to interfaces located on the
board. Essentially, it is the nervous system of the computer. Motherboards come in
different sizes or footprints which have direct impacts on the type of system that the

board is able to fit into. It is very important that the motherboard has an adequate source
of power for operation and that this power source has proper connections.
The Central Processing Unit (CPU), Random Access Memory (RAM), and
various disk or optical drives are all plugged into interfaces on a motherboard. Again,
when all these devices are connected, the overall computer is able to operate. Without
motherboards, the world of technology would not be where it is today. These critical
components have allowed for electronics to operate at high levels and speeds and because
of its presence technology continuously evolves. (R., K., 2012)
Thermosetting Polymers and Epoxy
Thermosetting polymers are known to release a significant heat of reaction during
processing. This chemical reaction that occurs during the curing of these polymers has a
great effect on the modeling of thermoset composites. It is vital to include an accurate
cure kinetic model in the process of thermoset composites. The differential scanning
calorimeter is an experimental tool for thermal analysis that is used all over primarily for
detecting any heat that flows from samples. It provides information on heat that is either
generated or absorbed from the samples as either a function of time or maybe even
temperature. (Kamal, 1973)
Based on experiments that were conducted, the glass transition temperature of the
100%-cured prepeg was found to be 199 degrees Celsius. Also, the presence of fibers
appeared to increase the prepeg’s temperature just slightly over that of the neat epoxy.
The AS4 fibers played little to no role in the curing behavior as well. The doubled staged
cure kinetics model that was isothermally-based accurately predicted the total energy that
was released and also the degree of the cure for similar scans. This experimentation is
6

important in the real world because technology drives the modern generation. Therefore,
companies seek to create the best products and part of getting the best product is being
able to engineer something that will work under a variety of conditions and last. That is
where epoxy becomes a major factor. (May, 1973)
Applications of Copolymers and Epoxy
Epoxy resins are a staple in the world of thermosetting polymers and are widely
used for numerous situations because of their great electrical and mechanical properties.
They have great resistance to water heat and chemicals. Tests were conducted to try and
explore the curing properties of a commercial epoxy resin after the addition of a SG
copolymer. The spectra of the commercial epoxy will be recorded using a Bruker AC200
and the molecular weight of the SG copolymer was determined by gel permeation. There
are no human subjects, only epoxy and other chemicals are being tested. The samples
were prepared through mixing and the mixture was then degassed in a vacuum. These
samples were pre-cured at 140 degrees Celsius for one hour and then cured at 160
degrees Celsius for four hours. The results clearly indicated that the hydrosilyation
reaction was successful. The results also showed that the addition of the SG copolymer to
the epoxy resin increased the mobility of the crosslinked network and therefore increases
the thermal stability. Dynamic mechanical thermal analysis (DMA) was the analytic
technique that was used. It measured the the viscoelastic properties and also obtain
information about the microstructure of crosslinked networks.The main point taken away
from this article is that the curing process of an epoxy resin was stabilized through the
addition of a polymer. This is important because this finding sheds light on the efficiency
of the epoxy curing process. (Hou, 2000)
7

Epoxies are often molded to protect important electrical components so thermal
stability is definitely essential to their environment. I feel as if the addition of the
copolymer was very interesting because of the ultimate results that the chemical reaction
displayed. The weakness would have to be the exploration of only one kind of copolymer
though. (McMichael, 1999)
One-part Epoxies
The reaction of a one-part epoxy is often initiated from an external source such as
temperature. Often times, these epoxies are placed at very high temperatures when in
their liquid form, and there are internal reactions that occur that result in a time-efficient
cure. In a particular experiment, the goal was to prepare a microencapsulated epoxy and
latent curing agent as well as evaluating the feasibility of this two-component repair
system for producing self-healing epoxy. The objective was to improve healing
efficiency. The bisphenol-A epoxy resin acted as the healing agent to be encapsulated.
The matrix of these composites were imported from China. There were no human
subjects used in this experiment. All materials were commercial so no further purification
occurred. In order to test the healing capabilities that of the fiber glass composites. 16 x
14 plain weave glass was imported. The main findings of the study included the fact that
the latent curing agent was able to successfully dissolve in the given epoxy and it was
cured at 130-180 degrees Celsius. Also it was concluded that the fracture toughness of
epoxy that contains microencapsulated epoxy and latent hardener depends on the contents
within them. Overall, it was found that the glass fabric laminates that were using the self-
healing epoxy in its curing process yielded a healing efficiency of 68%. This shows that
the addition of microencapsulated epoxies and latent curing agents could produce an
8

epoxy that is more prone to last longer and protect electronic components when applied
to most situations. (Yin, 2007)
Two-Part Epoxies
Diglycidyl ether of bisphenol-A-type is an epoxy resin that has two functions.
This epoxy was cured with different of types of curing agents. These agents contained a
difference in ratios. So basically, the authors were trying to discover the different effects
that the chemical structure of a hardener would have on the curing and behavior of epoxy
resins. The crosslink process of the epoxy resins and hardeners were followed by a
viscosimetry and also differential scanning calorimetry. There were no human subjects
involved in experimentation. The gelation time and also the activation energy of the
epoxy materials were discovered to be heavily dependent on the actual structure of the
harderner. However, the heat of the reactions did not seem to change much when the
hardeners were varied. (De Nograro, 2003)
Overall, the key point that should be taken away is that the chemical structure of
the hardener in a two-part epoxy system can have significant effects on the curing of the
epoxy. This is important because epoxies are heavily used in modern technology so
convenience and efficiency are very significant factors that must be considered due to the
time and cost that accompanies the development of new electronics. (Lee, 2000)
Epoxy and Fillers
The function of fillers in the curing of epoxy is to ultimately produce a stronger
final result. Physically, they resemble tiny grains of sand and the particle sizes vary. The
different mechanical properties when silica-filled epoxies were tested. Silica filled epoxy
are often chosen in the technological field because of their low costs, varying cure
9

temperatures, curing rates, and pretty good adhesion to substrates. However, epoxy resin
without filler happened to reduce the opportunity for solder bumps to contact copper so
the fillers must be carefully chosen so that this will work properly.
The silica-filled epoxy resin composites were supplied by The Packaging
Resource Center at Georgia Tech. The samples being tested had the same resin matrix but
were filled with spherical silica particulate by 0, 14, 21, 28, 33, and 39% filler volume
fractions. The mean diameter of silica particulate was about 4 μm. The curing condition
was 250°C for 40 min. In order to investigate the thermo-mechanical behaviors there was
a six-axis mini tester that was developed by Wayne State University. There were curves
tested both at room temperature as well as 115 degrees Celsius. And the results showed
that the mechanical behaviors of the materials were extremely sensitive to the silica filler
contents. At room temperature, it was shown that the materials became stronger with the
addition of silica filler into the epoxy matrix. However at 115 degrees it was shown that
the behaviors of the materials varied. Overall, the application of fillers into the world of
epoxy is very significant due to the various effects that they have on them. This study
showed that the addition of a silica-filler at room temperature actually strengthened the
cure of the epoxy resin. Furthermore, as technology continues to evolve, materials that
are stronger and lighter and more efficient are often the goal. (Wang, 2002)
Issues with Epoxy
Epoxy polymers are thermosetting materials that have many useful properties
such as high failure strength and good performance at high temperatures. That is one of
the main reasons why epoxies are often used for fiber-reinforced materials. However, one
major issue that accompanies this problem is that the material is relatively brittle and it
10

has poor resistance against the formation of cracks.The materials that were used in
experimentation were mainly based on a epoxy formulation that was one-part and cured
at very high temperatures. It was a standard diglycidyl ether of bis-phenol A. There were
also nano-particles of silica that were utilized. To determine the properties of the
matrices, the formulations were cured by mixing together the epoxy and silicone. There
were no human subjects used during experimentation. The main finding was that the
nano-silica phase as well as the rubber phase toughened matrices. The pure epoxy’s data
showed no toughening phase to that of the epoxy that contained the rubber particles.
Also, there were experiments done where the rubber and the silica were both added to see
if any additional toughness would result. The article did not display any particular use of
an analytical technique.The synergistic effects of having a structure with several phases
based on nano-SiO2 particles as well as micro rubbery domains are evident through this
experiment. Also, the addition of these rubber and silica particles did not have any
detrimental effects on the modulus of the epoxy itself. The understanding of these
mechanisms could potentially lead to increases in the mechanical performance of epoxy
polymers and also the development of composite materials produced at low costs in the
manufacturing industry. (Kinloch, 2005)
Summary
Epoxy (polyepoxide) is a “thermosetting polymer” which is formed when a resin
(epoxide) and a hardener (polyamine) react with each other. This substance is extremely
vital to the world of electronics. The range of situations that epoxy can be applied to is
quite vast. This includes generators, motors, insulators, and transformers. Many epoxy
systems are specifically used in industrial tooling to produce molds that can be used to
11

replace metal. This lowers overall costs and is chiefly more efficient. Now, in order for
epoxy to be created, two chemicals must react: a hardener and an activator (as stated
above). Therefore, epoxy can be considered a copolymer. The process of polymerization
can be referred to as “curing.” This procedure can be controlled through filler sizes, size
distributions, cure temperatures, as well as temperature rates. With this knowledge, the
most effective epoxy under various circumstances can be experimented.
12

1Chapter Three
Materials and Methods
Materials
1. Allied High Tech Products, Inc. Epoxy Resin (125 grams)
2. Allied High Tech Products, Inc. Epoxy Hardener (15 grams)
3. Glass Filler
a. 30% distribution
b. 50% distribution
4. One-inch Diameter Molding Container (5)
5. Thermocouple (5)
6. Strain Gauge (5)
7. Three-inch Wooden Mixer
Methods
Five molding containers of one-inch diameters were obtained. 1 mL of release
agent was obtained and spread uniformly throughout the inside of each container. 125
grams of Allied High Tech Products, Inc. Epoxy Resin were measured and placed into a
cup. 15 grams of Allied High Tech Products, Inc. Epoxy Hardener were also measured
and placed into the same cup. A wooden stick was then stirred in a counterclockwise
motion to mix the two liquids together until the solution was uniform and contained no
air bubbles. The 140-gram Resin-Hardener solution was then set aside.

Five strain gauges and five silicon substrates were then obtained. One strain
gauge was attached to each individual substrate and taped down into each molding
container. Five thermocouples were also obtained and taped onto the sides of each
container with the end of the wire hanging inside the middle of the container. 28 grams of
the Resin-Hardener solution were then placed into each of the five containers. 8.4 grams
of the glass filler (30% filler) were placed into one of the molding containers and stirred
counterclockwise with a wooden stick until the solution was uniform. Then 14 grams of
the same glass filler (50% filler) were placed into another cup and stirred in a
counterclockwise motion until the solution was uniform.
Three out of the five containers were left without any added filler material. Each of
the five prepared samples’ strain gauges and thermocouples were then attached to a
DELL computer and the Labview program was prepared for data collection. Each of the
samples was left to cure for a 24-hour period. After 24 hours, data collection was stopped
and the data for each sample was extracted.
Data Collection and Analysis
The data for this experiment were collected through the use of strain gauges to
measure apparent strain and thermocouples to do the same for temperature. During data
collection, strain gauges and thermocouples were attached to silicon substrates and placed
inside the filler before being connected to Dell computers. There was a program on the
computer called Labview that was programmed to collect data over a specified period of
time. The data was then analyzed and placed into table form using the program MatLab
which allowed the data to be comprehended more efficiently.
15

Chapter Four
Results
Data
Strain and temperature data were collected in the Center for Advanced Life Cycle
Engineering (CALCE) laboratory with strain gauges, thermocouples, and Labview
computer software. The strain data is measured in microstrain and the temperature data is
measured in degrees Celsius.
In the in-laboratory testing, an increase in filler distribution seemed to yield a
decrease in the magnitude of strain and temperature stresses, and the statistics revealed
supported this notion. After examination of general trends, the 50% filler was shown to
provide the least stressful environment out of the samples tested. This may be due to the
filler’s effects of decreasing molecule velocity during the cure process. There were errors
in some of the original samples. This is due to faulty equipment and the air-conditioning
system in the laboratory in the overnight setting.

In-Laboratory Study
Table 4.1: These are the measurements made using the strain gauges in microstrain units
throughout various filler distributions.
Strain (microstrain)
Filler Type
No Filler 30% Filler 50% Filler
Minimum Compression -0.223 ~~~ -0.331
Maximum Compression -143 -0.716 -0.677
Maximum Elongation ~~~ 0.25 ~~~
Table 4.2: These are the measurements made using the thermocouples in degrees Celsius
throughout various filler distributions.
Temperature (Celsius)
Temperature (Celsius) Filler Type
No Filler 30% Filler 50% Filler
Minimum Temp. 22.344 24.206 23.610
Maximum Temp. 28.709 29.777 29.704
Temp. Range 6.365 5.571 6.094
Data Analysis
18

Based on the data collected, general trends showed that an increase in filler
distribution within the epoxy did, in fact, yield an increase in both the overall strain and
temperature stresses; therefore, the null hypothesis was rejected. Two T-Tests were run
on the data sets of strain and temperature for comparison of 30% and 50% filler
distributions. The respective p-values of the one-tail and two-tail for strain were 6.68E-09
and 1.34E-08. Alternatively, the respective p-values of the one-tail and two-tail for
temperature were 5.65E-12 and 1.13E-11. All critical values are clearly less than the
alpha-value of 0.05 which certifies that the null hypothesis is rejected and the
experimental data is statistically significant. The sample that contained no filler
experienced strains with the greatest magnitudes. As the filler distribution increased,
there was a visible decrease in the magnitude of the overall strain.
Figure 4.1: This graph shows the strain experienced in filler distributions of 30% and
19

50% over time.
Table 4.3: This table shows the statistical values of the strain data after performing a t-
test.
Strain T-Test 30% Filler 50% Filler
Mean 2.07E-06 -1.7E-05
Variance 2.24E-10 8.42E-11
Observations 38 38
Hypothesized Mean Difference 0
Df 61
t Stat 6.555994
P(T<=t) one-tail 6.68E-09
t Critical one-tail 1.670219
P(T<=t) two-tail 1.34E-08
t Critical two-tail 1.999624
20

Figure 4.2: This graph shows the temperature changes experienced in filler distributions
of 30% and 50% over time.
Table 4.4: This table shows the statistical values of the strain data after performing a t-
test.
Temperature T-Test 30% Filler 50% Filler
Mean 26.51479 26.92626
Variance 0.823813 1.017128
Observations 513 513
Hypothesized Mean Difference 0
Df 1013
t Stat -6.8687
P(T<=t) one-tail 5.65E-12
t Critical one-tail 1.646359
P(T<=t) two-tail 1.13E-11
t Critical two-tail 1.962309
21

Chapter Five
Conclusions
Summary
In this study, strain and temperature changes of a two-part epoxy’s chemical
reaction were tested statistically at three different distributions. The purpose was to
conclude which composite yielded the most appealing curing environment for a silicon
substrate. The data was collected at the Center for Advanced Life Cycle Engineering at
the University of Maryland. Labview was the program utilized to achieve this goal. Data
was further analyzed by two statistical t-tests. The fillers themselves were scaled using a
digital balance. Strain gauges and thermocouples were placed into the liquid epoxy itself
to complete the measures. The null hypothesis of the experiment predicted that lower
filler distributions would yield lower strain and temperature, while the alternative yielded
that higher filler distributions would.
Conclusion and Discussion
According to the data, the series of experiments involving the examination of the
Allied High Tech Products, Inc. Epoxy Resin and Hardener’s curing process signify that
the addition of glass filler material to this thermosetting polymer yields a visible overall
decrease in the strains and temperature changes experienced by the silicon substrate.
Chemically, the addition of glass filler material reduced the original expansion rates of
the epoxy samples. The relative filler distributions decreased these rates based on their

sizes. Furthermore, the decrease in expansion rates yielded the apparent decreases in
23

temperature due to the fact that less expansion means slower moving molecules which
ultimately signify temperature drops. With that being said, the conclusions drawn during
this experimentation process can certainly be applied to the real world. Electronic
technology commonly utilizes epoxy and fragile materials of small sizes. Therefore, the
epoxy’s hardening process must definitely be considered when handling these
components that are often very expensive. The attention to an epoxy’s cure could
determine the success or failure of a project.
Recommendations
The results of this study should be used as a measure of strain and temperature
caused by various epoxy filler composites. Because the results showed behavior for only
one epoxy brand and filler type, the data did not indicate that epoxy behavior would be
consistent with brand. Also, great caution and care should be applied when handling
strain gauges and thermocouples so that data is collected most accurately.
Future Implications
Further study should be conducted to determine the behaviors of various other
filler types and distributions. Epoxy type could also most definitely be varied to compare
how different companies’ products react with these filler materials. Another implication
of this study is the testing of stresses that other potting materials place on components as
well. Overall, this experiment concludes that there is an average decrease in strain and
temperature stresses from no filler to 30% filler to 50% filler.
24

Literature Cited
Augarten, S. (1984). Bit by bit: An illustrated history of computers. New York: Ticknor
& Fields.
De Nograro, F. F., Guerrero, P., Corcuera, M. A., & Mondragon, I. (2003). Effects of
chemical structure of hardener on curing evolution and on the dynamic
mechanical behavior of epoxy resins. Journal of applied polymer science, 56(2),
177-192.
Hou, S. S., Chung, Y. P., Chan, C. K., & Kuo, P. L. (2000). Function and performance of
silicone copolymer. Part IV. Curing behavior and characterization of epoxy–
siloxane copolymers blended with diglycidyl ether of bisphenol-A. Polymer,
41(9), 3263-3272.
Kamal, M. R., & Sourour, S. (1973). Kinetics and thermal characterization of thermoset
cure. Polymer Engineering & Science, 13(1), 59-64.
Kinloch, A. J., Mohammed, R. D., Taylor, A. C., Eger, C., Sprenger, S., & Egan, D.
(2005). The effect of silica nano particles and rubber particles on the toughness of
multiphase thermosetting epoxy polymers. Journal of materials science, 40(18),
5083-5086.
Lee, C. L., & Wei, K. H. (2000). Curing kinetics and viscosity change of a two‐part
epoxy resin during mold filling in resin‐transfer molding process. Journal of
applied polymer science, 77(10), 2139-2148.
May, C. A., & Tanaka, Y. (1973). Epoxy resins; chemistry and technology. New York:
M. Dekker.
McMichael, K. (1999). Chemistry 240. Retrieved from http://chemistry2.csudh.edu/
rpendarvis/Polymer.html
R., K. (2012, September 07). What is a motherboard?. Retrieved from
http://www.wisegeek.org/what-is-a-motherboard.htm
25

Yin, T., Rong, M. Z., Zhang, M. Q., & Yang, G. C. (2007). Self-healing epoxy
composites–Preparation and effect of the healant consisting of microencapsulated
epoxy and latent curing agent. Composites Science and Technology, 67(2), 201-
212.
Wang, H., Bai, Y., Liu, S., Wu, J., & Wong, C. P. (2002). Combined effects of silica
filler and its interface in epoxy resin. Acta materialia, 50(17), 4369-4377.Wolfe.
(2009, 16 3). Homepage. Retrieved from http://hopage.cs.uri.edu/faculty/wolfe/
book/Readings/Reading03.htm
26

Appendix
Filler 2
Filler 1
Type 2 (36)
Filler 3
No Filler
(Control)
Filler2
Filler1
Type 3 (36)
Filler3
No Filler
(Control)
EPOXY(108)
Filler2
Filler1
Type 1 (36)
Filler3
No Filler
(Control)
*Original layout of experimentation (changed due to lack of materials and finances)
27

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