88 Equipment Engineering and Process Consulting, Inc Bios

1. Member Biographies
Todd O. Curtis - V.P. and Chief Technical Officer
 40 yrs. experience in III-V and Silicon: CVD/ALD processing and integration
 R&D with IBM, Intel, TI, Motorola, SEMATECH, SELETE Japan, TSMC, ST…
 Semi-Materials R&D Apps. Lab Mngr: equip, metro, staff, training, facilities…
 Over 25 articles: CVD & ALD, silicon and III-V materials, device integration
 Technology consultant to the 22nm node, selective deposition patent
 Semi, Solar, LED, and Raw Materials Engineering. Taiwan resident
Michel D. Ouaknine - Vice-President of European Operations
 μProcessor Apps Mgr. for 12 years with Intel, Intersil, and Zilog
 Authored 2 books on μP’s and ~ 40 technical & scientific papers
 CNAM ingénieur thesis on selective EPROM programming, 1976
 Coordinator with EU organizations: CE standardization, working with IMEC,
LETI & Fraunhofer Institute
 SEMI S23 standard on Energy Conservation. Paris resident
Peter J. Nowosad - President and Director of Operations
 20+ yrs. experience in project and customer support management WW
 Broad semiconductor and equipment background
 CAD design for high-tech chemical/gas distribution systems
 Knowledgeable in diffusion, CVD, ALD, PVD, and Etch
 Based and living in Taiwan since 2000
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2. Todd O. Curtis: Expanded Bio
Todd started his semiconductor career in 1973 at the Hewlett-Packard Opto-Electronics Division in Palo
Alto California. He spent the next 15 years in L.E.D. and MESFET III-V materials production and
development epitaxial operations at such notable companies as Siemens, Fairchild, Avantek, Gould-
Dexcel, and Watkins-Johnson Microwave Group.
In 1989 he began his silicon materials career in Watkins-Johnson Semiconductor Products Division in
Scotts Valley California at the cusp of the industry evolution from 150mm to 200mm wafers. Todd spent
the next 15 years with Watkins-Johnson in equipment and process engineering working in production
and R&D device and materials operations. Todd worked with and co-published technical papers with
companies world-wide including INTEL, TSMC, UMC, Texas Instruments, ST Microelectronics, Motorola,
IBM, Chartered, Samsung, Sematech, SMIC, Toshiba, Sony, and NEC.
His process development work in the early 1990’s on STI (shallow trench isolation), ILD (inter-level
dielectrics) and IMD (inter-metal dielectrics) became mainstream production processes used in over
80% of the semiconductor factories world-wide. His last R&D project was at the 22 nano-meter
technology node for ALD (atomic layer deposition) for high-K gate dielectrics and ALD tunable work-function
metal gates.
His 40+ years of materials research and production experience includes III-V's for L.E.D. and
MESFET's, and over 30 types of silicon related oxides, nitrides, and metals utilized in front-end and
back-end applications.
He has been an independent technology consultant since 2003 for equipment and process in the fields
of semiconductor, solar, and LED operations. He has lived in Taiwan since the year 2000 and travels
frequently to Vietnam in support of his current projects.
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3. Todd O. Curtis
Companies-Position-R&D Sites
Technicon 1971
Electrician
Hewlett-Packard
1973-1978
LED Epi & Xtal
Growth Ops.
Siemens Opto
1978-1979
GaAsP Epi R&D
Fairchild Opto
1979-1982
LPE, MOCVD
III-V EPI R&D
Avantek GaAs
1982-1983
Military GaAs
Epi & Implant
Dexcel-Gould
1983-1986
Military GaAs
AsCl3 Epi & Dev.
Si-Fab
1986-1988
Silicon Fab
Equipment
WJ Microwave
1988-89
Military
III-V MBE
WJ Semi. Equip.
1989-2000
APCVD, MOCVD
Apps. Lab R&D
ASML Thermal
2000-2003
ALD, APCVD,
MOCVD R&D
Consulting 03-06
Genus-Aixtron
2006-2007
ALD R&D CVD W
2007-Current
Used Equip.
Technical
Consulting
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4. GaAs ~ III-V
Process, Materials, Device, Equip.
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CONFIDENTIAL 4
Hewlett-Packard
1973-1978
Epi & Xtal Growth
GaAs, GaAsP, GaP
Siemens Opto
1978-1979
GaAsP VPE
Epi R&D
Fairchild Opto
1979-1982
LPE, MOCVD
III-V EPI R&D
Ternary & Quaternary
Avantek Microwave
1982-1983
Military GaAs
VPE Epi & Implant
Dexcel-Gould
1983-1986
Military GaAs
AsCl3, MBE Epi &
Device Process
WJ Microwave
1988-89
Military
III-V MBE
Genus-Aixtron
2006-2007
ALD & EPI R&D
MOCVD
Over 15 yrs. of
III-V Experience
Process Materials Device Equipment
AVANTEK

5. GaAs ~ III-V
Process, Materials, Device, Equip.
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Process
Epitaxy
MBE-MOCVD
LPE-VPE
Cl3 & AsCl3
Solid and
Semi Solid
Sources
Materials
GaAs
GaAsP
GaP
AlGaAs
InAlGaAs
P or N Doped
Device
L.E.D.
MESFETS
Lo-noise
Power
T and Y-gates
Air Bridges
HEMT-Quad-
Layers
Equip.
Reactors
Metals
Metrology
Parametric
Test
Cleans
All Types

6. Michel D. Ouaknine: Expanded Bio
• Designed various frequency counters and real time control equipment.
• Managed the design of a digital intelligent clock for industrial applications.
• Microprocessors and communications controller support specialist.
• Designed microprocessor application boards & data acquisition systems.
• Managed Intel, then Intersil, microprocessor courses, launched Zilog Z800 & Z8000 microprocessor
families, handled technical seminars & started the Intel European DRAM/EPROM test & analysis
laboratory.
• Created the subsidiary organization: sales, applications, marketing, customer service, bonded
warehouse...
• Addressed 3 different markets with a single organization, without conflicts nor duplicates.
• Qualified WDC X.25 communications products with all key South Europe organizations (CNET,
Transpac, Telefonica…) and customers (Olivetti, Bull, HP …).
• Reorganized European operations: sales, service & process engineers, inventories in strategic
locations...
• Introduced WSi (tungsten silicide) and high energy implant processes into key European accounts.
• Strategically re-focused European resources & grew EU sales to approximately 12 % of Genus
revenues.
• Initiated sales in South Europe, developed the company visibility & qualified Mattson into all major
semiconductor manufacturers in France & Italy (& their US operations).
• Global Account Manager for a major EU manufacturer, directly reporting to the president of our
company, developed the strategy & the necessary high level contacts. Developed a strong partnership:
joint papers & seminars; filed 2 joint patents.
• Promoted to the responsibility of RTP European Sales on January 1st, 2000.
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7. Michel D. Ouaknine: Expanded Bio
• Technical presentations for new equipment & processes; organizing demos: preparation, execution &
results review & analysis.
• Participation to new process developments; lectures to scientific seminars.
• Design engineer then applications manager for 12 years: design & support of microcomputers, real
time and data acquisition systems with Intel, Intersil and Zilog Europe subsidiaries.
• Initiated microprocessor & microcomputer courses for Intel customers & representatives.
• Started the European DRAM memory test & analysis laboratory and designed the first EPROM
programmer for Intel development systems.
• Author of « La pratique des microprocesseurs », 1977, Paris & Intersil IM6100 μP course book.
• Published ~40 papers in French & US magazines and for scientific symposia.
• Quality operations to provide total customer satisfaction: technical support, well controlled deliveries
& adequate follow up of customer requests.
• Familiar with EU organizations while involved in Corporate projects : CE standardization, design
center in Nice, France, distribution center in Amsterdam, The Netherlands...
• Started the European operations for 4 different US companies: Western Digital (1984), Genus (1992),
Mattson Technology (1996) and WaferMasters (2001).
• Set up & organized the European branch office in France, in synchronization with operations growth:
sales, applications, marketing, customer service, bonded warehouse & administration.
• Developed sales with key EU companies through partnership: JDP, joint patents, papers and
participation to scientific symposiums.
• Global Account Manager at Mattson Technology for a major semiconductor manufacturer, reporting
directly to the president.
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8. Michel D. Ouaknine
Companies-Position
Dyna Electronique
1972-1974
Design Mngr.
Intel
1974 to
Apps. Engineer
Intersil
Applications Manager
Zilog
to 1983
Applications Manager
Western Digital
1984-1990
Managing Director
Genus Inc.
1992-1996
Europe Director of
Operations
Mattson Tech.
1996-2001
RTP Sales Manager
Wafer Masters
2001-2004
Europe Operations
Manager
Technical and Sales
Consulting
2004 to current
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