Equipment & Materials for 3DIC & Wafer-Level Packaging Applications 2014 Report by Yole Developpement

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YOLE DEVELOPPEMENT
A comprehensive curvey of Equipment & Materials business,
Covering main trends, industry / market structures and market metrics
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Copyrights © Yole Développement SA. All rights reserved.
Advanced Packaging Platforms:
Equipment & Materials
COLLABORATION
INNOVATION
NEW PERSPECTIVES
Advanced Packaging & Manufacturing Team
FROM TECHNOLOGIES TO MARKET

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Presentation Outline
 Report Scope &
Definitions………………………………………….....….3
 Glossary……………………………………………….….…..4
 Companies Cited in this Report…………………..…7
 Definitions, Limitations & Methodology…….…8-9
 Analysis Comparison: 2011 vs. 2014 …………..…10
 Who should be interested in this report?.........11
 Executive
summary……………………………………………….....12
 Overall Equipment Market Forecasts ($M) ……..30
 Breakdown by Advanced Packaging Platform
 Breakdown by type of equipment
 Equipment market forecast for 3D & WLP...……. 37
 Overview of the technologies
 Current status
 Overview of the major equipment suppliers
 Positioning of the Different Equipment Suppliers, by
Technology
 Challenges/unmet needs
 Trends of the technology
 2013 – 2019 Market forecast from 2013 to 2019 (in $M, units)
 Market share (2013)
 Breakdown details for permanent wafer bonders/ C2W
Bonders / DRIE etching & other drilling tools / CVD / PVD /
ECD Plating / Exposure & Lithography / Spray coating /
Cleaning / Temporary Bonding & De-Bonding / Grinding-
Thinning-CMP / Wafer-molding / Inspection & Metrology /
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 Materials market forecast for 3D &
WLP...……………………………………………….…. 213
 2013 – 2019 Market forecast from 2013 to 2019 (in
$M)
 Market share (2013)
 Breakdown details for Photoresist & coatings /
Adhesive tapes / pre-applied & wafer-level underfills
/ Molding compounds / Plating & cleaning chemistries
/ Slurries for CMP / Temporary bonding materials/
Gas & precursors / sputtering targets
 3DIC & WLP Technologies Process Flows &
Manufacturing Trends
Analysis……………………………………...287
 Focus on Flip-Chip Wafer Bumping
 Introduction & background
 Typical manufacturing process flows
 Equipment & Materials suppliers involved
 Key process challenges and issues
 Focus on WL CSP Packaging
 Focus on FO WLP Packaging
 Focus on 2.5D Silicon Interposers
 Case of “Via first” TSV
for WLP MEMS Oscillator with TSV
 Focus on 3D WLP Platform
 Case of 3DIC & TSV ‘Via Middle’
 Conclusions & Perspectives …...…………………….. 289
From TECHNOLOGIES to MARKET
Copyright @ Yole Developpement SA.. All rights reserved

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Wafer-level-packages have emerged in many different varieties
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Advanced Packaging Platforms
Wafer-Level
Electrical Redistribution
Flip-chip & Wafer-Level
Stacking / Integration
WL CSP
‘Fan-in’
FOWLP
‘Fan-out’
2.5D
Interposer
FC wafer
bumping
on BGA
3D IC &
TSV
Embedded die
in PCB /
laminate
Wafer-Level
Interface / Encapsulation
3D WLP
For MEMS & sensors
(also called 3D SiP)
LED & Sensors
WLOptics

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Report Objectives
 This is a research update on the Equipment & Materials markets for 3D &
WLP applications
 This report’s objectives are to:
• Provide detailed information regarding equipment & materials used in 3D IC & WLP
‒ to update the market status of the Equipment & Materials markets for 3D & WLP applications
• Better understand WLP manufacturing technological trends
• Better understand equipment & materials industries for each process step in the 3D IC
& WLP applications
• Provide an overview of who is doing what, specificities and market share of each
market
• Gives market metrics both at equipment/material levels for 3D IC & WLP applications
• Gather and update all the information necessary to benchmark and compare all the
different alternatives offered by the current equipment and material toolbox for
wafer level packaging
• Provide an overview of the technological trends of the equipment & materials
technologies
 The following applications are not included:
• Leadframe-based Packages
• Thinned, Stacked WB Packages
• Wire-Bond Ball Grid Array Packages & PoP/PiP
• Equipment & materials used
‒ for Wafer Level Optics
• Panel will be mentioned in the report but forecast related to this field will not be included

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Fab-light players (outsourcing + focused investment in manufacturing & critical IP)
Substrate material suppliers
(FR4, BT resin, Cu clad, etc…)
SiP design
houses
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Transforming IC Packaging Supply Chain*
System /
Product
Sub-Module /
Sub-systems
Design & Assembly
Design
of chip & package
Wafer Level
Packaging
« Middle -end »
Silicon
Manufacturing
« Front-end »
Package Assembly &
Final test
« Back-end »
Front-end related
materials suppliers
OEMs
(Original
Equipment
Makers)
FE related
equipment suppliers
BE Packaging materials
suppliers
BE Packaging equipment
suppliers
Fab-less
IC players
IDMs (Integrated Device Manufacturers)
Integrated wafer / package manufacturing foundries
OSATs (Open Source Assembly & Test houses)
WLP houses (no need for traditional substrate)
PWB suppliers
(motherboard)
ODM / EMS / DMS
(electronic design &
manufacturing services)
Passive comp. &
SMT materials
SMT equipment
suppliers
Package substrate
laminate suppliers
* Existing business models represented in red, new business
models in orange
Wafer
foundries
Wafer Bumping houses PCB / PWB houses with Embedded die capability

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Involvement of the FE and BE equipment suppliers
 All the companies from R&D institutes to IP providers, equipment and materials suppliers, foundries, OSATs, IDMs, OEMs, substrate
makers have strategically positioned themselves in the “Middle-End” due to its high growth potential.
This evolution will lead to more investment in new equipment and materials
 The motivations for introducing new manufacturing tools to fulfill 3D technology’s requirements drive considerably the entrance of a
lot of equipment coming from the front-end and back-end areas in the ‘Middle-End’ space and create a battlefield between both
equipment vendors coming from Front-End and Back-End area who are willing to gain market share in the “Middle-End” space
 migration for equipment suppliers towards Middle-End space
 Depending on the products and applications needs, a trade-off between performance and cost will be needed for the processes that
have applications in both front-end and back-end and adopted in 3D integration process flow as well (for instance, lithography,
cleaning, deposition, etching etc),
• Supporting the trends of miniaturization, front-end tools would be preferred for achieving more aggressive features; however, they are typically more expensive.
• On the other side, the back-end equipment generally exhibits lower cost but can face scaling issues when semiconductor ICs continue to reduce in chip and feature size

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Equipment & Material Demand in the ‘Mid-End’
$3 000 M
$2 500 M
$2 000 M
$1 500 M
$1 000 M
$500 M
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$0 M
2013 2014 2015 2016 2017 2018 2019
Sales forecasts (M$)
Global Equipment & Material market forecast
for 3DIC & Wafer-Level-Packaging (in M$)
Equipment market
Material market
Yole Developpement © November 2014
 The wafer-level-packaging market remains a huge business opportunity and shows the
greatest potential for significant future growth in the semiconductor industry.
• That can be explained by the fact that devices are becoming more an more complex which drives
the investment in new equipment modifications and new materials development

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2013 Global Equipment Market for 3D TSV & WLP
TOTAL: $932M
Wafer
bonding
$XM
TB &
Debond
$XM
Spin coating/
Developer
~$XM
Dicing
~$XM
ECD Plating
$XM
DRIE
$XM
CVD
~$XM
PVD
~$XM
Inspection/
Metrology
~$XM
Lithography
~$XM
Others
Others: ~$XM
Rudolph
~$XM; X%
SMEE
~$XM; X%
Canon
~$XM; X%
SUSS
~$XM
X%
Ultratech
$XM
X%
Grinding &CMP
~$XM
Nikon
~$XM, X%

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Y included in this report
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Competitive environment

Major suppliers of other type of equipment are also
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Major competitors for
Mask aligners*
Major competitors for
projection (steppers +
scanner)
Major competitors for Laser
Direct Imaging
*SUSS provides Projection scanner which is
between mask aligner and projection stepper
Only supplier providing
laser ablation

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Lithography Equipment Market
3D & WLP Market share per equipment supplier
XXX

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Underfill
Dielectric
materials
RDL
Copper TSV
Bump plating
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Main materials for Advanced Packaging
Dielectric
materials
Assembly Materials Dielectric materials Metallization materials

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2013 Global Materials Market for 3D TSV & WLP
Permanent dielectric
resists
$XXM
Others
$XM, X%
AZ Electronic Materials
$XXM; X%
JSR Micro
$XM; X%
Sumito Bakelite/
Promerus
$XM; X%
DOW Chemical
$XM
X%
Fujifilm
$XM; X%
HD Microsystems/
Dupont
$XM
X%
Wafer Molding
compound
$XXM
Solder paste
$XXM
Plating
chemistries
$XXM
Slurries for CMP
$XXM
Cleaning chemistries
$XXM
Strippable plating resists
$XXM
TOTAL: $789M
Shin Etsu
$XM; X%

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WLP Dielectric Materials 2013 revenues
Breakdown by Dielectric material type
MXXX$
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PI
$91,9 M
55%
BCB
$25,4 M
15%
Silicone
$10,5 M
6%
PBO
$34,0 M
20%
Epoxy
$3,7 M
2%
WPR
$3,4 M
2%
Others
$0,2 M
0%
Yole Developpement
© November 2014
*AL-X
2013 Dielectric materials Market
Breakdown per type of dielectric material
 Main dielectric passivation applied to all Advanced Packaging platforms applications are Polyimide (PI) and BCB.
• PI is the key polymer material used for Wafer-Level-Packaging applications, mainly driven by flip chip applications.
‒ Flip-chip wafer bumping with electroplated solder and copper pillars which are in high volume in the CPU / GPU / ASIC / FPGA space and today entering in high
volume the mobile baseband / APE / RF PA Transceiver / PMU spaces
 BCB is also a very popular material in WLP applications, mainly supported by the WLCSP applications.
 However, PBO becomes a promising material for WLCSP and we are expecting demand for PBO to keep growing for WLCSP and
2.5D/3D IC applications
 WPR is being replaced because off its thermal stability issues

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More slides extracts

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Who Should be Interested in this Report?
 Equipment & material suppliers:
• Identify new business opportunities and prospects
• Understand the differentiated value of your products and technologies
in this market
• Identify technology trends, challenges and precise requirements related
to permanent bonding
• Evaluate the market potential of your permanent bonding technologies
• Position your company in the market
• Monitor and benchmark your competitors
 IDMs, CMOS foundries and OSAT players:
• Understand technology trends related to permanent bonding when used
in MEMS, LED, CIS and Advanced Packaging
• Spot new opportunities and define diversification strategies
 R&D organizations and investors:
• Monitor the global activity and consolidation currently occurring in the
semiconductor equipment and material business in order to identify new
partners and targets, and make the right decisions before committing to
one particular supplier

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Organizations Cited in the Report
Advantest, AGC, AI TEchnology Inc, Aimsolder, AIR LIQUIDE, Air Products, AJI – dvanced Jisso Technology, Ajinomoto Fine Techno Co Inc., Akrion systems,
AkroMetrix LLC, Alchimer, ALSI, Altatech Semiconductor, AMEC, Amicra Microtechnologies GmbH, AML, AnjiMicroelectronics, Applied Materials, Applied
Relay Testing, Applied Spectra, Asahi Kasei E-Materials Corporation, ASM Pacific Technologies, ASML Netherlands B.V., Assembleon, AST (Samurai), ASYS
GmbH, ATI, ATMI, ATOTECH, Auros Tech, Austin American Technology Corp, Axcelis Technologies, Ayumi Industry Co. Ltd., AZ Electronic Materials, Azores
Corp, Barth Electronics, BASF, Bergquist Company, Berliner Glass, Blue-M, Boschman Technologies B.V., Brewer Science, Bruker AXS , Cabot electronics,
CAMTEK USA, Canon ANELVA, Cascade Microtech, CHAPMAN, Chomerics, Corning, Corning Incorporated, CSM Instruments, Cyantek, Cyber-Technologies,
DaxinMaterials Corporation, Datacon Technology GmbH (BESI), DCG Systems, DEK semiconductor, DELO, Delta Design, Denka, Disco Corporation, DJ
DevCorp, Dai Nippon SCREEN, Dongjin SemichemCo., Doublecheck Semiconductors, Dow Corning Corporation, Dow Electronic Materials, DRY PLASMA
SYSTEMS, D-Tek Technology Co.,Ltd, DuPont Electronic Technologies, Dynaloy, DYNATEX International, Eastman Chemical, EBARA Technologies Corp., Ebina
Denka, ECI Technology, EEJA, Electroglas Inc, ENF Technology Co .Ltd, Enterprix, Enthone (Cookson Electronics), Epoxy Technology Inc., ERS – gmbh, ESEC AG,
ESI, Etched in Time Inc, EV Group, Evest Corp., EXCICO, Exelsius, FASSE CO., LTD., Fico molding (BESI), Finetech, FOGALE Nanotech, Frontier Semiconductor,
Frt Of America, FSI International, Fuji Polymers, FUJIFILM Electronic Materials, Furukawa America GE Sensing & Inspection, Gore, GPD Global, Inc.,
Hamamatsu, HamaTech APE GmbH & Co. KG, HD MicroSystems, Henkel Corporation, Heraeus GmbH, Hesse & Knipps, Hitachi Chemical Co., Ltd., Hitachi
High Technologies Corporation, Honeywell Electronic Materials, HORIBA Semiconductor, Hoya, IceMOS Technology, ICOS Vision Systems NV, Ikonix Imaging,
Indium Corporation, Ishihara Chemical , Ismeca Europe Semiconductor SA, JENOPTIK, Jet Metal, JSR Micro, Kester, KiyoKawa Plating industry, KLA-TENCOR,
Koh Young Technology Inc., Kulicke & Soffa, Kyzen Corporation, Laird Technologies, LAM Research Corporation , Laserod, Lasertec Corporation, Lauffer
Presses, Leybold Optics USA Inc, LG Chem., Ltd., Life Bioscience, LincoTec, Linde Gas, Lintec, Loadpoint, LORD Corporation, Mapper Lithography, Materion,
Mattson Technology, Mechatronic Systemtechnik, MECO, MEMC Electronic Materials, Inc. , Metryx, MicroChem, MicroFab Technologies Inc, Micronic Laser
Systems AB, Micronics Japan Co., Mitshubishi Gas Chemical, Mitsubishi Chemical Corporation, Mitsubishi Electric, Mitsubishi Heavy Industry (MHI),
Mitsubishi Materials, Mitsubishi Materials Corporation, Mitsui Chemicals, Momentive performance material, MSG Lithoglas AG, MTK Co, Ltd., Mühlbauer,
Nagase & Co., Ltd., Namics, Nanda Tech GmbH, NANOPLAS, Nanovea, NEC / SCHOTT, Newport, NEXX Systems, Nikko Metal, Nikon Corporation, Nippon
Electric Glass – NEG, Nippon Kayaku Co., Ltd., Nippon Sheet Glass – NSG, Nissan Chemical Industries, Nitta Haas Inc., Nitto Denko Corporation, Norcom
Systems Inc, Nordson ASYMTEK, Inc., Nordson dage, NordsonMarch, nScrypt Inc., Nusil Silicone Technology, Nypro Inc., oak-mitsui technologies, OEM
group, Oerlikon, Okmetic, Olympus-ITA, Inc., OM Group Ultra Pure Chemicals Pte. Ltd., OPμS, Orbotech Ltd., Oxford Instrument, Pac Tech, Palomar
Technologies Inc., Panasonic Denko, PANASONIC Factory Solutions, Philips Applied Technologies, picoDRILL, Plan Optik AG GmbH, Polymatech, Potomac
Laser, Praxair.com, Promerus LLC, Protavic America, Inc., PVA TePla AG, Ramgraber GmbH, rasco, REC Silicon, RENA GmbH, Replisaurus Technologies,
Ricmar Technology GmbH, Rorze, Rudolph Technologies, Saint-Gobain, SAMCO Inc. , Siconnex, SchmollMachinen, Schott AG, SCS - Speciality Coating
Systems, Sekisui Chemical Co., Ltd., Semiconductor Technologies & Instruments (ASTI), Semprius, SenjuMetal Industry Co., Ltd., SENTECH Instruments, SET -
Smart Equipment Technology, Seto Engineering Co., Ltd., Shanghai Micro Electronics Equipment , Shanghai Sinyang, Shibaura Mechatronics Corporation,
Shibuya Kogyo, Shin-Etsu Chemical Co.,Ltd. , Shin-Etsu MicroSi, Inc, SHINKAWA LTD., Shinko Seiki, Silecs, Singulus, SOITEC, Sokudo Co. Ltd., SolMateS,
Solvay, SolVision, SONIX, SONOSCAN, SPP (Sumitomo Precision Products Co., Ltd.), SPTS, SSEC - Solid State Equipment Corporation, Starfire Systems Inc.,
STIL SA, Strasbaugh, Sumco Corporation, Sumitomo Bakelite, Sumitomo Chemicals, Surface Science Integartion, SUSS Microtec, Sysmelec, Takada, Takatori
Ltd., Tamar Technology, Tamarack Scientific, Tango Systems, tecnisco, TEGAL, TEL (Tokyo Electron LTD.), Teradyne, Thin materials AG, Timbre Technologies,
tok, TOK (Tokyo Ohka Kogyo Co., LTD), Toray engineering Co.Ltd, Toray Industries, Inc, TOWA Corporation, TRESKY, TRIOPTICS, Ultraspray, Ultratech ,
ULVAC Inc., Umicore, Uyemura Co.Ltd, Uyemura International Corporation, Veeco, Verigy, Viscom AG, West-Bond, Inc., Xradia, YAMADA CORPORATION,
Young Chang Chemical, YoungTek Electronics Corp., Zebra Optical, Zeon Chemicals L.P., Zetta Core, Zygo Corporation, Zymet, Inc.

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About the author of this report
Amandine Pizzagalli
– Amandine is in charge of equipment & material fields for the Advanced Packaging &
Manufacturing team at Yole Développement after graduating as an engineer in Electronics,
with a specialization in Semiconductors and Nano Electronics Technologies. She worked in
the past for Air Liquide with an emphasis on CVD and ALD processes for semiconductor
applications.
Contact: pizzagalli@yole.fr

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Our latest market reports…
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3D IC Business Update
2014
FO WLP & Embedded Die Packages
2014

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Our report in 2015
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….Some of our Customers

Advanced Packaging Platforms: Equipment & Materials
Equipment & Materials for 3DIC & Wafer-Level Packaging Applications
Mainly supported today by flip-chip wafer bumping, 3D WLP, and WLCSP; the long term
growth of the equipment & materials business will be supported by the expansion of
3D TSV stack platforms.
TSV integration is creating growth and significant
interest in the equipment & materials industry
Mainly supported today by flip-chip wafer bumping,
the equipment market generated revenue of
more than $930M in 2013. It is expected that this
equipment market revenue will peak at almost
$2.5B. It is fueled by the 3D IC technology with
TSV interconnects, an area offering opportunities
for new developments in equipment modification—
equipment that is much more expensive than the
tools used for established Advanced Packaging
platforms (3D WLP, WLCSP, flip-chip wafer bumping).
Indeed, 2015 will be the key turning point for the
adoption of 3D TSV Stacks since the memory
manufacturers, such as Samsung, SK Hynix, Micron,
have already started to ship prototypes this year
and might be ready to enter in high-volume
manufacturing next year.
In addition, logic manufacturers will diversify
investments from System-on-Chip to Package-on-
Package and will benefit from Advanced Packaging
platforms such as 2.5D interposer and FO WLP to
stimulate their high-volume production.
The materials market will grow from $789M in
2013 to over $2.1B with a CAGR of 18%. Growth
will mainly be driven by the expansion of the next
generation Wafer-level-packaging platforms (3D
TSV stacked memories, multi-layer RDL for FO
WLP & WLCSP), which are becoming more complex
and requiring additional and various thin layers,
as well as advanced materials, to achieve better
performance.
This report will present a comprehensive overview of
the main equipment and materials used in the 3D &
WLP applications. In addition, it includes insights on
a number of equipment tools, breakdown by wafer
size & revenue, by type of equipment & materials
and advanced packaging applications. Moreover, it
also provides details about key suppliers, market
share and technological highlights that impact the
3D & WLP industry.
Equipment & materials market forecasts are
calculated for 2013–2019.
REPORT OUTLINE
• Title: Equipment & Materials
for 3DIC & WLP Applications
• November 2014
• Market & Technology Report
• PDF
• €5,990 - Multi user license
(320+ slides)
• €3,990 - One user license
(320+ slides)
KEY FEATURES OF THE REPORT
• 3D & WLP equipment and material
market metrics (units and value):
forecast 2013–2019
• Market share of major equipment
suppliers
• Key technical insights and
detailed analysis on equipment
& materials solutions, trends,
requirements and challenges
• Detailed WLP & other
technologies process flows and
scenarios analysis, including
evidence of the critical steps
related to each wafer-level-packaging
platform, and
what the available technology
alternatives are in the equipment
& materials toolbox
• Technology roadmap for adoption
of new technology
Market & Technology Report
WHAT’S NEW COMPARED TO LAST
EDITION?
• Update of market forecast from
2013 to 2019
• New analysis based on the
competitive landscape and market
share for all main equipment and
materials suppliers for 3D TSV &
WLP applications
• More in-depth analysis on the
different equipment & materials
technologies already available
on the market and technology
trends
• Update of 2013 key equipment
& materials suppliers
• Key technical insights and
detailed analysis on equipment
& materials solutions, trends,
requirements and challenges
Global Equipment & Material market forecast for 3DIC & Wafer-Level-Packaging
(in M$)
2013 2014 2015 2016 2017 2018 2019
(Yole Développement, November 2014)
$3 000 M
$2 500 M
$2 000 M
$1 500 M
$1 000 M
$ 500 M
Increase competition in the packaging area:
Battle in the equipment & materials industry
The packaging area has driven significant activity
throughout the entire supply chain to solve 3D
technology manufacturing challenges.
Starting in 2015, the strong growth of TSV
adoption will result in significant investments in
new equipment and materials to meet the key
requirements of 3D technology. Fabrication of
TSV requires several processing steps, each with
their own specifications, depending on the needs
of each application. In addition, robust integration
of all the steps will be critical for the successful
implementation of TSV technology.
Today, there are still many unresolved challenges:
remaining technical issues, standardization for
$ 0 M
Sales forecasts (M$)
Equipment market Material market

BGA
Dicing
W2W
collaborative business models and more
importantly cost, especially for consumer and
mobile applications.
The 3D TsV business has been of central interest
to the packaging area that has enabled the entry
of equipment suppliers coming from the Front-
End and Back-End (PCB) areas. Both of which
are looking to fi nd business opportunities in the
Middle-End.
Supporting the trends of miniaturization, front-end
tools would be preferred for achieving more
aggressive features; however, they are typically
more expensive.
Back-end equipment generally exhibits lower cost
but can face scaling issues when semiconductor
ICs continue to reduce in chip and function size.
As a result, to support the 3D integration process
fl ow, a trade-off between performance and cost
will be necessary.
In addition to existing tools to support all the
different 3D activities and processing needs,
several equipment and materials vendors have
emerged. A result of the various steps involved in
3D technology is that the equipment market has
become quite diversifi ed.
S eve r a l d i f f e r e n t g r o up s o f p l aye r s, e a c h
providing different expertise, have been formed:
• Top-tier semiconductor equipment suppliers
coming from the Front-End area
• Specialist equipment suppliers that have
developed knowledge and expertise in very
specifi c equipment lines. They are looking to
further increase their market share in their fi eld
of expertise through differentiation from Top-tier
equipment suppliers.
On the other hand, the last acquisitions—SPTS
acquired by Orbotech and the merger between
AMAT and TEL—show an interest by these
companies to provide equipment tools for the
Advanced Packaging industry and thus, support
as much as possible the Middle-End area.
Since the competition has increased between
equipment and materials suppliers, strategic
partnerships will probably be necessary to
support as much as possible the current and
future needs of 3D stacking.
This big change in the equipment & materials
market is creating a new battle in the Middle-End
area, which is going to be very interesting over
the next 5 years.
This report presents a detailed analysis on the
packaging industry, highlighting new strategies
developed by the equipment & materials suppliers.
It gives future evolution of the packaging industry
and detailed analysis on the impact of the latest
acquisitions on the evolution of the equipment &
materials markets.
Etch
Inspection
PVD
Implant
Cleaning
CVD
CMP
Wafer test
Thinning
2013 global equipment market for 3D TSV WLP
INCREASED COMPETITION IN ThE LIThOGRAPhy MARkET
The lithography market has gained signifi cant
interest within the equipment market. This fi eld has
driven the entrance of new equipment suppliers.
Today if ultratech and suss micro tech focused
on gaining a large portion of market share in the
lithography area, they might be challenged by
equipment suppliers coming from the Front-End
area, such as Nikon and Canon, that represent
Top-tier semiconductor equipment and equipment
vendors coming from the PCB industry (such as
Orbotech, Ushio).
The lithography market is quite diversifi ed and
segmented into several different types of
equipment suppliers. New entrants are trying
to enter the lithography market with alternative
solutions to mask aligners and steppers, both used
in the packaging area.
Competitive landscape and market share for the
major equipment & materials suppliers involved in
the Packaging industry are quantifi ed and detailed
in this report.
Entrance of the FE and the BE equipment suppliers in the middle end area
C2C / C2S
Underfill
Molding
Final test
FE
Wafer manufacturing BE
Assembly & test
Middle-End
TSV
Bumping
RDL / Wiring C2W
Handling
Inspection
++ More suitable for achieving
aggressive features
-- Expensive
++ Lower cost
-- Scaling issues
Wafer
bonding
$XXM
TB &
Debond
$XXM
Spin coating/
Developer
~$XXM
Dicing
~$XXM
ECD Platin g
$XXM
DRIE
$XXM
CVD
~$XXM
PVD
~$XXM
Inspection/
Metrolog y
~$XXM
Lithograph y
~$XXM
Grinding
&CMP
~$XXM
suppliers main
for
&
all for given equipment is materials WLP
of & share type 3D and for Market 10 equipment than materials more suppliers main
for
&
all for given equipment is materials WLP
of & share type 3D and for Market 10 equipment than materials more Others: ~$XM
Rudolph
~$XM; X%
SMEE
~$XM; X%
Nikon
~$XM, X%
Canon
~$XM; X%
SUSS
~$XM
X%
Ultratech
$M
X%

OBJECTIVES OF THE REPORT
• Provide market metrics both at equipment & materials levels (from 2013 to 2019)
• Provide market share of the key equipment & materials suppliers involved in the packaging industry
• Key technical insight into future equipment & materials trends and challenges
• A forecast for the next five years, and to predict future trends for equipment & materials for 3D & WLP
applications
• Better understand process flows and technological trends in package manufacturing
• Better understand equipment & materials industries for each process step
COMPANIES CITED IN THE REPORT (non exhaustive list)
Alchimer, AML, Applied Materials, Asahi Kasei E-Material, ASM Pacific Technologies, ATMI, ATOTECH,
Auros Tech, AZ Electronic Materials, Brewer Science, Cabot electronics, CAMTEK USA, Corning,
Disco, Dai Nippon SCREEN, Dongjin Semichem, Dow Corning, Dow Electronic Materials, DuPont
Electronic Technologies, Dynaloy (Eastman Chemical Company), EBARA Technologies, Ebina Denka,
Enterprix, Enthone (Cookson Electronics), EV Group, Evest, Fico molding (BESI), Finetech, FOGALE
Nanotech, Frt Of America, FSI International, KLA-TENCOR, Mitsubishi Heavy Industry (MHI),
Mitsubishi Materials, NEXX Systems, Oerlikon, Parker Hannifin and many more…
TABLE OF CONTENTS
Market & Technology Report
Complete and detailed technologies update for
equipment & materials used in 3D & WLP applications
Although today it is mainly supported by flip-chip
wafer bumping applications, the packaging market
remains a huge business opportunity. This market
shows the greatest potential for significant future
growth in the semiconductor industry.
Technologies related to equipment & materials
(but used for different process flows) are included
in this report. The process flows for each Advanced
Packaging platform, including flip-chip wafer
bumping trends, Fan-in WLCSP, 3D WLP, FOWLP,
2.5D silicon interposers, and 3DIC Via Middle & Via
Last processes, are also included in the report.
The key equipment & materials used in the
Advanced Packaging area are highlighted for each
process step and a detailed analysis is provided
for all process flows across each of the Advanced
Packaging platforms. Analysis of the Via First
process flow is detailed in this report as well.
• Report scope & definitions 3
• Glossary 4
• Companies cited in this report 7
• Definitions, limitations & methodology 8
• Analysis comparison: 2011 vs. 2014 10
• Who should be interested in this report? 11
• Executive summary 12
• Overall equipment market forecasts ($M) 30
> Breakdown by advanced packaging platform
> Breakdown by type of equipment
• Equipment market forecast for 3D & WLP 37
> Overview of the technologies
> Current status
> Overview of the major equipment suppliers
> Positioning of the different equipment
suppliers, by technology
> Challenges/unmet needs
> Trends of the technology
> 2013 – 2019 market forecast from 2013 to
2019 (in $M, units)
> Market share (2013)
> Breakdown details for permanent wafer
bonders / C2W bonders / DRIE etching
& other drilling tools / CVD / PVD / ECD
plating / exposure & lithography / spray
coating / cleaning / temporary bonding
& de-bonding / grinding-thinning-CMP /
wafer-molding / inspection & metrology
• Materials market forecast for 3D & WLP 213
> 2013 – 2019 market forecast from 2013
to 2019 (in $M)
> Market share (2013)
> Breakdown details for photoresist & coatings /
adhesive tapes / pre-applied & wafer-level
underfills / molding compounds / plating
& cleaning chemistries / slurries for CMP /
temporary bonding materials/ gas &
precursors / sputtering targets
• 3DIC & WLP technologies process flows
& manufacturing trends analysis 287
> Focus on Flip-Chip wafer bumping
> Introduction & background
> Typical manufacturing process flows
> Equipment & materials suppliers involved
> Key process challenges and issues
> Focus on WL CSP packaging
> Focus on FO WLP packaging
> Focus on 2.5D silicon interposers
> Case of via first TSV for WLP MEMS oscillator
with TSV
> Focus on 3D WLP platform
> Case of 3DIC & TSV via middle
• Conclusions & perspectives 289
Related reports
• 3DIC & 2.5D TSV Interconnect
for Advanced Packaging 2014
Business Update
• Permanent Wafer Bonding for
Semiconductor: Application
Trends & Technology
• LED Packaging Technology and
Market Trends 2014
• Status of the CMOS Image
Sensors Industry 2014
• Apple iPhone 5S Camera
Module, 8Mpixel 1.5μm Stacked
BSI CIS from Sony
Find all our reports
on www.i-micronews.com
AUTHOR
Amandine Pizzagalli is in charge of
equipment & material fields for the
Advanced Packaging & Manufacturing
team at Yole Développement
after graduating as an engineer in
Electronics, with a specialization in
Semiconductors and Nano Electronics
Technologies. She worked in the past
for Air Liquide with an emphasis on CVD
and ALD processes for semiconductor
applications.

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Each of them is entitled to assert and enforce those provisions
against the Buyer.
Any notices under these Terms and Conditions shall be given in
writing. They shall be effective upon receipt by the other Party.
The Seller may, from time to time, update these Terms and
Conditions and the Buyer, is deemed to have accepted the latest
version of these terms and conditions, provided they have been
communicated to him in due time.
9. Governing law and jurisdiction
9.1 Any dispute arising out or linked to these Terms and Conditions
or to any contract (orders) entered into in application of
these Terms and Conditions shall be settled by the French
Commercial Courts of Lyon, which shall have exclusive
jurisdiction upon such issues.
9.2 French law shall govern the relation between the Buyer and the
Seller, in accordance with these Terms and Conditions.

Equipment & Materials for 3DIC & Wafer-Level Packaging Applications 2014 Report by Yole Developpement

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Equipment & Materials for 3DIC & Wafer-Level Packaging Applications 2014 Report by Yole Developpement