AT&S Company Presentation April 2016

1. AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Fabriksgasse13 | A-8700 Leoben
Tel +43 (0) 3842 200-0 | E-Mail info@ats.net
www.ats.net
AT&S
first choice for advanced applications
Company Presentation
April 2016

2. 1
Company Overview
Strategy & Market
Annex
Financials
Table of Contents

3. 2
AT&S – a world leading high-tech PCB company
 Megatrend-driven
markets with attractive
growth potential
 Entering a new high-end
business segment by
2016
 Pure high-end segment play
 Technology & quality leader
 Largest European PCB
producer
 Partner of choice for blue
chip customer base
 Balanced industry portfolio
 Strong Asian production
footprint with focus on
high volume/low mix
 European footprint: high
mix/low volume
 Operational excellence:
Outstanding process
know-how, productivity
and efficiency
 One of the most profitable
players in the industry:
above industry EBITDA
margins
 Strong cash flow generation
 Proven long term successful
financial track record

4. AT&S – Key Facts
Strong track record1 Balanced portfolio / Global customer base2
7%
€ in millions
3
Split revenue: Business Unit, Q1-Q3 2015/16
Split revenue: Customer Region, Q1-Q3 2015/16
based on sold to party
23%
6%
14%
57%
Germany/Austria
Other European
countries
Asia
Americas
488
514
542
590
667
489
584
96 103 102
127
168
127 140
47 42 31
54
90 71 76
2010/11 2011/12 2012/13 2013/14 2014/15 Q1-Q3
2014/15
Q1-Q3
2015/16
Revenue EBITDA EBIT
+5%+5% +9% +13%
+19%
Revenue growth
60%
40%
Mobile Devices &
Substrates
Automotive,
Industrial, Medical

5. 4
Global footprint ensures proximity to supply chain
& cost efficiency
 European production facilities: high mix/low volume
 Asian production facilities: high volume/low mix
 Sales network spanning three continents
 8,688 employees*
Plant Shanghai, China
Staff: 4,636*
Plant Ansan, Korea
Staff: 276*
Plant Nanjangud, India
Staff: 1,167*
Plant Chongqing, China
under construction
Staff: 1,289*
Plant Leoben, Austria
Headquarters
Staff: 911*
Plant Fehring, Austria
Staff: 373*
AT&S sales officesAT&S plants
*Average, FTE, Q1-Q3 2015/16; 36 employees in other locations

6. ► volatility due to seasonal effects
5
Balanced high-end product portfolio
to level seasonality
Characteristic Selected ApplicationsSegment
1) Based on external revenue € in millions in Q1 2015/16
Mobile Devices &
Substrates
Advanced
Packaging
Selected Market
Leaders
GoPro
Sony
LG
Canon
Qualcomm
Blackberry
Lenovo
Huawei
Samsung
Xiaomi
ZTE
Intel
Apple
► stable business due to longer product life
time
 Includes the segment Advanced Packaging (in the
process of being established) as well as group
management and financial activities
Others
(Revenue € in millions)
(Revenue € in millions)
Automotive,
Industrial,
Medical
Revenue
Share1)
Communication
Computing
Automotive:
Lighting, thermal, sensors,
safety, infotainment,
powertrain
Medical:
Patient monitoring,
therapy, diagnostic
Industrial:
Instrumentation &
control, power
solutions, lighting
Consumer
Electronics
Osram
Hella
Siemens
General Electric
Continental
Harmann
EADS
Texas Instruments
ST Microelectronics
Freescale
Semiconductor
RFMD
TDK-Epcos
Qualcomm
60%
40%
68.0
88.7
120.9
104.5 115.9 112.2 123.4
Q1 14/15Q2 14/15Q3 14/15Q4 14/15Q1 15/16Q2 15/16Q3 15/16
72.6 71.7 65.9 72.6 77.8 79.5 72.7
Q1 14/15Q2 14/15Q3 14/15Q4 14/15Q1 15/16Q2 15/16Q3 15/16

7. 6
Company Overview
Strategy & Market
Annex
Financials
Table of Contents

8. AT&S Positioning Strategy
Strategic focus on high-end technologies
High-end
HDI PCBs and
IC-Substrates
~30%
High-end technology share > 70%
HDI and Anylayer PCBs, Embedding
Complementary
technology share: <30%
SS, DS, ML,
Flex, RF
Structure of general PCB market – based on technologies
Single-sided (SS), double-sided (DS), multilayer- (ML),
flex and rigid-flex (RF) PCBs
~70%
AT&S Revenue structure in 2014/15 - based on technologies
7

9. Strategy: Selecting segments and applications
 Market segments – selected by AT&S:
Mobile Devices & Substrates Automotive Industrial Medical
Attractive, specific
application growth:
> 10 %
Potential for sustainable
high EBITDA margins :
> 20 %
Technological fit:
dense structures:
35 - 60 micrometer
Criteria for selection
Smartphones, Tablets,
Ultrabooks, Wearables ..
Navigation, Advanced
Driver Assistance
Systems, Infotainment..
Machine-2-Machine
Communication,
Industrial Computer…
Hearing Aids, Patient
Monitoring ..
1 2 3
 Specific applications that show attractive, overall growth within our addressed market segments :
8

10. 9
Market Player/Position HDI Technology
Source: Prismark, August 2014; NTI CY2013; AT&S Strategy
Market position HDI Technology
Revenue (US$ in millions)
Rank Country Supplier HDI
Non HDI
PCBs
IC-
Substrates
Total
revenue
1 TWN Unimicron 682 671 795 2,148
2 TWN Compeq 538 509 - 1,047
3 AUT AT&S 530 248 - 778
4 KOR SEMCO 480 173 1,212 1,865
5 JPN Ibiden 426 - 1,080 1,506
6 USA TTM 406 962 - 1,368
7 TWN Zhen Ding 343 1,774 - 2,117
8 TWN Tripod 305 1,077 - 1,382
9 KOR DAP 279 21 - 300
10 TWN Unitech 236 304 - 540

11. Source: AT&S; Prismark (2015), JMS (2014), YOLE (2015)
Advanced Packaging represents the “Embedded die – package” forecast.
FC-Substrates represents “FC-BGA” and “FC-CSP” package substrates.
Market per Segments 2014 – 2019 [US$ in millions]
The Total PCB & Substrate Market will reach around
70 bn US $ in 2019
Overall Market development
Market per Technology 2014 – 2019 [US$ in millions]
10
CAGR 4% CAGR 4%

12. The world is changing – miniaturisation &
modularisation as main drivers
11
2003/04 2013 2016 2024
?
Type Mobile Phone Smartphone System in Package All in One
PCB 125x55mm 85x20mm 30x30mm 20x20 ?
Form Factor 1 0.25 0.13 0.06 ?
Line/Space 100/100µm 40/40µm 30/30µm 20/20µm ?
Technology 1-n-1 Anylayer Anylayer&Embedding ?

13. 12
AT&S’ advanced technology solutions
General Description & Technology Application Areas Customer Base Market Size
High-End
(HDI) PCBs
PCBs are the interconnection platform for electric, electronic
& mechanical components (such as resistors , capacitors, IC’s,
connectors; etc.)
Density: Line/ Space > 35 micron
Computer, Consumer,
Communication, Automotive
Industrial, Medical
OEM´s
Tier 1
Tier 2
AT&S addresses a
market of
USD 5.8bn *
Substrate-like
PCBs
Substrate-like PCBs are the next evolution of high-end HDI
PCBs with higher density: Line/Space 20-30micron
Wearables and applications of
the “Internet of Things”
OEM’s
Tier 1
Tier 2
Technology in
introduction, part
of High –end HDI
and Low-end
Substrate market
* AT&S addresses part of a total market of USD 47.5bn/ source: Global Production Value 2014, Prismark, March 2015

14. 13
* AT&S addresses part of a total market of USD 7.6bn/ source: Global Production Value 2014, Prismark, March 2015;)
** Source: AT&S; Prismark (2015), JMS (2014), YOLE (2015); Advanced Packaging represents the “Embedded die – package” forecast.
IC (FC)-Substrates represents “FC-BGA” and “FC-CSP” package substrates.
General Description & Technology Application Areas Customer Base Market Size
IC Substrates
IC-Substrates serve as interconnection platform with
higher density (Line/Space < 15 micron) between
semiconductors (Chips) & PCBs
High-end processors for
Computer, Communication,
Automotive, Industrial
OEM’s
Semiconductor
Industry
AT&S addresses a
market of
USD 5.1bn *
Embedded
Component
Packaging
(ECP®) Embedded Component Packaging allows to embed
active/passive components (e.g. wafer level dies) within the
layers of a PCB – contributes to miniaturisation
Power Electronics, e.g. for
Automotive, Industrial
OEM’s
Semiconductor
Industry
AT&S addresses a
market of
USD 210m **
AT&S’ advanced technology solutions

15. Growth Project Chongqing – IC-S & Substrate-like
PCBs
Building 1: IC Substrate plant
Specifications:
 Clean Room Class < 100
Building 2: Substrate-like PCB plant
Specifications:
 Clean Room Class < 10,000 to
< 1,000 in special areas
14

16. Growth Project Chongqing – Overview
15
 Location: Chongqing, Central China
 Total investment: € 480m in first phase
(until mid 2017)
 Expected CAPEX-revenue ratio: mean of 0.9 (at full
expansion – incl. second phase)
 Start of High Volume Mass Production
> IC Substrates: February 2016
> Substrate-like PCBs: expected second half 2016
* at full expansion (incl. a second phase not yet scheduled)
** Capex for tangible fixed assets
Plant I Plant II
Products: IC Substrates Substrate-like PCBs
Capacity: 150,000 sqm/p.a.* 200,000 sqm/p.a.*
Investment** Phase 1: ~ € 280m ~ € 200m
Investment** as of 31/12/2015: € 195.6m € 45.3m

17. 16
Driving Future Trends in Customer Segments:
Internet of Things (IoT) and Application Structures
 Healthcare
 Glasses
Wearable Electronics
Smart Mobility  Autonomous Driving
 Car2Car Communication
Smart City  Smart Lighting
Smart Buildings  Home/Building Automatisation
 Energy Management
Smart Production/Industry 4.0  Automatisation/Robotics
 Production Control Systems
Smart Healthcare  Connectivity (e.g. online patient
monitoring)
Smart Energy  Smart Metering
 30-50 billion of „Things“ will be connected in 2020
 Wearables market forecast: USD 10 – 60 billion by 2018
Source: IHS, 2013

18. 17
Company Overview
Strategy & Market
Annex
Financials
Table of Contents

19. 18
Sound top-line growth, above industry margins
and increasing cash conversion
488
514
542
590
667
489
584
96
103 102
127
168
127
140
19.7%20.1%
18.9%
21.6%
25.1% 26.0%
24.0%
€ in millions
71
87
72
105
144
95
130
Revenue
Y-O-Y growth
Operating Cash Flow
Y-O-Y development
EBITDA and
EBITDA-margin
 Continuous growth path up to full
capacity utilisation
 Revenue with products out of
Asian production increased from
69% in 2010/11 to 81% in Q1-Q3
2015/16
 EBITDA increase due to good product
mix and high capacity utilisation
 EBITDA margin guidance FY 2015/16:
>19% due to impact from ramp-up
Chongqing plant
 Operating cash flow generation
driven by strong EBITDA
performance
€ in millions € in millions

20. 19
Capex & Staff
CAPEX
CAPEX reflects investments in Chongqing
project (whereof € 122.1m) and technology
investments in existing locations .
113
40
90
165
130
177
2011/12 2012/13 2013/14 2014/15 Q1-Q3
2014/15
Q1-Q3
2015/16
STAFF*
The increased headcount is primarily based on
the Chongqing project.
7,417 7,321
7,027
7,638
8,688
2011/12 2012/13 2013/14 2014/15 Q1-Q3 2015/16
123
60954 1,289
* incl. leased personnel, FTE, average for the period(€ in millions)
Core business Employees project Chongqing

21. Financials Q1-Q3 2015/16
20
€ in thousands (unless otherwise
indicated)
01.04.2015 – 31.12.2015 01.04.2014 – 31.12.2014
STATEMENT OF PROFIT OR LOSS
Revenue 584,333 489,416
produced in Asia 81% 79%
produced in Europe 19% 21%
EBITDA 140,233 127,284
EBITDA margin 24.0% 26.0%
EBIT 76,074 70,811
EBIT margin 13.0% 14.5%
Finance costs - net (2,664) (4,376)
Income Taxes (13,182) (16,097)
Profit for the period 60,228 50,338
Cash Earnings 124,292 106,751
EPS in € 1.55 1.29
EBITDA increase of 10.2% based on high
capacity utilisation and good product mix;
Positive FX effects of € 10.9m included.
Revenue increase of 19.4%:
7.6% from organic growth and 11.8%
from FX effects.
Higher interest expenses
overcompensated by higher interest
income and capitalised interests for
qualified assets
EBITDA margin decline in comparison to
very high benchmark of 26.0% in Q1-Q3
2014/15

22. 21
Profit for the period and earnings per share
 Earnings per share increased by 19.6%
23.3 23.3 23.3
30.8
38.9 38.9 38.9
1.51 1.14 0.62 1.24 1.78 1.29 1.55
-20
-15
-10
-5
0
0
10
20
30
40
50
2010/11 2011/12 2012/13 2013/14 2014/15 Q1-Q3
2014/15
Q1-Q3
2015/16
Number of shares, average number; in million pcs. Earnings per share; in €

23. Financials Q1-Q3 2015/16
22
€ in thousands (unless otherwise
indicated) 31.12.2015 31.03.2015
STATEMENT OF FINANCIAL POSITION
Non-current assets 836,746 712,757
Current assets 639,343 508,055
Equity 599,649 604,358
Non-current liabilities 548,189 413,070
Current liabilities 328,251 203,384
Total assets 1,476,089 1,220,812
Net debt 192,420 130,510
Net gearing 32.1% 21.6%
Net working capital 81,271 95,319
Net working capital per revenue 10.4% 14.3%
Equity ratio 40.6% 49.5%
Improvement of net income was
overcompensated by negative FX effects

24. 23
Financial debt, cash and net debt
212
273
299
372
405
18
31
82
261
274
194
243
217
111
131
2010/11 2011/12 2012/13 2013/14 2014/15
Gross debt Cash Net debt

25. 24
Net debt/EBITDA
2.0
2.3
2.1
0.9
0.8
2010/11 2011/12 2012/13 2013/14 2014/15
 Expected multiple in temporary peak of Chongqing investments: < 3.5x

26. 25
Overview Debt Portfolio Duration
Maturity
€ in millions < 1 Year 1-5 Years > 5 Years Total
Corporate Bond 82.3 - - 82.3
Export Loans
32.0
- - 32.0
Public funds and other - 2.7 1.4 4.1
Bank Borrowings 16.8 381.9 102.3 501.0
Total 31/12/2015 131.1 384.6 103.7 619.4
Total 31/03/2015 46.0 321.6 37.7 405.3
 Average debt portfolio duration: 4.0 years (2014/15: 3.8 years)
 Average financing costs of 2.7%
 153m € of credit lines not utilised
Refinancing 2015/16

27. Financials Q1-Q3 2015/16
26
€ in thousands 01.04.2015 – 31.12.2015 01.04.2014 – 31.12.2014)
STATEMENT OF CASH FLOWS
Profit for the period 60,228 50,338
Non cash bearing of profit or loss 63,195 65,442
Changes in Working Capital 6,475 (20,406)
Cash flow from operating activities 129,898 95,374
Cash flow from investing activities (175,667) (130,433)
Cash flow from financing activities 204,117 16,838
Change in cash and cash equivalents 158,348 (18,221)
Decrease in Net Working Capital due to
improved customer payment term.
Continuous planned high CAPEX
based on investments in
Chongqing and continuous upgrades
of existing production facilities.

28. 27
Net Working Capital Management
Net Working Capital Development - € in millions and in % of revenue
92
103
92 95
81
18.0%
19.0%
15.6%
14.3%
10.4%
2011/12 2012/13 2013/14 2014/15 Q3 2015/16
Net Working Capital development Net Working Capital % of revenue

29. AT&S - Stock Profile
Listing: Vienna Stock Exchange,
Prime Standard
Indices: ATX, WBI
ThomsonReuters (A): ATSV.VI
Bloomberg (A): ATS AV
Annual Results 2015/16 10 May 2016
Record Date Annual General Meeting 27 June 2016
22nd Annual General Meeting 07 July 2016
Ex-Dividend Day 26 July 2016
Record Date Dividend 27 July 2016
Dividend Payment Day 28 July 2016
Results for the first quarter 2016/17 28 July 2016
Results for the first half-year 2016/17 03 November 2016
28
Financial Calendar 1 year development / Daily volume
ATX
AT&S
# of shares outstanding 38.85m
Avg. daily volume: 65.400 shares
Performance ytd: -11.40%
Performance 1 year: -11.76%
Dividend 2014/15: EUR 0.36/per share
Dividend yield: 2.5%

30. 29
14.9% of Free Float not identified
AT&S – Shareholder structure

31. 30
Outlook FY 2015/16
 Management expects the satisfactory capacity utilisation to continue for the financial year
2015/16 provided that the macroeconomic environment remains stable and customer demand
continues at a good level.
 On the basis of the organic growth in the first nine months, an expected seasonality in the next
three months, management confirms its revenue guidance of EUR 740 million.
 Influenced by the expected costs of the start-up of the new plants in Chongqing, the EBITDA
margin should exceed 19% (guidance at the beginning of the financial year: 18-20%). This
includes an EBITDA margin in the core business at a similar level of the previous year.

32. 31
Company Overview
Strategy & Market
Annex
Financials
Table of Contents

33. 32
AT&S Product Portfolio
HDI
any-layer printed circuit
boards
HDI microvia printed
circuit boards – high
density interconnect
Multilayer printed
circuit boards
Double-sided printed
circuit boards
IMS printed circuit
boards – insulated
metal substrate
Further technological
enhancement to HDI
microvia: All electrical
connections in HDI any-layer
boards consist of laser-drilled
microvias. Advantage:
further miniaturisation, and
higher performance and
reliability. AT&S produces HDI
any-layer in 4 to 12 layers.
HDI: high
density interconnect,
meaning laser-drilled
connections (microvias).
HDI is first step
towards miniaturisation.
AT&S can produce 4-layer
laser PCBs up to 6-n-6
HDI multi layer PCBs.
Found in almost every area of
industrial electronics. AT&S
produces printed circuit
boards with 4 to 28 layers, in
quantities from individual
prototypes to small batches
and mass production.
Used in all areas of
electronics.
AT&S focuses on double-
sided printed circuit boards
with thicknesses in the range
of 0.1-3.2 mm.
IMS: insulated metal
substrate. Primary function:
heat dissipation for use
mainly with LEDs and power
components.
Production site
Shanghai Shanghai, Leoben Leoben, Nanjangud, Fehring Fehring, Nanjangud Fehring
Applications
Smartphones, Tablets,
Notebooks
Mobile phones and nearly all
electronic applications
including automotive
(navigation, infotainment and
driver assistance systems)
Used in all electronic
applications including touch
panels, and in products
ranging from aircraft to
motorcycles, from storage
power plants to solar arrays
Primarily industrial and
automotive applications
Lighting industry

34. 33
AT&S Product Portfolio
Flexible printed
circuit boards
Semi-flexible printed
circuit boards
Rigid-flex printed
circuit boards
Flexible printed circuit
boards on aluminium
AT&S patented
technologies
Used to replace
wiring and connectors,
allowing for connections
and geometries that are
not possible with rigid
printed circuit boards.
More limited bend radius
than flexible printed circuit
boards. The use of a
standard thin laminate
makes them a cost-effective
alternative.
Combine the
advantages of flexible
and rigid printed circuit
boards, yielding benefits
for signal transmission,
size and stability.
Used when installing LEDs
in car headlights, for
example, where the
printed circuit board is
bonded to an aluminium
heat sink to which the
LEDs are then attached.
Production site
Ansan, Fehring Fehring Leoben, Ansan Ansan
Applications
Nearly all areas of
electronics, including
measuring devices and
medical applications
Automotive applications Industrial electronics,
such as production
machines and industrial
robots
Lighting, automotive,
building lighting
ECP: Embedded
Component Packaging
ECP® is a patented AT&S packaging
technology used to embed
active and passive electronic
components in the inner layers
of a printed circuit board. ECP®
technology is used in
ever smaller, more efficient and
more powerful devices, such
as smartphones, tablets, digital
cameras and hearing aids.
Production site: Leoben
2.5D® Technology
Platform
Combines mechanical and
electronic miniaturisation, and
enables partial reduction of the
thickness of a circuit board.
Advantage: populated assemblies
have a thinner profile.
Can be also used to
make cavities in the printed circuit
board, e.g. for acoustic
channels. Major application
for this technology is the 2.5D®
rigid-flex printed circuit board,
a lower cost alternative for flex-to
install applications.
Production sites:
Leoben, Shanghai

35. Management
34
Andreas Gerstenmayer, CEO
 Joined AT&S as CEO in 2010
 Previous positions include:
 18 years of work experience at Siemens, including Managing Director with Siemens Transportation Systems
GmbH Austria and CEO of the Drive Technology business unit in Graz from 2003 to 2008
 Partner at FOCUSON Business Consulting GmbH after leaving Siemens
 Education and other positions:
 Member of the Research Council of Styria
 Degree in Production Engineering from Rosenheim University of Applied Sciences
Heinz Moitzi, COO
 COO since 2005; with AT&S since 19811)
 Previous positions include:
 Various management positions within AT&S
 Measurement engineer with Leoben University of Mining and Metallurgy
 Education:
 Degree from Higher Technical College of Electrical Engineering
Karl M. Asamer, CFO
 Joined AT&S as CFO in 2014
 Previous positions include:
 Managing Director of GEKA Group in Germany
 Managing Director of Sell GmbH in Germany
 Education:
 Degree: doctorate in business administration in Linz, Austria
1)He was already with the founding company of AT&S

36. 35
Milestones

37. Five core dimensions of sustainability within AT&S
Energy and
carbon footprint
Water
AT&S – a learning
organisationResources
Thinking ahead –
shaping the future
CSR gains importance in long term success
 Improving efficiency
 Motivated and qualified staff
CSR as a key to sustainable business success
36
The importance of sustainability is rising within:
 Authorities
(basis for securing operation licences)
 Customers
(relevant for placing orders)

38. AT&S saves CO2 and Water…
37
Sustainability – Figures and Fields of Action
AT&S aims to minimise its
environmental footprint by
reducing the CO2 emissions
per m2 PCB attributable to
production processes by 5%
a year.
AT&S aims to reduce
the Group‘s annual
fresh water
consumption per m2
PCB by 3%.
765.2
834.7
783.9
734.0
2011/12 2012/13 2013/14 2014/15
Freshwater consumption
In liters per sqm weighted PCB
1)
47.4
51.0
50.7
49.0
2011/12 2012/13 2013/14 2014/15
CO2-Footprint
1)
In kg per sqm weighted PCB
1) Since 2012/13 calculation according to EICC standards
before that AT&S internal calculation

39. Visit: www.ats.net; Twitter @AT&S IR_PR; YouTube AtundS
38
AT&S – first choice for advanced applications
IR Contact:
Elke Koch
Fabriksgasse 13,
8700 Leoben/Austria
Tel: +43 3842 200 5925
Mobile: +43 676 8955 5925
Fax: +43 3842 200 15909
e.koch@ats.net
www.ats.net

40. Disclaimer
39
This presentation is provided by AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, having its headquarter at Fabriksgasse 13, 8700 Leoben, Austria
(“AT&S”), and the contents are proprietary to AT&S and for information only.
AT&S does not provide any representations or warranties with regard to this presentation or for the correctness and completeness of the statements contained therein,
and no reliance may be placed for any purpose whatsoever on the information contained in this presentation, which has not been independently verified. You are
expressly cautioned not to place undue reliance on this information.
This presentation may contain forward-looking statements which were made on the basis of the information available at the time of preparation and on management‘s
expectations and assumptions. However, such statements are by their very nature subject to known and unknown risks and uncertainties. As a result, actual
developments, results, performance or events may vary significantly from the statements contained explicitly or implicitly herein.
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