Gateway Hardware Design and Implementation

1. WP1
Gateway HW Design & Implementation
LEADER: EUROTECH
INVOLVED PARTNERS: ATOS, SKYWATCH, BIOASSIST,
MOBISTAR, LIBELIUM
AGILE MEETING, 20-21 July 2016, Berlin DE

2. WP1 Objectives (recap)
Main objective:
specification, design and implementation of the hardware
of the modular gateway.
The modular gateway:
• will be available in two versions:
• the “makers” version based on RaspberryPi;
• the industrial version with a new HW design based on Intel architecture.
• will be based on a set of core and expansion modules:
• core modules: carrier module, cpu module, the storage module or the power supply,
etc.;
• extension modules: the communication modules, sensing modules, etc..
AGILE KICK-OFF MEETING, 12-14 January 2016, Trento IT

3. WP1 Objectives (recap 2)
Address two levels of modularity:
• modularity for existing HW: an expansion module (shield) allows the RPi to
be extended with new modules;
• intrinsic modularity: in the industrial gateway any architectural element is a
module.
Hardware module interoperability:
❓ identify the HW technologies that simplify and promote interoperability;
❓ specify a set of rule to follow during modules design and development.
Hardware prototypes development:
• Implement a set of prototypes of the “makers” gateway;
• Implement a set of prototypes of the industrial gateway;
• implement a set of expansion modules that will be adopted in the pilots.
AGILE KICK-OFF MEETING, 12-14 January 2016, Trento IT

4. WP1 - Status
T1.1 Definition of the design and development methodology concluded.
Elicitation of requirements and specifications definition for both
gateway have been concluded.
T1.2 First version of the Makers Gateway design concluded. First set of
prototypes available.
T1.3 Design of industrial Gateway: ongoing. First samples of the carrier
module and of the enclosure available.
Next deadlines:
◦ MS1 - AGILE Initial Design MS1 & Draft Framework Release (M9)
◦ Initial design of the AGILE platform (SW and HW) and release of a draft version of the AGILE framework (sw and
basic hw built on existing prototyping platforms).
◦ D8.1 - Pilot Design and analysis requirements and specification
◦ Contribution to deliverable editing.
AGILE KICK-OFF MEETING, 12-14 January 2016, Trento IT

5. WP1 - Timeline
• D1.1 - AGILE Gateway architecture specifications and initial design (SUBMITTED)
Gateway requirements, design specification and initial architectural design for both the industrial and makers version.
• D1.2 - AGILE Gateway hardware final prototypes 2nd AGILE Release – Hardware Platform
Final designs, features and functional specifications of the hardware prototypes. Delivery of the final AGILE Gateway prototypes.
• MS1 - AGILE Initial Design MS1 & Draft Framework Release
Initial design of the AGILE platform (SW and HW) and release of a draft version of the AGILE framework (sw and basic hw built on existing prototyping
platforms).
• MS2 - AGILE Framework (SW and HW) release & Initial Integration
Delivery of the AGILE platform (software components, makers and industrial gateway prototypes) and the initial integration of the software components.
AGILE KICK-OFF MEETING, 12-14 January 2016, Trento IT

6. Design methodology
Design for modularity (DFM): DFM follows the emerging trend in HW
design and manufacturing known as “Build to Order”.
◦ BTO products are not built until a confirmed order for products is received.
◦ We extend BTO also to the design phase (not only manufacturing).
◦ Traditionally, BTO is the most appropriate approach used for highly
customized or low volume products.
◦ DFM allows to map a custom design in a design based on standard modules!
DFM has been applied to the design of the industrial gateway:
◦ definition of the reference design;
◦ definition and implementation of a general purpose consolidated design;
◦ definition and implementation of a vertical consolidated design (the
monitoring station, Pilot C).

7. Requirements
Requirement elicitation is based on:
◦ partners expertise,
◦ study of pilots.
On pilots side, the elicitation has been inspired maily by Pilots A, C and D:
◦ the requirements identified in Pilot B and E, will be integrated in D8.1;
◦ the final version of the gateways (M18) will consider also these requirements.
Three main categories of requirements has been identified:
◦ makers gateway specific requirements;
◦ industrial gateway specific requirements;
◦ shared requirements.

8. WP1 - Makers gateway
AGILE KICK-OFF MEETING, 12-14 January 2016, Trento IT
FIRST DESIGN
•Architecture & Configuration defined
•Shield for Raspberry Pi in design
• First prototype available
• 2 modules to be plugged on top of Rasp Pi
• Raspberry Pi GPIOs accessible for sensors
•Hot Swap à Allowed by pressing button
• The gateway is able to recognize which module (among the list of supported
modules) has been plugged

9. WP1 - Makers gateway
AGILE KICK-OFF MEETING, 12-14 January 2016, Trento IT
FIRST DESIGN

10. WP1 - Makers gateway
AGILE KICK-OFF MEETING, 12-14 January 2016, Trento IT
FIRST DESIGN
•CONNECTIVITY
• Raspberry Pi 2
• 2 modules to be plugged
• Wifi & 3G/4G à USB Dongle
• Raspberry Pi 3
• 2 modules to be plugged
• Wifi & Bluetooth Low Energy à included in Raspberry
• 3G/4G à USB Dongle

11. Makers gateway architecture
- Two communication sockets – Xbee form factor with UART and SPI.
- Hot swap of the radios using a push button and a dedicated LED
- External power source selectable between the Raspberry or external DC source
- Debug LEDs to allow knowing the current state by visual inspection.

12. Makers gateway meets the
Raspberry Pi HAT specification
Dimensions meet the requirements in
the HAT specification
EEPROM memory added to store
vendor info and GPIO usage
- The shield uses a 40 pin female connector to allow a physical connection with the Raspberry Pi
- Raspberry Pi GPIOS are physically accessible from the user.

13. WP1 - Makers gateway
AGILE KICK-OFF MEETING, 12-14 January 2016, Trento IT

14. Makers gateway specifications
Feature Description Requirement Reference
Power
Nominal input power 5V DC pin from Raspberry
Pi
ID_HW_52 External input power 5V to 20 V DC supply
Consumption < 100mA without radio
modules
Radio sockets
Communication UART and SPI ID_HW_1,
ID_HW_3,
ID_HW_10,
ID_HW_47,
ID_HW_48,
ID_HW_60,
ID_HW_61
Power 3V3
Form factor Xbee form factor
I/O interfaces
UART Two multiplexed UARTs ID_HW_1,
ID_HW_3,
ID_HW_10,
ID_HW_47,
ID_HW_48,
ID_HW_53,
ID_HW_54,
ID_HW_55,
ID_HW_58
ID_HW_60,
ID_HW_61
SPI Two SPI modules allowed
General I/O All Raspberry GPIO
available
Environment
Operating temperature -20 to +50 ºC ID_HW_5
Storage temperature -40 to +85 ºC
Dimensions Size According HAT
specification
ID_HW_4,
ID_HW_57
On board temperature
sensor
Operational range -40 ~ +85 ºC
ID_HW_12,
ID_HW_51
Full accuracy range 0 ~ +65 ºC
Accuracy ±1 ºC (range 0 ºC ~ +65
ºC)
Response time 1.65 seconds (63%
response from +30 to
+125 °C).
Typical consumption 1 μA measuring
On board Humidity
sensor
Measurement range 0 ~ 100% of Relative
Humidity (for
temperatures < 0 °C and
> 60 °C see figure below)
ID_HW_12,
ID_HW_51
Accuracy < ±3% RH (at 25 ºC, range
20 ~ 80%)
Hysteresis ±1% RH
Operating temperature -40 ~ +85 ºC
Response time (63% of step 90% to 0%
or 0% to 90%): 1 second
Typical consumption 1.8 μA measuring
Maximum consumption 2.8 μA measuring
On board Pressure
sensor
Measurement range 30 ~ 110 kPa
ID_HW_12,
ID_HW_51
Operational temperature
range
-40 ~ +85 ºC
Full accuracy
temperature range
0 ~ +65 ºC
Absolute accuracy ±0.1 kPa (0 ~ 65 ºC)
Typical consumption 2.8 μA measuring
Maximum consumption 4.2 μA measuring
On board ADC
Accuracy 18-Bit
ID_HW_51
Channels Up to 4 channels
On board voltage
reference
2.048V
I/O interface I2C
Power 3V3
Programmable data rate From 3.75 to 240 SPS
• On board ADC
• On board Temperature, Humidity
and Pressure sensor

15. Industrial modular gateway:
requirements
Status:
◦ industrial gateway reference design defined;
◦ general purpose industrial gateway consolidate design:
◦ design defined;
◦ implementation ongoing;
◦ first samples of the carrier and of the modular enclosure available expected for the 27/7;
◦ first prototypes should be available by the end of 2016.
◦ vertical consolidated design (monitoring station, Pilot C):
◦ a very preliminary version defined;
◦ the final design and the prototypes will be available for M18.

16. Industrial Gateway reference
design

17. Preliminary monitoring station
consolidated design

18. Industrial gateway block
diagram

19. Industrial gateway renderings

20. Industrial Gateway Modules
CPU Module:
◦ Intel Atom BayTrail or Apollo Lake families
◦ 10W TDP Class CPU
◦ COM Express Type 10
Board Management Module BMM:
◦ 32 Bit Microcontroller
◦ Manages system and modules status and related transitions (cold boot,
warm boot, low power states such as suspend or hybernate).
◦ Manages system maintenance, e.g.:
◦ secure update,
◦ auto test,
◦ extended input wakeup & suspend,
◦ special features like injection sensing, timed procedure, etc.

21. Industrial Gateway Modules (2)
Storage module:
1. storage integrated in the CPU module, e.g. eMMC Flash, SATA SSD
(e.g. it is used in high rugged and reliable system to avoid vibration
issue).
2. Internal expansion, e.g. mSATA SSD Drive or SD Memory Card.
3. External storage module, e.g. HDD/SDD Disk with optional Drive Bay.
AUX I/O Module (e.g. PoE or panel display backlight): these modules
have a power absorption that is not supported by the carrier and must
be connected directly to the power supply module. The I/O modules are
powered by the carrier.

22. Industrial Gateway Modules (3)
I/O Expansion modules:
◦ they generate the signal that must be available on the external panel;
◦ implement I/O functionalities for a specific vertical;
◦ provide connectors for a specific vertical;
◦ allows to customize the external connections.
◦ Examples:
◦ BUS converter
◦ Expander, e.g. I2C-> 10 GPIO
◦ Isolated and protected I/O
◦ Special functions like a particular
field bus for a Scada application.
I/O
Expansion
Module
USB
EXTERNAL PANEL
3xRS485
Ethernet RJ45
ML2
MIL

23. Industrial Gateway Modules (3)
User I/O Modules: it can be an external module or a set of functionalities
implemented in the carrier. It’s cheaper than I/O expansion and satisfies
mechanical requirements.
◦ SD Memory Card.
◦ Test, debug and development interfaces.
◦ Maintenance interfaces.
◦ Legacy interfaces, like mouse and keyboard.
I/O Modules for fieldbus:
◦ integrated, provided by the CPU module or by the BMM, e.g. CANBus;
◦ internal expansion module, providing potentially any kind of fieldbus.
Power module: it can be integrated or external and provide a wide range
power for multiple domain application (24V-110V).
◦ Insulated and/or protected version available.
◦ Support for tensions lower than the nominal range (e.g. for automotive).
◦ Designed for EN50155, MIL-STD, FCC, CE.

24. Industrial gateway preliminary
specifications
Feature Description
Ref.
Requirements
PROCESSOR CPU
Intel Atom BayTrail (E3845, 1.91GHz, 4
cores)
GW_6,
GW_22,
GW_38
MEMORY RAM Up to 4GB 1333 MHz DDR3L
GW_7,
GW23
STORAGE
Embedded storage Up to 8GB eMMC
GW_8,
GW_24,
GW_38SATA
1x mSATA
1x SATA II
Removable
storage
Micro SD slot (service panel)
optional Removable Drive Bay
GW_25
I/O INTERFACES
Wired
networking
2x Indipendent Gb Ethernet
(10/100/1000) auto-sensing
GW_1,
GW_26,
GW_19
USB
1x USB 2.0, 1x USB3.0
1x USB 2.0 (service panel)
Noise and surge protected
GW_27,
GW_19,
GW_20,
GW_34
Serial
1x RS-232 (5 wires) optoisolated,
up to 3x RS-485/RS-422 configurable
optoisolated,
1x console (service panel)
Fieldbus
Integrated 1x CANBus 2.0B;
other fieldbus standard supported by
miniPCIe cards
Generic
programmable
I/O
Up to 8 digital optoisolated and
protected lines: 3x In, 3x Out
1x system on remote ctrl
GW_28,
GW_19
Video
Default: 1x mini Display Port (service
panel)
custom option for 2nd video LVDS,VGA
or HDMI
GW_29,
GW_19,
GW_20,
GW_34
Audio
1x Line IN stereo, 1x Line OUT stereo
or optional integrated MIC and Speaker
(2W)
GW_31,
GW_19
OTHER
RTC Ultra low power RTC
GW_32
RTC backup > 1 month
Watchdog Yes, CPU module independent GW_33
Non volatile User
Memory
Serial EEPROM GW_34
TPM Optional GW_21
Programmable
button
Yes (service panel) GW_34
SIM support 1x micro SIM slot (service panel) GW_35
INTEGRATED
SENSORS
GPS
Yes. Options:
integrated high sensitivity receiver; up
to 3 concurrent GNSS
(GPS, Galileo, GLONASS, BeiDou)
with external antenna;
external module;
GW_18
System
temperature
Operating temperature range
temperature sensor
GW_14
Accelerometer Two or three axes GW_14
INTERNAL
EXPANSIONS
High speed
Expansion
Interface
Rugged Board to Board connector
PCI express Gen 2.0 1x 1-lane
SATAII port, USB2, Ctrl, Pwr
GW_10,
GW_11,
GW_12,
GW_27,
GW_37,
GW_38,
GW_19
miniPCIe Slots
3x independent miniPCIe slots
one slot mSATA compatible
POWER
Nominal power
Input
110-220 V AC or 12-24 V DC protected
not isolated
GW_40,
GW_16Power
Consumption
<50W Max

25. Industrial gateway preliminary
specifications (2)
ENVIRONMENT
Operating
Temperature
-20 to +50 °C
GW_4,
GW_5,
GW_39,
GW_41,
GW_42
Storage
Temperature
-40 to +85 °C
Humidity 0 to 95% non-condensing
Dimensions
reference
design
Form factor Rugged BOX PC
Width x Depth x
Height
< 140x260x70 mm
Weight < 3.0 Kg
Thermal solution Fanless, conductive cooling
DESIGNED FOR
CERTIFICATIONS
Regulatory
CE, FCC,
EN45545 (fire&smoke)
GW_13,
GW_43
Safety UL 60950
Environmental
RoHS2
REACH
Radio RED
Cellular
Carrier Specific, External antenna
design
Ingres
Protection
IP 65

26. Thanks for the attention.
That’s all folks.