Complete the PEM Assembly Flow using the processes listed below Wafer rightarrow rightarrow rightarrow rightarrow rightarrow rightarrow rightarrow Ship Wafer Encapsulation Wire Bond Deflash Ship Trim/Form Dice Die Attach Solution Order of processes is as follows: (a) Wafer (g) Dice (h) Die Attach (c) Wire Bond (b) Encapsulation (d) Deflash (f) Trim/Form (e) Ship.