An loT-operated wheelchair seminar abstract would likely focus on the application of Internet of Things (IoT) technology to enhance the functionality and independence of wheelchairs, particularly for individuals with disabilities. The abstract would highlight how loT enables remote monitoring, control, and even autonomous navigation of wheelchairs via smartphones or other devices, ultimately improving the user's quality of life. Here's a more detailed breakdown of what such an abstract might cover: Key Areas: Problem Statement: The abstract would begin by outlining the challenges faced by individuals with mobility impairments and the limitations of traditional Home Search Notifications Activity

1. VLSI Design and Fabrication
• An Overview of Very Large Scale Integration
• Presented by: [Your Name]
• Date: [Date]

2. Introduction to VLSI
• • VLSI (Very Large Scale Integration) integrates
millions of transistors on a chip.
• • Powers compact, high-performance
electronics.
• • Evolution: SSI → MSI → LSI → VLSI → ULSI.

3. VLSI Design Flow
• 1. Specification
• 2. Architecture Design
• 3. RTL Design (HDL)
• 4. Logic Synthesis
• 5. Verification & Simulation
• 6. Physical Design
• 7. Fabrication
• 8. Testing & Packaging

4. Design Domains
• • Behavioral Domain – Algorithm-level design
• • RTL Domain – Register Transfer Level
• • Gate Level – Logic gates
• • Layout Level – Mask layout

5. Fabrication Process Overview
• 1. Wafer Preparation
• 2. Oxidation
• 3. Photolithography
• 4. Etching
• 5. Doping (Ion Implantation)
• 6. Metallization
• 7. Packaging

6. Photolithography Process
• • Coat wafer with photoresist
• • Mask alignment & UV exposure
• • Develop to remove exposed areas
• • Transfers transistor patterns

7. CMOS Technology
• • Uses NMOS and PMOS
• • Low power and high noise immunity
• • Ideal for scaling and integration

8. Challenges in VLSI
• • Power consumption
• • Heat dissipation
• • Timing closure
• • Yield and defects
• • Process variation

9. Applications of VLSI
• • Microprocessors and microcontrollers
• • ASICs for communication
• • Embedded systems
• • AI/ML accelerators
• • IoT devices

10. Conclusion
• • Backbone of modern electronics
• • Involves design, testing, fabrication
• • Continual innovation in technology nodes
(e.g., 7nm, 3nm)