SST International is a world leader in package assembly that has been in business since 1978. They design and build vacuum/pressure furnaces for microelectronic component assembly. Their systems provide void-free solder joints in a flux-free environment. SST takes a solution-directed approach, partnering with customers to customize turnkey solutions for their microelectronic package assembly needs. Their systems are used for applications like eutectic die bonding, solder reflow, component assembly, and more. They produce a wide range of microelectronic packages.