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Semiconductor
Device Company
Purchasing Profile
Bill Kohnen

A general model for a
midrange company in size
and technology
General Comments
   Total purchase spend for semiconductor
    producers is over 50% of revenue
   Companies with Fabs of course spend more
    directly on front end capital and materials
    than fab lite or fabless companies.
   Focus of Purchasing may vary at Fab v.
    fabless but costs still impact with any model
    Labor portion of front and back end NOT
    addressed specifically
Broad Categories
            Category



      27%
                       Front End
                       Backend
               53%
                       Indirect
      20%
What Makes Up Front End
                     New Equipment
    3%
          9%
                     Silicon
    8%
                     Chemical and gas
   10%
                     Photomask
               59%
    11%              Quartzware

                     Equipment Spares and
                     Maintenance
Comment on Front End
   New equipment of course varies depending on
    semiconductor business cycle and need for
    additional capacity
   Technology and new process equipment
    generally make up 10% to 20% of equipment
    spend
   Silicon, Chemicals, gas and Quartzware are driven
    by utilization but at a baseline level of operations
    the absolute spend drops at a max of 50%.
   Photomask spend can be a leading indicator of
    growth although there is also some baseline level
    of replacement and repair spending
What Makes Up Backend
                 Column1
        6% 4%
                           Equipment
    7%                     Direct materials
                 39%       Test and Burn In Boards
   9%
                           Kits, Contactors

   12%                     Trays, Tubes,Tape,Film
                           Spares
                           Shipping Materials
           23%
Comment on Backend
 Equipment   needs more volatile
 Materials overall also subject to baseline
  levels but variation also driven by various
  package types – not seen in front end
 Tubes, tray, Film depends on product and
  customer demand
 Spares can be higher if older machines
  used
 Shipping supplies demand driven
Front end vs. Backend
Item        Front End             Back End


Equipment   Less Competition      More opportunity
            Used and              for savings.
            refurbished market    Negotiations, taking
            opportunities         excess FG, Lots of
            Generally build to    demo, competitive
            order. High level     bidding
            technology driven
            sales and decision
            process
Materials   Unless self imposed   Can be limited
            spec there is more    competition based
            competition           on low volume for
            between suppliers     materials and
                                  package tapes
Front end vs. Backend
Item               Front End              Back End


Equipment Spares   In downturn more       More variety in
and Maintenance    likely to be reduced   backend and older
                   as systems idled.      systems generally
                   Still in some cases    creates more
                   tech support           inventory and
                   outsourced             complexity.
                                          Constraints on
                                          service frequent.
Shipping and       Clean room             Very competitive
Handling items     requirements tens to   with multiple
                   drive costs although   suppliers. Some
                   more competition in    total cost benefit
                   this space             benefit for local
                                          support
What Makes up indirect
          7%          Healthcare
     8%         24%   Facilities
   10%                IT
                      Consulting
   12%                Marketing
                22%   General Admin
          17%         Travel
Comment on Indirect Spend
 Indirect spend includes more specific
  categories
 The spend is not typically centralized
 Company culture has greater impact
 Often focus of indirect spend is on
  efficiency
 Semiconductor industry has not derived
  savings other industries have in this area
Adjustments
 Model  is for a mid sized mid range
  technology company in normal growth
  part of cycle
 For high end process technology and
  volume equipment may be adjusted
  higher (Microprocessor, Memory)
 For mature lower end technology lower
  equipment portion (Discrete, Some
  Analog)

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Semiconductor Device Company Purchasing Profile

  • 1. Semiconductor Device Company Purchasing Profile Bill Kohnen A general model for a midrange company in size and technology
  • 2. General Comments  Total purchase spend for semiconductor producers is over 50% of revenue  Companies with Fabs of course spend more directly on front end capital and materials than fab lite or fabless companies.  Focus of Purchasing may vary at Fab v. fabless but costs still impact with any model  Labor portion of front and back end NOT addressed specifically
  • 3. Broad Categories Category 27% Front End Backend 53% Indirect 20%
  • 4. What Makes Up Front End New Equipment 3% 9% Silicon 8% Chemical and gas 10% Photomask 59% 11% Quartzware Equipment Spares and Maintenance
  • 5. Comment on Front End  New equipment of course varies depending on semiconductor business cycle and need for additional capacity  Technology and new process equipment generally make up 10% to 20% of equipment spend  Silicon, Chemicals, gas and Quartzware are driven by utilization but at a baseline level of operations the absolute spend drops at a max of 50%.  Photomask spend can be a leading indicator of growth although there is also some baseline level of replacement and repair spending
  • 6. What Makes Up Backend Column1 6% 4% Equipment 7% Direct materials 39% Test and Burn In Boards 9% Kits, Contactors 12% Trays, Tubes,Tape,Film Spares Shipping Materials 23%
  • 7. Comment on Backend  Equipment needs more volatile  Materials overall also subject to baseline levels but variation also driven by various package types – not seen in front end  Tubes, tray, Film depends on product and customer demand  Spares can be higher if older machines used  Shipping supplies demand driven
  • 8. Front end vs. Backend Item Front End Back End Equipment Less Competition More opportunity Used and for savings. refurbished market Negotiations, taking opportunities excess FG, Lots of Generally build to demo, competitive order. High level bidding technology driven sales and decision process Materials Unless self imposed Can be limited spec there is more competition based competition on low volume for between suppliers materials and package tapes
  • 9. Front end vs. Backend Item Front End Back End Equipment Spares In downturn more More variety in and Maintenance likely to be reduced backend and older as systems idled. systems generally Still in some cases creates more tech support inventory and outsourced complexity. Constraints on service frequent. Shipping and Clean room Very competitive Handling items requirements tens to with multiple drive costs although suppliers. Some more competition in total cost benefit this space benefit for local support
  • 10. What Makes up indirect 7% Healthcare 8% 24% Facilities 10% IT Consulting 12% Marketing 22% General Admin 17% Travel
  • 11. Comment on Indirect Spend  Indirect spend includes more specific categories  The spend is not typically centralized  Company culture has greater impact  Often focus of indirect spend is on efficiency  Semiconductor industry has not derived savings other industries have in this area
  • 12. Adjustments  Model is for a mid sized mid range technology company in normal growth part of cycle  For high end process technology and volume equipment may be adjusted higher (Microprocessor, Memory)  For mature lower end technology lower equipment portion (Discrete, Some Analog)