James Dale is an experienced semiconductor professional seeking full-time employment utilizing his expertise in moving products from R&D to volume production. He has over 30 years of experience in the semiconductor industry, specializing in production line and yield management. His most recent roles include Process Integration Manager at FLIR Systems, where he led yield improvement efforts and technology roadmapping, and Senior Process Development Engineer, where he developed production methods and qualified new processes. He holds multiple patents related to uncooled infrared detection technology.

1. James L. Dale
116 Gerard Drive
Goleta, CA 93117
(805) 450-7210
An experiencedsemiconductorprofessional seekingfull timeemploymentwithanorganization
that can fullyutilizemyexpertiseinmovingnew productsandprocessedfromR&Dintovolume
production.Mystrengthsare productionline andyieldmanagement.Istartedinthe semiconductor
businessin1985 at Micron Technology.Atthattime there were only600 employees.We hadverypoor
qualityandhad to learnanddevelopwhatisnow calledSix Sigmapracticesonourown.Twentyyears
laterthe companyhad over12,000 employeesandmanufacturinglinesacrossthe worldwithacapacity
of over50,000 wafersa week.
I am proficientwithall MicrosoftOffice products,JMPstatistical analysissoftware,andhave
recentlystartedusingCoventorMEMsFinite Elemental Analysissoftware.
Referencesavailable onrequest.
Work Experience
2016 - Present FLIR Systems – Process IntegrationManager
Managementof an engineeringgroupresponsible foryield improvementof waferbased
processesforuncooledinfraredproducts.Create andexecutethe uncooledtechnology
roadmap.Thisincludesworkingwithfoundriesandequipmentsuppliestoplancapital
spendingtomeetthe yieldandcosttargetsfor all uncooledproducts.
2009 – 2016 FLIR Systems – Senior ProcessDevelopmentEngineer
Responsibilitiesincludefoundry engineeringsupportandyieldimprovementforall
uncooledinfraredproducts.ResearchandDevelopmentof new uncooledIRdetection
technologies.Leadpixel processdesignengineerforuncooledIRproducts.
Major Accomplishments:DevelopedaproductionmethodforVanadiumOxide
depositionthatgreatlyimproveswaferto waferrepeatability,waferthroughput, and
eliminationof reworks.
Successful development,qualification,andproductionrampof a 12um microbolometer
processwithin18 months.
Co-Inventoronmultiple patentsrelatedtouncooledIRdetectionprocesstechnology
and pixel design.
2007 – 2009 AMIS and ON Semiconductor- TechnologyResearch and DesignEngineer

2. Responsibilitiesincludedtransfer,startup,andqualificationof proprietaryprocess
technologyinON Semi productionlines. Foundrycustomersupporttechnical contact.
TechnologyleadforDefenseDepartmentresearchprojectsrelatedtoprocess
technology.
Major Accomplishments:Successful processtransferandqualificationof a25um
microbolometerprocess.
1985 – 2007 Micron Semiconductor– ProcessIntegration Engineer, Adv.DRAM Group,and
others.
2003 – 2007: SeniorProcessIntegrationEngineer(AdvancedDRAM) –Responsiblefor
developmentandqualificationof 78nmDRAMtechnology.Workedwithateamof
elevenengineersandtechnicianstodevelopa78nm DRAMprocesstechnologyon
200mm substratesandthentransferand qualifythe processattwolocationson300mm
substrates.Projectcompletedsix monthsaheadof schedule,first300mmproduction
wafersachievedyieldsof 90%.
Major Accomplishments:
Co-author for VLSIpaper“A 78nm 6F2
DRAMtechnologyformultigigabitdensities”
2002 – 2003: ProcessIntegrationEngineer(Japan)–Responsible fortransferand
qualificationof 0.13um 8 feature squaredand6 feature squaredDRAMarchitecturesto
the Japan productionline.
Major Accomplishments:Determinedroot cause of variable retentiontimefailures
whichdelayedproductionqualificationbysix months.
1995 – 1998: PlasmaEtch SectionManager(R&D DRAMpilotproductionline) –
Responsible forall aspectsof R&D plasmaetcharea.Managed a staff of 30+ processand
equipmentengineers,andtechnicians.
Major Accomplishments:Establishedequipmentandprocessmonitoringmethodsinthe
newlyestablishedR&Dpilotproductionline.Thisbecame the benchmarkforall other
processsections.
1998 – 2001: ProcessIntegrationEngineer(TechnologyTransfer) –Responsiblefor
transferringandqualifyingMicrons’DRAMprocesstechnologyto3 newlyacquired
semiconductorfabsfromTexasInstruments.
Major Accomplishments:Successful transferandqualificationof 0.21um, 0.18um, and
0.15um DRAMtechnologies.Became the worldwideresource forprocessimprovement
for all five productionlines.
1992 – 1994: Photolithography ManufacturingEngineer–Responsibleformaintaining
photolithographyandmetrologywhileonshift.

3. 1987-1991: PlasmaEtch Engineer– Responsible formaintainingthe plasmaetch
productionline while onshift.ShiftLeadfrom1989-1991.
Major Accomplishments:Developedaplanarizationprocessthatenabled1ummetal
pitchfor SRAMproducts.
Establishedspecsforall productionandmaintenance proceduresinplasmaetchthat
enabledISO9000 certification.Establishedprocesscontrol methodsandreactionsforall
plasmaetchprocesses.(Scrapwasreducedby~10% in the plasmaetcharea)
1985 – 1986: WetProcess EquipmentEngineer–Responsibleforequipment
maintenance.
Major Accomplishments:Establishedproductionandmaintenance proceduresthat
enableda60% reductionof spinrinse dryersrequiredforthe productionline.