Michael Dietz is an electrical and computer engineering student at the University of Illinois, graduating in May 2015 with a 3.7 GPA. He has interned at Intel and Grain Processing Corporation, focusing on automation and process control. His interests include big data, wearable technology, and he is involved in various campus and community activities.

1. 515 Bash Ct. Apt. #20
Champaign, IL 61820
(630) 649-0898
mjdietz2@illinois.edu
MICHAEL DIETZ
EDUCATION UNIVERSITY OF ILLINOIS – URBANA CHAMPAIGN (UIUC)
Electrical and Computer Engineering (Graduating May 2015)
3.7 Cumulative GPA
SKILLS & ABILITIES Software: C++, Python, C, VBA, Java, Assembly
Hardware: RTL, SystemVerilog, VHDL, ModelSim, SoC, FPGA
Interests: Big Data, Wearable Technology, Internet of Things, Maker
EXPERIENCE FACILITY ELECTRICAL ENGINEER INTERN | INTEL CORPORATION
May 2014 – August 2014, Hillsboro, OR
 Worked closely with other engineers in my group to automate
all excel workbooks to eliminate repetitive manual tasks.
 Wrote scripts which supported the shakedown of a new factory.
 Updated documentation of an entire factories power
distribution.
CONTROLS AND INSTRUMENTATION INTERN | GRAIN PROCESSING CORPORATION
May 2013 – August 2013, Muscatine, IA
 Built GUI’s for Programmable Logic Controllers which operators used to control
factory processes from a computer.
 Developed a general program to calculate HVAC loads in switch rooms.
 Automated inefficient data entry processes engineers had been doing for years.
CAMPUS/COMMUNITY
INVOLVEMENT
 Intramural Boxing Club
 Track & Field Club
 Work with under privileged kids in a “Beat the Streets”
community boxing gym.
 Worked with Urbana’s Sustainability Division to start a
composting program in local middle schools.
 Sigma Alpha Lambda national leadership and honors fraternity.
PROJECTS  Ask me about some of the projects I’ve completed and the ones
I’m currently working on!

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