This document provides a simulation of a PWM IC spice model and includes:
1) A circuit diagram of the evaluation circuit used for simulation with the PWM IC, capacitor, resistor, and oscillator components.
2) Waveform charts showing the output of the oscillator, voltage at the CS pin, and voltage at the DT pin over time.
3) An explanation that the simulation results are for the spice model of the PWM IC and evaluation circuit shown in the diagram.
Location of Siam Bee Technologies Co.,Ltd. LocationTsuyoshi Horigome
Siam Bee Technologies Co.,Ltd. is located at #1305 BB Bldg.54 Sukhumvit 21 (Asoke)Rd. ,Bangkok,10110 Thailand. The company is headed by Tsuyoshi Horigome of the Device Modeling Laboratory. The document provides the name and address of a company in Thailand.
This document describes a simplified SPICE behavioral model for simulating fuse behavior. The model allows users to set parameters like current rating, fusing factor, internal resistance, and melting value based on datasheet specifications. Simulation results show fusing time varies with DC current level and different current waveforms based on I2t heating effects. A specific fuse model tailored for a part provides more accurate fusing time predictions than the general model.
The document discusses the development of silicon carbide power devices such as SiC MOSFETs and SiC JFETs. These devices offer several advantages over traditional silicon devices, including the ability to operate at higher temperatures, voltages, and switching frequencies. The document outlines the historical development and commercialization of SiC power devices from 2011 through 2020.
The document appears to be notes from a meeting held on May 13, 2015. It includes the date of the meeting and a brief title or description of "2015/05/13 - ." The limited information provided does not allow for a more detailed 3 sentence summary.
This document describes a simplified SPICE behavioral model for simulating the input-output characteristics of a DC/DC converter. The model focuses on the input-output relationships rather than detailed circuitry, allowing faster system-level simulations. Key parameters like efficiency, input and output voltages can be set to represent different converter specifications. The model enables transient and DC sweep analysis to observe output voltage and efficiency variations with changing input voltage.
Device Modeling of Diode 3-type SPICE Models by Bee TechnologiesTsuyoshi Horigome
This document discusses diode device modeling and compares three levels of modeling technology - professional, standard, and easy. The professional model uses complex equivalent circuit modeling and accounts for both turn-on and turn-off transition times. The standard model models transition times separately and uses simpler equivalent circuits. The easy model only models one transition time and uses basic device parameters.
This document provides a simulation of a PWM IC spice model and includes:
1) A circuit diagram of the evaluation circuit used for simulation with the PWM IC, capacitor, resistor, and oscillator components.
2) Waveform charts showing the output of the oscillator, voltage at the CS pin, and voltage at the DT pin over time.
3) An explanation that the simulation results are for the spice model of the PWM IC and evaluation circuit shown in the diagram.
Location of Siam Bee Technologies Co.,Ltd. LocationTsuyoshi Horigome
Siam Bee Technologies Co.,Ltd. is located at #1305 BB Bldg.54 Sukhumvit 21 (Asoke)Rd. ,Bangkok,10110 Thailand. The company is headed by Tsuyoshi Horigome of the Device Modeling Laboratory. The document provides the name and address of a company in Thailand.
This document describes a simplified SPICE behavioral model for simulating fuse behavior. The model allows users to set parameters like current rating, fusing factor, internal resistance, and melting value based on datasheet specifications. Simulation results show fusing time varies with DC current level and different current waveforms based on I2t heating effects. A specific fuse model tailored for a part provides more accurate fusing time predictions than the general model.
The document discusses the development of silicon carbide power devices such as SiC MOSFETs and SiC JFETs. These devices offer several advantages over traditional silicon devices, including the ability to operate at higher temperatures, voltages, and switching frequencies. The document outlines the historical development and commercialization of SiC power devices from 2011 through 2020.
The document appears to be notes from a meeting held on May 13, 2015. It includes the date of the meeting and a brief title or description of "2015/05/13 - ." The limited information provided does not allow for a more detailed 3 sentence summary.
This document describes a simplified SPICE behavioral model for simulating the input-output characteristics of a DC/DC converter. The model focuses on the input-output relationships rather than detailed circuitry, allowing faster system-level simulations. Key parameters like efficiency, input and output voltages can be set to represent different converter specifications. The model enables transient and DC sweep analysis to observe output voltage and efficiency variations with changing input voltage.
Device Modeling of Diode 3-type SPICE Models by Bee TechnologiesTsuyoshi Horigome
This document discusses diode device modeling and compares three levels of modeling technology - professional, standard, and easy. The professional model uses complex equivalent circuit modeling and accounts for both turn-on and turn-off transition times. The standard model models transition times separately and uses simpler equivalent circuits. The easy model only models one transition time and uses basic device parameters.
The document appears to be notes from May 13, 2015 about something new. It includes a date, the word "NEW", and a file path indicating it may be meeting notes or a memo from that date.
This document describes a simplified SPICE behavioral model for simulating the input-output characteristics of a DC/DC converter. The model focuses on the relationships between input voltage, output voltage, and efficiency rather than detailed circuitry. It allows faster system-level simulations compared to cycle-to-cycle models. Parameters like output voltage, efficiency, and minimum/maximum input voltages can be adjusted to specify different converter designs. The document provides an example model and shows how to simulate the input-output characteristics.
The document describes a simplified SPICE behavioral model for simulating the behavior of fuses in circuits. The model allows users to set parameters like current rating, fuse factor, internal resistance, and normal melting value to simulate how long it takes a fuse to blow under different current conditions. Simulation results are presented demonstrating how fusing time varies based on steady direct current levels and different current waveforms providing the same peak current. Instructions are provided on installing the model libraries and symbols for use in SPICE simulations.
This document provides a list of 4,412 models of electronic components from various manufacturers. It includes semiconductors, passive parts, batteries, mechanical parts, motors, lamps, and power supplies. For each component type, the document specifies the manufacturer, part number, model, thermal characteristics, and last update. It appears to be a comprehensive parts list from a company called Siam Bee Technologies for their SPICEPARK component library.
This document provides a list of 257 SPICE models from various manufacturers that are available for free download. The models are organized into categories such as Diode/General Purpose Rectifier, Diode/Schottky Rectifier, Laser Diode, Junction FET, MOSFET, and more. For each category, the document lists the number of models available from each manufacturer and provides details on the specific part numbers and model parameters.
This document provides a summary of semiconductor parts inventory from Spice Park in June 2016. It lists 282 general purpose rectifier diodes from various manufacturers such as Fairchild, Fuji, International Rectifier, Intersil, ROHM, Shindengen, and Toshiba. For each part, the manufacturer, model, thermal characteristics, and date are provided. The majority of the rectifiers are from Fairchild, Intersil, and ROHM.
The document appears to be notes from May 13, 2015 about something new. It includes a date, the word "NEW", and a file path indicating it may be meeting notes or a memo from that date.
This document describes a simplified SPICE behavioral model for simulating the input-output characteristics of a DC/DC converter. The model focuses on the relationships between input voltage, output voltage, and efficiency rather than detailed circuitry. It allows faster system-level simulations compared to cycle-to-cycle models. Parameters like output voltage, efficiency, and minimum/maximum input voltages can be adjusted to specify different converter designs. The document provides an example model and shows how to simulate the input-output characteristics.
The document describes a simplified SPICE behavioral model for simulating the behavior of fuses in circuits. The model allows users to set parameters like current rating, fuse factor, internal resistance, and normal melting value to simulate how long it takes a fuse to blow under different current conditions. Simulation results are presented demonstrating how fusing time varies based on steady direct current levels and different current waveforms providing the same peak current. Instructions are provided on installing the model libraries and symbols for use in SPICE simulations.
This document provides a list of 4,412 models of electronic components from various manufacturers. It includes semiconductors, passive parts, batteries, mechanical parts, motors, lamps, and power supplies. For each component type, the document specifies the manufacturer, part number, model, thermal characteristics, and last update. It appears to be a comprehensive parts list from a company called Siam Bee Technologies for their SPICEPARK component library.
This document provides a list of 257 SPICE models from various manufacturers that are available for free download. The models are organized into categories such as Diode/General Purpose Rectifier, Diode/Schottky Rectifier, Laser Diode, Junction FET, MOSFET, and more. For each category, the document lists the number of models available from each manufacturer and provides details on the specific part numbers and model parameters.
This document provides a summary of semiconductor parts inventory from Spice Park in June 2016. It lists 282 general purpose rectifier diodes from various manufacturers such as Fairchild, Fuji, International Rectifier, Intersil, ROHM, Shindengen, and Toshiba. For each part, the manufacturer, model, thermal characteristics, and date are provided. The majority of the rectifiers are from Fairchild, Intersil, and ROHM.