6. Facilities Upgrade
Since 2006, we have replaced every major piece of equipment in
every major process.
DRILLING
16 Mark VI drills replaced with 2 Excellon System 2000’s, 8 Century 2001’s, and 4 Mania Micronics
IMAGING (Primary & LPI)
4 new Olec AT-30’s purchased. All have 4-camera automatic alignment systems and hybrid collimated light
sources
WET PROCESS
DES, SES, Shadow, and Oxide lines replaced with Hollmuller lines that incorporate latest spray technology
Deburr and pre-LPI scrub replaced with Ishii Hyoki equipment
LPI
DP dual sided screeners replaced with 2 Argus Spray Coating lines
7. Planned Facilities Upgrade
As of July 2009, we have the following planned improvements
MULTILAYER LAMINATION
5,000 SF building expansion to house 3 10-opening Burkle PC-controlled lamination system (one of the best
in N.A.)
ENIG & DESMEAR
Automated lines to replace manual dip lines
COPPER VIA FILL LINE
Chemistry and line to plate blind vias shut with plated Cu
8. Multilayer PCB Products
Examples of Current Technology Applications
•Fine Line and Spacing
•Controlled Impedance Designs
•Heavy Copper PCBs
•PTFE / Hybrid Technologies
•RF-Microwave Boards
•Thermal Management PCBs
•Aluminum / Metal Core PCBs
•PCB Heatsink Registration
•Via-in-Pad Technology
•Open Face / Internal Cavity Boards
•Blind / Buried Vias
9. Production Capabilities
Layer Count 1 - 24 +
Largest Panel Size: 18” x 24
Smallest Circuit Width/Spacing: .004 mils, 3 mils proto
Material Thickness: 0.003” – 0.200”
Materials: FR-4; FR-5; Teflon; Polyimide; Metal Heat Sinks
Smallest Mech. Drilled Hole .006”
Hole Size and Dimensional Tolerances: + / - .003” and + / -.002”
Finishes: HASL, Immersion Silver/Gold, Deep Gold
Lead Free Finishes: Pb-Free HASL; SN100CL
Electrical Testing Flying Probe and Bed of Nails
Fabrication Routing, Blanking and Scoring
Plasma Processing unit Teflon Activation, Etch Back, Desmear
Laser Drilling Routing and Trimming
10. Circuit Board Capacity
Number of Panels 18” x 24” Panels
Quick-Turn Prototypes Fast Turn Production
Layers Turnaround Layers Turnaround
24 Hrs 2 Days 3 Days 4 Days 5 Days 10 Days 15 Days
2 Layer 75 300 1,500 2,250 2 Layer 3,000 15,000 30,000
4 Layer 35 75 300 1,500 4 Layer 2,250 6,000 15,000
6 Layer - 75 150 600 6 Layer 1,500 3,000 15,000
8 Layer 1,200 3,000 15,000
8+ Layer - 75 150 300
11. Quality
Six Dedicated Manufacturing Engineers
ISO 9002 Certified in 1995
QS 9000 Certified in 1998
Delphi C7000 (High Reliability) Certified in 1999
TS 16949 & ISO 9000:2000 Certified in 2003
(1st PCB Manufacturer in North America)
ISO 14001 Certified in 2005
AS9100 Certified in 2007
ITAR Registered in 2009
12. Offshore Sourcing
P te h
lo c Dig l P B
ita C
ISO9001 UL
ISO14001 ISO9002
E169497 QS9001
TS16949 ISO14001
13. Asian Partners
High Quality and On Time Delivery
Pre-engineering performed at Saturn for manufacturability and panelization
Saturn performs First Article inspection on all new lots
Saturn will inventory up to 4 weeks domestically
Saturn’s China-based personnel supervise all orders at the manufacturing level
Saturn’s production-certified facility can fulfill ramp schedules while offshore facilities fill supply pipeline for ongoing
production requirements
18. Free Aluminum Core LED PCB Keychain
Thank You
e hope you will consider Saturn Electronics Corporation as your Quick-Turn Prototype
and Small to High-Volume Production Manufacturer