The document provides instructions for updating the software on LT 200 and DRB 200 thermostats, including preparing the PC with the necessary software and files, connecting the thermostat to the service adapter and PC, running the software update process using the Flip program, and checking that the update was successful. It also lists new variants of the LT 200 and DRB 200 thermostats and provides troubleshooting tips for issues with initializing or heating.
Taiyo Yuden SAW and BAW Band 7 Duplexer integrated into Skyworks’ System in P...Yole Developpement
Taiyo Yuden’s Well-Proven Metal Seal Packaging and SAW/BAW technology in LTE Band 7 high isolation duplexer used in Skyworks’ PAMiD
In the last five years, Skyworks has been the largest radio-frequency (RF) component supplier for Huawei. In Huawei’s last flagship, the Mate 9 Pro, and the P10 series, Skyworks supplies entire Long-Term Evolution (LTE) front-end solutions based on its SkyOne® Technology. The solutions comprise Low-, Mid- and High-Band front end modules (FEMs) featuring Surface Acoustic Wave (SAW) and Bulk Acoustic Wave (BAW) filters. Skyworks is known to produce its own SAW filter and to outsource the BAW filter. In its High-Band PA Module integrated Duplexer (PAMiD), Skyworks integrates a duplexer supplied by Taiyo Yuden in metal seal packaging featuring a SAW and a Thin Film Bulk Acoustic Resonator (FBAR)-BAW filter based on Taiyo Yuden Technology.
The filters are located in a System In Package (SiP) with a power amplifier, switch and a RF integrated circuit. The device is a custom version of a Taiyo Yuden commercial device. The duplexer’s SAW filter uses sapphire and lithium tantalate substrates and its BAW filter has an original FBAR design using an air gap cavity on a silicon substrate.
In this report, the complete duplexer is analyzed, from the filters to the packaging developed by Fujitsu Media Limited, which was bought by Taiyo Yuden. The report includes a complete analysis of the package, the SAW filter and the BAW filter, featuring a cost analysis and price estimation for the device. A schematic of the BAW filter is also provided to understand the difference between shunt and series cells.
Finally, the report includes complete performance and technology comparisons with the previous generation of the band 7 duplexer from Taiyo Yuden and a technology comparison with BAW filters and packaging solutions from Qorvo and Broadcom.
More information on that report at http://www.i-micronews.com/reports.html
The document summarizes the specifications of the JA Solar JAP72S01-330 1500V solar photovoltaic module. It provides key details such as an efficiency rating of up to 16.99%, power output warranty of 25 years, and 12-year product warranty. Electrical parameters at standard test conditions and nominal operating cell temperature are listed, along with I-V and P-V curves showing module performance under different irradiance and temperature conditions. Mechanical details like module dimensions and connector type are also specified.
El documento describe diferentes tipos de medios de transmisión guiados, incluyendo cable de par trenzado sin blindaje (UTP), cable de par trenzado blindado (STP), cable coaxial y fibra óptica. Explica que los cables UTP y STP usan pares de cobre trenzados para la transmisión de datos, mientras que la fibra óptica usa haces de luz a través de fibras de vidrio o plástico. También compara las ventajas y desventajas de estos diferentes medios de transmisión guiados.
Deep analysis of the 400Gb optical transceiver from a leading Chinese company.
More information: https://www.systemplus.fr/reverse-costing-reports/innolights-400g-qsfp-dd-optical-transceiver/
Texas Instruments’ LMG5200 GaN Power Stage - 2018 teardown reverse costing re...system_plus
The first 80V half-bridge GaN power stage from TI, with innovative packaging.
More information on that report at http://www.systemplus.fr/reverse-costing-reports/texas-instruments-lmg5200-gan-power-stage/
Take a look at the fifth generation of EPC’s low voltage transistor
The low voltage GaN device market is increasingly important, and Efficient Power Conversion Corporation (EPC) is a major player in low voltage GaN-on-silicon high-electron-mobility transistor (HEMT) devices. 100V GaN HEMTs are a very new technology but they already compete with silicon transistors, especially in the field of megahertz high frequency applications.
System Plus Consulting has investigated the company’s EPC2045 device, its latest driving 100V for applications such as single-stage 48V converters, USB-C data and power connectors, LiDAR sensors, point-of-load converters and loads in open rack server architectures.
With its new transistor and GaN epitaxy design, the EPC2045 achieves a breakdown voltage of 100V for a current of 16A at 25°C, and a very low RdsOn on-resistance of 7mΩ compared to the previous generation.
The chip-scale packaging of EPC products reduces the final device cost and decreases its inductance, bringing advantages not only with respect to competitors in GaN, but also silicon.
Compared to silicon transistors, GaN process developments have significantly lowered capacitance. This translates into lower gate drive losses and lower device switching losses at higher frequencies for the same on-resistance and voltage rating.
More information on that report at http://www.i-micronews.com/reports.html
Guided modes of Optical Step Index Fiberajay singh
This document provides an assignment to:
1) Calculate the modes supported by a parabolic index fiber with specified parameters.
2) Determine the effective indices and group velocities of the supported modes.
3) Plot the transverse field distributions of the modes.
4) Calculate the intermodal dispersion of the fiber from the propagating modes.
Matlab code is provided to solve the problems numerically.
Taiyo Yuden SAW and BAW Band 7 Duplexer integrated into Skyworks’ System in P...Yole Developpement
Taiyo Yuden’s Well-Proven Metal Seal Packaging and SAW/BAW technology in LTE Band 7 high isolation duplexer used in Skyworks’ PAMiD
In the last five years, Skyworks has been the largest radio-frequency (RF) component supplier for Huawei. In Huawei’s last flagship, the Mate 9 Pro, and the P10 series, Skyworks supplies entire Long-Term Evolution (LTE) front-end solutions based on its SkyOne® Technology. The solutions comprise Low-, Mid- and High-Band front end modules (FEMs) featuring Surface Acoustic Wave (SAW) and Bulk Acoustic Wave (BAW) filters. Skyworks is known to produce its own SAW filter and to outsource the BAW filter. In its High-Band PA Module integrated Duplexer (PAMiD), Skyworks integrates a duplexer supplied by Taiyo Yuden in metal seal packaging featuring a SAW and a Thin Film Bulk Acoustic Resonator (FBAR)-BAW filter based on Taiyo Yuden Technology.
The filters are located in a System In Package (SiP) with a power amplifier, switch and a RF integrated circuit. The device is a custom version of a Taiyo Yuden commercial device. The duplexer’s SAW filter uses sapphire and lithium tantalate substrates and its BAW filter has an original FBAR design using an air gap cavity on a silicon substrate.
In this report, the complete duplexer is analyzed, from the filters to the packaging developed by Fujitsu Media Limited, which was bought by Taiyo Yuden. The report includes a complete analysis of the package, the SAW filter and the BAW filter, featuring a cost analysis and price estimation for the device. A schematic of the BAW filter is also provided to understand the difference between shunt and series cells.
Finally, the report includes complete performance and technology comparisons with the previous generation of the band 7 duplexer from Taiyo Yuden and a technology comparison with BAW filters and packaging solutions from Qorvo and Broadcom.
More information on that report at http://www.i-micronews.com/reports.html
The document summarizes the specifications of the JA Solar JAP72S01-330 1500V solar photovoltaic module. It provides key details such as an efficiency rating of up to 16.99%, power output warranty of 25 years, and 12-year product warranty. Electrical parameters at standard test conditions and nominal operating cell temperature are listed, along with I-V and P-V curves showing module performance under different irradiance and temperature conditions. Mechanical details like module dimensions and connector type are also specified.
El documento describe diferentes tipos de medios de transmisión guiados, incluyendo cable de par trenzado sin blindaje (UTP), cable de par trenzado blindado (STP), cable coaxial y fibra óptica. Explica que los cables UTP y STP usan pares de cobre trenzados para la transmisión de datos, mientras que la fibra óptica usa haces de luz a través de fibras de vidrio o plástico. También compara las ventajas y desventajas de estos diferentes medios de transmisión guiados.
Deep analysis of the 400Gb optical transceiver from a leading Chinese company.
More information: https://www.systemplus.fr/reverse-costing-reports/innolights-400g-qsfp-dd-optical-transceiver/
Texas Instruments’ LMG5200 GaN Power Stage - 2018 teardown reverse costing re...system_plus
The first 80V half-bridge GaN power stage from TI, with innovative packaging.
More information on that report at http://www.systemplus.fr/reverse-costing-reports/texas-instruments-lmg5200-gan-power-stage/
Take a look at the fifth generation of EPC’s low voltage transistor
The low voltage GaN device market is increasingly important, and Efficient Power Conversion Corporation (EPC) is a major player in low voltage GaN-on-silicon high-electron-mobility transistor (HEMT) devices. 100V GaN HEMTs are a very new technology but they already compete with silicon transistors, especially in the field of megahertz high frequency applications.
System Plus Consulting has investigated the company’s EPC2045 device, its latest driving 100V for applications such as single-stage 48V converters, USB-C data and power connectors, LiDAR sensors, point-of-load converters and loads in open rack server architectures.
With its new transistor and GaN epitaxy design, the EPC2045 achieves a breakdown voltage of 100V for a current of 16A at 25°C, and a very low RdsOn on-resistance of 7mΩ compared to the previous generation.
The chip-scale packaging of EPC products reduces the final device cost and decreases its inductance, bringing advantages not only with respect to competitors in GaN, but also silicon.
Compared to silicon transistors, GaN process developments have significantly lowered capacitance. This translates into lower gate drive losses and lower device switching losses at higher frequencies for the same on-resistance and voltage rating.
More information on that report at http://www.i-micronews.com/reports.html
Guided modes of Optical Step Index Fiberajay singh
This document provides an assignment to:
1) Calculate the modes supported by a parabolic index fiber with specified parameters.
2) Determine the effective indices and group velocities of the supported modes.
3) Plot the transverse field distributions of the modes.
4) Calculate the intermodal dispersion of the fiber from the propagating modes.
Matlab code is provided to solve the problems numerically.
This document provides an overview of femtocell technology. It defines a femtocell as a small cellular base station for use in homes and small businesses that connects to the mobile network via broadband. The document describes the need for femtocells to improve indoor coverage, their advantages like increased capacity and coverage, different types (2G, 3G, OFDM), key elements of the femtocell network architecture, and how femtocells work by connecting to the internet to route calls and data. It also covers femtocell characteristics and the future potential of the technology.
Rapport du CIGRE : Innovative solutions for overhead lines supports version-i...RTE
This document discusses innovative solutions for overhead line supports that balance functionality and aesthetics. It summarizes work by CIGRE Working Group B2.08 on this topic. The document outlines the evolution of overhead line tower design from early functional structures to more recent designs that integrate towers into the landscape or transform them into works of art. Case studies are presented from Finland, Denmark, France, and Iceland showcasing unique designs for specific locations that blend engineering and design considerations.
The document provides information on Crabtree's Platinum KNX range of wiring accessories, which includes KNX-enabled switches and sockets. These products allow building management components like lighting, HVAC, and access control systems to communicate via the KNX standard communication protocol. Crabtree's KNX switches and sockets are available in finishes to match their existing Platinum wiring accessory range. Key details like mounting instructions, terminal connections, programming, and available models/finishes are described for the KNX switches and sockets.
The document discusses the shift towards using coherent optical technology at the network edge. It argues that 100G QSFP28 ports using coherent 100ZR technology will dominate the optical edge in the coming years. This will allow for longer transmission reaches of over 300km compared to traditional direct detection. Key advantages of coherent 100ZR include lower power consumption of 5W or less in a QSFP28 form factor, simplified deployment without manual tuning, and compatibility with existing network infrastructure. The technology could enable seamless upgrades to 100G speeds at aggregation points across access networks.
desence,sensitivity calculation with and without external LNA, Noise figure calculation with and without external LNA and IIP3 calculation with and without external LNA
Panasonic PGA26C09DV 600V GaN HEMT teardown reverse costing report published ...Yole Developpement
Panasonic’s first 600V GaN HEMT has an innovative structure designed to integrate a normally-off transistor in a standard package, without a cascade structure
System Plus Consulting unveils Panasonic’s first GaN HEMT, assembled in a standard TO220 package. Thanks to its specific die design, the component is normally-off without using a cascade structure or special packaging.
Panasonic’s PGA26C09DV features a medium-voltage breakdown of 600V for a current of 15A (25°C), with very low RdsOn compared to its competitors. The transistor is optimized for AC-DC power supply, photovoltaic, and motor inverters.
The GaN and AlGaN layers are deposited by epitaxy on a silicon substrate. A complex buffer and template layer structure is used to reduce stress and dislocation. This is complemented by a thick superlattice structure clearly visible in the TEM analysis.
Based on a complete teardown analysis, this report also provides a production cost estimate for the epitaxy, HEMT, and package.
Moreover, this report offers a comparison with GaN Systems’ GS66504B and Transphorm’s GaN HEMT, highlighting the huge differences in design and manufacturing process and their impact on device size and production cost.
For more information visite us at: http://www.i-micronews.com/reports.html
The document describes the Eclipse wireless backhaul solution, which combines PDH, SDH, and Ethernet applications into a single platform. It offers:
- Software-defined architecture allowing operators to adapt networks to changing conditions.
- Optimized wireless nodes supporting multiple outdoor units with routing, aggregation, and selectable traffic interfaces.
- Efficient terminal options providing cost-effective solutions for transporting E1, STM1, and Ethernet data.
Welcome to our Uveeglass pvt Ltd Toughened Glass Plant!
We are a friendly-owned business that has been supplying durable, high-quality toughened glass products since 2021. Our plant is located in E344 Swroopganj Growth Centre, Hamirgrh, Bhilwara. 311025 Rajasthan
Our experts manufacture a wide range of products – from safety tempered glass for skylights, rooflights and external doors, to toughened glass for glazed balustrades, partition walls and office partitions. Our experienced engineers use advanced technology to create superior products.
We strive to provide excellent customer service and value for money. Our team of professionals will advise you on the best solution for your toughened glass needs. We are committed to offering short lead times, competitive prices and a speedy delivery service.
Thank you for visiting our website.
www.uveeglass.com If you require further information, please do not hesitate to contact us on mobile number 9414130995
SHANKAR MAHESHWARI
Original Power Supply IC TOP244YN TOP244Y TOP244 TO-220-7 New Power IntegrationsAUTHELECTRONIC
Original Power Supply IC TOP244YN TOP244Y TOP244 TO-220-7 New Power Integrations
https://authelectronic.com/original-power-ic-top244yn-top244y-top244-to-220-7-new-philippin
This report takes a look into the patenting activity around gallium Nitride uncovering the companies, inventors, and key applications.
GaN is a binary III-V direct bandgap semiconductor commonly used in LEDs. Its wide-band gap of 3.4 eV affords its special properties for applications in optoelectronic, high-power and high-frequency devices. Because GaN offers very high breakdown voltages, high electron mobility, and saturation velocity it is also an ideal candidate for high-power and high-temperature microwave applications like RF power amplifiers at microwave frequencies and high-voltage switching devices for power grids. Solutions that use GaN-based RF transistors are also replacing the magnetrons used in microwave ovens.
Gallium Nitride (GaN) transistor models have evolved from GaAs (gallium arsenide) transistor models; however there are many advantages GaN offers:
• Higher operating voltage (over 100-V breakdown)
• Higher operating temperature (over 150°C channel temperature)
• Higher power density (5 to 30 W/mm)
• Durable and crack-resistant material
GaN devices are often grown on SiC (silicon carbide) substrates, but to achieve lower-cost GaN devices, they can be grown on sapphire and silicon wafers. GaN’s wide bandgap allows for higher breakdown voltages and operation at high temperatures. The high thermal conductivity of SiC makes it a better substrate than silicon for power amplifier applications that require good heat sinking.
ROADM Technologies for Flexible - Tbitsec Optical NetworksCPqD
This document discusses technologies for flexible, high-capacity optical networks, including ROADMs. It describes how ROADMs are used to manage traffic through optical network intersections. It then summarizes technologies like coherent Nyquist filtering, superchannels, flexible grid WSS, hybrid Raman-EDFA amplifiers, and multi-port flexgrid optical channel monitors that enable increased network capacity, reduced costs, and transparent wavelength management for 400Gb/s and 1Tb/s transmission. These improved ROADM subsystems will enable more future-proof ROADM architectures.
1) El documento proporciona definiciones breves de varios términos relacionados con la historia y cultura de la antigua Grecia, como nombres de ciudades, dioses, personajes históricos, instituciones políticas y sociales, y conceptos culturales. 2) Los términos van desde "A" como Abdera y Abidos hasta "Z" e incluyen definiciones de conceptos como ágora, areópago, democracia ateniense, espartanos y más. 3) El documento sirve como glosario conciso
El documento habla sobre el 40 aniversario del equipo de fútbol americano Mulos Rojos FCQ de la Facultad de Ciencias Químicas de la UANL de 1970-1971. Describe los recuerdos y anécdotas de los jugadores sobre los entrenamientos difíciles, los viajes para comprar equipo, y la camaradería del equipo. Finaliza reconociendo que aunque nunca ganaron un campeonato, lo más importante fue la amistad que se formó entre los jugadores.
IndScan is an email-based new project alert service provided by Enpejay Research Information Services Pvt Ltd that identifies new industrial projects in India. It offers daily or fortnightly reports summarizing key details of new projects across over 30 industries. Subscribers include project consultants, contractors and industrial service providers seeking new business leads. The service covers projects' names, locations, costs, details, and contact information to help subscribers identify prospects and track industry trends and competitors. Customization is currently not offered but may be in the future. Interested companies can subscribe by email or online order form.
Shaila Dúrcal, América Sierra, Carlos Vives, Draco, Jessy & Joy, Juan Luis Guerra, La Arrolladora Banda El Limón, Olga Tañón, Pitbull, Prince Royce, Ricky Martin, Romeo y Thalía, Gerardo Ortiz, Latin Grammys, Jenni Rivera, Musica Latina
The document discusses various techniques for scaling PHP applications, including:
1. Using load balancers to distribute traffic across multiple servers and ensure high availability.
2. Implementing session persistence to maintain user sessions as clients are load balanced.
3. Separating static and dynamic content to improve performance by serving static files from optimized servers.
4. Caching frequently accessed data and generated pages to reduce database queries.
5. Database replication and other techniques for scaling the application database infrastructure.
6. Code optimization methods like opcode caching and acceleration.
7. Design considerations like modularity when planning for scalability.
Este documento habla sobre las tintas e impresiones utilizadas en la criminalística documentológica. Explica que las tintas son líquidos coloreados que dejan residuos de color, intensidad y perennidad al evaporarse sobre el papel. También describe los lápices como elementos escritores sólidos y coloreados. Luego detalla los diferentes tipos de colorantes y materiales pigmentados que constituyen las tintas y elementos escritores, así como los diferentes métodos de escritura y impresión. Finalmente, explica los instrumentos y técn
The document discusses the benefits of exercise for mental health. Regular physical activity can help reduce anxiety and depression and improve mood and cognitive functioning. Exercise causes chemical changes in the brain that may help protect against mental illness and improve symptoms.
Trabajo equipo n5 final gerencia estrategica de la comunicación (1)Mélida Sanabria
Este documento presenta la memoria descriptiva de un equipo de estudiantes de la Maestría en Comunicación Corporativa. El equipo número 5 analizará la influencia del ambiente interno y externo en la planificación, identidad e imagen de las organizaciones. Cada integrante abordará un tema relacionado y publicará contenidos en la cuenta de Instagram "Comunicación100" para promover el desarrollo comunicacional de pequeñas y medianas empresas. El objetivo es fomentar la interacción con el público a través de herramientas y estrategias comunic
Este documento describe la localidad de Cerro Colorado en Córdoba, Argentina, incluyendo su ubicación, flora y fauna nativas, y los pueblos originarios que habitaron la región como los comechingones. Resume la vegetación local como molle, cardón y algarrobos, y la fauna como gato montés, zorros y aves como el jote. Además, describe brevemente las viviendas, vestimenta, armas y costumbres de los comechingones.
Fluentd is an open source data collector that allows users to collect, process, and store log data and events. It has a pluggable architecture that allows adding input plugins to collect data from various sources and output plugins to send data to different storage solutions. It provides reliable log forwarding and processing capabilities.
This document provides an overview of femtocell technology. It defines a femtocell as a small cellular base station for use in homes and small businesses that connects to the mobile network via broadband. The document describes the need for femtocells to improve indoor coverage, their advantages like increased capacity and coverage, different types (2G, 3G, OFDM), key elements of the femtocell network architecture, and how femtocells work by connecting to the internet to route calls and data. It also covers femtocell characteristics and the future potential of the technology.
Rapport du CIGRE : Innovative solutions for overhead lines supports version-i...RTE
This document discusses innovative solutions for overhead line supports that balance functionality and aesthetics. It summarizes work by CIGRE Working Group B2.08 on this topic. The document outlines the evolution of overhead line tower design from early functional structures to more recent designs that integrate towers into the landscape or transform them into works of art. Case studies are presented from Finland, Denmark, France, and Iceland showcasing unique designs for specific locations that blend engineering and design considerations.
The document provides information on Crabtree's Platinum KNX range of wiring accessories, which includes KNX-enabled switches and sockets. These products allow building management components like lighting, HVAC, and access control systems to communicate via the KNX standard communication protocol. Crabtree's KNX switches and sockets are available in finishes to match their existing Platinum wiring accessory range. Key details like mounting instructions, terminal connections, programming, and available models/finishes are described for the KNX switches and sockets.
The document discusses the shift towards using coherent optical technology at the network edge. It argues that 100G QSFP28 ports using coherent 100ZR technology will dominate the optical edge in the coming years. This will allow for longer transmission reaches of over 300km compared to traditional direct detection. Key advantages of coherent 100ZR include lower power consumption of 5W or less in a QSFP28 form factor, simplified deployment without manual tuning, and compatibility with existing network infrastructure. The technology could enable seamless upgrades to 100G speeds at aggregation points across access networks.
desence,sensitivity calculation with and without external LNA, Noise figure calculation with and without external LNA and IIP3 calculation with and without external LNA
Panasonic PGA26C09DV 600V GaN HEMT teardown reverse costing report published ...Yole Developpement
Panasonic’s first 600V GaN HEMT has an innovative structure designed to integrate a normally-off transistor in a standard package, without a cascade structure
System Plus Consulting unveils Panasonic’s first GaN HEMT, assembled in a standard TO220 package. Thanks to its specific die design, the component is normally-off without using a cascade structure or special packaging.
Panasonic’s PGA26C09DV features a medium-voltage breakdown of 600V for a current of 15A (25°C), with very low RdsOn compared to its competitors. The transistor is optimized for AC-DC power supply, photovoltaic, and motor inverters.
The GaN and AlGaN layers are deposited by epitaxy on a silicon substrate. A complex buffer and template layer structure is used to reduce stress and dislocation. This is complemented by a thick superlattice structure clearly visible in the TEM analysis.
Based on a complete teardown analysis, this report also provides a production cost estimate for the epitaxy, HEMT, and package.
Moreover, this report offers a comparison with GaN Systems’ GS66504B and Transphorm’s GaN HEMT, highlighting the huge differences in design and manufacturing process and their impact on device size and production cost.
For more information visite us at: http://www.i-micronews.com/reports.html
The document describes the Eclipse wireless backhaul solution, which combines PDH, SDH, and Ethernet applications into a single platform. It offers:
- Software-defined architecture allowing operators to adapt networks to changing conditions.
- Optimized wireless nodes supporting multiple outdoor units with routing, aggregation, and selectable traffic interfaces.
- Efficient terminal options providing cost-effective solutions for transporting E1, STM1, and Ethernet data.
Welcome to our Uveeglass pvt Ltd Toughened Glass Plant!
We are a friendly-owned business that has been supplying durable, high-quality toughened glass products since 2021. Our plant is located in E344 Swroopganj Growth Centre, Hamirgrh, Bhilwara. 311025 Rajasthan
Our experts manufacture a wide range of products – from safety tempered glass for skylights, rooflights and external doors, to toughened glass for glazed balustrades, partition walls and office partitions. Our experienced engineers use advanced technology to create superior products.
We strive to provide excellent customer service and value for money. Our team of professionals will advise you on the best solution for your toughened glass needs. We are committed to offering short lead times, competitive prices and a speedy delivery service.
Thank you for visiting our website.
www.uveeglass.com If you require further information, please do not hesitate to contact us on mobile number 9414130995
SHANKAR MAHESHWARI
Original Power Supply IC TOP244YN TOP244Y TOP244 TO-220-7 New Power IntegrationsAUTHELECTRONIC
Original Power Supply IC TOP244YN TOP244Y TOP244 TO-220-7 New Power Integrations
https://authelectronic.com/original-power-ic-top244yn-top244y-top244-to-220-7-new-philippin
This report takes a look into the patenting activity around gallium Nitride uncovering the companies, inventors, and key applications.
GaN is a binary III-V direct bandgap semiconductor commonly used in LEDs. Its wide-band gap of 3.4 eV affords its special properties for applications in optoelectronic, high-power and high-frequency devices. Because GaN offers very high breakdown voltages, high electron mobility, and saturation velocity it is also an ideal candidate for high-power and high-temperature microwave applications like RF power amplifiers at microwave frequencies and high-voltage switching devices for power grids. Solutions that use GaN-based RF transistors are also replacing the magnetrons used in microwave ovens.
Gallium Nitride (GaN) transistor models have evolved from GaAs (gallium arsenide) transistor models; however there are many advantages GaN offers:
• Higher operating voltage (over 100-V breakdown)
• Higher operating temperature (over 150°C channel temperature)
• Higher power density (5 to 30 W/mm)
• Durable and crack-resistant material
GaN devices are often grown on SiC (silicon carbide) substrates, but to achieve lower-cost GaN devices, they can be grown on sapphire and silicon wafers. GaN’s wide bandgap allows for higher breakdown voltages and operation at high temperatures. The high thermal conductivity of SiC makes it a better substrate than silicon for power amplifier applications that require good heat sinking.
ROADM Technologies for Flexible - Tbitsec Optical NetworksCPqD
This document discusses technologies for flexible, high-capacity optical networks, including ROADMs. It describes how ROADMs are used to manage traffic through optical network intersections. It then summarizes technologies like coherent Nyquist filtering, superchannels, flexible grid WSS, hybrid Raman-EDFA amplifiers, and multi-port flexgrid optical channel monitors that enable increased network capacity, reduced costs, and transparent wavelength management for 400Gb/s and 1Tb/s transmission. These improved ROADM subsystems will enable more future-proof ROADM architectures.
1) El documento proporciona definiciones breves de varios términos relacionados con la historia y cultura de la antigua Grecia, como nombres de ciudades, dioses, personajes históricos, instituciones políticas y sociales, y conceptos culturales. 2) Los términos van desde "A" como Abdera y Abidos hasta "Z" e incluyen definiciones de conceptos como ágora, areópago, democracia ateniense, espartanos y más. 3) El documento sirve como glosario conciso
El documento habla sobre el 40 aniversario del equipo de fútbol americano Mulos Rojos FCQ de la Facultad de Ciencias Químicas de la UANL de 1970-1971. Describe los recuerdos y anécdotas de los jugadores sobre los entrenamientos difíciles, los viajes para comprar equipo, y la camaradería del equipo. Finaliza reconociendo que aunque nunca ganaron un campeonato, lo más importante fue la amistad que se formó entre los jugadores.
IndScan is an email-based new project alert service provided by Enpejay Research Information Services Pvt Ltd that identifies new industrial projects in India. It offers daily or fortnightly reports summarizing key details of new projects across over 30 industries. Subscribers include project consultants, contractors and industrial service providers seeking new business leads. The service covers projects' names, locations, costs, details, and contact information to help subscribers identify prospects and track industry trends and competitors. Customization is currently not offered but may be in the future. Interested companies can subscribe by email or online order form.
Shaila Dúrcal, América Sierra, Carlos Vives, Draco, Jessy & Joy, Juan Luis Guerra, La Arrolladora Banda El Limón, Olga Tañón, Pitbull, Prince Royce, Ricky Martin, Romeo y Thalía, Gerardo Ortiz, Latin Grammys, Jenni Rivera, Musica Latina
The document discusses various techniques for scaling PHP applications, including:
1. Using load balancers to distribute traffic across multiple servers and ensure high availability.
2. Implementing session persistence to maintain user sessions as clients are load balanced.
3. Separating static and dynamic content to improve performance by serving static files from optimized servers.
4. Caching frequently accessed data and generated pages to reduce database queries.
5. Database replication and other techniques for scaling the application database infrastructure.
6. Code optimization methods like opcode caching and acceleration.
7. Design considerations like modularity when planning for scalability.
Este documento habla sobre las tintas e impresiones utilizadas en la criminalística documentológica. Explica que las tintas son líquidos coloreados que dejan residuos de color, intensidad y perennidad al evaporarse sobre el papel. También describe los lápices como elementos escritores sólidos y coloreados. Luego detalla los diferentes tipos de colorantes y materiales pigmentados que constituyen las tintas y elementos escritores, así como los diferentes métodos de escritura y impresión. Finalmente, explica los instrumentos y técn
The document discusses the benefits of exercise for mental health. Regular physical activity can help reduce anxiety and depression and improve mood and cognitive functioning. Exercise causes chemical changes in the brain that may help protect against mental illness and improve symptoms.
Trabajo equipo n5 final gerencia estrategica de la comunicación (1)Mélida Sanabria
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1. Dr. Bruno Lange GmbH & Co. KG
Service Manual
LT 200 / DRB 200
DOC222.52.00609.Mar05
2. HACH LANGE GmbH Postfach 27 02 47 D-40525 Düsseldorf
Service Düsseldorf: Bongert, Willms, Krouß, Heger
ServiceSupport Volker Maue
VM
CC: Möller-Kemsa
+49 (0) 211 5288-375
+49 (0) 211 5288-289
volker.maue@hach-lange.de
10.03.2005
Service Information
Bitte aktualisieren Sie Ihre Serviceunterlagen!
Please update your service manuals!
Thermostat LT 200 / DRB 200 Software Version 1.3.3
Bei einigen Thermostaten gab es Ausfälle mit dem Fehler „Init Error“ und defekten Heizfolien. Deswegen
wurde die Software mit folgenden Änderungen verbessert:
Verbesserung der Spannungserkennung in der Initialisierungsphase
Menü für Dauertest eingefügt (im erweiterten Testprogramm – Burn in Test) – nur für die Produktion
Einführung eines Auslieferungsstatus Sprachauswahl erscheint beim erstmaligen Einschalten (im
erweiterten Testprogramm - Supply Defaults Set) – nur für die Produktion
Das Softwareupdate sollte nur auf Geräten erfolgen, welche sich zur Reparatur in der Serviceabteilung
befinden. Es sollen keine funktionsfähigen Thermostate mit der neuen Software aktualisiert werden!
Achtung: Das Softwareupdate erfolgt nur im Servicecenter in Düsseldorf! Alle anderen
Serviceabteilungen tauschen bitte die Rechnerkarte aus!
Seit Ende 2004 gibt es 3 zusätzliche Varianten des LT 200 bzw. DRB 200:
LTG082.xx.23000 LT 200 9x13 / 6x13mm + 9x13 / 6x13mm
LTG082.xx.51000 LT 200 6x13 / 4x20mm + 6x13 / 4x20mm
LTG082.xx.44001 DRB 200 9x16 / 6x16mm + 9x16 / 6x16mm
As some customers had problems with the reactor LT 200 / DRB 200 (error message “Init Error”, defective
heating foils), we modified the software with following improvements:
Better recognition of main voltage during the initialization
Insert a long time heating test (advanced test program – Burn in Test) – only for production
3. Insert a start-up mode after the first power on a language selection appears (advanced test program –
Supply Defaults Set) – only for production
Please update only the devices which are being repaired in the service department! Please don’t update
devices which are still in working order!
Note: The upgrade of the new software version only take place at our service department
in Düsseldorf! All other service departments should replace the digital board!
Since the end of 2004 some additional version of LT 200 / DRB 200 are available:
LTG082.xx.23000 LT 200 9x13 / 6x13mm + 9x13 / 6x13mm
LTG082.xx.51000 LT 200 6x13 / 4x20mm + 6x13 / 4x20mm
LTG082.xx.44001 DRB 200 9x16 / 6x16mm + 9x16 / 6x16mm
Volker Maue
BU Lab Photometer
Softwareupdate LT 200 / DRB 200
1. Hilfsmittel
PC mit Betriebssystem Windows 9x / Me / NT / 2000 / XP und serieller Schnittstelle
Programm Flip (Atmel)
Konfigurationsdatei "LT200.cfg"
Datei "YYX471.hex"
Achtung: Die komplette Software ist im Intranet im Menü Service / Software verfügbar!
Service-Adapter VAA564
Schnittstellenkabel, Nullmodemkabel gekreuzt, Dr.Lange Bestell-Nr. LZV087
2. Vorbereitende Tätigkeiten
Programm Flip aus zip-Datei auspacken und auf in einem Ordner abspeichern
3. Update
LT 200 / DRB 200 öffnen
Auf der Rechnerplatte ZBA719 den gewinkelten 8-poligen Stecker des Serviceadapters VAA564 wie im
Bild dargestellt aufstecken
4. Das Nullmodemkabel zwischen den Service-Adapter und der seriellen Schnittstelle COM1 des PC's
anschließen (siehe Grafik)
LT200 / DRB 200
ZBA719
PC
Service-
RS232 Adapter
COM1 Kabel VAA564
LZV087
Den gelben Taste am Service-Adapter drücken und den Thermostaten einschalten
Im Display des Thermostaten erfolgt keine Anzeige
Taster wieder loslassen und am PC das Programm flip.exe starten
Im Menü File den Punkt Read Configuration File auswählen (siehe Bild)
Datei "LT200.cfg" auswählen (siehe Bild)
5. den Button Run anklicken (siehe roter Kreis im Bild)
die Schritte Erase, Blank Check, Program und Verify werden automatisch nacheinander abgearbeitet
(siehe Bild)
6. Programm Flip beenden
Thermostat ausschalten
Service-Adapter entfernen
Thermostat einschalten
Softwareversion kontrollieren, wird während der Initialisierungsphase angezeigt
7. Software update LT 200 / DRB 200
1. Aids
PC or notebook with Windows 9x / Me / NT / 2000 / XP and serial port
Program Flip (Atmel)
Configuration file "LT200.cfg"
File "YYX471.hex"
Note: These files are available as download in our Hach-Lange Intranet, menu Service/Software.
Service adapter VAA564
Null modem cable, Dr.Lange order no. LZV087
2. Preliminaries
Unzip program Flip and save all files in a separate folder
3. Update
Open the thermostat LT 200 / DRB 200.
Connect the service adapter VAA564 to the digital board ZBA719 (see photo).
Connect the null modem cable LZV087 between service adapter and PC serial port COM1 (see graphic).
LT200 / DRB 200
ZBA719
PC
Service-
RS232 Adapter
COM1 Cable VAA564
LZV087
8. Press the yellow switch of the service adapter and power on the thermostat.
Note: It does not appear any text on the display!
Release switch and start the program flip.exe.
In the menu, select File, Read Configuration File...F4 (see screenshot).
Select file "LT200.cfg" (see screenshot).
Start by clicking Run (see red circle on the screenshot).
9. The steps Erase, Blank Check, Program and Verify are carried out automatically in sequence (see
screenshot).
Exit program Flip.
Power off the thermostat.
Remove service adapter.
Power on the thermostat.
Check the software version, it appears during the initialization.
10.
11. Content
1. General 2
1.1 Variants ............................................................................................................ 2
1.2 Technical data .................................................................................................. 4
1.3 Initializing for 115V / 230V mains voltage ........................................................ 5
1.4 Error messages ................................................................................................ 5
2. Settings 6
2.1 Language.......................................................................................................... 6
2.2 Contrast ............................................................................................................ 6
3. Test program 7
3.1 Loading the test program ................................................................................. 7
3.2 User interface ................................................................................................... 9
3.3 Set block type ................................................................................................... 9
3.4 Displaying the software version and block type ............................................. 10
3.5 Restore factory settings.................................................................................. 10
4. Temperature adjustment 11
5. Troubleshooting 15
6. Removing, fitting and repairing individual components 16
6.1 Overview......................................................................................................... 17
6.2 Opening the thermostat.................................................................................. 19
6.3 Top section of the enclosure .......................................................................... 20
6.4 Protective lid ................................................................................................... 20
6.5 Covers ............................................................................................................ 21
6.6 Digital board ................................................................................................... 21
6.7 Display............................................................................................................ 22
6.8 Touch-sensitive keypad.................................................................................. 23
6.9 Mains connector with switch, interference suppression filter ......................... 23
6.10 Powerpack board ......................................................................................... 24
6.11 Heating block, heating foil, temperature sensor........................................... 26
7. Spare parts 28
8. Inspection document 34
9. Circuit diagrams and component mounting diagrams 37
Dr. Bruno Lange GmbH & Co. KG 1. General • 1
12. 1. General
1.1 Variants
LT 200
Article no. LTG082.xx.10000 Openings: 9 x 13mm and 2 x 20mm
Article no. LTG082.xx.21000 Openings: 15 x 13mm
Openings: 6 x 13 and 4 x 20mm
2 • 1. General Dr. Bruno Lange GmbH & Co. KG
13. DRB 200
Article no. LTG082.xx.30001 LTG082.xx.40001:
Openings: 9 x 16mm and 2 x 20mm Openings: 15 x 16mm
Article no. LTG082.xx.42001 Openings: 15 x 16mm
Openings: 6 x 16 and 4 x 20mm
Dr. Bruno Lange GmbH & Co. KG 1. General • 3
14. 1.2 Technical data
Type Thermostat with one heating block or two separate heating blocks with integrated
protective lids for heating cuvette tests and reaction vessels
Temperature programs LT 200:
COD program (148°C, 120 min)
100°C program (100°C, 30, 60, 120 min)
40°C program (40°C, 10 min) and
freely selectable from 37 to 148°C (no cooling)
DRB 200:
TOC program (105°C, 120 min)
100°C program (100°C, 30, 60, 120 min)
105°C program (105°C, 30, 60, 120 min)
150°C program (150°C, 30, 60, 120 min)
165°C program (165°C, 30, 60, 120 min)
and freely selectable from 37 to 165°C (no cooling)
Time programs Freely selectable 0-480 min; acoustic signal after countdown to zero
Heating rate LT 200:
from 20°C to 148°C in 10 min (in conformity with DIN 38409-44)
DRB 200:
from 20°C to 150°C in 10 min
Temperature stability +/- 2°C
Number of cuvettes LT 200:
LTG082.xx.10000: 9 x 13 mm diameter, 2 x 20 mm diameter
LTG082.xx.21000: left: 15 x 13 mm diameter
right: 6 x 13 mm diameter, 4 x 20 mm diameter
DRB 200:
LTG082.xx.30001: 9 x 16 mm diameter, 2 x 20 mm diameter
LTG082.xx.40001: 15 x 16 mm
LTG082.xx.42001: left: 15 x 16 mm diameter
right: 6 x 16 mm diameter, 4 x 20 mm diameter
Power requirements 115 / 230 V, +5%/-15%, 50 / 60 Hz, safety class I
Power input LTG 082.xx.10000, LTG082.xx.30001 / LTG082.xx.40001:
115 V: 300 VA; 230 V: 450 VA
LTG 082.xx.21000, LTG082.xx.42001: 115 V: 600 VA; 230 V: 900 VA
Safety tests CE, GS and cTUVus
Environmental Operating temperature: 10 - 45°C
requirements Storage temperature: -40 - 60°C
Relative humidity: max. 90%, non-condensing
Dimensions W x H x D: 250 x 145 x 310 mm
Weight LTG 082.xx.10000, LTG082.xx.30001 / LTG082.xx.40001: 2 kg (instrument only),
3.5 kg (with packaging)
LTG 082.xx.21000, LTG082.xx.42001: 2.8 kg (instrument only), 4.3 kg (with
packaging)
Warranty 2 years
4 • 1. General Dr. Bruno Lange GmbH & Co. KG
15. 1.3 Initializing for 115V / 230V mains voltage
The thermostat is suitable for both 115V and 230V mains voltage. The software determines the correct
voltage setting automatically during the initialization phase. When the thermostat is switched on, the heating
block or, in the case of a two-block thermostat, the right heating block is heated for 5 seconds at full power
(both half-waves of the power supply are used). If the temperature change after 5 seconds is less than 3°C,
the software assumes that the mains voltage is 115V. The heating foil is driven by the full wave of the 115V
power supply.
If the temperature change after 5 seconds is greater than 3°C, the software assumes that the mains voltage
is 230V. In this case, the heating foil is driven by only every fourth wave of the 230 V power supply.
The heating foil can therefore be used with approximately the same power input at different mains voltages.
The right and left heating blocks of a two-block thermostat are driven alternately. This reduces the load on
the power supply network.
1.4 Error messages
Error message Explanation Response
Block too hot! After the thermostat is switched on, it is Allow the block to cool
Please Wait! heated for about 5 seconds to initialize it. Check temperature sensor
However, if the block temperature is Check powerpack board
greater than 160°C before the heating
phase starts, this error message is
displayed.
A user program has been started but the
block temperature is higher than the
required temperature.
Init error Initialization could not be performed. The Check temperature sensor
thermostat is not heating up. Check heating foil
Check powerpack board
No amplifier adjust! Digital board has not These error Replace digital board
been adjusted messages are for use
No interface! No user interface has during production. Select user interface in advanced
been selected test program.
No block select! No block type has Select block type in advanced test
been selected program.
No block adjust! No temp. adjustment Select adjust temp. in test
has been carried out program.
No tuning left! The temperature adjustment was started but
not completed.
Initializing Initialization could not be carried out. Check temperature sensors
Overtemp. WAIT! Pt1 and Pt2
Check heating foil
Check powerpack board
Dr. Bruno Lange GmbH & Co. KG 1. General • 5
16. 2. Settings
2.1 Language
Press the left key, keep it held down and switch on.
Sprache
GB D
The following language options are available:
GB Great Britain
D Germany
F France
I Italy
E Spain
NL Netherlands
S Sweden
PL Poland
After a language has been selected, the initialization of the thermostat starts.
2.2 Contrast
Press the centre key, keep it held down and switch on.
Contrast 140
OK
The contrast can be adjusted with the left and centre keys. Press the right key to store the setting. The
initialization of the thermostat then starts.
6 • 2. Settings Dr. Bruno Lange GmbH & Co. KG
17. 3. Test program
3.1 Loading the test program
There are a basic and an advanced test program.
The basic test program can only be used to adjust (calibrate) the temperature of the heating blocks. The
advanced test program can be used to specify the number of blocks and set the software to Dr. Bruno
Lange or Hach mode.
Basic test program
Press the right key, keep it held down and switch on.
Service
Temp. adjust
Start
Service
End
Temperature adjustment
Final inspection Main program
Start End
Only for Production!
Dr. Bruno Lange GmbH & Co. KG 3. Test program • 7
18. Advanced test program
Press the right key, keep it held down and switch on. Then press the left key and keep it held down for about
10 seconds.
Service
Ampl. adjust User interface
Start Beep ∗DBL Hach
Only for Production! Emits audible signal
Set block type Info
left right Show
Block left Block right
15 9+2 15 9+2
Info about block
selection and
software
Block left Block right
6+4 End 6+4 End
Temp. adjust Final inspection Service
Start Start End
Final inspection
Temp. adjustment Start End
Main program
Only for Production!
8 • 3. Test program Dr. Bruno Lange GmbH & Co. KG
19. 3.2 User interface
In the User Interface menu of the advanced test program, the left key can be used to select DBL (Dr. Bruno
Lange) and the centre key can be used to select Hach. If DBL is selected, the time starts to count down to
zero immediately after the program starts. If Hach is selected, the time starts to count down to zero when
the selected temperature has been reached and the Start key has been pressed.
User interface
∗DBL Hach
Press the right key ( ) until the following menu appears.
Service
End
Press the left key (End).
The program branches back to normal mode.
Note: When DBL or Hach is selected, the temperature programs in the user menu revert to the
factory settings.
3.3 Set block type
In the Set block type menu in the advanced test program, the left key can be used to select the left block
type and the right key to select the right block type.
Set block type
left right
The following block types can be selected:
Block type LT 200 DRB 200
15 15 x 13mm 15 x 16mm
9+2 9 x 13mm + 2 x 20mm 9 x 16mm + 2 x 20mm
6+4 6 x 13mm + 4 x 20mm 6 x 16mm + 4 x 20mm
The selections can be saved by pressing the End key.
Block left
6+4 End
Dr. Bruno Lange GmbH & Co. KG 3. Test program • 9
20. 3.4 Displaying the software version and block type
In the Info menu of the advanced test program, the Show key on the left can be used to display the software
version and the selected block type.
Info
Show
For example:
DBL 15 6+4
V 1.2.2
DBL = Dr. Bruno Lange user interface
15 = Left block type 15 x 13mm
6+4 = Right block type 6 x 13mm + 4 x 20mm
V1.2.2 = Software version 1.2.1
Software history:
Version 1.2.2 First delivery Sep. 2003
Version 1.2.3 Default contrast changed, Error message "No interface" implemented (for production)
Oct. 2003
3.5 Restore factory settings
In order to restore the factory settings, DBL or Hach must be selected again in the User Interface menu.
See 3.2 User interface
10 • 3. Test program Dr. Bruno Lange GmbH & Co. KG
21. 4. Temperature adjustment
General
The temperature adjustment is described for the double block (LTG082.xx.21000, LTG082.xx.42001).
Aids
Glycerol, anhydrous (reagent grade >99.5%), approx. 5ml
Laboratory thermometer ASTM 67C (range 95°C – 155°C, resolution 0.2°C, height 379mm)
Article-No.: VAA568
Pipette
Protective goggles
LT 200: Cuvette, outside diameter 13mm, Order no.: LCW906 (25 cuvettes)
DRB 200: Cuvette, outside diameter 16mm, Order no.: 2275800 (1 cuvette), 2275806 (6 cuvettes)
Preparation of the cuvette
LT 200: Mark the cuvette 62mm (+/-0.5 mm) from the base.
DRB 200: Mark the cuvette 56mm (+/-0.5mm) from the base.
Place the laboratory thermometer in the cuvette.
Use a pipette to fill the cuvette up to the mark with glycerol.
Note: The glycerol should be at room temperature!
Position of the cuvette
Second row from the front, in the middle (see in the diagram)
LT 200:
Article no. LTG082.xx.10000 Article no. LTG082.xx.21000
Dr. Bruno Lange GmbH & Co. KG 4. Temperature adjustment • 11
22. DRB 200:
Article no. LTG082.xx.30001 Article no. LTG082.xx.40001
Article no. LTG082.xx.42001
Adjustment
Place the cuvette in the left block.
Take care: Wear protective goggles!
Hot glycerol could escape from the open cuvette.
Start the basic test program (see 3.1 Loading the test program):
Press the right key, keep it held down and switch on.
In the Temp. adjust menu, press the left key (Start)
Temp. adjust
Start
The thermostat heats both blocks to 100°C.
23°C 25°C
120' 120'
12 • 4. Temperature adjustment Dr. Bruno Lange GmbH & Co. KG
23. When the block temperature reaches 100°C the thermostat emits an acoustic signal.
100°C 100°C
110' 110'
Note: The temperature in the heating block and the cuvette is stable after about 25 minutes.
Please wait until the displayed time is below 95'!
Press the left key.
100°C 100°C
90' 90'
Use the left and centre keys (under the arrows) to set the value displayed by the laboratory thermometer
and press the right key (OK).
True value left
100.0 OK
Place the laboratory thermometer in the right block together with the cuvette and wait until the value
displayed by the laboratory thermometer is stable.
Press the right key.
100°C 100°C
90' 90'
Use the left and centre keys (under the arrows) to set the value displayed by the laboratory thermometer
and press the right key (OK).
True value right
100.0 OK
The corrected temperature is accepted after it has been confirmed by pressing the OK key. After the
correction has been carried out, check the desired temperature of 100°C again with the laboratory
thermometer.
Take care: The 100°C correction can only be carried out once per adjustment sequence.
Dr. Bruno Lange GmbH & Co. KG 4. Temperature adjustment • 13
24. Press the centre key.
100°C 100°C
80' 80'
Press the right key (End).
Final inspection
Start _ End
If another temperature adjustment is necessary, press the left key (Start) in the next menu. If no further
correction is needed, press the right key ( ).
Temp. adjust
Start
Press the left key (End).
Service
End
The program branches back to normal mode.
The thermostat carries out the initialization.
Checking the temperature
Insert the laboratory thermometer in the thermostat together with the cuvette and heat to 100°C in normal
mode. After about 25 minutes read the temperature shown by the thermometer. The tolerance of +/- 2°C
should not be exceeded.
Cooling phase
At a room temperature of about 24°C the cooling time:
from 148°C 40°C = 160 minutes
from 100°C 40°C = 125 minutes
14 • 4. Temperature adjustment Dr. Bruno Lange GmbH & Co. KG
25. 5. Troubleshooting
The following table should serve as a troubleshooting aid. The identification of faults in individual
components is described in detail in section "6. Removing, fitting and repairing individual component".
Problem Fault identification
Display remains blank after the Measure mains voltage
thermostat is switched on. Press or replace the switch
Measure powerpack board voltage fuse F1 okay?
Check cable from powerpack board to digital board
Measure +5V on digital board
Replace the display
Replace the digital board
Thermostat does not heat up. Measure powerpack board voltage fuses F2, F3 okay?
Check heating foil
Check temperature sensor
Check cable from powerpack board to digital board
Replace the powerpack board
Replace the digital board
Thermostat heats up too far or not Carry out temperature adjustment
far enough. Check heating foil
Check temperature sensor
Check cable from powerpack board to digital board
Replace the powerpack board
Replace the digital board
Only the left heating block of a Check right temperature sensor
two-block thermostat is displayed. Check right heating foil
Check cable from powerpack board to digital board
Replace the powerpack board
Replace the digital board
The thermostat cannot be Cable between touch-sensitive keypad and computer - no contact
operated. Defective touch-sensitive keypad
Replace top section of enclosure, including touch-sensitive keypad
Replace the digital board
Dr. Bruno Lange GmbH & Co. KG 5. Troubleshooting • 15
26. 6. Removing, fitting and repairing
individual components
16 • 6. Removing, fitting and repairing individual components Dr. Bruno Lange GmbH & Co. KG
27. 6.1 Overview
Outside view
1 – Protective lid, transparent
2 – Cover, black
3 – Insulating mat
4 – Top section of enclosure
5 – Touch-sensitive keypad
6 – Display
7 – Digital board
Dr. Bruno Lange GmbH & Co. KG 6. Removing, fitting and repairing individual components • 17
28. Inside view
1 – Protective padding
2 – Heating block
3 – Interference suppression filter
4 – Spacer
5 – Powerpack board
6 – Mains connector and switch
7 – Bottom section of enclosure
8 – Base of enclosure
18 • 6. Removing, fitting and repairing individual components Dr. Bruno Lange GmbH & Co. KG
29. 6.2 Opening the thermostat
Unplug the thermostat.
Remove the seal from the base or push a Phillips screwdriver through it, and remove the 4 screws (see
1 in illustration)
Use a screwdriver to carefully bend inward the two locking hooks (see 2 in the illustration) on the base
and remove the top section of the enclosure.
Dr. Bruno Lange GmbH & Co. KG 6. Removing, fitting and repairing individual components • 19
30. 6.3 Top section of the enclosure
Remove the top section of the enclosure:
Open the thermostat (see 6.2 Opening the thermostat)
Disconnect the connector from the powerpack board (see 1 in the illustration)
Spare part:
LT 200: LZT038 Top section of enclosure (Lange) with touch-sensitive keypad
DRB 200: LZT039 Top section of enclosure (Hach) with touch-sensitive keypad
6.4 Protective lid
Remove the protective lids:
Half open the protective lid (about 45°) and take hold above the external hinge, with your thumb inside
the protective lid.
Press your thumb against the inside of the protective lid and carefully bend it slightly open and lift it
forward out of its mount (see illustration).
Then raise the protective lid slightly and remove the other side from the mount.
Spare part:
LZT048 Protective lid, transparent
20 • 6. Removing, fitting and repairing individual components Dr. Bruno Lange GmbH & Co. KG
31. 6.5 Covers
Open the thermostat (see 6.2 Opening the thermostat).
Remove the top section of the enclosure (see 6.3 Top section of the enclosure).
Remove the protective lids (see 6.4 Protective lid).
Remove the screws (1 and 2 in the illustration) and take out the covers.
Note: The insulating mats are not included in the spare part.
Spare part:
LT 200+DRB 200: LZT047 Cover without openings
LT 200: LZT041 Cover 9x13 2x20
LZT042 Cover 15x13
LZT043 Cover 6x13 4x20
DRB 200: LZT044 Cover 9x16 2x20
LZT045 Cover 15x16
LZT046 Cover 6x16 4x20
6.6 Digital board
Fault identification:
Measure the +5V DC on the digital board at connector P3, PIN2 = +5V, PIN3=GND (see illustration).
Dr. Bruno Lange GmbH & Co. KG 6. Removing, fitting and repairing individual components • 21
32. Replacing the board:
Open the thermostat (see 6.2 Opening the thermostat).
Remove the top section of the enclosure (see 6.3 Top section of the enclosure).
Disconnect the ribbon cable from the two cable holders in the top section of the enclosure.
Take care: The connector of the ribbon cable (see 1 in the illustration) is soldered to the digital board
and cannot be disconnected there!
Disconnect the cable of the touch-sensitive keypad (see 2 in the illustration) from the digital board.
Remove the 4 screws (see 3 in the illustration).
Take care: The threaded sleeves under the screws may turn with the screws. Hold the threaded
sleeves in place with a 5.5 mm open-ended spanner!
Remove the digital board.
After replacement:
Power on the device
On the display of the thermostat appears " No interface!"
Press the key below "OK", the advanced test program appears
in menu User Interface select Hach or DBL, see 3.2 User interface
in menu Set block type select block type, see 3.3 Set block type
in menu Temp. adjust press Start, see 4. Temperature adjustment
Spare part:
YAB001 Digital board
6.7 Display
Fault identification:
Measure the +5V DC on the digital board (see 6.6 Digital board).
Set the contrast, see (2.2 Contrast).
Replacing the display:
Remove the digital board.
Remove the 4 threaded sleeves (see 1 in the illustration) with a 5.5mm socket spanner or open-ended
spanner.
Remove the display.
Note: After mounting a new display, do not tighten the threaded sleeves too firmly, as this could
cause them to be ripped out of the plastic.
22 • 6. Removing, fitting and repairing individual components Dr. Bruno Lange GmbH & Co. KG
33. Spare part:
YAB017 Display
6.8 Touch-sensitive keypad
Fault identification:
Check the keypad cable to ensure that there is a good connection with the digital board (see 6.6 Digital
board).
Replacing the keypad:
If the touch-sensitive keypad is defective, replace the complete top section of the enclosure together
with the keypad (see 6.3 Top section of the enclosure).
Spare part:
LT 200: LZT038 Top section of enclosure (Lange) with touch-sensitive keypad
DRB 200: LZT039 Top section of enclosure (Hach) with touch-sensitive keypad
6.9 Mains connector with switch, interference
suppression filter
Fault identification:
See 6.10 Powerpack board
Replacing the mains connector with switch:
Open the thermostat (see 6.2 Opening the thermostat).
Remove the top section of the enclosure (see 6.3 Top section of the enclosure).
Remove the nut (see 2 in the illustration) from the interference suppression filter (see 1 in the
illustration) with a 7mm open-ended spanner.
Push the interference suppression filter to one side and disconnect the cables connected to the mains
connector.
Press in the top and bottom locking hooks on the mains connector (see 1 in the illustration below) and
pull out the unit.
Note: Press in the bottom locking hook with an offset screwdriver or similar.
Dr. Bruno Lange GmbH & Co. KG 6. Removing, fitting and repairing individual components • 23
34. Spare part:
LZT040 Mains connector with switch
6.10 Powerpack board
Method of functioning:
Section of the circuitry (double block)
Part 1:
The mains current is supplied to connector P4 of the powerpack board via the mains connector and the
interference suppression filter. The current passes through the fuse F1 (6.3A T) to the triacs V1 and V2. The
triacs are driven from the digital board via the optocouplers H1 and H2. The current from the triacs is
conducted through connectors P2 and P3 to the heating foils. Each heating foil is protected by a 3.15 A T
fuse (F2 and F3).
Part 2:
The mains current passes through the varistor R11 and the fusing resistor R5 to the bridge rectifier D1. The
pulsating direct current is smoothed by the capacitor C2 and applied to the internal switched mode power
supply (I4, L3 ...). The required +5V voltage is set with the help of the voltage drop over D4 and I1. The
current is smoothed with C3 and L2 and applied to the digital board through connector P1.
See 9. Circuit diagrams and component mounting diagrams
24 • 6. Removing, fitting and repairing individual components Dr. Bruno Lange GmbH & Co. KG
35. Fault identification:
Warning: When the thermostat is open and switched on, potentially lethal voltages are present
on the powerpack board and the heat sinks of the triacs!
Switch on the open thermostat.
Measure the following voltages at the measuring points shown in the illustration:
Measuring Cause of fault if no voltage is
Voltage Response
point present
1–2 115/230 V AC Mains input defective Replace mains connector and
Defective switch switch
Defective interference Check interference suppression
suppression filter filter
1–3 115/230 V AC Fuse F1 = 6.3A slow reacting/ Check heating foil
defective Replace powerpack board
2–4 115/230 V AC Fuse F2 = 3.15A slow reacting/
defective
2–5 115/230 V AC Fuse F3 = 3.15A slow reacting/
defective
6–7 + 5 V DC Switched mode mains power Replace powerpack board
supply defective
Replacing the powerpack board:
Open the thermostat (see 6.2 Opening the thermostat).
Remove the top section of the enclosure (see 6.3 Top section of the enclosure).
Unplug the infeed (see 1 in the illustration) and the two heating foil connectors (see 2 in the illustration).
Unplug the two temperature sensor connectors (see 3 in the illustration) while pressing the connector
latch.
Lift out the powerpack board.
Spare part:
YAB002 Double powerpack board
YAB016 Single powerpack board
Dr. Bruno Lange GmbH & Co. KG 6. Removing, fitting and repairing individual components • 25
36. 6.11 Heating block, heating foil, temperature sensor
Fault identification:
Two heating foils are bonded to each heating block. They are connected in series. Between them is a
thermal link (see illustration)
1 – Heating foil
2 – Heating foil
3 – Thermal link
4 – PT1000 temperature sensor
5 –Temperature sensor connection
6 – Heating foil connection
7 – Spacer
Disconnect the connector for the heating foil (plug-in place HEAT 1 or HEAT 2 on the powerpack board)
and measure the resistance with a multimeter: approx. 43 Ohm
Disconnect the connector for the PT1000 temperature sensor (plug-in place Pt 1 or Pt 2 on the
powerpack board) and measure the resistance with a multimeter:
Temperature (°C) Approx. resistance (Ohm)
0 1000
10 1039
20 1078
30 1116
40 1155
50 1194
60 1232
70 1271
80 1309
90 1347
100 1385
110 1423
120 1461
130 1498
140 1536
150 1573
Note: If a thermal link (resistance = infinite) or a heating foil or a temperature sensor is defective,
always replace the complete heating block!
Replacing the heating block, etc.:
Open the thermostat (see 6.2 Opening the thermostat).
Remove the top section of the enclosure (see 6.3 Top section of the enclosure).
Disconnect the connector of the powerpack board (see 6.10 Powerpack board).
26 • 6. Removing, fitting and repairing individual components Dr. Bruno Lange GmbH & Co. KG
37. Remove the interference suppression filter (see 6.9 Mains connector with switch, interference
suppression filter) and the grounding cable of the fixing screw.
Remove the 4 screws for the right (see 1 in the illustration) or the left heating block (see 2 in the
illustration).
Replace the complete heating block
Spare part:
LT 200: LZT032 Lange heating block, 9x13 2x20
LZT033 Lange heating block, 15x13
LZT034 Lange heating block, 6x13 4x20
DRB 200: LZT035 Hach heating block, 9x16 2x20
LZT036 Hach heating block, 15x16
LZT037 Hach heating block, 6x16 4x20
Dr. Bruno Lange GmbH & Co. KG 6. Removing, fitting and repairing individual components • 27
38. 7. Spare parts
LT 200 + DRB 200
Display Mains connector with switch
Order no.: YAB017 Order no.: LZT040
Powerpack board, double Powerpack board, single
Order no.: YAB002 Order no.: YAB016
Digital board Protective lid, transparent
Order no.: YAB001 Order no.: LZT048
28 • 7. Spare parts Dr. Bruno Lange GmbH & Co. KG
40. LT 200
Cover 15x13 Cover 6x13 4x20
Order no.: LZT042 Order no.: LZT043
Cover 9x13 2x20 Top part of enclosure (Lange)
Order no.: LZT041 with touch-sensitive keypad
Order no.: LZT038
30 • 7. Spare parts Dr. Bruno Lange GmbH & Co. KG
41. Heating block (Lange) 9x13 2x20 Heating block (Lange) 15x13
Order no.: LZT032 Order no.: LZT033
Heating block (Lange) 6x13 4x20
Order no.: LZT034
Dr. Bruno Lange GmbH & Co. KG 7. Spare parts • 31
42. DRB 200
Cover 15x16 Cover 6x16 4x20
Order no.: LZT045 Order no.: LZT046
Cover 9x16 2x20 Top part of enclosure (Hach)
Order no.: LZT044 with touch-sensitive keypad
Order no.: LZT039
32 • 7. Spare parts Dr. Bruno Lange GmbH & Co. KG
43. Heating block (Hach) 15x16 Heating block (Hach) 6x16 4x20
Order no.: LZT036 Order no.: LZT037
Heating block (Hach) 9x16 2x20
Order no.: LZT035
Dr. Bruno Lange GmbH & Co. KG 7. Spare parts • 33
45. Inspection document
Dear Customer
The company Dr. Bruno Lange GmbH, Germany, has introduced a quality system
according to DIN EN ISO 9001. Dr. Lange-Instruments are designed, produced and
serviced according to the requirements of this quality system. If using the service
regularly, you can be sure that you fullfill the requirements of your own quality system.
This servicing document helps you to document you control and inspection activities of
your measuring and the test equipment.
Name of Instrument:
Instrument-Type: LTG
Instrument-No.:
Results:
Keys ok
Display ok
Power supply ok
Timer ok
Temperature ok
Temperature heating block, left:
Nominal value 100 °C 148 °C
Tolerance + / - 2 °C + / - 2 °C
Actual value
Temperature heating block, right:
Nominal value 100 °C 148 °C
Tolerance + / - 2 °C + / - 2 °C
Actual value
Date:
Service engineer:
Signature:
46.
47. 9. Circuit diagrams and
component mounting diagrams
Dr. Bruno Lange GmbH & Co. KG 9. Circuit diagrams and component mounting diagrams • 37
48. 8 7 6 5 4 3 2 1
VCC
8
!"# 3
1
2
F
VCC VCC F
4
" "
GND GND
GND
GND
8
GND GND GND GND
3
1 &1 '
GND
$ % 2
1
GND
5
4
+
3 7 &1 '
n.c. GND
6
-
02 GND
2
GND
E
E
GND
GND
VCC VCC
GND
GND
VCC
L+
L-
GND
1
GND
2
VCC
!"# 3
( 4
( ) 5
( 6
(( 7
(( 8
D
41 30 (( 9
GND X1 P0.0/AD0
31 (( 10
P0.1/AD1 D
32 (( 11
P0.2/AD2
weder vervielfältigt noch Dritten zugänglich gemacht werden.
3 40 33 (( 12
VCC VCC GND X2 P0.3/AD3
Und sie darf durch den Empfänger oder Dritte auch nicht in
34 (( 13
P0.4/AD4
Ohne unsere vorherige Zustimmung darf diese Untelage
2 44 35 (( 14
RESET Reset P0.5/AD5
36
P0.6/AD6
1 VCC 37 ( , /*
-'.
GND GND P0.7/AD7
anderer Weise mißbräuchlich verwertet werden.
5
3 29
4 2 P1.0-AN0 P2.0/AD8
GND 4 28
P1.1-AN1 P2.1/AD9
5 27
P1.2-AN2 P2.2/AD10
3
GND GND 6 26
P1.3-AN3 P2.3/AD11
7 25
VCC P1.4-AN4 P2.4/AD12
!"# 8 24 1
5
&* &*$
P1.5-AN5 P2.5/AD13
4 2 9 23 &* &*$ 2
GND P1.6-AN6 P2.6/AD14
1 10 22 &* &*$ 3
P1.7-AN7 P2.7/AD15
2 4
3
VCC
VCC
GND 3 11 21 5
GND EA P4.1
4 +( 12 20 GND 6
P3.0/RxD P4.0
C 5 +( 13 19 7
P3.1/TxD P3.7/RD C
6 &*$ 14 18 8
P3.2/INT0 P3.6/WR
7 &*$ 15
P3.3/INT1
8 &*$ VCC &&' 16 VCC /-"/"2#
P3.4/T0
17 2 $ %
P3.5/T1 VAREF GND GND GND
) 1
VAGND VCC
42
VCC VCC
38
PSEN GND
39 VCC
ALE
43
GND GND
GND
VCC
1
2
GND
3
B 4
5 GND
GND
6 Bei Änderung sind gleichzeitig
GND
7
8
GND
die Steuerungsmerkmale in
9 " &1 '
881.0010-00 sx entsprechend
10
GND zu erhöhen.
11 " &1 '
12
GND
Protel
13 Erstm.Verw.
14
Maße ohne Leiterplatte: XMF664-C
Toleranzangabe
&"0"&,. GND LTG082
Datum Name
Benennung
Bearb. 10.10.02 Adamscheck
A
Gepr. 10.10.02 Bressel Rechnerplatte
Norm.
Stromlaufplan
Zeichnungsnummer: 881.0010-00 Blatt
1
02
01
144 A 03
--
11.04.03
10.10.02
Bud
AD.
Error : Lange.jpg file not found. ZBA719 v. 1 Bl.
8 7 6 5 Verteiler Zust. Änderung Datum Name Datei: P:PROJEKTHt200SZBA568protelZba568a.DDB - ZBA71921.sch