LFoundry - The Customer-Specific Analog and Mixed-Signal Foundry

LFoundry

… the customer-specific manufacturer of
choice for analog, mixed-signal and
specialized technologies

© 2010 LFoundry GmbH. All rights reserved.

Outline

 Company & Business Update

 Foundry Service

 Manufacturing

 Technology

2 © 2010 LFoundry GmbH. All rights reserved.

LFoundry Facts

Business Model

 Providing dedicated foundry capacity and
services for
 Specialized analog, mixed signal designs
 Customer specific technologies
 Joint technology developments

 Offering worldwide customers advanced
process technologies and a robust portfolio
of IP, innovative technology extensions and
certifications.

 LFoundry “Sicherheit” for
 Reliable supply and delivery
 Superior-price performance
 Protection of Customer Design and IP
 Stay leading-edge in analog mixed signal and customized technologies
 Sustainable, dedicated technology and foundry partner

LFoundry Profile
… the customer-specific manufacturer of choice

 … featuring unparalleled flexibility,  … ensuring “Sicherheit”
speed and reliability, security and
reliability to meet protection for customers,
aggressive on-time their designs and their IP
delivery demands

 … offering worldwide customers advanced process technologies and a robust portfolio of
IP, innovative technology extensions and certifications


LFoundry Organisation

CFO CTO COO
CEO
Dr. H.- M. G. Spitzlsperger G. Ernst
M. Lehnert
Dudenhausen

V.P. Sales&Marketing V.P. Quality President France
T.D. / R&D Operations
Michael Hösl Gerhard Weindl Jean-Pierre Delesse

Finance Purchasing I.T. H.R.

Landshut
LFoundry Silicon
Rousset Foundry GmbH
S.A.S.


LFoundry Worldwide Organization

Headquarter
Fabs
Sales Fabs
Landshut 330 employees

Rousset 750 employees

SalesForce
UK 2

Germany 4

France 2

USA 4

Korea/Taiwan 1

Israel 1

Japan 1


LFoundry at a Glance

Landshut, Germany Rousset, France

 LFoundry Corporate Headquarter  LFoundry Rousset
 Landshut Silicon Foundry wafer size: 200 mm
wafer size: 200 mm capacity 8“: >20k wspm
capacity 8“: up to 12k wspm cleanroom area: 11000 m²
cleanroom area (CR): 5000 m²  750 employees, >10y experience
 330 employees, >18y experience  Technology
 Technology 0.15µm/0.11µm PDK i.D.
0.35µm, 0.15µm PDK, 0.11µm i.D. 0.18/ 0.15/ 0.13/ 0.11µm customer specific
0.35µm … 0.13µm customer specific Path to 0.08µm (tools available)
MEMS, Opto processes


LFoundry Milestones

 Development  Acquisition of Atmel’s
cooperation with IHP Fab in Rousset (F)
Microelectronics  Ramp RF MEMS for
 150nm CMOS PDK EPCOS
release and MPW  Collaboration with
start TESAT Spacecom

LFoundry
2H 2008 1H 2009 2H 2009 1H 2010 2H 2010 1H 2011
Foundation

 Development of open  Open UK office  Development
access based PDK  Join IPL Alliance to start of 110nm
develop iPDK
 SST Flash in 150nm
 Start manufacturing of
Automotive design for
MAS Oy


LIFE (LFoundry integrated Foundry Ecosystem)

LFoundry wants to interact with the customer


LFoundry Revenue Share
by Region

 European market dominated by
Germany and France
 Overall healthy worldwide share
 Our Customers serve the global market

Germany 32,2%
France 12,0%
Europe United Kingdom 3,4%
USA Israel 3,0%
Asia Europe 4,1%
USA 30,0%
Asia 15,2%

LFoundry Customers Target Market [%]
Worldwide Market [%]


LFoundry Revenue by Market
Security Aerospace Communication
Medical Utilisation of Radiation hard RF applications
New CMOS security and IP 150nm with high integration
applications protection strength Customer specific
CMOS Opto processes

Automotive
Automotive Certified
Communication 26,6%
High Voltage LDMOS Consumer 51,6%
Industry/ Energy 1,7%
Automotive 2,1%
Medical 6,3%
Industry/Energy Security 11,4%
CMOS Opto Aerospace 0,3%
Power management

Consumer
Customer specific processes SoC, Technology Extensions
Various fabless companies

LFoundry markets reflects worldwide analog/mixed signal market

Outline


 Foundry Service

 Manufacturing

 Technology


Prototyping Services

Flexible Manufacturing options with superior price performance

 Full Mask Set
 Full flexibility in timing and volume
 Reasonable NRE cost

 MLM (Multi Layer Mask)
 Full flexibility in timing for small
volume production
 Significantly reduced NRE costs

 MPW (Multi Project Wafer)
 Ideal solution for prototyping and low
volume production
 Lowest NRE costs

Monthly MPW runs for every PDK technology

LFoundry Customer's Timing
Advantage


LFoundry EDA


Outline


 Foundry Service

 Manufacturing

 Technology


Manufacturing Facts

16000 m² class 1 clean-room
 32000 wafer starts per month
 Automatic transportation system
 Automatic Recipe Download
 EDP Lot Dispatch System
 98% yield performance
 fast cycle time: 1.2dpm


Key Performance Data

 Benchmark line speed as key
enabler for time to market

 Excellent process yield performance
as key enabler for cost efficiency

Quality Assurance

Certification:

 QMS & Automotive QS9000 (TS 16949)

 Environment (ISO 14001)

 Smart Card Security ISO15408

Standard:

 JEDEC JP001.01
 Level 1 wafer level reliability performed by LFoundry
(<10ppm fails; 10 years; max. temp. 125°C)
 Level 2 device level reliability performed by our customers

 AEC Automotive Electronics Council Q100 Ref-F
Grade 0 -40°C to 150°C  under preparation
Grade 1 -40°C to 125°C  prepared
Grade 2 -40°C to 105°C

Initially LFoundry developed the LF150 (0.15µm) technology, which is again
based on the long time experienced similar RENESAS process (Secure MCU / Automotive).


Outline


 Foundry Service

 Manufacturing

 Technology


Foundry Technology Roadmap

 Strong development force for innovative technology applications


Voltage domains

5V >100V
3.3V 80V
2.5V 60V
1.2V low Vt
40V
1.2V core 8V
5V
1.2V high Vt HVMOS – LDMOS
3.3V
1.8V high speed •Industrial
•Power devices
1.8V low leak •Energy Harvesting
Common voltage
•Aerospace
Core MOS •Automotive Electronics
characterised
at 1.2V •Consumer Electronics
•Home Entertainment
•Medical appliances
ultra low leak
•Mobile Systems
digital lib
(in discussion)


LF150 Modularisation


0.15µm Foundry Technology

… integrated into the user-friendly, all-in-one Process Design Kit (PDK)

 LF150 is a 0.15µm modular CMOS process:  Poly-, Metal- and Diffusion Resistors
- 19 Mask for standard Process  MIM Capacitors
- shallow trench isolation (STI)
 Diodes
- deep N-Well (NISO)
- 1-2 Poly layers  NPN-Bipolartransistor (within the standard CMOS
- gate oxide thickn.[nm]: 2.8/6.8/16.0 Process), PNP with C on ground
- cobalt salicidation  RF-Devices like Transistors, Resistors,
- up to 6 level of Al (330nm, 800nm) Capacitors, Inductors and Varactors
- extra Thick Top Metal (2-6µm Al)  GPIO library 3.3V, 1.8V and 5V
intermetal dielectric: HDP  Full Analog PDK for Cadence Virtuoso 6.1.x
 Core voltage: 1.8V  Full Analog PDK for Tanner including >20 digital
 Design rules: standard cells
- Physical Gate length: 150nm  Digital standard cells library (>400 cells for low
- Contact/Via size: 180/240nm power and high performance applications)
- Metal pitch: 0.48µm prepared for Cadence, Mentor and Synopsys
 MOS Transistors: Gate-Density 110 kGates/mm²
- 1.8V low leakage NMOS/PMOS
 Variety of memory options: SRAM, OTP, NVM
- 1.8V high speed NMOS/PMOS
- 3.3V NMOS/PMOS  Constantly incrasing IP Portfolio: µController,
- 5V NMOS/PMOS ADC, LDO, POR, OTA, Bandgap, Charge Pump,
Interface buses, …


0.15µm Foundry Technology


IP Portfolio
LFoundry and our worldwide partners offer a top class Intellectual Property (IP) Portfolio to
support the design needs of our customers. With our long time experience we offer on the one
side proven IP to accelerate customers time-to-market, on the other side LFoundry support by
creating customised IP in time with outstanding quality.

Mixed-signal IPs
ADC, DAC, LDO, PLL, Bandgap,
Bias Generator, Charge Pump,
Oscillator, OP Amps, OTA, POR, ... Cores
Memory IP 8051 until high end
SRAM (Mobile Semi) 8b to 32b also as RISC
EEPROM (LFoundry) low leak to high performance
Flash (SST) well known partners as
OTP (NSCore) COrtus, Ensilica, Evatronix,
MTP (NSCore) Innopower, ...

Interfaces
GPIO library, Serial,
SPI Interface bus, I2C,
Cell Library USB, ...
low leak standard library
high speed standard library
elements such as Buffer,
Latches, Flip-Flop, Physical
Delay, Tristate, ... Detectors / Security
temperature sensor, AES/DES, ...

... whatever you need for your SOC,
we have it


LFoundry Technology Extensions -
CMOS-based MEMS Processing
Thick layer processing (AlCu up to 7µm, resist up to10µm)
Thick metal
Special Polymer processing (IVD, PBO, …)
5µm Stress engineering (for various materials: nitrides, …)
Strongly tapered processing / etching profiles
Sacrificial layer process (oxide, a-silicon)
Tapered processing Backside processing (PVD, PECVD, Implant, …)

aSi


LFoundry Technology Extensions -
Opto CMOS Processing

 High sensitivity photosensors, integrated in CMOS
 light exposure from backside, enabled
through LFoundry backside
& thin wafer processing

 CMOS based Optofilter
 customized wavelenth filter thru modified
structured layers integrated in CMOS
 for i.e. multi spectral cameras,
ambient light sensors, …

Light sensors
 CMOS Imager for special applications
 MBPD (modified buried photo-diode)
for l = 450-1100nm
 Focus on spezialized applications,
i.e. large image sensors with
Standard, high volume
stitching requirements


Conclusion

LFoundry is

 the reliable, fast and flexible
customer-specific manufacturer
of choice,
 providing leading-edge
specialized technology capacity,
 advanced analog and mixed-
signal process technologies and
 “Sicherheit” reliability, security
and protection for customers,
their designs and IP.


LFoundry - The Customer-Specific Analog and Mixed-Signal Foundry

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