Introduction Overview of Moldex3D Highlight Features in R15.0 New module In-mold Decoration simulation PU Chemical Foaming Function Enhancements New runner meshing technology New structural mesh for runner and cooling channel Non-matching mesh enhancement Moldex3D R15.0 Portfolio and Extended Advantages Moldex3D Products Summary

1. Version: R15.0
Moldex3D Series Product

2. 2
> Introduction
– Overview of Moldex3D
> Highlight Features in R15.0
– New module
• In-mold Decoration simulation
• PU Chemical Foaming
– Function Enhancements
• New runner meshing technology
• New structural mesh for runner and cooling channel
• Non-matching mesh enhancement
> Moldex3D R15.0 Portfolio and Extended Advantages
> Moldex3D Products Summary
Contents

3. Introduction

4. 4
> World’s leading 3D CAE software for plastic injection molding
industries
> Long-term solutions for customers to ensure efficiency and mold
savings in product design process
> With over years heritage of analysis experiences, Moldex3D has
made its success convincing its simulation capability for a wide
variety of industry applications
Iteration

5. 5
> Working closely with leading alliance partners for more integrated
simulation performance to take care of different industrial needs
> Help our customers increase productivity and improve time to
market
Integrated Solutions
Product
Lifecycle
Management
Molding Innovation

6. 6
> Adopted by 3,200+ renowned companies and industries
> Prove Moldex3D capabilities of bringing quality solutions
Featured Customers
Automobile High Tech/Electronics Material/Equipment

7. 7
Non-Stop Technology Innovation
R9.1
R10.0
R9.0
R8.1
R3.x
R4.x
R7.0
R5.x
R7.1
R6.x
R8.0
Shell Gas
Shell FPCW
Solid RIM
Solid Fiber
Solid FPCW
Solid Mesh
Enhanced
Flow
Parallel-SMP
Tetra Mesh
Solid MCM
Solid I2
Hybrid Mesh
Parallel-
Cluster
Windows
x64
BLM
Enhanced
FastCool
eDesign
Optics
Viscoelastic
Transient
Cool
License
Manager
RHCM
IC
Packaging
Optical
Molding
Automatic
3D Meshing
Cooling
Optimization
Insert
Molding
Two-Color
Molding
FEA
Integration
Mold Insert
Complete
3D Solid
Simulations
Remote
Computing
Solid Warp+
BLM+
eXplorer
ICM
Stress
Remote
Computing
on Linux
NX, Creo
Embedded
Design
Verification
Conformal
Cooling
Cloud
Computing
2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012
R12.0
R11.0
Advanced
Hot Runner
Co-Injection
Gas / Water
Injection
MuCell®
DOE
HyperWorks
Partner
Alliance
Designer
Underfill
SolidWorks
Embedded
Viewer
Underfill
Project
Microcellular
Foaming
eDesignSYNC
Injection
Compression
PIM/MIM
Compression
Molding
Bi-injection
Annealing
FSI
Cloud
Computing+
R13.0
Fiber+
Designer
BLM
CCD
Cadence
Interface
2014
Mold
Deformation
Customization R14.0
Moldex3D
Digimat-RP
Designer
BLM+
Fiber+
Hot Runner
Steady
2015
CADdoctor
RTM
Resin Transfer
Molding
MuCell®+
F/P/W+
2016
R15.0
PU Chemical
Foaming
Runner
Technology+
Non-
matching
mesh+
2017
Public Cloud
IMD+

8. Powerful Pre-Processing

9. 9
Boost Work Efficiency in Pre-processing
Meshing Features
Moldex3D Mesh
Support various solid meshing types with elements of tetra, voxel, and hybrid
Automatic 3D Meshing Engine (eDesign)
- Full auto-meshing features and powerful wizards
- User-friendly interface with intuitive setting guidance
- Simple, fast, and efficient modeling and variant mesh preparation

10. 10
Boost Work Efficiency in Pre-processing
Meshing Features
High Resolution 3D Mesh Technology (BLM)
- Support auto mesh generation with more precise quality for model
preparation, especially for complicated 3D geometry
- Enhance solver accuracy for viscous heating, pressure simulation, and
warpage prediction
- Support tetra elements, boundary layer mesh (BLM) and robust non-matching technology
- Accurate, precise, and efficient for advanced molding processes
Hybrid Mesh Technology
- Create mesh manually for customized purpose
- Increase mesh resolutions significantly with acceptable element count
- Control uniform or biasing mesh pattern and element layer count in thickness direction
- Support tetra, pyramid, prism, and hexahedral elements
- Flexible, delicate, and accurate for complex geometry shapes

11. 11
More Pre-Processor Enhancement in R15.0
Designer Boundary Layer Mesh (BLM)
New Structural Mesh for Runner and Cooling Channel
- Hexa-based solid runner mesh
- More connecting node types for line runner
- Real time setting verification
New in R15.0

12. 12
More Pre-Processor Enhancement in R15.0
Designer Boundary Layer Mesh (BLM)
Enhance Capability on Runner Meshing
- Support mixed type to construct runner system with combination of curve and geometry runner/gate
- Regular auto solid runner mesh for more complex layout
- Better mesh resolution and less element count
New in R15.0

13. 13
More Pre-Processor Enhancement in R15.0
Solvers
[Flow/Pack/Cool/Warp] Non-Matching Mesh Enhancement
- Extend non-matching technology for mold insert and moldbase, besides cooling channels and heating rod
- Provide better continuity and accuracy for cooling analysis result
Moldbase
Mold base
Part
Part Insert
New in R15.0

14. 14
Meshing Technology Positioning
Design Validation
(eDesign)
Molding Innovation
(BLM)
Molding Innovation+
(Solid)
Automatic meshing Automatic meshing
Advanced manual meshing
(Tetra, Hexa, Prism, Pyramid, Hybrid)
CAD/PLM integration
CAD/PLM integration
Process optimization
Process optimization
Innovative process supports
Easy, fast, efficient Accurate, precise, efficient Customized, delicate, accurate

15. 15
Boost Work Efficiency in Pre-processing
Integrated Applications
Geometry Healing Tool (CADdoctor)
- Enable multi-CAD data exchange between Moldex3D pre-processing and multi-CAD platforms
- Fix the defects of part and simplify the complicated geometry structure with high-quality surfaces and entities for better
BLM generation

16. 16
Boost Work Efficiency in Pre-processing
Integrated Applications
CAD Interoperability (SYNC)
- Integrate with PTC® Creo®, NX, and SOLIDWORKS®
- Provide automatic mesh engine and intelligent wizards for CAE analysis and help to build a complete injection molding
system in CAD environment
- Synchronize design changes with simulations to effectively optimize the process settings
- Enable CAD users to quickly validate part designs directly in familiar CAD/CAM environments
NXPTC® Creo® SOLIDWORKS®

17. R15 Portfolio and Extended
Advantages

18. 18
> Comprehensive solutions with series of simulation packages:
– eDesign Basic
– eDesign
– Professional (eDesign + BLM + Tetra)
– Advanced (eDesign + BLM + Tetra + Hybrid)
> More specific solutions for innovative process demands:
– IC Packaging
– Solution Add-on
> One license for both thermoplastics
and thermosets
(* excluding IC Packaging)
Moldex3D R15 Product Portfolio

19. 19
> Full range of flow simulation capabilities
> Decide ultimate gate location, eliminate weld
lines and air traps with the filling behavior
prediction
eDesign Basic Package
Included Modules
> Designer
> Flow
> Parallel Processing*4
> Project

20. 20
> Full auto-meshing feature and intelligent
wizards with intuitive workflow
> Simple, fast, and efficient for your part
design validation
eDesign Package
Included Modules
> Designer
> Flow
> Pack
> Cool
> Warp
> MCM
> Parallel Processing*4
> Project
> Solution Add-ons*
* optional

21. 21
> Include eDesign, BLM, and Tetra meshing
technologies
> Support auto-features of eDesign and robust
meshing capabilities
> Enhanced simulation efficiency for exact
molding innovation
Professional Package
Included Modules
> Designer
> Designer BLM
> 3D Coolant CFD
> Flow
> Pack
> Cool
> Warp
> MCM
> Parallel Processing*8
> Project
> Solution Add-ons*
* optional

22. 22
> Include eDesign, BLM, Tetra, and Solid
meshing technologies
> Increase mesh resolution with flexible
control of diverse mesh elements creation
> Give in-depth validation and bring innovation
for the highest complex processes
Advanced Package
Included Modules
> Designer
> Designer BLM
> 3D Coolant CFD
> Flow
> Pack
> Cool
> Warp
> MCM
> Parallel Processing*12
> Project
> Solution Add-ons*
* optional

23. 23
> More advanced modules for specific process
demands
> Flexible functionality extensions for
innovative process concepts
Solution Add-on
Included Modules New in R15.0
> SYNC
> CADdoctor
> Expert
> Optics
> VE
> Fiber
> Stress
> FEA Interface
> Micromechanics Interface
> Digimat-RP
> Compression Molding
> Injection Compression Molding
> Foam Injection Molding
> Resin Transfer Molding
> Transient Cool
> 3D Coolant CFD
> Advanced Hot Runner
> Cooling Channel Designer
> GAIM /WAIM
> Co-Injection
> Bi-Injection
> Powder Injection Molding
> In-mold Decoration
> PU Chemical Foaming

24. 24
IC Packaging
> A complete series solution for IC Packaging
process
> Provide in-depth analysis, and optimize
IC Packaging layout design
Included Modules
> Mesh
> Designer
> Cadence Interface*
> Flow
> Cure
> Cool
> Warp
> MCM
> Stress
> FEA Interface
> Compression Molding*
> Underfill*
> Viscoelasticity (VE)*
> Wire Sweep
> Paddle Shift
> Post Mold Cure*
* optional
> Project
> Parallel Processing*8

25. Standard Injection Molding Solutions

26. 26
Flow
Most Potential Issues are Fixed Here
> Simulate the filling process
> Optimize gate and runner design with minimum weld lines, air traps, burn marks,
and short shot problems
> Optimize process conditions in filling stage, such as injection time,
melt temperature, etc
Standard Analysis - 1/5
> Provide coupled solvers to simulate Flow/Pack/Cool/Warp
with synchronous data exchange
> More effective temperature result can be performed
New in R15.0

27. 27
Pack
Shrinkage Compensation. Good Packing Leads to Good Dimension
Standard Analysis - 2/5
> Predict gate freeze time and estimate effective packing profile for average
pressure effect
> Minimize sink marks and flash problems, etc
> Predict the volumetric shrinkage and requirement of clamping force to minimize
warpage control

28. 28
Cool
Dominate the Cycle Time = Money
> Support cooling simulation with advanced analysis capabilities for mold and
cooling circuit designs
– Transient cool
– Variotherm
– Conformal cooling
– 3D coolant CFD
> Control mold temperature variations to optimize cooling efficiency and minimize
part warpage
Standard Analysis - 3/5
1 bar 0.1 bar

29. 29
Warp
Good Product with Perfect Shape Design
> Validate part deformed ratio of shrinkage effect and identify warpage causes
> Evaluate fiber orientation, residual stress and material viscoelasticity effects on
warpage
> Provide flatness to evaluate the warpage of surface plane
> Provide Enhanced Warp analysis to consider transient effect in mold
Standard Analysis - 4/5
New in R15.0
> Consider the film effect for better warpage results, and predict final part shape

30. 30
Multi-Component Molding (MCM)
Precise multi-component molding analysis
> Simulate insert molding, overmolding, and multi-shot sequential molding
processes
> Evaluate interactions of different materials, and consider the material properties
to minimize warpage and delamination
> Evaluate core deflection by unbalanced flow
> Detect potential re-melt issue
Standard Analysis - 5/5
Note:
One-way FSI is supported. Two-way FSI
analysis needs an additional Stress license

31. DOE & Optimization

32. 32
Expert
Design of Experiment for optimal analysis decision
> Create analysis variation and provide graphical summaries automatically
> Use efficient DOE method to quickly obtain optimal process conditions for part
quality evaluation
An Effective Tool for Optimized Result
Original warpage: 0.41 mm Optimized warpage: 0.17 mmFound the best result
Objective
3 variables, each with 3 values

33. Injection Molded Plastic Optics

34. 34
Optics/Viscoelasticity (VE)
Enhance Warpage Calculation Accuracy
Optics
> Predict flow- or thermally-induced birefringence, retardation, polarization,
fringed orders, and fringed patterns
> Integrate with CODE V for further non-uniform refractive index prediction
Viscoelasticity (VE)
> Analyze the viscous and elastic properties of polymeric materials
> Support warpage analysis for further part deformed evaluation
> Simulate with Moldex3D Optics module to validate flow-induced residual stress
effect, and optimize optical properties
Realistic Material Characteristics of Plastics

35. Meet Growing Demands of
Lightweight Composite Products

36. 36
Fiber
Fiber Orientation Decides Product Structural Strength
> Support complete predictions of fiber orientation, length, breakage, and
concentration for short and long fiber-reinforced plastics
> Support flake orientation simulation
> Evaluate the strength of parts and weld line regions
> Further consideration of screw-induced fiber analysis
> Provide validations of product dimensional stability and the resistance to
deformation
Fiber Reinforced Plastics
Flake orientation indicates flow mark and
weld line on the surface

37. 37
Stress
Deformed Behaviour Validation for Better Structure of Products
> Evaluate mechanical properties and deformation behaviour under certain
external loadings
> Support core shift analysis of core deflection simulation with inserts and fluid
interaction
> Support annealing simulation with Viscoelasticity
Stress and Deformation
Core Shift
Note:
Core Shift analysis is supported in Solid projects,
except IC Packaging, ICM, and CM
Total displacement

38. 38
FEA Interface
Interactive Structural Analysis with Leading FEA Software
> Integrate with leading software with different results format output
– ANSYS / ABAQUS / LS-DYNA / MSC-Nastran / Marc / OptiStruct
> Provide user interoperability with ANSYS Workbench and ABAQUS interface
output efficiency
> Support direct data output and 3D results mapping for efficient structural
performance validation
Integrated Interfaces for Structural Analysis

39. 39
Micromechanics Interface
Direct Data Output for Structure Performance Validation
> Give a plus for integration of Digimat and Converse to bring an enhanced
prediction accuracy of structural behaviour with direct data output of:
– Weld line
– Fiber Orientation
– Flow-induced residual stress
– Temperature
– MuCell®
Integrated Interfaces for Structural Analysis
Fiber orientation
MuCell®
Structural FEA
Micromechanics
Interface
Composite
material analysis
FEA software
Nonlinear analysis LS-DYNA

40. 40
Digimat-RP
More Accurate Simulations of Composite Materials
> A joint product with e-Xstream engineering
> Bridge a straight-forward workflow from Moldex3D injection molding to Digimat advanced
material non-linear analysis
> Give more accurate structural non-linear material validation of reinforced plastic parts
Better Non-linear Modeling Simulation
New in R15.0
> Support automatic reverse engineering for material model generation based on experiment
data
Moldex3D
Fiber orientation
Moldex3D Stress Solver
Linear behavior
Moldex3D
FEA Interface
Moldex3D
Micromechanics Interface
Moldex3D
Digimat-RP FEA software
Non-linear behaviors
▪Failure
▪Large deformation
▪Crack
FEA software
Linear behavior

41. 41
Compression Molding (CM)
Dynamic Performance for Wall Thickness Design
> Control the process variation after the compression to decide the charge design
> Predict optimized compression conditions for perfect shape of large and fairly intricate
parts
> Simulate with fiber length orientation to avoid degradation, bleeding or flashing, and
optimize product strength
Better Control of Compression Process
Pressure distribution Fiber orientation
New in R15.0
> Integrate with LS-DYNA to provide more accurate compression molding process from solid
deformation stage to liquid filling stage

42. 42
Injection Compression Molding (ICM)
Enhanced Replication for the Parts with Micro Structures
> Visualize property changes in the compression molding process
> Support with VE and Optics analysis for thin and flat products to optimize
residual stress, shrinkage, and warpage
Solution to Micro Structures
Smaller shrinkage variation
Compression birefringence effect
Velocity vector movements prediction

43. 43
Foam Injection Molding
Utilize Physical Foaming to Enhance Product Quality
> Visualize melt expansion behaviour of polymer-gas during microcellular foaming process
> Visualize cell size and density distribution with considerations of cell nucleation and growth
> Evaluate surface quality and bubble effect to reduce weight, tonnage, and shrinkage, etc
> Support core-back feature for better understanding of gas volume fraction variation of cell
distribution
> Provide cell size and density data output to Digimat for structural performance validation
Make Products Lighter
New in R15.0
> Support CBA material simulation as an initial gas concentration option for thermoplastic
analysis
MuCell® is a registered trademark of Trexel, Inc.

44. 44
Resin Transfer Molding (RTM)
Predict Filling Behaviours of Resin through Fiber Mat
> Simulate the filling performance to the effects on different fiber mat types and
orientation
> Predict the filling behaviours in thickness direction to find the cure reaction
trend and optimal control of resin infusion
Large Dimension Composite Molding Technique

45. 45
Polyurethane (PU) Chemical Foaming
Bubble Properties Validation under the Chemical Response
> New capability for simulation of polyurethane (PU) chemical foaming processes
> Predict the bubble variation and density distribution under the chemical effects
> Ensure a desired volume-to-weight ratio of the product
Make Products Lighter New in R15.0

46. Injection Temperature Matters:
Heat and Cool Management

47. 47
Cooling Channel Designer (CCD)
Efficient Cooling Channels Design for Conformal Cooling Analysis
> Create conformal cooling channels automatically based on the contour of
product
> Provide a fast and intuitive workflow to build complex cooling system
> Observe the flow behaviour inside the channels with further 3D Coolant CFD
analysis
Cooling Channel Design Tool

48. 48
Advanced Hot Runner
Manage Thermal Control to Enhance Molding Efficiency
> Support quick steady analysis for complex hot runner system
> Enable to prepare mesh at air gap region and visualize temperature distribution
for better heating rod/coil design verification
> Visualize melt temperature, pressure, and flow rate distribution inside hot
runner
> Improve thermal uniformity, optimize heating cycle, and prevent degradation of
plastic material
Insights of Thermal and Flow in Melt Delivery

49. 49
3D Coolant CFD
Enhance Cooling Efficiency
> Simulate water flow in 3D cooling channels to guarantee cooling efficiency
> Visualize the streamline properties and predict hot spots along the conformal
cooling channels
> Optimize cooling system design and achieve cycle time reduction
More Analysis Features for Cooling System Management
New in R15.0
> Provide new 3D CFD solver with more powerful computing kernel to deliver
more stability and realistic predictions for complicated coolant design

50. 50
Conformal Cooling
Enhance Cooling Efficiency
> Provide more efficient method to build complex cooling channel layout
> Predict stream line, pressure loss, and velocity/temperature results inside the
pipes to evaluate the dead end
> Validate the pipe surface roughness effects and provide information for cooling
system design revision
> Minimize cooling rate difference through the whole part
More Analysis Features for Cooling System Management
Different
velocity

51. 51
Transient Cool
Enhance Cooling Efficiency
> Support various dynamic variotherm technologies
– Heat & Cool™, Induction Heating Molding (IHM), and Electricity Heating Mold (E-Mold),
etc
> Visualize the temperature variation to decide melt fluidity in filling stage and
verify the target mold temperature during heating and cooling stages
> Further improve part quality within a reasonable cycle time
More Analysis Features for Cooling System Management

52. Innovative Molding Processes

53. 53
Gas/Water-Assisted Injection Molding (GAIM/WAIM)
3D Visualization of Dynamic Gas and Fluid Penetration
> Determine polymer and gas entrances positions with proper injection time and
injection volume of plastic and gas
> Optimize skin thickness and core-out ratio distribution to predict corner effect
and blow through
Even Skin/Core Ratio Distribution Control

54. 54
Powder Injection Molding (PIM)
Freedom of Shaping Metal/Ceramic Parts
> Simulate injection molding stage in the process workflow
> Visualize flow behaviours of feedstock
> Consider the impact on powder concentration and predict black lines due to
phase separation of powder and binder
Monitor Powder Concentration Performance
Black line prediction
Weld line prediction

55. 55
Co-Injection
Optimize Two Materials Dynamic Combinations
> Visualize dynamic filling interactions of skin and core materials
> Optimize geometry thickness and process conditions based on blow through
prediction
> Identify temperature imbalance and pressure resistance variations and optimize
shrinkage and warpage
Two Sequential Materials on Skin/Core Variation
Blow through occurred

56. 56
Bi-Injection
Two Separated Melt Entrance Setting for Filling Optimization
> Define two independent melt entrance and process parameters for different
materials
> Visualize the two melt front advancement and predict the potential weld lines to
optimize gate design
Two Materials Filling Behaviour

57. 57
In-Mold Decoration (IMD)
Efficient Decoration Layers Simulation
> New module in R15.0 to support IMD film boundary condition (BC) setting with
minimum human effort for model preparation
> Provide wash-out index to better predict the wash-off ink decoration of the film
> Predict the issues by considering injection speed and temperature effects
Ensure Successful Decorative Products
Thermal effect with IMD film Thermal effect without IMD film
New in R15.0

58. Computing Technology

59. 59
High Performance Parallel Computing
Stay Ahead with Enhanced Speed
> Utilize the strength of multi-core, multi-CPU, and multi-PC cluster
> Provide multiple remote computing farms for more efficient calculation on
single computer with high analysis efficiency
High Performance Parallel Processing
Remote computing

60. IC Packaging

61. 61
> An independent product series of encapsulation solutions for
specific IC Packaging industry applications
– Transfer molding / Molded underfill
– Capillary Underfill
– Wire sweep
– Paddle shift
– Compression molding
– Post mold cure warpage
– Filler concentration
> Complete validation of the mounting process from substrate to chip,
including the interconnection between microchips and wire
bonding, to identify IC components and drag force of resin flow
IC Packaging Encapsulation Innovation

62. 62
Transfer Molding / Molded Underfill
Predict Void Location and Improve Quality of Packaging
Mold Encapsulation Innovation
> Demonstrate the impact to flow behaviour to predict the defects such as voids, air traps,
short shot, and race track
> Provide solution to process of filling and curing phenomenon
Ref: Jonathan Tamil, et. al. “Molding Flow Modeling and Experimental Study on
Void Control for Flip Chip Package Panel Molding with Moldable Underfill Technology”,
IMAPS, 2011

63. 63
Capillary Underfill
Visualize Filling Patterns between Die and Substrate Driven by Capillary Flow
Mold Encapsulation Innovation
> Demonstrate flow behaviour under capillary phenomena during the dispensing process
> Minimize the impact of surface tension, and consider the drag force on cavity wall
> Simulate with the aim of obtaining a balanced melt front to reduce contact angle and avoid
voids
> Ensure moldability and increase reliability of flip chip packaging design

64. 64
Wire Sweep Analysis
Wire Structure Optimization
> Provide full insights of molding behaviour to assess wire curves under the impact of
drag force, such as:
– Wire deformation
– Wire sweep index
– Wire crossover
> Enable to export linear or non-linear data of wire stress-strain behaviour to ANSYS and
ABAQUS
> Predict excessive amount of wires deformation and provide significant indicator of
wire structural performance optimization
Mold Encapsulation Innovation
Wire-to-wire
short
Wire
breakage
© David Hsu

65. 65
Paddle Shift Analysis
IC Components Validation Under the Filling Force Effect
> Predict the paddle shift effect due to unbalanced force loading from EMC
flow during encapsulation
Mold Encapsulation Innovation
Unbalanced pressure loading from EMC flow ChipLeadframe
(a) Before deflection (b) After deflection

66. 66
Compression Molding (Embedded Wafer Level Packaging)
Support Different Process Conditions for Compression Process in IC Packaging
> Apply in compression molding, embedded wafer level packaging, no flow underfill, or non
conductive paste
> Examine the molding behaviour on stacked-die and substrate under the compression
force effect
> Visualize die shift behaviour and maximum shear stress distribution on wafer, wire sweep
behaviors during molding
Mold Encapsulation Innovation

67. 67
IC Packaging (Post Mold Curing)
Warpage Validation under the Cure Shrinkage Effect
IC Packaging (Filler Concentration)
Filler Particles Behaviours Validation for An Even Concentration Distribution
Mold Encapsulation Innovation
> Predict the warpage behaviours affected by CTE mismatch and cure shrinkage effects
> Accurately control the inherent stresses and validate the amount of warpage
> Predict filler particles simulation to observe how the particles aggregate, how the
concentration varies, and find an optimal gate design to achieve an uniform distribution
> Simulate with Moldex3D Powder Injection Molding module to have in-depth verification of
inner structure on IC products design

68. Conclusion

69. 69
> Moldex3D complete series products lead you to explore your ideas,
prove your concept of designs, boost collaborative relationship,
and keep business innovative ahead market
> From start to finish, Moldex3D takes care of all the steps no matter
from CAD design, CAE simulation to manufacturing
> Definitely build your confidence to quality products and create
competitiveness with industries
Moldex3D Product