This document proposes a new method to identify faulty contact pins in semiconductor testing sockets using contact impedance measurement. Currently, visual inspection and open/short circuit tests are used but have limitations. The proposed method measures the impedance of each pin using a contact impedance tester consisting of a microprocessor, LCR meter, and software. It can identify pins with high impedance qualitatively on a GUI in real-time, improving on resistance-only tests. This allows faulty pins to be identified earlier, reducing debugging time and costs of socket replacement.