Kiran Nayakar A/L Supramaniam completed a 6-month industrial training program at Semiconductor Assembler and Manufacturer Sdn. Bhd. to gain exposure to real-world engineering. The training objectives were to expose students to engineering professions, facilitate knowledge sharing between students and industry staff, and develop creative/positive thinking for overcoming engineering problems. Kiran learned about the company's semiconductor packaging processes like die preparation, die attach, wire bonding, and encapsulation. His training scope involved machine operation like pick and place, die bonding, wire bonding, and capping. Through the training, Kiran understood the roles of technicians and engineers better and gained skills in time management, goal setting,

1. INDUSTRIAL TRAINING PRESENTATION
31 JANUARY 2023 – 16 JUNE 2023
KIRAN NAYAKAR A/L SUPRMANIAM

3. SELF INTRODUCTION
Name : KIRAN NAYAKAR A/L SUPRAMANIAM
Registration No : 01DEP20F1065
Institution : UNGKU OMAR POLYTECHNIC
Course : DIPLOMA IN ELECTRONICS ENGINEERING COMMUNICATION
Supervisor : EN.KAMARUL BIN AHMAD
TS. ZAINAL FITHRI BIN DAHARI
MUHAMAD ZAKI B.ABDUL RAHMAN

4. INDUSTRIAL TRAINING OBJECTIVE
To give exposure to students the real situation
in engineering profession
To provide a channel for sharing or exchange of ideas,
knowledge and Technologies between the student and
staffs of industry.
To build and increase creative and positive
thinking when overcoming engineering
problems

5. COMPANY PROFILE
Semiconductor Assembler and Manufacturer Sdn. Bhd.
PT. 2108, Sri Senawang Light Industries Centre,
70450 Seremban, Negeri Sembilan,
Malaysia

6. PRODUCTS MANUFACTURED
Ceramic Packages
Glob Top Ceramic Packages
Metal Cans
Die Sorting & Packing

7. SEMICONDUCTOR PROCESS
DIE
PREPARATION
DIE ATTACH
WIRE BOND
CONFORMAL
COATING
ENCAPSULATION
LEAD FINISH MARKING
TEST
PACK

8. TRAINING SCOPE
PICK AND PLACE
• How to operate and set up pick up and place machine.
MACHINE # 1 MACHINE #2 MACHINE #3

9. DIE BOND
• How to operate and set up die bond machine.
• How to change and setting collet for die bond machine.
• How to adjust the temperature for the device in the hot plate.

10. WIREBOND
• Checking parameters in the wire bonding machine such as
ultrasound frequency, amplitude, power, bonding forces,
bonding time, and bonding temperature.
• Conduct troubleshooting of wire bond failure root causes.
• Work closely with Engineering to assure that customer’s
requirements are properly met.
• Change the wedge and gold or aluminum wire refer to
bonding diagram.
• Set up the device bonding programme.

11. CAPPING
• Set up, perform changeovers and adjust capping machines.
• Perform basic machine troubleshooting and maintenance.
• Keep daily records of downtime and machine operations.

12. CONCLUSION
During my industrial training, I was exposed to the working lives of technicians and engineers.
Throughout my internship, I could understand more about the definition of a technician and
engineer and prepare myself to become a responsible and innovative technician and engineer in
the future. During my training period, I realized that observation is a main element in finding out the
root cause of a problem. Not only for my project but for my daily activities too. During my project, I
cooperated with my colleagues and operators to determine the problems. Moreover, the project
indirectly helps me to learn independently, discipline myself, be considerate and patient, have self-
trust, take initiative, and have the ability to solve problems. Besides, my communication skills are
strengthened when communicating with others. During my training period, I have received criticism
and advice from engineers and technicians when mistakes were made. However, those tips are
useful guidance for me to change myself and avoid making the same mistakes again.
Throughout my industrial training, I found that several things were important:
 Time Management
 Goal Management
 Colleague relation
 Critical and analytical thinking

13. THANK YOU