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Low Power –Gate Length Biasing
Unconstrained Power
Power density
Low Power Techniques
Gate Length Biasing
Gate Length Biasing
Process node vs Stdcell
Process node vs Stdcell
Gate Length Biasing
• Freedom to assign different biased gate-lengths to
different devices.
We consider three options:
• Technology level: All devices in the library have the same
biased gate-length.
• Cell level: All devices in a cell have the same biased gate-
length. Devices in different cells may have different biased
gate-lengths.
• Device level: All devices are free to have an independent
biased gate-length.
Gate Length Biasing
• Application of this technique results in reduced leakage and
leakage variability while having very small impact on circuit
performance.
• Approach does not require additional process steps and can be
applied anytime during the design cycle.
• Gate-length biasing reduces leakage and its variability,
however, with a delay penalty.
Constrained to less than 10% to preserve pin- and layout-
compatibility.
Approach applicable as a post-layout/post-RET step
Gate Length Biasing
• Allow devices in a cell to have different biasing, and have
cell variants with different sets of timing arcs slowed down
• Rise & fall transitions not both critical  bias devices
that govern the non-critical transition
• Timing arcs of a cell not all critical  bias devices to
make non-critical arcs slow and reduce leakage
• Initial results:
• Additional 2%-5% leakage reduction
• Significant leakage variability reduction
Disadvantages:
• Increased cell library and GDSII size
• Evaluate at future technology nodes
• Leakage power contributes significantly to
total power
• All High- Vth implementation too slow
• All Low-Vthimplementation too leaky
• Dual- Vthprocesses popular
GLBPresentation1

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GLBPresentation1

  • 1. Low Power –Gate Length Biasing
  • 7. Process node vs Stdcell
  • 8. Process node vs Stdcell
  • 9. Gate Length Biasing • Freedom to assign different biased gate-lengths to different devices. We consider three options: • Technology level: All devices in the library have the same biased gate-length. • Cell level: All devices in a cell have the same biased gate- length. Devices in different cells may have different biased gate-lengths. • Device level: All devices are free to have an independent biased gate-length.
  • 10. Gate Length Biasing • Application of this technique results in reduced leakage and leakage variability while having very small impact on circuit performance. • Approach does not require additional process steps and can be applied anytime during the design cycle. • Gate-length biasing reduces leakage and its variability, however, with a delay penalty. Constrained to less than 10% to preserve pin- and layout- compatibility. Approach applicable as a post-layout/post-RET step
  • 11. Gate Length Biasing • Allow devices in a cell to have different biasing, and have cell variants with different sets of timing arcs slowed down • Rise & fall transitions not both critical  bias devices that govern the non-critical transition • Timing arcs of a cell not all critical  bias devices to make non-critical arcs slow and reduce leakage • Initial results: • Additional 2%-5% leakage reduction • Significant leakage variability reduction Disadvantages: • Increased cell library and GDSII size • Evaluate at future technology nodes
  • 12. • Leakage power contributes significantly to total power • All High- Vth implementation too slow • All Low-Vthimplementation too leaky • Dual- Vthprocesses popular