This report analyzes the global market for Power System in Package (PSiP) dc-dc converter modules. It forecasts strong growth in the PSiP market from $65 million in 2011 to $284 million in 2016 due to factors like increasing demand from communications and computers. PSiP devices could replace solutions like voltage regulators and switching converters by offering higher efficiency and power density. The report also examines technology trends, competitive landscape, and market opportunities for PSiP products in various applications.

1. DC-DC Converter ICs: Power System in Package, Worldwide Technology
Trends, Forecasts and Competitive Environment, First Edition
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Technology-Trends-Forecasts-and-Competitive-Environment-First-Edition-170260.html
This report provides a detailed and quantitative analysis of the global market for Power Sistem in
Package (PSiP) dc-dc converter modules. In many instances, unit sales, dollar sales and pricing
trends are discussed. See the listing of Figures for a complete description of the Tables included
in this unique and extensive analysis.
Topics covered include:
Definitions and Factors Driving Adoption
System Maker Demand Characteristics
IC Developments and Packaging Trends
Materials Challenges
Application Demand Characteristics
Worldwide PSiP Forecasts
Commercial Development
Competitive Overview
PSiP products are encroaching certain dc-dc converter IC markets and could replace traditional
solutions over the next five years. The total Worldwide PSiP dollar market is projected to grow
from approximately $65 million in 2011 to $284 million in 2016, a compound annual growth rate
(CAGR) of 34.4%. High growth rates are expected for all the application segments targeted by
companies making PSiP products.
The engineering innovations that have led to PSiP, PCiP and PwrSoC designs will have an
impact on different levels and functions of existing dc-dc power converter ICs and modules.
PSiP and PCiP (and eventually PwrSoC) products are expected to encroach on the current levels
occupied by LDOs, switching regulators, and controllers/FETs.
The best opportunities are in communications and computers, where unit CAGRs are expected
to range between 35% and 50% between 2011 and 2016; and revenue CAGRs will be around
23% to 38% over the forecast period. Industrial applications will see good growth, as well,
around 55% for unit sales and 44% for dollar sales.
The best smaller markets will have even faster unit growth, but this is due to very low starting
bases. These include automotive, military/aerospace and medical applications, which will see
growth between 50% and 100%. Most of these applications will not see significant revenue until
2013, however.
“Power System in Package” is a term that encompasses several new package styles that could
replace certain existing dc-dc converter IC solutions in the future. The bulk of this report focuses
on “Power Supply in Package” (PSiP) designs, which are highly integrated micro-modules and
the most commercially advanced, although still considered an emerging solution. It also includes

2. “Power Supply on Chip” (PwrSoC), which is a complete switch-mode dc-dc converter solution
integrated onto a single piece of silicon (not yet commercially available); and “Power Converter
in Package” (PCiP), where some components are integrated, but other components are external.
PSiP devices could replace LDOs, for instance, since they can address space constraint
challenges while tripling power efficiency in ultra-low-noise environments. They could also
replace noisy dc-dc switching regulators with ultra-quiet, high-efficiency dc-dc converters and
miniaturize traditional discrete dc-dc converters.
This report identifies the functions that require the specific benefits offered by
PSiP/PCiP/PwrSoC products; and then identifies the applications that need these functions,
which are presently being met by LDOs, switching regulators, and so on. Due to pricing
constraints, however, these products are expected to be a very small portion of the overall dc-dc
converter IC market, but their share is growing.
No true commercial PwrSoC products currently exist, so the forecasts presented are for
PSiP/PCiP-type products. But these functions and applications could be met by future PwrSoC
products, as well. Darnell Group believes that looking at these technologies based on the
functions that the components perform opens up the commercial potential for PwrSoC, PSiP and
PCiP products. For example, an isolation barrier is typical in many applications, but this function
may be performed with multiple technologies. Capacitors are used for filtering and energy
storage, which can also be addressed in other ways.
Looking at PwrSoC, PSiP and PCiP technologies from a function integration perspective, as
opposed to a component integration perspective, also opens up the application markets where
these devices can be used, since the limitations of components integration may no longer apply.
Alternative solutions for these applications can be considered, and some companies are already
looking at this kind of redefinition in designing products. Not all of these solutions are cost-
effective yet, but they are expected to be over the coming years.
At the present time, most PSiP/PCiP solutions are being directed at the lower input voltage
segments. This is expected to change over the course of the forecast period, with products being
used in higher input voltage applications. While PSiPs are intended to primarily compete with
non-isolated dc-dc converter modules, PwrSoCs are expected to compete with both modules and
IC-based solutions.
Printed-circuit-board-based dc-dc converter modules are dominant at current levels of 5A and
more, and are less common at lower current levels. PSiPs are the more “mature” technology, are
commercially available, and are becoming more cost-competitive. PSiP-style products are not a
new trend, but they are expected to be the “advance guard” for PwrSoC products. Most
companies Darnell spoke to see a growing market for PSiP-style devices, including system
makers. PwrSoC still faces issues with cost and other economic factors, so adoption is expected
to be sporadic and in “niche” applications, such as computer distributed point-of-load, mobile
devices, and applications where ultrahigh-power density is required.
Since no true PwrSoC commercial products exist yet, this report focuses on companies that are

3. either making PSiP products, or are developing technologies or researching innovative solutions
that are expected to further the PwrSoC market. The applications targeted by companies making
PSiP products include high-performance computer applications, such as servers; telecom
applications; and mobile devices, such as tablets and smartphones. Energy harvesting was also
cited as a “definite market,” along with “some industrial.” Although not included specifically in
these forecasts, PwrSoC is projected for small products and low-current applications.
Original equipment manufacturers (OEMs) frequently drive trends and changes in power supply
designs. The same dynamics are expected for PwrSoC. Intel sees “the start of a revolution in
power delivery and power management for SoCs and high performance applications.” Part of
this is “combining” power delivery and power management in applications ranging from
performance servers to small consumer electronic devices. Intel says, “The trend in platform
power needs to shrink, become more efficient, and be more cost-effective.”
With system makers driving power trends and prices coming down, the PSiP (and related
products) market is expected to grow significantly enough in the next few years to provide good
“early adopter” opportunities for companies with the foresight to take advantage of them.
Table of Contents :
Introduction 6
Definitions and Factors Driving Adoption 8
System Maker Demand Characteristics 10
IC Developments and Packaging Trends 14
3D IC Packaging/Stacked Solutions 14
Functional Integration versus Component Integration 16
High-Voltage CMOS Technology 18
Embedded Batteries 18
Materials Challenges 20
Integrating Magnetics in PSiPs and PwrSoCs 20
Application Demand Characteristics 24
FPGAs 25
Radio Frequency (RF) Transmitters 26
Memory Termination Supply (VTT) 27
Energy Harvesting 27
Worldwide PSiP Forecasts 29
Forecast Assumptions 29
Market Adoption Drivers and Challenges 30
PSiP, PwrSoC and Non-Isolated Module Price/Performance 32
Output Current Forecasts 36
Input Voltage Forecasts 41
Application Drivers and Forecasts 45

4. Commercial Development 58
Competitive Overview 58
Analog Devices 58
Cymbet Corp. 59
Efficient Power Conversion (EPC) 60
Enpirion 61
Infineon 63
Infinite Power Solutions 64
Intel 64
Linear Technology 65
National Semiconductor 66
NXP Semiconductors 67
ROHM 68
Texas Instruments 69
University of Rochester 70
Vicor 71
Volterra 71
List of Exhibits
TABLES
Table 1 – PSiP Companies, Selected Applications and Enablers 34
Table 2 – Worldwide PSiP Market, by Output Current (millions of units) 37
Table 3 – Worldwide PSiP Market, by Output Current (millions of $) 37
Table 4 – Worldwide PSiP Market, by Output Current ($/unit) 37
Table 5 – Worldwide PSiP Market, by Input Voltage (millions of units) 41
Table 6 – Worldwide PSiP Market, by Input Voltage (millions of $) 42
Table 7 – Worldwide PSiP Market, by Input Voltage ($/unit) 43
Table 8 – Worldwide PSiP Market, by Application (millions of units) 47
Table 9 – Worldwide PSiP Market, by Application (millions of $) 48
Table 10 – Worldwide PSiP Market, by Application ($/unit) 48
Table 11 – Worldwide PSiP Market, by Application and Output Current (millions of units) 52
Table 12 – Worldwide PSiP Market, by Application and Input Voltage (millions of units) 55
FIGURES
Figure 1 – Linear Technology µModule 9
Figure 2 – 2011: POL Regulators in Server Systems 11
Figure 3 – 2012-2015: POL Regulators for Servers 12
Figure 4 – Beyond 2015: Integrated Regulators in a Processor Package 12
Figure 5 – Cross-section of a Device Using a PowerStack Package 16
Figure 6 – EnerChip Die in System-in-Package 19
Figure 7 – Cross-Section Diagram of isoPower Transformer 21
Figure 8 – Photograph of isoPower Transformer 21

5. Figure 9 – Bond Wire Inductor 22
Figure 10 – Low Temperature Co-fired Ceramic DC-DC Converter Prototype 23
Figure 11 – Micro-Inductor Structure 23
Figure 12 – Normalized Pricing for Point-of-Load Converters 33
Figure 13 – Price Differentials Between High-Performance PSiP Products and Equivalent “Generic”
Products, by Amperage Segment (2011 and 2016) 35
Figure 14 – Worldwide PSiP Market, by Output Current (millions of units) 38
Figure 15 – Worldwide PSiP Market, by Output Current (unit market share) 39
Figure 16 – Worldwide PSiP Market, by Output Current (millions of $) 40
Figure 17 – Worldwide PSiP Market, by Input Voltage (millions of units) 43
Figure 18 – Worldwide PSiP Market, by Input Voltage (unit market share) 44
Figure 19 – Worldwide PSiP Market, by Input Voltage (millions of $) 45
Figure 20 – Worldwide PSiP Market, by Application (millions of units) 49
Figure 21 – Worldwide PSiP Market, by Application (unit market share) 49
Figure 22 – Worldwide PSiP Market, by Application (millions of $) 50
Figure 23 – Worldwide PSiP Market, Application Growth Rates – 2011 & 2016 (units and dollars 51
Figure 24 – Worldwide PSiP Market, by Application and Output Current (millions of units) 53
Figure 25 – Worldwide PSiP Market, by Application and Input Voltage (millions of units) 57
Figure 26 – EnerChip Bare Die Attachment Mechanisms 60
Figure 27 – Enpirion Power-System-on-Chip 62
Figure 28 – Texas Instruments TPS82671 System-in-Package Regulator, Embedded DC-DC Converter IC 70
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