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![© 2010 IBM Corporation
IBM Power Systems
Active Memory Expansion - Planning Tool
Tool included in AIX 6.1 TL4 SP2
Run tool in the partition of interest for memory expansion.
Input desired expanded memory size. Tool outputs different real memory
and CPU resource combinations to achieve the desired effective memory.
Active Memory Expansion Modeled Statistics:
-----------------------
Modeled Expanded Memory Size : 8.00 GB
Expansion True Memory Modeled Memory CPU Usage
Factor Modeled Size Gain Estimate
--------- -------------- ----------------- -----------
1.21 6.75 GB 1.25 GB [ 19%] 0.00
1.31 6.25 GB 1.75 GB [ 28%] 0.20
1.41 5.75 GB 2.25 GB [ 39%] 0.35
1.51 5.50 GB 2.50 GB[ 45%] 0.58
1.61 5.00 GB 3.00 GB [ 60%] 1.46
Active Memory Expansion Recommendation:
---------------------
The recommended AME configuration for this workload is to configure
the LPAR with a memory size of 5.50 GB and to configure a memory
expansion factor of 1.51. This will result in a memory expansion of
45% from the LPAR's current memory size. With this configuration,
the estimated CPU usage due to Active Memory Expansion is
approximately 0.58 physical processors, and the estimated overall
peak CPU resource required for the LPAR is 3.72 physical processors.
This sample partition
has fairly good
expansion potential
A nice “sweet” spot for
this partition appears
to be 45% expansion
•2.5 GB gained memory
•Using about 0.58 cores
additional CPU resource](https://image.slidesharecdn.com/11136442-221209192955-23e2855b/85/11136442-ppt-124-320.jpg)
![© 2010 IBM Corporation
IBM Power Systems
Active Memory Expansion: Partition On / Off
With HMC, check Active Memory
Expansion box and enter
True and max memory
Memory expansion factor
To turn off expansion, unclick box
Partition IPL required to turn on or off
Active Memory Expansion Modeled Statistics:
-----------------------
Modeled Expanded Memory Size : 8.00 GB
Expansion True Memory Modeled Memory CPU Usage
Factor Modeled Size Gain Estimate
--------- -------------- ----------------- -----------
1.21 6.75 GB 1.25 GB [ 19%] 0.00
1.31 6.25 GB 1.75 GB [ 28%] 0.20
1.41 5.75 GB 2.25 GB [ 39%] 0.35
1.51 5.50 GB 2.50 GB [ 45%] 0.58
1.61 5.00 GB 3.00 GB [ 60%] 1.46
Active Memory Expansion Recommendation:
---------------------
The recommended AME configuration for this workload is to configure
the LPAR with a memory size of 5.50 GB and to configure a memory
expansion factor of 1.51. This will result in a memory expansion of
45% from the LPAR's current memory size. With this configuration,
the estimated CPU usage due to Active Memory Expansion is
approximately 0.58 physical processors, and the estimated overall
peak CPU resource required for the LPAR is 3.72 physical processors.
5.5 true
8.0 max](https://image.slidesharecdn.com/11136442-221209192955-23e2855b/85/11136442-ppt-125-320.jpg)
![[Café techno] - Ibm power7 - Les dernières annonces](https://cdn.slidesharecdn.com/ss_thumbnails/cafetechnod-fi-annoncesibmpower7du16avril2013-130528050901-phpapp01-thumbnail.jpg?width=640&height=640&fit=bounds)
11136442.ppt
- 1. © 2010 IBMCorporation IBM Power Systems Power a Smarter Planet with POWER7 Smarter Systems for a Smarter Planet John Sheehy Systems Architect jes@e-techservices.com
- 2. © 2010 IBMCorporation IBM Power Systems 2 IBMVision Designed, integrated systems are part of the transformational story of the next decade.
- 3. © 2010 IBMCorporation IBM Power Systems 3 IBM Systems & Technology lay the foundation Workload Optimization Deep Understanding of Client Needs Approach challenge from the client’s perspective A Comprehensive Portfolio A family of “fit-for-purpose” servers, storage & system software Technology Leadership Investing in future technology for differentiation and sustained leadership
- 4. © 2010 IBMCorporation IBM Power Systems 4 Smarter Money Power Systems performance, security and availability are capabilities that provide the world’s largest banks with the ability to move today’s money - intangible, invisible information - from a paycheck to a bank to a retailer and back into another business account. Smarter Cities Cities large and small depend on the ability of Power Systems to sift through the data needed to not only solve crimes and respond to emergencies, but to help prevent them. Power Systems help manage traffic, share information across city agencies, keep citizens informed and give them access to services. Smarter Telecom Telcos are using Power Systems to deliver new services dynamically to an exploding number of devices - and Power’s scalability means that new services can be added quickly, new clients can be billed accurately, and costs can be reduced with consolidation.
- 5. © 2010 IBMCorporation IBM Power Systems 5 Organizations are moving from “what” to “how” How do I infuse intelligence into a system for which no one enterprise or agency is responsible? How do I bring all the necessary constituents together? How do I make the case for budget? How do I get a complex solution through procurement? How do I coalesce support with citizens? Where should I start? How fast should I move? “ ”
- 6. © 2010 IBMCorporation IBM Power Systems 6 Transformations to “smarter” solutions require smarter systems that: Scale quickly and efficiently Optimize workload performance Flexibly flow resources Avoid downtime Save energy Automate management tasks
- 7. © 2010 IBMCorporation IBM Power Systems 7 Power your planet. Smarter systems for a Smarter Planet.
- 8. © 2010 IBMCorporation IBM Power Systems 8 Source: IDC Quarterly Server Tracker Q309 release, November 2009 UNIX Server Rolling Four Quarter Average Revenue Share POWER4 Dynamic LPARs POWER6 Live Partition Mobility POWER5 Micro-Partitioning Customers are moving to higher value …as shown by the largest shift of customer spending in UNIX History
- 9. © 2010 IBMCorporation IBM Power Systems 9 successful Power Migration Factory migrations to date. There were over 500 Power migrations during 2009, with more than 90% from Sun and HP customers (including x86 consolidation). In 4Q09 alone, Power achieved nearly 200 competitive migrations. 2,100
- 10. © 2010 IBMCorporation IBM Power Systems •POWER7 Processor •POWER7 Servers –Power 750 –Power 755 –Power 770 –Power 780 •Active Memory Expansion •Upgrades •I/O Update Agenda….
- 11. © 2010 IBMCorporation IBM Power Systems •Balance System Design – Cache, Memory, and IO •POWER7 Processor Technology – 6th Implementation of multi- core design – On chip L2 & L3 caches •POWER7 System Architecture – Blades to High End offerings – Enhances memory implementation – PCIe, SAS / SATA POWER7 System Highlights
- 12. © 2010 IBMCorporation IBM Power Systems Operating Systems Power Systems Portfolio (Feb 2010) Major Features: Modular systems with linear scalability PowerVM Virtualization Physical and Virtual Management Roadmap to Continuous Availability Binary Compatibility Energy / Thermal Management Power 755 Power 750 520 BladeCenter JS12 / JS22 JS23 / JS43 595 575 Power 770 Power 780
- 13. © 2010 IBMCorporation IBM Power Systems POWER7 Systems Technology Value… •Technology –Roadmap –Processor Instruction Retry –Green Technology built in –Common architecture from Blades to High- end •Performance –Power Systems scalability from blades to high end systems –Performance leadership in a variety of workloads –Best Performance per core –Memory and IO bandwidth Hypervisor Virt I/O Server Shared I/O Single SMP Hardware System
- 14. © 2010 IBMCorporation IBM Power Systems POWER7 Processor POWER7 Processor
- 15. © 2010 IBMCorporation IBM Power Systems Processor Technology Roadmap 2001 Dual Core Chip Multi Processing Distributed Switch Shared L2 Dynamic LPARs (32) 2004 Dual Core Enhanced Scaling SMT Distributed Switch + Core Parallelism + FP Performance + Memory bandwidth + Virtualization 2007 Dual Core High Frequencies Virtualization + Memory Subsystem + Altivec Instruction Retry Dyn Energy Mgmt SMT + Protection Keys 2010 Multi Core On-Chip eDRAM Power Optimized Cores Mem Subsystem ++ SMT++ Reliability + VSM & VSX (AltiVec) Protection Keys+ POWER8 Concept Phase POWER4 180 nm POWER5 130 nm POWER6 65 nm POWER7 45 nm
- 16. © 2010 IBMCorporation IBM Power Systems POWER5 POWER5+ POWER6 POWER7 Technology 130 nm 90 nm 60 nm 45 nm Size 389 mm2 245 mm2 341 mm2 567 mm2 Transistors 276 M 276 M 790 M 1.2 B Cores 2 2 2 4 / 6 / 8 Frequencies 1.65 GHz 1.9 GHz 3-5 GHz 3-4 GHz L2 Cache 1.9 MB Shared 1.9 MB Shared 4 MB / Core 256 KB / Core L3 Cache 36 MB 36 MB 32 MB 4 MB / Core Memory Cntrl 1 1 2 / 1 2 LPAR 10 / Core 10 / Core 10 / Core 10 / Core Processor Designs
- 17. © 2010 IBMCorporation IBM Power Systems POWER7 Processor Chip •Cores : 8 ( 4 / 6 core options ) •567mm2 Technology: –45nm lithography, Cu, SOI, eDRAM •Transistors: 1.2 B –Equivalent function of 2.7B –eDRAM efficiency •Eight processor cores –12 execution units per core –4 Way SMT per core – up to 4 threads per core –32 Threads per chip –L1: 32 KB I Cache / 32 KB D Cache –L2: 256 KB per core –L3: Shared 32MB on chip eDRAM •Dual DDR3 Memory Controllers –90 GB/s Memory bandwidth per chip •Scalability up to 32 Sockets –360 GB/s SMP bandwidth/chip –20,000 coherent operations in flight Binary Compatibility with POWER6 POWER7 CORE L2 Cache POWER7 CORE L2 Cache POWER7 CORE L2 Cache POWER7 CORE L2 Cache POWER7 CORE L2 Cache POWER7 CORE L2 Cache POWER7 CORE L2 Cache POWER7 CORE L2 Cache L3 Cache and Chip Interconnect MC1 MC0 Local SMP Links Remote SMP & I/O Links F A S T L3 REGION
- 18. © 2010 IBMCorporation IBM Power Systems eDRAM technology IBM’s eDRAM technology benefits: Greater density, Less power requirements, Fewer soft errors, and Better performance Enables POWER7 to provide 32MB of internal L3 Cache L3 Cache critical to balanced design / performance: 6:1 Latency improvement for L3 accesses vs external L3 2X Bandwidth improvement with on chip interconnect. 32B busses to and from each core No off chip driver or receivers in L3 access path. eDRAM is nearly as fast as conventional SRAM but requires far less space 1/3 the space of conventional 6T SRAM implementation 1/5 the standby power Soft Error Rate 250x lower than SRAM ( Better availability ) 1.5 Billion reduction in transistors IBM is effectively doubling microprocessor performance beyond what classical scaling alone can achieve,” said Dr. Subramanian Iyer, DE (Distinguished Engineer) DT EDRAM Cell
- 19. © 2010 IBMCorporation IBM Power Systems POWER7 Core 64-bit PowerPC architecture v2.07 Execution Units •2 Fixed Point Units •2 Load Store Units •4 Double Precision Floating Point Units •1 Branch •1 Condition Register •1 Vector Unit •1 Decimal Floating Point Unit •6 Wide Dispatch •Units include distributed Recovery Function Out of Order Execution Modes: POWER6, POWER6+ and POWER7 L2 Cache IFU CRU/BRU ISU DFU FXU VSX FPU LSU •POWER7 continues to support VMX / Extends SIMD support with VSX –2 VSX units that can each handle 2 Double-Precision FP instructions –8 FLOPS per cycles –VSX units can also handle 4 Single Precision instructions per cycle –VSX instruction set support for vector and scalar instructions
- 20. © 2010 IBMCorporation IBM Power Systems AIX Release/TL Max Cores & Threads Supported POWER6 Mode POWER7 Mode AIX 5.3 (All TLs Supported 64 / 128 N/A AIX 6.1 TL2, TL3 64 / 128 N/A AIX 6.1 TL4 64 / 128 64 / 256 AIX 6.1 TL5 64 / 128 64 / 256 AIX 7.1 64 / 128 256 / 1024 POWER7 Modes: IBM i and AIX IBM i Release Max Cores & Threads Supported POWER6 Mode POWER7 Mode IBM i 6.1 32 / 64 32 / 128 Special Support 64/128 32 / 128 IBM i 7.1 32 / 64 32 / 128 Special Support 64/128 64 / 256
- 21. © 2010 IBMCorporation IBM Power Systems 21 Linux Max Processors & Threads Supported POWER6 Mode POWER7 Mode RHEL 5 ( Updates newer than U4) 64 / 128 N/A SLES 10 SP# and newer 64 / 128 N/A SLES 11 ( All Service Packs) 64 / 128 256 / 1024 RHEL 6 (Next major RHEL version) 64 / 128 256 / 1024 POWER7 Modes: Linux
- 22. © 2010 IBMCorporation IBM Power Systems POWER7 Design Physical Design: •8 cores with integrated cache and memory controllers •4 / 6 / 8 Core options •45nm technology Features: •4th Generation SMP Fabric Bus •3rd Generation Multi-Threading •New Power Bus •Energy Optimized Design •Multiple Memory Controllers •DDR3 memory support •Enhanced GX System Buses •On-Chip L2/L3 Cache •eDRAM L3 Cache •Industry Standard IO Core L2 Core L2 Memory Interface Core L2 Core L2 Core L2 Core L2 Core L2 Core L2 G X P O W E R B U S S M P F A B R I C L3 Cache
- 23. © 2010 IBMCorporation IBM Power Systems Transition from POWER6 POWER6 Memory+ GX+ Bridge Memory+ GX Bus Cntrl Memory Cntrl Memory Cntrl Fabric Bus Controller Core Alti Vec L3 Ctrl L3 L3 Ctrl L3 Core Alti Vec 4 MB L2 4 MB L2 Core L2 Core L2 Memory Interface Core L2 Core L2 Core L2 Core L2 Core L2 Core L2 G X S M P F A B R I C P O W E R B U S POWER7 Memory++ L3 Cache
- 24. © 2010 IBMCorporation IBM Power Systems Memory Channel Bandwidth Evolution DDR2 @ 553 / 667 MHz Effective Bandwidth: 2.6 GB/sec DDR3 @ 1066 MHz Effective Bandwidth: 6.4 GB/sec DDR2 @ 553 MHz Effective Bandwidth: 1.1 GB/s POWER5 POWER6 POWER7 Memory Performance: 2x DIMM Memory Performance: 4x DIMM Memory Performance: 6x DIMM D D R 3 D D R 3 D D R 3 D D R 3 D D R 3 D D R 3 D D R 3 D D R 3 D D R 3 D D R 3
- 25. © 2010 IBMCorporation IBM Power Systems Multi-threading Evolution Thread 1 Executing Thread 0 Executing No Thread Executing FX0 FX1 FP0 FP1 LS0 LS1 BRX CRL Single thread Out of Order FX0 FX1 FP0 FP1 LS0 LS1 BRX CRL S80 Hardware Multi-thread FX0 FX1 FP0 FP1 LS0 LS1 BRX CRL POWER5 2 Way SMT FX0 FX1 FP0 FP1 LS0 LS1 BRX CRL POWER7 4 Way SMT Thread 3 Executing Thread 2 Executing
- 26. © 2010 IBMCorporation IBM Power Systems POWER7 TurboCore Mode • TurboCore Chips: 4 available cores • Aggregation of L3 Caches of unused cores. •TurboCore chips have a 2X the L3 Cache per Chip available –4 TurboCore Chips L3 = 32 MB • Performance gain over POWER6. –Provides up to 1.5X per core to core • Chips run at higher Unused Core TurboCores Core L2 Core L2 Memory Interface Core L2 Core L2 Core L2 Core L2 Core L2 Core L2 G X S M P F A B R I C P O W E R B U S 32 MB L3 Cache POWER7 Chip Power 780 TurboCore Chip
- 27. © 2010 IBMCorporation IBM Power Systems Core L2 Core L2 Memory Interface Core L2 Core L2 Core L2 Core L2 Core L2 Core L2 G X S M P F A B R I C P O W E R B U S 24 MB L3 Cache POWER7 Core / Cache options 6-Core Chip Power 750 & Power 770
- 28. © 2010 IBMCorporation IBM Power Systems POWER7 SMT4 •Standard Cache Option •All cores active •Requires POWER7 Mode – POWER6 Mode supports SMT1 and SMT2 •Operating System Support – AIX 6.1 and AIX 7.1 – IBM i 6.1 and 7.1 – Linux •Dynamic Runtime SMT scheduling – Spread work among cores to execute in appropriate threaded mode – Can dynamical shift between modes as required: SMT1 / SMT2 / SMT4 •LPAR-wide SMT controls – ST, SMT2, SMT4 modes – smtctl / mpstat commands •Mixed SMT modes supported within same LPAR – Requires use of “Resource Groups” 0 0.5 1 1.5 2 SMT1 SMT2 SMT4
- 29. © 2010 IBMCorporation IBM Power Systems POWER7 Multi-threading Options •TurboCore option •50% of the cores active 0 0.5 1 1.5 2 2.5 SMT4 SMT2 Single 0 0.5 1 1.5 2 2.5 SMT4 SMT2 Single •MaxCore option •All cores active Based of rPerf workload
- 30. © 2010 IBMCorporation IBM Power Systems Fully Optimized POWER7 Module Packaging •Distributed Enterprise/SMB, Infrastructure Consolidation –Low-cost organic module designed for 2/4 socket platforms –Targets infrastructure consolidation, distributed enterprise and SMB –Targets sweet spot of performance, scalability and reliability –High-density, low-power options •Large Scale Enterprise and Server Consolidation –Glass ceramic targets leadership performance, scalability and reliability –Designed for enterprise database, ERP, CRM and decision support –Ideal for mission-critical and highly virtualized environments –Supports scalability up to 32 sockets •Massive Scale-Out –Quad-chip MCM targets high octane MFLOP engines –Targets unparalleled capacity for modeling complex systems and compute-intensive research –Scales up to 256 w eight-core processors per server and networked clusters of thousands of servers driving >PFLOP capability 2/4s Blades and Racks Single Chip Organic High-End and Mid-Range Single Chip Glass Ceramic Compute Intensive Quad-chip MCM
- 31. © 2010 IBMCorporation IBM Power Systems POWER7 Offerings… Power 750 Power 755 Power 770 Power 780
- 32. © 2010 IBMCorporation IBM Power Systems High-End / Mid-Range Packaging High-End and Mid-Range Single Chip Glass Ceramic (61mm) 3363 Pins
- 33. © 2010 IBMCorporation IBM Power Systems POWER7 Core Offerings
- 34. © 2010 IBMCorporation IBM Power Systems Processor Offerings for Blades / Rack / HPC POWER7 Processor Offerings Cores / Socket 4 6 8 PS700 / 701 / 702 Yes - Yes Power 750 - Yes Yes (3) Power 755 - - Yes Configuration Options Sockets 1 2 3 4 6 Core Chips 6 Cores 12 Cores 18 Cores 24 Cores 8 Core Chips 8 Cores 16 Cores 24 Cores 32 Cores 1-4 Socket System
- 35. © 2010 IBMCorporation IBM Power Systems Processor Offerings for Modular Systems POWER7 TurboCore / CoD Processor Offerings Cores / Socket 4 TurboCore 6 8 Base 8 Enhanced Power 770 - Yes Yes - Power 780 Yes - - Yes Configuration Options Enclosures 1 2 3 4 4 Core Chips 8 Cores 16 Cores 24 Cores 32 Cores 6 Core Chips 12 Cores 24 Cores 36 Cores 48 Cores 8 Core Chips 16 Cores 32 Cores 48 Cores 64 Cores
- 36. © 2010 IBMCorporation IBM Power Systems Energy Management
- 37. © 2010 IBMCorporation IBM Power Systems EnergyScale •EnergyScale is IBM Trademark. It consists of a built-in Thermal Power Management Device (TPMD) card and Power Executive software. •IBM Systems Director is also required to manage Energy-Scale functions. •EnergyScale is used to dynamically optimizes the processor performance versus processor power and system workload. •IBM Systems Director is also required to manage AEM functions and supports the following functions: 37
- 38. © 2010 IBMCorporation IBM Power Systems Definition of Terms •Energy Trending –EnergyScale provides continuous collection of real-time server energy consumption. This energy usage data may be displayed or exported by IBM Systems Director Active Energy Manager. –Administrators may use such information to predict data center 38
- 39. © 2010 IBMCorporation IBM Power Systems Definition of Terms (continued) •StaticEnergy Saver Mode –Static Energy Saver lowers the processor frequency and voltage on an Power 750 a fixed amount, reducing the energy consumption of the system while still delivering predictable performance. –This percentage is predetermined to be within a safe operating limit and is not user configurable. –Active Energy Manager is the 39
- 40. © 2010 IBMCorporation IBM Power Systems Definition of Terms (continued) •Dynamic Energy Saver Mode –Dynamic Energy Saver varies processor frequency and voltage based on the utilization of the Power 750 POWER7 processors. –The user must configure this setting from Active Energy Manager. –Processor frequency and utilization are inversely proportional for most workloads, implying that as the frequency of a processor increases, its utilization decreases, given a constant workload. –Dynamic Energy Saver takes advantage of this relationship to detect opportunities to save power, based on measured real-time system utilization. 40
- 41. © 2010 IBMCorporation IBM Power Systems Definition of Terms (continued) •Energy Capping –Power Capping enforces a user specified limit on energy consumption. –The user must set and enable an energy cap from the Active Energy Manager user interface. –In most data centers and other installations, when a machine is installed, a certain amount of energy is allocated to it. 41
- 42. © 2010 IBMCorporation IBM Power Systems Definition of Terms (continued) •“Soft” Energy Capping –There are two power ranges into which the power cap may be set . –When a power cap is set in the guaranteed range (described above), the system is guaranteed to use less energy than the cap setting. –Setting a energy cap in this region allows for the recovery of the margined power, but in many cases cannot be used to save 42
- 43. © 2010 IBMCorporation IBM Power Systems Definition of Terms (continued) •Processor Nap –The IBM POWER7 processor uses a low- power mode called Nap that stops processor execution when there is no work to do on that processor core. –The latency of exiting Nap falls within a partition dispatch (context switch) such that the Hypervisor firmware can use it as a general purpose idle state. –When the Operating System detects that a 43
- 44. © 2010 IBMCorporation IBM Power Systems Definition of Terms (continued) •Processor Nap –If the processor core is in a shared processor pool (the set of cores being used for micro-partition dispatching) and there is no micro-partition to dispatch, the Hypervisor puts the second thread into Nap mode. –By entering Nap mode, it allows the hardware to clock off most of the circuits inside the processor core. 44
- 45. © 2010 IBMCorporation IBM Power Systems Definition of Terms (continued) •Energy-Optimized Fan Control and Altitude Input –On the Power 750, firmware will dynamically adjust fan speed based on energy consumption, altitude, ambient temperature, & energy savings modes. –Systems are designed to operate in worst- case environments, in hot ambient temperatures, at high altitudes, & with high power components. –In a typical case, one or more of these 45
- 46. © 2010 IBMCorporation IBM Power Systems Definition of Terms (continued) •Processor Folding –Processor Folding is a consolidation technique that dynamically adjusts, over the short-term, the number of processors available for dispatch to match the number of processors demanded by the workload. –As the workload increases, the number of processors made available increases; as the workload decreases, the number of processors made available decreases. 46
- 47. © 2010 IBMCorporation IBM Power Systems POWER7 TPMD
- 48. © 2010 IBMCorporation IBM Power Systems TPMD: Thermal Power Management Device • TPMD card is part of the base hardware configuration. • Residing on the processor planar • TPMD function is comprised of a risk processor and data acquisition • TPMD monitor power usage and temperatures in real time • Responsible for thermal protection of the processor cards • Can adjust the processor power and performance in real time. • If the temperature exceeds an upper (functional) threshold, TPMD actively reduces power consumption by reducing processor voltage and frequency or throttling memory as needed. • If the temperature is lower than upper (functional) threshold, TPMD will allows POWER7 cores to “Over clock” if workloads demands are present.
- 49. © 2010 IBMCorporation IBM Power Systems POWER7 “Over Clock” Uplift
- 50. © 2010 IBMCorporation IBM Power Systems Active Energy Manager Benefits: •Monitor energy consumption to allow better utilization of available energy resources. •Can trend actual energy consumption and corresponding thermal loading of IBM Systems running in their environment with their applications. : –Allocate less power and cooling infrastructure to IBM servers –Lower power usage on select IBM servers –Plan for the future by viewing trends of power usage over time –Determine power usage for all components of a rack 50
- 51. © 2010 IBMCorporation IBM Power Systems POWER7 Model 750 POWER7 Model 750
- 52. © 2010 IBMCorporation IBM Power Systems Power 750 Product Features •Features of the Power 750:8233-E8B… –POWER7 processor with multiple cores •32-ways (8 cores/processor card x 4 processor cards) –Industry Standard RDIMM, DDR3 1066 Mbps with enhanced memory RAS features including 64-byte marking ECC code, and ChipKill detection and correction. •512 GB maximum (16GB/DIMM x 8 DIMMs/processor card x 4 processor cards) –8 hot plug and front access SFF SAS DASD. –1 slim media bay for DVD. –1 half high bay for tape drive. –Hot plug 3 PCIe slots and two PCIX slots with Enhanced Error Handling. –One GX+ slot and one GX++ slot (not hot pluggable) 52
- 53. © 2010 IBMCorporation IBM Power Systems Power 750 System 8233-E8B POWER7 Architecture 6 Cores @ 3.3 GHz 8 Cores @ 3. 0, 3.3, 3.55 GHz Max: 4 Sockets DDR3 Memory Up to 512 GB System Unit SAS SFF Bays Up to 8 Drives (HDD or SSD) 73 / 146 / 300GB @ 15k (2.4 TB) (Opt: cache & RAID-5/6) System Unit IO Expansion Slots PCIe x8: 3 Slots (2 shared) PCI-X DDR: 2 Slots 1 GX+ & Opt 1 GX++ 12X cards Integrated SAS / SATA Yes System Unit Integrated Ports 3 USB, 2 Serial, 2 HMC Integrated Virtual Ethernet Quad 10/100/1000 Optional: Dual 10 Gb System Unit Media Bays 1 Slim-line DVD & 1 Half Height IO Drawers w/ PCI slots PCIe = 4 Max: PCI-X = 8 MAX Cluster 12X SDR / DDR (IB technology) Redundant Power and Cooling Yes (AC or DC Power) Single phase 240 VAC or -48 VDC Certification (SoD) NEBS / ETSI for harsh 4U Depth: 28.8”
- 54. © 2010 IBMCorporation IBM Power Systems Power 750 System Overview •8 SFF Bays •(Disk or SSD) •Dual Power Supplies •Half-High Bay •(tape or removable disk •Up to 4 •Processor / Memory Cards •3 PCIe & 2 PCI-X •Slots •Fans •TPMD •DVD
- 55. © 2010 IBMCorporation IBM Power Systems 55 Power Supplies Tape Drive Remove DASD Bay DVD Drive Operator Panel 8 SFF DASD / SSD Power 750 Front View
- 56. © 2010 IBMCorporation IBM Power Systems 56 SAS Port System Port 1 System Port 2 USB Ports HMC Ports IVE Ethernet PCIe Slot 1 or GX++ Slot PCIe Slot 2 or GX+ Slot PCIe Slot 3 PCIX Slot 5 PCIX Slot 4 Power 750 Rear View SPCN
- 57. © 2010 IBMCorporation IBM Power Systems 57 POWER7 chip Enhanced Buffer controller 4 DIMM Slots 4 DIMM Slots Processor Card Processor Cards 6-core 3.3 GHz #8335 – 1 to 4 per server 8-core 3.0 GHz #8332 – 1 to 4 per server 8-core 3.3 GHz #8334 – 1 to 4 per server 8-core 3.55 GHz #8336 – 4 per server All processor cards on the same server must be identical feature code Processor VRM Memory VRM
- 58. © 2010 IBMCorporation IBM Power Systems 58 Power 750 System Layout DIMM DIMM SN DIMM DIMM SN DIMM DIMM SN DIMM DIMM SN POWER7 Chip DIMM DIMM SN DIMM DIMM SN DIMM DIMM SN DIMM DIMM SN POWER7 Chip DIMM DIMM SN DIMM DIMM SN DIMM DIMM SN DIMM DIMM SN POWER7 Chip DIMM DIMM SN DIMM DIMM SN DIMM DIMM SN DIMM DIMM SN POWER7 Chip Power Supply 1 Power Supply 2 8 SFF / SSD DASD SLIM DVD Tape Drive Anchor Card Cache RAID Card (opt) Aux Write Cache (opt) SPCN1 SPCN2 HMC1 HMC2 S1 S2 GX++ Slot TPMD SAS Controller DASD & Media Back Plane IO Controller USB USB RJ45 RJ45 ENET PHY RJ45 RJ45 ENET PHY PCI-X S4 PCIe S3 PCI-X S5 PCIe S2 PCIe S1 USB MUX GX+ Slot FSP Op-Panel Ext SAS USB 2nd Proc / Memory Card required for GX++ Bus
- 59. © 2010 IBMCorporation IBM Power Systems Memory Options for Power 750 / 755 Feature Size (2 DIMM) DIMM Size Memory Speed 750 Max Memory 8 GB 4 GB 1066 MHz 128 GB 16 GB 8 GB 1066 MHz 256 GB 32 GB 16 GB 1066 MHz 512 GB Power 755 Power 750 Feature Size (2 DIMM) DIMM Size Memory Speed 755 Max Memory 8 GB 4 GB 1066 MHz 128 GB 16 GB 8 GB 1066 MHz 256 GB
- 60. © 2010 IBMCorporation IBM Power Systems Power 750 Memory •8 DDR3 DIMM slots per processor card •DIMMS: 4GB, 8GB and 16GB •Plugged in pairs. 1 feature code = 1 pair •Min = 1 feature per SERVER, but min 1 feat per Proc card recommended •Can NOT mix different size DIMMs on same processor card •Can have different size DIMMs on same server. One proc card GB memory capacity with DIMM size 1 Pair 2 Pair 3 Pair 4 Pair 4 GB 8 16 24 32 8 GB 16 32 48 64 16 GB 32 64 96 128 Feature Code Feature GB #4526 16 #4527 32 #4528 64 The following is for ONE processor card in the Power 750 # Proc card 1 2 3 4 DIMM slots 8 16 24 32 Min/Max GB 8 / 128 8 / 256 8 / 384 8 / 512
- 61. © 2010 IBMCorporation IBM Power Systems POWER7 Memory Bandwidth (750 / 755 / Blades ) POWER7 Mem Cntrl D D R 3 D D R 3 D D R 3 D D R 3 D D R 3 D D R 3 D D R 3 D D R 3 D D R 3 D D R 3 Nova Max Read Bandwidth: 51.168 GB/sec Max Write Bandwidth: 25.584 GB/sec Max Combined Bandwidth: 68.224 GB/sec D D R 3 D D R 3 D D R 3 D D R 3 D D R 3 D D R 3 D D R 3 D D R 3 D D R 3 D D R 3 Nova Nova Nova Each Nova Chip (Read/Write Buffer) supports two DIMMS Chip Bandwidth
- 62. © 2010 IBMCorporation IBM Power Systems Memory Bandwidth L1 ( Data ) 170.4 GB/sec L2 170.4 GB/sec L3 113.6 GB/sec Memory 68.224 GB/sec per Socket 272.896 GB/sec per System Intra-Node Buses 6.4 GB/sec GX++ Bus (12X DDR) GX+ Bus (12X SDR) 20 GB/sec 10 GB/sec ( Shared ) GX Bus Slot 1 GX Bus Slot 2 Internal IO Slots Total IO Bandwidth 20 GB/sec 5** GB/sec 5** GB/sec 30 GB/sec Power 750 Bandwidth @ 3.55 GHz ** Pass thru bus
- 63. © 2010 IBMCorporation IBM Power Systems Power 750 Information…. •Physical Specifications: –Width: 440 mm (17.3 in) –Depth: 730.8 mm (28.8 in) –Height: 175 mm (6.89 in) –Weight: 54.4 kg (120 lb) •Operating voltage: –200 to 240 V •Operating Frequency: 50/60 Hz •Power Consumption: 1950 watts (maximum) •Power Factor: 0.97 •Thermal Output: 4778 Btu/hour (maximum)
- 64. © 2010 IBMCorporation IBM Power Systems Functional Differences Power 550 Power 750 Up to 8 Cores (4 sockets) Up to 32 Cores (4 sockets) Up to 256 GB Memory 32 DIMM slots Up to 512 GB Memory 32 DIMM slots DDR2 DIMMS DDR3 DIMMs 6 3.5 in or 8 SFF SAS disk/SSD 8 SFF SAS disk/SSD 3 PCIe & 2 PCI-X slots 3 PCIe & 2 PCI-X slots Commercial focus Commercial & HPC focus GX Bus & GX Passthru Slots GX Bus & GX Passthru Slots IVE: Dual Gb Optional: Quad Gb, or 10 Gb IVE: Quad Gb Optional: Dual 10 Gb TPMD Enhanced TPMD Guiding Light Light Path
- 65. © 2010 IBMCorporation IBM Power Systems Comparative Information….
- 66. © 2010 IBMCorporation IBM Power Systems Bandwidth Properties… 0 10 20 30 40 50 60 70 Memory Intra IO Power 550 Power 750
- 67. © 2010 IBMCorporation IBM Power Systems POWER7 / POWER6 Comparison 0 1000 2000 3000 4000 5000 6000 7000 8000 9000 Energy Consumption Thermal Power 750 Power 550 Power 560 Power 750: 32 Cores Power 550: 8 Cores Power 560: 16 Cores Active
- 68. © 2010 IBMCorporation IBM Power Systems Power 750 vs Power 550 / 560 Performance* / KW Performance* / K BTU * Calculated on rPerf, CPW results siimilar
- 69. © 2010 IBMCorporation IBM Power Systems POWER7 Model 755
- 70. © 2010 IBMCorporation IBM Power Systems Power 755 HPC: 8236-E8C •Power 755 / Power 750 Differences: 1.Only an 8-core 3.3GHz will be offered 2.Valid configuration is 32-core 3.3GHz (i.e. 4 processor cards). 3.No 16GB DIMM - Maximum memory is 256GB. 4.No IBM i O/S support 5.No PowerVM features (i.e. no LPAR or DLPAR) 6.No RAID feature (CCIN 57B7 & 57B8) 7.No Split Disk feature 8.No tape drive 9.No external I/O Drawers (e.g. Tres 19 Drawers) 10.No IB 12x SDR adapter (CCIN 1817) 71
- 71. © 2010 IBMCorporation IBM Power Systems 5.3 / 6.1 RHEL / SLES Power 755 4-Socket HPC System 8236-E8C POWER7 Architecture 4 Processor Sockets = 32 Cores 8 Core @ 3.3 GHz DDR3 Memory 128 GB / 256 GB, 32 DIMM Slots System Unit SAS SFF Bays Up to 8 disk or SSD 73 / 146 / 300GB @ 15K (up to 2.4TB) System Unit Expansion PCIe x8: 3 Slots (1 shared) PCI-X DDR: 2 Slots GX++ Bus Integrated Ports 3 USB, 2 Serial, 2 HMC Integrated Ethernet Quad 1Gb Copper (Opt: Dual 10Gb Copper or Fiber) System Unit Media Bay 1 DVD-RAM ( No supported tape bay ) Cluster Up to 64 nodes Ethernet or IB-DDR Redundant Power Yes (AC or DC Power) Single phase 240vac or -48 VDC Up to 8.4 TFlops per Rack ( 10 nodes per Rack ) 4U x 28.8” depth
- 72. © 2010 IBMCorporation IBM Power Systems 73 Power 755 System Layout DIMM DIMM SN DIMM DIMM SN DIMM DIMM SN DIMM DIMM SN POWER7 Core DIMM DIMM SN DIMM DIMM SN DIMM DIMM SN DIMM DIMM SN POWER7 Chip DIMM DIMM SN DIMM DIMM SN DIMM DIMM SN DIMM DIMM SN POWER7 Chip DIMM DIMM SN DIMM DIMM SN DIMM DIMM SN DIMM DIMM SN POWER7 Chip Power Supply 1 Power Supply 2 8 SFF / SSD DASD SLIM DVD Anchor Card SPCN1 SPCN2 HMC1 HMC2 S1 S2 GX++ Slot TPMD SAS Controller DASD & Media Back Plane IO Controller USB USB RJ45 RJ45 ENET PHY RJ45 RJ45 ENET PHY PCI-X S4 PCIe S3 PCI-X S5 PCIe S2 PCIe S1 USB MUX FSP Op-Panel Ext SAS USB
- 73. © 2010 IBMCorporation IBM Power Systems 1H / 2010 Scaling 64 nodes (32 Cores/node) 54 TFlops Operating Systems AIX 6.1 TL 04 / 05 Linux HPC Stack Levels xCAT v2.3.x GPFS v3.3.x PESSL v3.3.x LL v4.1.x PE v5.2.x ESSL Beta (GA 06/2010) ESSL v5.1 Compilers GA Levels XLF v13.1 VAC/C++ v11.1 Power 755 HPC Cluster Node IB-DDR Interconnect Data Center in a Rack Up to 10 Nodes per Rack Air cooled
- 74. © 2010 IBMCorporation IBM Power Systems POWER5+ 575 (1.9GHz) Power 575 (4.7GHz) Power 755 (3.3GHz) Latency (cycles/ns) 220 cycles / 110ns 420 cycles / 90ns 336 cycles / 102ns Bus 2 X DRAM Freq 4 X DRAM Freq 6 X DRAM Freq Memory Controllers per chip 1 per chip 1 (2 in HE) 1 Peak Bandwidth per chip 25GB/s 34GB/s 68 GB/s DRAM Technology DDR2 DDR2 DDR3 Power 755 Memory
- 75. © 2010 IBMCorporation IBM Power Systems Power 755 Power 575 Cores/chip 8 4 Total cores 32 32 Frequency 3.3 GHz 4.7 GHz Memory (max) 256 GB 256 GB Performance / TFlops .84 .6 Cooling Air Water Cores/rack Rack type 320 19” 448 24” Power (Watts) 1650 5400 755 offers the same core count per node 40% better performance per node (Linpack) 1/3 the power per node 37% less floor space for a 64 node configuration. Power 755 vs Power 575
- 76. © 2010 IBMCorporation IBM Power Systems Feature 755 750 Processors 32-core @ 3.3 GHz 32-core @ 3.55 GHz 6 / 12 / 18 / 24-core @ 3.3 GHz 8 / 16 / 24 / 32-core @ 3.0 GHz Memory 128GB OR 256GB 4GB & 8GB DIMMS 512GB Max. 4GB, 8GB, 16GB DIMMS GX slot support Yes – IB clustering Yes I/O Drawer support No Yes DASD Backplane No Split Backplane Split Backplane support Integrated Ethernet Quad GbE or Dual 10GbE Quad GbE or Dual 10GbE Virtualization No PowerVM support PowerVM Std and Ent DASD / Bays 8 SFF SAS HDD / SDD 10k and 15K SFF drives 8 SFF SAS HDD / SDD 10k and 15K SFF drives Optional RAID Internal Tape No Yes Performance Metric TFLOPS rPerf Misc. No IBM i Support IBM i Support Power 755 vs. 750 Offering Structures
- 77. © 2010 IBMCorporation IBM Power Systems POWER7 Model 770 Model 780
- 78. © 2010 IBMCorporation IBM Power Systems Power 770 Power 770 Processor Technology 6 Cores @ 3.55 GHz 8 Cores @ 3.1 GHz L3 Cache On Chip Redundant Power & Cooling Yes Redundant Server Processor Yes / Two Enclosure minimum Redundant Clock Yes / Two Enclosure minimum Concurrent Add Support Yes Concurrent Service Yes System Unit Single Enclosure 4 Enclosures Processors Up to 2 Sockets 8 Sockets DDR3 Memory (Buffered) Up to 512 GB Up to 2 TB SAS/SSD SFF Bays 6 24 DVD-RAM Media Bays 1 Slim-line 4 Slim-line SAS / SATA Controller 2 / 1 8 / 4 PCIe bays 6 PCIe 24 PCIe GX++ Slots (12X DDR) 2 8 Integrated Ethernet Std: Quad 1Gb Opt: Dual 10Gb + Std: Four Quad 1Gb Opt: Four x Dual 10Gb + Maint Coverage: 9 x 5 4U x 32 inches Depth
- 79. © 2010 IBMCorporation IBM Power Systems Power 780 Power 780 Processor Technology 4 Cores @ 4.1 GHz TurboCore 8 Cores @ 3.8 GHz L3 Cache On Chip Redundant Power & Cooling Yes Redundant Server Processor Yes / Two Enclosure minimum Redundant Clock Yes / Two Enclosure minimum Concurrent Add Support Yes Concurrent Service Yes System Unit Single Enclosure 4 Enclosures Processors 2 Sockets 8 Sockets DDR3 Memory (Buffered) Up to 512 GB Up to 2 TB SAS/SSD SFF Bays (CEC) 6 24 DVD-RAM Media Bays 1 Slim-line 4 Slim-line SAS / SATA Controller 2 / 1 8 / 4 PCIe (CEC) 6 PCIe 24 PCIe GX++ Slots (12X DDR) 2 8 Integrated Ethernet Std: Quad 1Gb Std: Four Quad 1Gb Maint Coverage 24 X 7 PowerCare Support
- 80. © 2010 IBMCorporation IBM Power Systems POWER7 Processor Chip 16 DIMM slots PCIe Slots FSP GX Slots 6 SFF Bays POWER7 Processor Chip Interconnect TPMD POWER7 Modular Layout
- 81. © 2010 IBMCorporation IBM Power Systems POWER7 Modular Front View Fabric Interconnects 6 SFF Bays DVD Fans Op Panel
- 82. © 2010 IBMCorporation IBM Power Systems POWER7 Modular Rear View Two GX++ Bays IVE Ports Two Power Supplies FSP Connectors HMC Ports P C I e P C I e P C I e P C I e P C I e P C I e SPCN Ports HMC Ports Serial Port USB Ports
- 83. © 2010 IBMCorporation IBM Power Systems POWER7 Modular System View Socket Socket Fan Fan Fan Fan Fan PCIe Slot PCIe Slot PCIe Slot PCIe Slot PCIe Slot PCIe Slot FSP & Clock Regulator Memory DIMMs Qty: 8 Memory DIMMs Qty: 4 Memory DIMMs Qty: 4 TPMD Power GX++ (12X) SFF 16 DIMM cards
- 84. © 2010 IBMCorporation IBM Power Systems Power 770 and Power 780 Processor Options Socket Socket Memory Memory Memory Power 780 Processor Options (2 Sockets per enclosure ) 16-core 3.86 GHz #4982 – 1 to 4 per server 8-core 4.14 GHz #4982 – 1 to 4 per server - Turbo Core Power 770 Processor Options (2 Sockets per enclosure ) 12-core 3.5 GHz #4980 – 1 to 4 per server 16-core 3.1 GHz #4981 – 1 to 4 per server
- 85. © 2010 IBMCorporation IBM Power Systems Modular Block Diagram….. RAID Battery RAID Battery SN DRAM DRAM DRAM DRAM DRAM DRAM DRAM DRAM DRAM SN DRAM DRAM DRAM DRAM DRAM DRAM DRAM DRAM DRAM 8 SN Dimms SN DRAM DRAM DRAM DRAM DRAM DRAM DRAM DRAM DRAM SN DRAM DRAM DRAM DRAM DRAM DRAM DRAM DRAM DRAM PSI Media X Bus A/B Buses 8 SN Dimms Write Cache Y Bus Z Bus CPU CARD DASD Backplane PSI I/O Backplane PWR7 Ext SAS GX++ A/B Buses GX++ Write Cache FSP Card SAS SAS EXP EXP PCIe Buses PCIe Buses SATA 4 x 1Gb Eth 2 x HMC Anchor Card PWR7 GX++ Busses GX++ Busses IVE IVE USB PCI-X Serial PCI-X IVE USB Serial P C I e P C I e P C I e P C I e P C I e P C I e TPMD IOC2 IOC2
- 86. © 2010 IBMCorporation IBM Power Systems Cooling Domains Air Flow Domain 1 Fans (5) Power Supply Fans (built-in) Front Rear POWER7 Modular supports Hot-Plug and Redundant cooling. There are five fans across the front of the box drawing in room air and is the primary cooling domain. Cool the processors, memory and I/O sub-system. TPMD controls this domain through the FSP. Control algorithm uses the processor, memory and I/O subsystem temperatures as input for fan control. Second cooling domain, that uses fans inside of each power supply Cools the power supplies and DASD. SPCN controls the fan speed on the power supplies. If the DASD/SSD cage is not installed, SPCN relinquishes control of the fans to the power supplies. Power supplies control fan speed based on internal power supply temperatures. Fan redundancy is limited to 1 fan fault per domain. More than one failing fan in each domain will force a drawer shutdown.
- 87. © 2010 IBMCorporation IBM Power Systems POWER7 Modular Memory Card Options Feature Size (4 DIMM card) DIMM Size Memory Speed Max Memory 32 GB 8 GB 1066 MHz 512 GB 64 GB 16 GB 1066 MHz 1 TB 128 GB 32 GB 800 MHz 2 TB 4Q10 planned
- 88. © 2010 IBMCorporation IBM Power Systems POWER7 Chip DIMM 1 SN DIMM 2 SN DIMM 3 SN DIMM 4 SN DIMM 5 SN DIMM 6 SN DIMM 7 SN DIMM 8 SN Mem Ctrl 1 Mem Ctrl 0 D C B A A B C D POWER7 Modular Memory Layout
- 89. © 2010 IBMCorporation IBM Power Systems POWER7 Modular Memory Bandwidth POWER7 Mem Cntrl DRAMs… DRAMs… Mem Cntrl Max Read Bandwidth: 102.336 GB/sec Max Write Bandwidth: 51.168 GB/sec Max Combined Bandwidth: 136.448 GB/sec Nova Nova Nova Nova Nova Nova Nova Nova
- 90. © 2010 IBMCorporation IBM Power Systems Two Enclosure Fabric Topology 2 1 FC #3711 FC #3712
- 91. © 2010 IBMCorporation IBM Power Systems Three Enclosure Fabric Topology 3 2 3 FC #3713 Two cables FC #3712
- 92. © 2010 IBMCorporation IBM Power Systems Four Enclosure Fabric Topology 2 4 4 3 3 4 FC #3712 FC #3713 Two cables FC #3714 Three cables
- 93. © 2010 IBMCorporation IBM Power Systems CEC Enclosure 1 FSP/ Clock CEC Enclosure 2 FSP/ Clock CEC Enclosure 3 Drw to Drw Connection CEC Enclosure 4 Drw to Drw Connection Drw to Drw Connection Point to Point Cabling Three cables Hot Drawer Add Support Add cables to live systems No disruptions Hot Failover support FSP Clock Concurrent Service Support FSP Cabling Configuration ( Logical View ) Front Rear Drw to Drw Connection
- 94. © 2010 IBMCorporation IBM Power Systems FSP 4 Enclosure Configuration Enclosure 1 Enclosure 2 Enclosure 3 Enclosure 4 Cable 2 Cable 1 Cable 3
- 95. © 2010 IBMCorporation IBM Power Systems 19-inch Rack Considerations 2 1 Cables wider than CEC Multi-enclosure configurations supported in IBM “Enterprise” racks: IBM 7014-T00, -T42, #0551, #0553 No problemS with a front door (regular or acoustic), but if use rack trim, need new #6247 trim kit For a Power 780 door with the pretty 780 label, order as feat code of 7014-T42 rack.
- 96. © 2010 IBMCorporation IBM Power Systems POWER7 770 Bandwidth @ 3.1 GHz Memory Bandwidth L1 ( Data ) 148.8 GB/sec L2 148.8 GB/sec L3 99.2 GB/sec Memory 4 Nodes 136.448 GB/sec per socket 1091.584 GB/sec Inter-Node Buses (4 Nodes) 158.016 GB/sec Intra-Node Buses (4 Nodes) 415.744 GB/sec Int GX Bus 1 & 2 4 Enclosures 19.712 GB/sec 78.848 GB/sec Ext GX Bus 1 & 2 4 Enclosures 39.424 GB/sec 157.696 GB/sec Total IO ( 4 Enclosures ) 236.544 GB /sec
- 97. © 2010 IBMCorporation IBM Power Systems POWER7 780 Bandwidth @ 3.86 GHz Memory Bandwidth L1 ( Data ) 185.28 GB/sec L2 185.28GB/sec L3 123.52 GB/sec Memory 4 Nodes 136.448 GB/sec per Socket 1091.584 GB/sec Inter-Node Buses (4 Nodes) 158.016 GB/sec Intra-Node Buses (4 Nodes) 415.744 GB/sec Int GX Bus 1 & 2 4 Enclosures 19.712 GB/sec 78.848 GB/sec Ext GX Bus 1 & 2 4 Enclosures 39.424 GB/sec 157.696 GB/sec Total IO ( 4 Enclosures ) 236.544 GB /sec
- 98. © 2010 IBMCorporation IBM Power Systems POWER7 780 Bandwidth @ 4.14 GHz Memory Bandwidth L1 ( Data ) 198.72 GB/sec L2 198.72 GB/sec L3 132.48 GB/sec Memory 4 Nodes 136.448 GB/sec per Socket 1091.584 GB/sec Inter-Node Buses (4 Nodes) 158.016 GB/sec Intra-Node Buses (4 Nodes) 415.744 GB/sec Int GX Bus 1 & 2 4 Enclosures 19.712 GB/sec 78.848 GB/sec Ext GX Bus 1 & 2 4 Enclosures 39.424 GB/sec 157.696 GB/sec Total IO ( 4 Enclosures ) 236.544 GB /sec
- 99. © 2010 IBMCorporation IBM Power Systems POWER7 Modular Information…. Physical Specifications (4 EIA units) Width: 483 mm (19.0 in.) Depth: 863 mm (32.0 in.) Height: 174 mm (6.85 in) Weight: 70.3 kg (155 lb) Operating voltage: 200 to 240 V Operating Frequency: 50/60 Hz Power Consumption: 1600 watts (maximum) Per enclosure with 16 cores active Power Factor: 0.97 Thermal Output: 5461 Btu/hour (maximum) Per enclosure with 16 cores active Power-source Loading 1.649 kva (maximum configuration) Noise Level and Sound One enclosure with 16 active cores: 6.8 bels / 6.3 bels with acoustic rack doors (operating/idle) Four enclosures with 64 active cores: 7.4 bels / 6.9 Bels with acoustic rack doors (operating/idle)
- 100. © 2010 IBMCorporation IBM Power Systems Power 770 & 780 vs Power 570 Differences Power 570 Power 770 & 780 Up to 8 sockets, Up to 32 Cores Up to 8 Sockets, Up to 64 cores Up to 768 GB Memory Up to 2 TB Memory ( Initial GA will be 1 TB) DDR2 DIMMS DDR3 DIMMS Six 3.5” SAS Bays / Enclosure Six SFF SAS Bays / Enclosure 4 PCIe & 2 PCI-X slots per Enclosure 6 PCIe slots per Enclosure No write cache or RAID-5/6 support Write cache & RAID-5/6 support Single integrated DASD / Media Cntlr Three integrated DASD / Media Controllers Optional Split Backplane Standard Split backplane Optional Tri-Split Backplane No Power & Management Thermal Power & Thermal management TPMD support Clock Cold Failover No Concurrent Maintenance of FSP/Clock Concurrent Drawer Maint restrictions Concurrent Drawer Add cable restrictions Clock Hot Failover Planned Concurrent Maintenance No Restrictions ( 4Q / 2010 ) No Restrictions
- 101. © 2010 IBMCorporation IBM Power Systems Comparative Information….
- 102. © 2010 IBMCorporation IBM Power Systems Power 570/32 vs 770 Bandwidth Properties… 0 200 400 600 800 1000 1200 Memory Inter Intra IO POWER6 POWER7
- 103. © 2010 IBMCorporation IBM Power Systems POWER7 / POWER6 Enclosure Comparison 0 1000 2000 3000 4000 5000 6000 Power Consumption Thermal Power 770 Power 570 POWER7: 16 Cores active / POWER6: 8 Cores Active
- 104. © 2010 IBMCorporation IBM Power Systems rPerf / KW rPerf / KBTU Power 780/770 vs Power 570/32
- 105. © 2010 IBMCorporation IBM Power Systems rPerf Performance
- 106. © 2010 IBMCorporation IBM Power Systems 770 780 595 POWER6 Nodes 4 4 8 Processors 12 - 48 / 16 - 64 8 – 32 / 16 - 64 8 – 64 ( Upgradeable to 256 Cores) Frequency 3.1 GHz 3.5 GHz ( 6 Core ) 3.55 GHz 4.14 Core ( 4 Core ) 4.2 GHz 5.0 GHz Memory / core 21 / 16 GB 32 / 16 GB 64 GB rPerf 493.37 / 579.39 418.64 / 685.09 553 Memory Bandwidth 1088 GB/sec 1088 GB/sec 1376 GB / sec IO Bandwidth 236 GB /sec 236 GB/sec 640 GB/sec Warranty 9 x 5 24 x 7 24 x 7 PowerCare No Yes Yes IBM Power 770 / 780 Positioning
- 107. © 2010 IBMCorporation IBM Power Systems POWER7 Performance
- 108. © 2010 IBMCorporation IBM Power Systems Simplify Web Facing Application Deployment 1 JVM AIX TL4 64 bit 16 threads 1 JVM Windows 64 bit 16 threads 3920 Transactions/sec IBM Power 750 8 cores 3.55GHz Nehalem EP 8 cores 2260 Transactions/sec 73% more work per JVM image Simpler configurations Better scale for software built on application server Extend WebSphere Application Server to fully exploit up to 32 threads in a single process, thereby reducing the number of images required IBM WebSphere Application Server 7 Competitive application server
- 109. © 2010 IBMCorporation IBM Power Systems Simplify SAP Infrastructure And Reduce Costs Case Study - Support 15,000 Users 1 1 0 IBM Power 750 certification number not available at press time and can be found at sap.com/benchmarks. IBM Power System 750, 4p / 32–c / 128 – t, POWER7, 3.55 GHz, 256 GB memory, 15,600 SD users, dialog resp.: 0.98s, line items/hour: 1,704,330, Dialog steps/hour: 5,113,000, SAPS: 85,220, DB time (dialog/ update):0.015s / 0.028s, CPU utilization: 99%, OS: AIX 6.1, DB2 9.7; IBM Power 570 16p / 32-c / 64 –t, 256 GB memory, 14,432 SD users, POWER6 4.2 GHz, AIX 6.1, DB2 9.5, cert# 2008057 All results are 2-tier, SAP EHP 4 for SAP ERP 6.0 (Unicode) and valid as of 2/9/2010. DB2 on Power 750 Oracle on Sun T5440 Oracle on Sun X4640 15,600 SD Users 32 cores POWER7 4,720 SD Users 32 cores UltraSPAR C T2+ 10,000 SD Users 48 cores AMD Opteron SAP Sales and Distribution ERP 6.0 EHP 2-Tier performance Support 3.3x more users on DB2 and Power 750 than Oracle on SPARC Infrastructure costs per user DB2 on Power 750 $100/user Oracle on Sun T5440 $185/user Oracle on Sun x4640 $123/user SAP and DB2 on Power 750
- 110. © 2010 IBMCorporation IBM Power Systems Power Systems rPerf Performance
- 111. © 2010 IBMCorporation IBM Power Systems POWER4™ p670 1.1 GHz rPerf: 24.46 KWatts: 6.71 3.64 POWER4+ ™ p670 1.5 GHz rPerf: 46.79 KWatts: 6.71 6.97 POWER5™ p5-570 1.65 GHz rPerf: 68.4 KWatts: 5.2 13.15 POWER5+ ™ p570 1.9 GHz rPerf: 85.20 KWatts: 5.2 16.38 POWER6™ Power 570 4.7 GHz rPerf: 134.35 KWatts: 5.6 23.99 POWER6™ Power 570 4.2 GHz rPerf: 193.25 KWatts: 5.6 34.56 POWER7™ Power 780 3.8 GHz rPerf: 685.09 KWatts: 6.4 107.04 Performance per Watt
- 112. © 2010 IBMCorporation IBM Power Systems POWER7 Odds and Ends
- 113. © 2010 IBMCorporation IBM Power Systems POWER7 Virtualization Support Maintain 1 to 10 ratio for Physical cores to LPARs. Power 750: Up to 160 (320) LPARS Power 755 Not Supported Power 770 / 780: Up to 160 (640) LPARs PS700 Up to 40 LPARS PS701 Up to 80 LPARs PS702 Up to 160 LPARs Active Memory Expansion Active Memory Expansion compresses in-memory data to fit more data into memory Increases the effective amount of memory capacity Managed by the OS and hypervisor OS compresses and decompress data based on memory accesses Is transparent to applications
- 114. © 2010 IBMCorporation IBM Power Systems HMC Support HMC V7 R710 is the minimum level for POWER7 support HMC used to manage any POWER7 processor based server, must be a CR3 or later model rack-mount HMC or C05 or later deskside HMC. If IBM Systems Director is used to manage an HMC or if the HMC manages more than 254 partitions, the HMC should have 3GB of RAM minimum and be a CR3 model or later rack-mount, or C06 or later deskside.
- 115. © 2010 IBMCorporation IBM Power Systems POWER7 OS Support
- 116. © 2010 IBMCorporation IBM Power Systems POWER7 OS Software Support AIX 5.3 with the 5300-11 Technology Level and SP2, or later AIX 6.1 with the 6100-04 Technology Level and SP3, or later IBM i 6.1 with 6.1.1 machine code, or later SUSE Linux Enterprise Server 10 with SP3 for POWER SUSE Linux Enterprise Server 11 for POWER, or later RHEL SoD VIOS 2.1.2.12 with Fix Pack 22.1 and Service Pack 2, or later
- 117. © 2010 IBMCorporation IBM Power Systems POWER7 Hardware Support TL9 TL8 TL10 TL11 TL12 2009 – 2011 AIX TL Roadmap 04/2010 10/2010 AIX 6.1 AIX 5.3 04/2011 10/2011 10/2009 AIX 7.1 TL0 TL1 TL2 SP Service Pack POWER7 Support TL2 TL1 TL3 TL4 TL5 TL6 TL7 TL8 TL12 TL5 TL9 TL10 TL2 TL3 TL11 TL4 SP SP SP SP SP SP
- 118. © 2010 IBMCorporation IBM Power Systems Partition Mobility POWER6 POWER6+ POWER7 Binary Compatibility between POWER6 and POWER7 Leverage POWER6 / POWER6+ Compatibility Mode Migrate partitions between POWER6 and POWER7 Servers Forward and Backward
- 119. © 2010 IBMCorporation IBM Power Systems POWER7 Active Memory Expansion POWER7 Processor
- 120. © 2010 IBMCorporation IBM Power Systems Active Memory Expansion POWER7 Advantage Expand memory beyond physical limits More effective server consolidation Run more application workload / users per partition Run more partitions and more workload per server Expanded Memory True Memory Effectively up to 100% more memory True Memory True Memory True Memory True Memory True Memory Expanded Memory Expanded Memory Expanded Memory Expanded Memory Expanded Memory
- 121. © 2010 IBMCorporation IBM Power Systems Active Memory Expansion & Active Memory Sharing Active Memory Expansion Effectively gives more memory capacity to the partition using compression / decompression of the contents in true memory AIX partitions only Active Memory Sharing Moves memory from one partition to another Best fit when one partition is not busy when another partition is busy AXI, IBM i, and Linux partitions Active Memory Expansion Active Memory Sharing Supported, potentially a very nice option Considerations Only AIX partitions using Active Memory Expansion Active Memory Expansion value is dependent upon compressibility of data and available CPU resource 0 5 10 15 #10 #9 #8 #7 #6 #5 #4 #3 #2 #1
- 122. © 2010 IBMCorporation IBM Power Systems Active Memory Expansion Innovative POWER7 technology For AIX 6.1 or later For POWER7 servers Uses compression/decompression to effectively expand the true physical memory available for client workloads Often a small amount of processor resource provides a significant increase in the effective memory maximum Processor resource part of AIX partition’s resource and licensing Actual expansion results dependent upon how “compressible” the data being used in the application A SAP ERP sample workload shows up to 100% expansion, Your results will vary Estimator tool and free trial available
- 123. © 2010 IBMCorporation IBM Power Systems Active Memory Expansion – Client Deployment 1 Planning Tool A.Part of AIX 6.1 TL4 B.Calculates data compressibility & estimates CPU overhead due to Active Memory Expansion C.Provides initial recommendations 2 60-Day Trial A.One-time, temporarily enablement B.Config LPAR based on planning tool C.Use AIX tools to monitor Act Mem Exp environment D.Tune based on actual results 3 Deploy into Production A.Permanently enable Active Memory Expansion B.Deploy workload into production C.Continue to monitor workload using AIX performance tools Memory Expansion CPU Utilizatio Estimated Results CPU Utilization Memory Expansion App. Performa Memory Expansion Time Performance Actual Results
- 124. © 2010 IBMCorporation IBM Power Systems Active Memory Expansion - Planning Tool Tool included in AIX 6.1 TL4 SP2 Run tool in the partition of interest for memory expansion. Input desired expanded memory size. Tool outputs different real memory and CPU resource combinations to achieve the desired effective memory. Active Memory Expansion Modeled Statistics: ----------------------- Modeled Expanded Memory Size : 8.00 GB Expansion True Memory Modeled Memory CPU Usage Factor Modeled Size Gain Estimate --------- -------------- ----------------- ----------- 1.21 6.75 GB 1.25 GB [ 19%] 0.00 1.31 6.25 GB 1.75 GB [ 28%] 0.20 1.41 5.75 GB 2.25 GB [ 39%] 0.35 1.51 5.50 GB 2.50 GB[ 45%] 0.58 1.61 5.00 GB 3.00 GB [ 60%] 1.46 Active Memory Expansion Recommendation: --------------------- The recommended AME configuration for this workload is to configure the LPAR with a memory size of 5.50 GB and to configure a memory expansion factor of 1.51. This will result in a memory expansion of 45% from the LPAR's current memory size. With this configuration, the estimated CPU usage due to Active Memory Expansion is approximately 0.58 physical processors, and the estimated overall peak CPU resource required for the LPAR is 3.72 physical processors. This sample partition has fairly good expansion potential A nice “sweet” spot for this partition appears to be 45% expansion •2.5 GB gained memory •Using about 0.58 cores additional CPU resource
- 125. © 2010 IBMCorporation IBM Power Systems Active Memory Expansion: Partition On / Off With HMC, check Active Memory Expansion box and enter True and max memory Memory expansion factor To turn off expansion, unclick box Partition IPL required to turn on or off Active Memory Expansion Modeled Statistics: ----------------------- Modeled Expanded Memory Size : 8.00 GB Expansion True Memory Modeled Memory CPU Usage Factor Modeled Size Gain Estimate --------- -------------- ----------------- ----------- 1.21 6.75 GB 1.25 GB [ 19%] 0.00 1.31 6.25 GB 1.75 GB [ 28%] 0.20 1.41 5.75 GB 2.25 GB [ 39%] 0.35 1.51 5.50 GB 2.50 GB [ 45%] 0.58 1.61 5.00 GB 3.00 GB [ 60%] 1.46 Active Memory Expansion Recommendation: --------------------- The recommended AME configuration for this workload is to configure the LPAR with a memory size of 5.50 GB and to configure a memory expansion factor of 1.51. This will result in a memory expansion of 45% from the LPAR's current memory size. With this configuration, the estimated CPU usage due to Active Memory Expansion is approximately 0.58 physical processors, and the estimated overall peak CPU resource required for the LPAR is 3.72 physical processors. 5.5 true 8.0 max
- 126. © 2010 IBMCorporation IBM Power Systems Upgrades POWER7 Processor
- 127. © 2010 IBMCorporation IBM Power Systems Upgrades from POWER6 and POWER6+ Power 780 3.8 GHz / 4.1 GHz POWER6+ 570/32 4.2 GHz POWER6 570 3.5, 4,2, 4.7 GHz 9117-MMA 9117-MMB All existing POWER6 570 systems can upgrade to POWER7 Power 770 3.5 GHz POWER6+ 570 4.4, 5.0 GHz 9179-MHB POWER6 upgrades to POWER7 POWER6+ upgrades to POWER7 Power 570/32 upgrades to POWER7 POWER7 System Upgrades
- 128. © 2010 IBMCorporation IBM Power Systems POWER6+ 570/32 9117-MMA 4.2 GHz POWER6+ 570 9117-MMA 4.4, 5.0 GHz POWER6 570 9117-MMA 3.5, 4.2, 4.7 GHz POWER6 570 9406-MMA 4.7 GHz POWER7 780 9179-MHB 3.8 / 4.1 GHz POWER7 770 9117-MMB 3.5 GHz POWER7 770 9117-MMB 3.1 GHz •No direct POWER5 upgrades to POWER7. Use 2-step upgrade, first to POWER6 then to POWER7. •Upgrades to POWER6 570 available as long as new box sales of POWER6 570 available •Withdrawal planned end 2010 Power 770 and Power 780 Upgrades
- 129. © 2010 IBMCorporation IBM Power Systems I/O Upgrade Considerations All the newer IBM I/O drawers, disk, SSD and PCI adapters used on POWER6 supported on POWER7 servers May need to move 3.5-inch SAS drives and PCI-X adapters Older I/O on POWER6 servers, but not on POWER7 servers RIO / RIO2 / HSL I/O drawers SCSI disk smaller than 69GB or SCSI drives slower than 15k rpm QIC tape drives IOPs and IOP-based PCI adapters (IBM i) 2749, 5702, 5712, 2757, 5581, 5591, 2790, 5580, 5590, 5704, 5761, 2787, 5760, 4801, 4805, 3709, 4746, 4812, 4813 Older LAN adapters: #5707, 1984, 5718, 1981, 5719, 1982 Older SCSI adapters: #5776, 5583, 5777 Telephony adapter: #6412 See planning web page www.ibm.com/systems/power/hardware/sod2.html
- 130. © 2010 IBMCorporation IBM Power Systems Power 520 SoD for Upgrade SoD provided in February For Power 520 (8203-E4A) 2-core or 4-core servers Upgrade to a POWER7 product preserving the serial number
- 131. © 2010 IBMCorporation IBM Power Systems RAS POWER7 Processor
- 132. © 2010 IBMCorporation IBM Power Systems Power Systems: Hardware & OS RAS Leadership Ref: ITIC 2009 Global Server Hardware and Server OS Reliability Survey
- 133. © 2010 IBMCorporation IBM Power Systems Availability / Reliability by Design for POWER7 Processors Dynamic De-Allocation Packaging Instruction Retry Alternate Processor Recovery First Failure Data Capture Help eliminates intermittent failures Hot Plug / Removal Fans & Power Supplies Hot Plug / Removal PCI-X & PCIe Adapters IO Drawers Hot Plug / Removal Disks Memory Chip Kill technology with Bit-steering Passive backplane No active components Hypervisor Mainframe technology Mobility Partition Mobility WPAR Mobility Operating System Hot patch Kernel Storage Keys Concurrent Add: 770/780 Eliminates Upgrade outages Concurrent Service{ 770/780 Eliminates Repair Outages Hot Add I/O racks Dual Clocks 770/780
- 134. © 2010 IBMCorporation IBM Power Systems POWER7 Instruction Retry Recovery Capability Array error Error correction (ECC) Arrays with parity oProcessor restarts Instruction flow and Data flow Error Processor restarts Control Error Processor restarts System Resiliency Processor states are check pointed and protected with ECC Processor states can be moved from one processor to another upon unsuccessful recovery restart (CP Sparing) Core Recovery Unit Core restart Core error collection Execution Units Load/ Store Instruction Fetch Decode
- 135. © 2010 IBMCorporation IBM Power Systems PCI Adapter Fabric Bus Interface to other Chips and Nodes ECC protected Node hot add /repair Core Recovery Leverage speculative execution resources to enable recovery Error detected in GPRs FPRs VSR, flushed & retried Stacked latches to improve SER Alternate Processor Recovery Partition isolation for core checkstops L3 eDRAM ECC protected SUE handling Purge and Line delete Spare rows and columns GX IO Bus ECC protected Concurrent add/repair InfiniBand® Interface Redundant paths Retry/Freeze behavior options for Internal I/O Hub Faults PHB Errors IO Hub PCI Bridge Advanced 64 Byte ECC on Memory Multiple chip chipkill detections and sparings HW assisted scrubbing SUE handling CRC with retry and Dynamic data bit-line sparing on channel interface OSC0 OSC1 Dynamic Oscillator Failover Concurrent Repair BUF BUF BUF BUF X8 Dimms Fabric Interface POWER7 770/780: RAS Features
- 136. © 2010 IBMCorporation IBM Power Systems Power 750 / 755 Memory RAS Features Memory RAS Power 750 supports memory Scrubbing, 64-byte Marking ECC and Chipkill. Memory errors are usually classified as either soft or hard. Hard errors can be caused by defects within the DRAM package among other reasons (e.g. defect in the silicon), and are usually permanent once they occur. Soft errors are caused by charged particles or radiation, and are usually transient. Memory scrubbing corrects soft single bit errors in background while memory is idle preventing multiple bit errors. Memory ECC is able to detect and correct single bit memory errors, which make up the majority of memory errors. It can also isolate a single Chipkill to a bad DRAM chip. Memory Chipkill has the ability to correct the single bit errors that standard ECC memory can correct but also multi-bit (2, 3, 4 bits) memory errors and by doing so it increases server availability/reliability even further. Selective Memory Mirroring is where an amount of memory is reserved and sections of the memory to select for mirroring in the reserved memory are dynamically determined. The selected sections of the memory contain critical areas. The selected sections of the memory are mirrored in the reserved memory. 137
- 137. © 2010 IBMCorporation IBM Power Systems Guiding Light vs. Light Path User interface and repair action simplification POWER6 Guiding light: Console Monitored System Used in POWER6 systems Technician used the HMC or ASMI to see what happened and what to replace FRUs and their locations are found in the error log Used HMC or ASMI to enter location code to activate identify LEDs from console to verify where FRUs are Exchange FRUs (CM or dedicated) per procedure instructions System Attention LED is persistent after power cycle until cleared by technician. POWER7 Light Path: Console-less HW service simplicity (fast and easy) Used in POWER7 systems No need to view logs, just replace the FRUs with their LED on oLEDs are activated automatically when error is detected. Friendly, color coded labels on Power 750 cover show how to pull and plug parts External LED indicates a failure inside the unit Internal LEDs per FRU indicate what to replace oFRUs are either Hot Plug or system has to be powered off oGold cap powers fault LEDs when system power is removed Replacing a FRU automatically resets the fault LEDs 138
- 138. © 2010 IBMCorporation IBM Power Systems POWER7 Processor POWER7 Servers Power 750 Power 755 Power 770 Power 780 Active Memory Expansion I/O Upgrades Summary
- 139. © 2010 IBMCorporation IBM Power Systems This document was developed for IBM offerings in the United States as of the date of publication. IBM may not make these offerings available in other countries, and the information is subject to change without notice. Consult your local IBM business contact for information on the IBM offerings available in your area. Information in this document concerning non-IBM products was obtained from the suppliers of these products or other public sources. Questions on the capabilities of non-IBM products should be addressed to the suppliers of those products. IBM may have patents or pending patent applications covering subject matter in this document. The furnishing of this document does not give you any license to these patents. Send license inquires, in writing, to IBM Director of Licensing, IBM Corporation, New Castle Drive, Armonk, NY 10504-1785 USA. All statements regarding IBM future direction and intent are subject to change or withdrawal without notice, and represent goals and objectives only. The information contained in this document has not been submitted to any formal IBM test and is provided "AS IS" with no warranties or guarantees either expressed or implied. All examples cited or described in this document are presented as illustrations of the manner in which some IBM products can be used and the results that may be achieved. Actual environmental costs and performance characteristics will vary depending on individual client configurations and conditions. IBM Global Financing offerings are provided through IBM Credit Corporation in the United States and other IBM subsidiaries and divisions worldwide to qualified commercial and government clients. Rates are based on a client's credit rating, financing terms, offering type, equipment type and options, and may vary by country. Other restrictions may apply. Rates and offerings are subject to change, extension or withdrawal without notice. IBM is not responsible for printing errors in this document that result in pricing or information inaccuracies. All prices shown are IBM's United States suggested list prices and are subject to change without notice; reseller prices may vary. IBM hardware products are manufactured from new parts, or new and serviceable used parts. Regardless, our warranty terms apply. Any performance data contained in this document was determined in a controlled environment. Actual results may vary significantly and are dependent on many factors including system hardware configuration and software design and configuration. Some measurements quoted in this document may have been made on development-level systems. There is no guarantee these measurements will be the same on generally-available systems. Some measurements quoted in this document may have been estimated through extrapolation. Users of this document should verify the applicable data for their specific environment. Current: 1Q 2010 Special notices
- 140. © 2010 IBMCorporation IBM Power Systems IBM, the IBM logo, ibm.com AIX, AIX (logo), AIX 6 (logo), AS/400, Active Memory, BladeCenter, Blue Gene, CacheFlow, ClusterProven, DB2, ESCON, i5/OS, i5/OS (logo), IBM Business Partner (logo), IntelliStation, LoadLeveler, Lotus, Lotus Notes, Notes, Operating System/400, OS/400, PartnerLink, PartnerWorld, PowerPC, pSeries, Rational, RISC System/6000, RS/6000, THINK, Tivoli, Tivoli (logo), Tivoli Management Environment, WebSphere, xSeries, z/OS, zSeries, AIX 5L, Chiphopper, Chipkill, Cloudscape, DB2 Universal Database, DS4000, DS6000, DS8000, EnergyScale, Enterprise Workload Manager, General Purpose File System, , GPFS, HACMP, HACMP/6000, HASM, IBM Systems Director Active Energy Manager, iSeries, Micro- Partitioning, POWER, PowerExecutive, PowerVM, PowerVM (logo), PowerHA, Power Architecture, Power Everywhere, Power Family, POWER Hypervisor, Power Systems, Power Systems (logo), Power Systems Software, Power Systems Software (logo), POWER2, POWER3, POWER4, POWER4+, POWER5, POWER5+, POWER6, POWER7, pureScale, System i, System p, System p5, System Storage, System z, Tivoli Enterprise, TME 10, TurboCore, Workload Partitions Manager and X-Architecture are trademarks or registered trademarks of International Business Machines Corporation in the United States, other countries, or both. If these and other IBM trademarked terms are marked on their first occurrence in this information with a trademark symbol (® or ™), these symbols indicate U.S. registered or common law trademarks owned by IBM at the time this information was published. Such trademarks may also be registered or common law trademarks in other countries. A current list of IBM trademarks is available on the Web at "Copyright and trademark information" at www.ibm.com/legal/copytrade.shtml The Power Architecture and Power.org wordmarks and the Power and Power.org logos and related marks are trademarks and service marks licensed by Power.org. UNIX is a registered trademark of The Open Group in the United States, other countries or both. Linux is a registered trademark of Linus Torvalds in the United States, other countries or both. Microsoft, Windows and the Windows logo are registered trademarks of Microsoft Corporation in the United States, other countries or both. Intel, Itanium, Pentium are registered trademarks and Xeon is a trademark of Intel Corporation or its subsidiaries in the United States, other countries or both. AMD Opteron is a trademark of Advanced Micro Devices, Inc. Java and all Java-based trademarks and logos are trademarks of Sun Microsystems, Inc. in the United States, other countries or both. TPC-C and TPC-H are trademarks of the Transaction Performance Processing Council (TPPC). SPECint, SPECfp, SPECjbb, SPECweb, SPECjAppServer, SPEC OMP, SPECviewperf, SPECapc, SPEChpc, SPECjvm, SPECmail, SPECimap and SPECsfs are trademarks of the Standard Performance Evaluation Corp (SPEC). NetBench is a registered trademark of Ziff Davis Media in the United States, other countries or both. AltiVec is a trademark of Freescale Semiconductor, Inc. Cell Broadband Engine is a trademark of Sony Computer Entertainment Inc. InfiniBand, InfiniBand Trade Association and the InfiniBand design marks are trademarks and/or service marks of the InfiniBand Trade Association. Other company, product and service names may be trademarks or service marks of others. Current: 1Q 2010 Special notices (cont.)
- 141. © 2010 IBMCorporation IBM Power Systems The IBM benchmarks results shown herein were derived using particular, well configured, development-level and generally-available computer systems. Buyers should consult other sources of information to evaluate the performance of systems they are considering buying and should consider conducting application oriented testing. For additional information about the benchmarks, values and systems tested, contact your local IBM office or IBM authorized reseller or access the Web site of the benchmark consortium or benchmark vendor. IBM benchmark results can be found in the IBM Power Systems Performance Report at http://www.ibm.com/systems/p/hardware/system_perf.html . All performance measurements were made with AIX or AIX 5L operating systems unless otherwise indicated to have used Linux. For new and upgraded systems, AIX Version 4.3, AIX 5L or AIX 6 were used. All other systems used previous versions of AIX. The SPEC CPU2006, SPEC2000, LINPACK, and Technical Computing benchmarks were compiled using IBM's high performance C, C++, and FORTRAN compilers for AIX 5L and Linux. For new and upgraded systems, the latest versions of these compilers were used: XL C Enterprise Edition V7.0 for AIX, XL C/C++ Enterprise Edition V7.0 for AIX, XL FORTRAN Enterprise Edition V9.1 for AIX, XL C/C++ Advanced Edition V7.0 for Linux, and XL FORTRAN Advanced Edition V9.1 for Linux. The SPEC CPU95 (retired in 2000) tests used preprocessors, KAP 3.2 for FORTRAN and KAP/C 1.4.2 from Kuck & Associates and VAST-2 v4.01X8 from Pacific- Sierra Research. The preprocessors were purchased separately from these vendors. Other software packages like IBM ESSL for AIX, MASS for AIX and Kazushige Goto’s BLAS Library for Linux were also used in some benchmarks. For a definition/explanation of each benchmark and the full list of detailed results, visit the Web site of the benchmark consortium or benchmark vendor. TPC http://www.tpc.org SPEC http://www.spec.org LINPACK http://www.netlib.org/benchmark/performance.pdf Pro/E http://www.proe.com GPC http://www.spec.org/gpc VolanoMark http://www.volano.com STREAM http://www.cs.virginia.edu/stream/ SAP http://www.sap.com/benchmark/ Oracle Applications http://www.oracle.com/apps_benchmark/ PeopleSoft - To get information on PeopleSoft benchmarks, contact PeopleSoft directly Siebel http://www.siebel.com/crm/performance_benchmark/index.shtm Baan http://www.ssaglobal.com Fluent http://www.fluent.com/software/fluent/index.htm TOP500 Supercomputers http://www.top500.org/ Ideas International http://www.ideasinternational.com/benchmark/bench.html Storage Performance Council http://www.storageperformance.org/results Notes on benchmarks and values Current: 1Q 2010
- 142. © 2010 IBMCorporation IBM Power Systems The IBM benchmarks results shown herein were derived using particular, well configured, development-level and generally-available computer systems. Buyers should consult other sources of information to evaluate the performance of systems they are considering buying and should consider conducting application oriented testing. For additional information about the benchmarks, values and systems tested, contact your local IBM office or IBM authorized reseller or access the Web site of the benchmark consortium or benchmark vendor. IBM benchmark results can be found in the IBM Power Systems Performance Report at http://www.ibm.com/systems/p/hardware/system_perf.html . All performance measurements were made with AIX or AIX 5L operating systems unless otherwise indicated to have used Linux. For new and upgraded systems, AIX Version 4.3 or AIX 5L were used. All other systems used previous versions of AIX. The SPEC CPU2000, LINPACK, and Technical Computing benchmarks were compiled using IBM's high performance C, C++, and FORTRAN compilers for AIX 5L and Linux. For new and upgraded systems, the latest versions of these compilers were used: XL C Enterprise Edition V7.0 for AIX, XL C/C++ Enterprise Edition V7.0 for AIX, XL FORTRAN Enterprise Edition V9.1 for AIX, XL C/C++ Advanced Edition V7.0 for Linux, and XL FORTRAN Advanced Edition V9.1 for Linux. The SPEC CPU95 (retired in 2000) tests used preprocessors, KAP 3.2 for FORTRAN and KAP/C 1.4.2 from Kuck & Associates and VAST-2 v4.01X8 from Pacific-Sierra Research. The preprocessors were purchased separately from these vendors. Other software packages like IBM ESSL for AIX, MASS for AIX and Kazushige Goto’s BLAS Library for Linux were also used in some benchmarks. For a definition/explanation of each benchmark and the full list of detailed results, visit the Web site of the benchmark consortium or benchmark vendor. SPEC http://www.spec.org LINPACK http://www.netlib.org/benchmark/performance.pdf Pro/E http://www.proe.com GPC http://www.spec.org/gpc STREAM http://www.cs.virginia.edu/stream/ Fluent http://www.fluent.com/software/fluent/index.htm TOP500 Supercomputers http://www.top500.org/ AMBER http://amber.scripps.edu/ FLUENT http://www.fluent.com/software/fluent/fl5bench/index.htm GAMESS http://www.msg.chem.iastate.edu/gamess GAUSSIAN http://www.gaussian.com ANSYS http://www.ansys.com/services/hardware-support-db.htm Click on the "Benchmarks" icon on the left hand side frame to expand. Click on "Benchmark Results in a Table" icon for benchmark results. ABAQUS http://www.simulia.com/support/v68/v68_performance.php ECLIPSE http://www.sis.slb.com/content/software/simulation/index.asp?seg=geoquest& MM5 http://www.mmm.ucar.edu/mm5/ MSC.NASTRAN http://www.mscsoftware.com/support/prod%5Fsupport/nastran/performance/v04_sngl.cfm STAR-CD www.cd-adapco.com/products/STAR-CD/performance/320/index/html NAMD http://www.ks.uiuc.edu/Research/namd HMMER http://hmmer.janelia.org/ http://powerdev.osuosl.org/project/hmmerAltivecGen2mod Current: 1Q 2010 Notes on HPC benchmarks and values
- 143. © 2010 IBMCorporation IBM Power Systems Notes on performance estimates rPerf for AIX rPerf (Relative Performance) is an estimate of commercial processing performance relative to other IBM UNIX systems. It is derived from an IBM analytical model which uses characteristics from IBM internal workloads, TPC and SPEC benchmarks. The rPerf model is not intended to represent any specific public benchmark results and should not be reasonably used in that way. The model simulates some of the system operations such as CPU, cache and memory. However, the model does not simulate disk or network I/O operations. rPerf estimates are calculated based on systems with the latest levels of AIX and other pertinent software at the time of system announcement. Actual performance will vary based on application and configuration specifics. The IBM eServer pSeries 640 is the baseline reference system and has a value of 1.0. Although rPerf may be used to approximate relative IBM UNIX commercial processing performance, actual system performance may vary and is dependent upon many factors including system hardware configuration and software design and configuration. Note that the rPerf methodology used for the POWER6 systems is identical to that used for the POWER5 systems. Variations in incremental system performance may be observed in commercial workloads due to changes in the underlying system architecture. All performance estimates are provided "AS IS" and no warranties or guarantees are expressed or implied by IBM. Buyers should consult other sources of information, including system benchmarks, and application sizing guides to evaluate the performance of a system they are considering buying. For additional information about rPerf, contact your local IBM office or IBM authorized reseller. ======================================================================== CPW for IBM i Commercial Processing Workload (CPW) is a relative measure of performance of processors running the IBM i operating system. Performance in customer environments may vary. The value is based on maximum configurations. More performance information is available in the Performance Capabilities Reference at: www.ibm.com/systems/i/solutions/perfmgmt/resource.html Current: 1Q 2010
Editor's Notes
- #3 [Our vision] This is our vision. Designed, integrated systems are more essential for our clients' business than they have ever been before. And if there was ever a time that reminded us of this, it's today when our clients are facing more complex challenges than ever before: A medical system that holds the promise of unlocking new cures and treatments — attached to a fragmented and antiquated health care system; A system of energy that powers our economy, but simultaneously endangers our planet; Threats to the security of their businesses that seek to exploit the very interconnectedness and openness so essential to global commerce. For all the reasons our company -- and our clients -- are so energized by the opportunities of a smarter planet; these are the same reasons I am so optimistic about the future of our business in IBM Systems and Technology No one can predict the magnitude of new applications that will come from a smarter planet. In no area will innovation be more important than in the development of new technologies to make new applications possible. [Transition] And IBM Systems will lay the foundation for smarter planet applications. Let me explain.
- #4 [IBM Systems and Technology lay the foundation] First and foremost is our understanding of our clients and having a deep appreciation of their environment and the types of applications and workloads that they need to run to allow their businesses to reach the markets they serve. We have a comprehensive portfolio, second to no one else in the industry. And our technology leadership and the investments we'll continue to make, securing our future leadership and differentiation. STG is laying the foundation for the workload optimization that is necessary on a smarter planet. On a smarter planet, the new types of applications and workloads will span across all industries and will have new capabilities. Just think about areas like video surveillance, financial analytics, network security and threat management. Or on-line infotainment and advanced search. [Transition] These workloads require systems that can optimize specifically for them.
- #6 Organizations are increasingly understanding the potential benefits of becoming “smarter” ... and are now starting to ask “how do I get started?” The questions aren’t just about the technology they need, but also about how to deal with unclear ownership of large systems... of dealing with a wide array of stakeholders. They are asking how they build a business case for the budget or how they get the solution through procurement? If a public sector organization, how do they build support among voters or agencies? Where exactly do they start and how fast can they move? IBM can help with these questions as we have started to build experience with hundreds and thousands of organizations, governments, and businesses who have successfully embarked on these transformations One such agency is Queensland Motorways in Brisbane, Australia (next chart)
- #7 Smarter systems: Scale quickly and efficiently to manage and analyze large amounts of information Optimize performance to differing requirements across multiple workloads Flexibly adapt to changing requirements and demands - flowing resources where needed instantly for high utilization and ROI Avoid downtime by being highly reliable, available and resilient Save energy by intelligently balancing performance needs with efficiency requirements Automate management tasks to save on labor and staffing in resource constrained environments
- #8 That’s why we are proud to introduce the first of a family of systems designed specifically for the needs of a smarter planet - the next generation of Power Systems with POWER7 processors We want to help clients - business and organizations of all kinds - to Power their planets with these new smarter systems To bring workloads from all over - consolidate them - optimize them - and support the scaling, resiliency, flexibility, energy and automation needs those workloads demand As we said earlier... it all starts with technology leadership... the kind of leadership embodied in the all-new POWER7 family of processors
- #9 Let’s start with a quick look at where we are in the market and update on where we’ve come through 2009. IBM Power continued to gain share through a challenging year for the IT industry... and UNIX as a platform gained share most of the year against other alternatives. HP continued to decline as PA-RISC customers looked to other alternatives versus moving to Itanium... which has continued to have roadmap delays... Tukwila is now 4 years late and still a question mark. Sun has continued to be in near free fall as uncertainty over their future hung over them. Now that Oracle has competed the acquisition, we’ll see where they go from here... they have certainly started with some wild claims and not much news on the roadmap front. In the midst of all of this uncertainty, IBM’s solid performances and stability have been a beacon for customers moving to higher value with IBM Power... and as a result we have seen the largest shift in client spending from HP and Sun to Power in UNIX history... putting IBM Power at the highest revenue share ever achieved by a UNIX vendor. POWER4 LPARs is 4Q01 POWER5 APV is 3Q04 (July 2004 was announce date) POWER6 Live Partition Mobility is 2Q07 (May 2007 was announce date for first POWER6 570)
- #10 As a result, IBM has successfully helped over 2100 companies migrate from HP and Sun UNIX platforms as well as help many clients consolidate x86 applications to Power... leveraging the expertise we have developed over the years to do these migrations in a very methodical way... helping the customer assess what can be achieved, what TCO they should expect, and how to do the migration with minimal to no disruption to their business. It’s about addressing the fear of risk that clients have when they do a major platform move... and we have been able to demonstrate that we can help them manage that risk such that the returns they receive from the migration to Power far exceed any risk that may be percieved to exist. With that look back, let’s turn to the future and why we are here today.
- #60 Note – 8GB feature planned availability 15 Mar 2010
- #78 Gap 3.3GHz up to drive upsell to faster performance and limit buy down from Saturn Power 550 with 3.5/4.2/5.0GHz has delivered significant incremental GP using this model. - ~70% buy faster frequency - From third to first in $25k to $100k UNIX price band with this pricing strategy
- #89 Each system must contain a minimum of 16 GB of active system memory. Memory features 5600, 5601, and 5602 can be mixed on the same POWER7 processor module. Frequencies must be the same across the memory controller (4 DIMM slots)
- #90 Memory features 5600, 5601, and 5602 can be mixed on the same POWER7 processor module. Frequencies must be the same across the memory controller (4 DIMM slots)
- #111 110
- #137 Power7 continues to provide high reliability and availability features to our customers. New to Power7 is our 64 Byte ECC algorithm in memory. This new innovative ECC algorithm from IBM research allows a full 8 bit device kill to be corrected on the fly. This combined with providing a spare device on the dimm provides protection against double devices kills on DDR3 memory. Another new feature in POWER7 is selective memory mirroring. In Power7 we split the memory by channel pairs. This enables us to selectively pick memory address ranges to be mirrored in both channel pairs. This will allow customers on a per partition basis choose if they want their memory protected. Power7 offers all features from previous generation such as core recovery, sparing, Hot Node add and repair, and redundant oscillators. The new on chip EDRAM also provides reliability features such as ECC protection, spare rows and columns and line delete.