Captronic séminaire électronique imprimée - 20/09/2017 - Présentation du CEA TECH / Liten - En partenariat avec l’AFELIM (Association Française de l'Electronique Imprimée) et le soutien du Pôle Numérique de la CCI Bordeaux Gironde, Cap’tronic a organisé le mercredi 20 septembre dans les locaux de l’IMS à Talence, une rencontre autour de l' "électronique imprimée" afin de faire un tour d’horizon de la chaîne de valeur d'une filière dont le marché mondial est estimé à 330 milliards de dollars en 2027.

1. Printed electronics |
PRINTED ELECTRONICS, FUTURE & SOLUTIONS

2. | 2Printed electronics |
• INTRODUCTION
• TECHNOLOGY
• TRENDS
• PICTIC Platform / CEA Tech - Liten
• CONCLUSION
OUTLINE OUTLINE

3. | 3
Lille
Metz
Grenoble
(Leti/Liten)
Chambéry (Liten)
Nantes
Bordeaux
Toulouse
Cadarache
Saclay (List)
CEA TECH & REGIONAL PLATFORMS
Confidentiel
Micro-nanotechnologies and their
integration in systems
Software-intensive systems
Advanced manufacturing
New energy technologies
and nanomaterials
3 Thematic
Institutes
1 Diffusion
Institute
in direct relationship
with Leti/List/Liten

4. | 4Confidentiel
NOUVELLE AQUITAINE PLATFORMS
RÉGIONAL INTEGRATION PLATFORMS
3 TECHNOLOGICAL LABORATORIES IN NOUVELLE AQUITAINE (BORDEAUX)
~20 people located in Bordeaux

5. Printed electronics |
TECHNOLOGY

6. | 6
DEVICE
• 1- Full-fill specification from device
• 2- Optimize performances
• 3- Optimize Process stability & Yield
Substrate/ layer n-1
• Surface energy
• Roughness
• Accepted Solvent
• Thermal budget
Printing Technics:
• Transfer Principle
• Range of accepted
formulation
• Stability
• Throughput
• Registration
• Thickness range and control
• Drying
Inks
• Viscosity
• Surface Tension
• Solvent safety
• Solvent evaporation
• Electrical Performances
KEY TECHNOLOGICAL ASPECTS
Printed electronics |

7. | 7Printed electronics |
SUBSTRATE :
Plastic
• Polyester :
• Polyethylene naphthalate ( PEN)
• Polyethylene terephthalate
(PET).…
• Polyimide
• Kapton
Paper Thin Glass

8. | 8
Gravure/OffsetScreen-Printing Ink-Jet
A NEW ELECTRONIC ?
PRINTING ELECTRONIC FUNCTIONS ?PRINTING TECHNOLOGIES
Printed electronics |

9. | 9
World Class Research Facilities for Flexible Electronics
OUR PLATFORMS
→ Gen1 320mmx380mm Facilities, 400m2 Clean Room , Class 10,000
Automatic Screen Printer
Ellipsometry
Carac
CONFIDENTIEL | CEA | 2015

10. | 10
OUR PRINTED DEVICES
Organic Transistors
C-OTFT for Analog/Digital
P-OTFT for Matrixes
Rectifiers
Passives Devices
RF Filters
Conductors – Heaters-TCOs
Magnetic Inductances
Ferro-based Sensors
Piezolelectric – Pyroelectric
Acoustic - NVM
Resistive Sensors
Temperature Sensors
Strain gauge
Antennae-Conductors
UHF Antennae
Antenna Coupler
Acoustic-Haptic
Loudspeaker
Actuator
Bio-Sensors
OECT
Electrochemical
Photodetectors
Visible and NIR
CONFIDENTIEL | CEA | 2015
@l.godart/cea
Chem Sensors
pH

11. | 11
OUR TOOLSET
Screen Print
Manual & Automatic
Stencil – screens
Gravure Print
Cylinders
Flexo Print
Photopolymer stamps
Inkjet
126-256 nozzles
Photonic Curing
Xenon lamps
Slot Die
Vacuum Bake
Laser Ablation
2 » mask
DUV laser
NanoImprint
PDMS stamps
SAMs
Aerosol Jet
Tilted Head
Curved surfaces
2.5 D Printing
Aerosol jet
CONFIDENTIEL | CEA | 2015

12. | 12
OUR SKILLS
Ink Formulation
Solvents, Viscosity
DSC, TGA,..
Electrical Testing
Manual & Automatic Probers
Ferroelectric & Optical bench
Parameter Extraction
Compact Modeling
Static & Dynamic
TCAD Modeling
Design Rule/ DTK
Commercial SWs
LVS, DRC
Foil Interconnect
ACF - Staples – Chip Bonding
Lamination –Vacuum Seal-Laser Cut
Reliability Study
T° , H20% bench
Mechanical bench
Barriers
Foil Lamination
F2F Vacuum Sealing
Laser Cut
Data & Yield Analysis
Statistical Analysis – 2D Mapping
Automatic Gen1 Prober
Plasturgy
In Mould labeling
Nano-Caracterisation
KFM, SEM,…, ESRF
Ellipsometry
CONFIDENTIEL | CEA | 2015

13. | 13Printed electronics |
Printing
techniques
Viscosity (Pa s) Thickness
(µm)
Feature size
(µm)
Throughput (m²s-1) Comment
Flexography 0,05-0,5 0,04-2,5 80 3-30 High throughput,
thick layer/low
viscosity ink
Gravure 0,01-0,2 <0,1-8 75 3-60 Fast printing, high
resolution
Offset 5-100 0,5-2 10-50 3-30 High quality, high
throughput,
Need for ink
additive
Screen 0,5-50 0,015-100 20-100 2-3 Robust,simple,
thick layer, large
feature size,high
ink viscosity
Inkjet 0,001-0,04 0,01-20 20-50 0,01-0,5 Non contact,
small ink
quantities, digital
printing, low
viscosity, slow
speed
PRINTING SOLUTIONS & FEATURE SIZE
Source: Organic
Electronics (2006) Wiley

14. | 14
ROAD TOWARDS STABLE PRINTED CIRCUIT TECHNOLOGY
DEVICE
Development
TECHNO
Stabilization
(Foil2Foil)
PACKAGE
Model & DRM
DTK
DELIVERY
TECHNO
Development
(Device2Device)
MATERIAL
Optimization
Printed IC Design Tool-Kit & Fab Platform ready for prototyping with
conventional silicon circuit Flow
POLLUX
CASTOR
Architecture
Design
Building Block
Simulation
System
Simulation
Layout
(DRC,LVS)
Tape out
& Roll
Fabrication
Printing
Circuits !!!
Analog to Digital
Converter (ADC)
Printed electronics |

15. Printed electronics |
TRENDS

16. | 16
Printed electronics |
TRENDS… TOWARDS REAL 3D ?
3D Screen-Print
 Add steps for printed devices
Strato-Conception
 Insert strates with printed devices
+

17. Printed electronics |
OUR ECOSYSTEMS

18. | 18Printed electronics |
FRENCH AFELIM ASSOCIATION

19. | 19Printed electronics |
EUROPEAN COLLABORATION

20. | 20Printed electronics |
LET’S COLLABORATE