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Bonding &
Die Attach
Applications
ABOUT THE MATERIAL
One Part Epoxy
EP3HTS-TC
THERMAL CONDUCTIVITY
110-118 BTU•in/(ft²•hr•°F)
[16-17 W/(m•K)]
NOT PREMIXED AND FROZEN
NASA LOW OUTGASSING
VERY LONG OPEN TIME
AT ROOM TEMPERATURE
PERFORMANCE
PROPERTIES
HARDNESS, 75°F
60-70 Shore D
COEFFICIENT OF THERMAL
EXPANSION, 75°F
20-23 x 10-6
in/in/°C
VOLUME RESISTIVITY, 75°F
<1x10-6
ohm-cm
VISCOSITY, 75°F
Thixotropic paste
SERVICE TEMPERATURE
-80°F to +400°F
[-62°C to +204°C]
APPLICATION
AND CURING
THIXOTROPIC INDEX, 75°F
10
CURE SCHEDULE
15-20 minutes at 300°F
DIE SHEAR STRENGTH, 75°F
(2 X 2 MM [80 X 80 MIL])
9-12 kg-f
154 Hobart Street, Hackensack, NJ 07601 USA
+1.201.343.8983 • main@masterbond.com
www.masterbond.com

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Silver Filled Epoxy for Bonding & Die Attach Applications

  • 1. for Bonding & Die Attach Applications ABOUT THE MATERIAL One Part Epoxy EP3HTS-TC THERMAL CONDUCTIVITY 110-118 BTU•in/(ft²•hr•°F) [16-17 W/(m•K)] NOT PREMIXED AND FROZEN NASA LOW OUTGASSING VERY LONG OPEN TIME AT ROOM TEMPERATURE PERFORMANCE PROPERTIES HARDNESS, 75°F 60-70 Shore D COEFFICIENT OF THERMAL EXPANSION, 75°F 20-23 x 10-6 in/in/°C VOLUME RESISTIVITY, 75°F <1x10-6 ohm-cm VISCOSITY, 75°F Thixotropic paste SERVICE TEMPERATURE -80°F to +400°F [-62°C to +204°C] APPLICATION AND CURING THIXOTROPIC INDEX, 75°F 10 CURE SCHEDULE 15-20 minutes at 300°F DIE SHEAR STRENGTH, 75°F (2 X 2 MM [80 X 80 MIL]) 9-12 kg-f 154 Hobart Street, Hackensack, NJ 07601 USA +1.201.343.8983 • main@masterbond.com www.masterbond.com