Bunga Tanjung - National ICC Convention 2017

PE DIVISION
TEMPLATE DESIGN BY: RAHIZAH HAMDAN
1
WELCOME TO ICC NATIONAL
CONVENTION
14 ~ 16 AUGUST 2007

PE DIVISION
2
AGENDA
INTRODUCTION
Presenter
• Introduction
• Group Proceeding
• Problem Selection
• Problem Definition
• Analysis
• Corrective Action
• Monitoring
• Standardization
• Achievement

PE DIVISION
MPT PRODUCTDESTINATION
38% 16% 13%3%
Europe Japan
North America Other Region
Local Market
30%
PEP
PEM
PTK
PTM,TPT
PAC
AST
PTW
PTD,PSD
MND,MDE
PCH,PSG
PSM,SPS
PIC
PET
PMM
PSSA,YMSA
MMSA
JPN
Indian Ocean
Pacific
Ocean
MPT= MALAYSIA PIONEER TECHNOLOGY
PIONEERWORLDWIDE
P R O D U C T I O N L A Y O U T
MPT
INTRODUCTION
3

PE DIVISION
MALAYSIA PIONEERTECHNOLOGY
C O M P A N Y P R O F I L E
PIONEER TECH. (M)SDN.BHD
LOCATED AT;
No. 5,TG AGASIND.AREA,
84000MUAR,JOHOR
MALAYSIA
AUG 1993
MUAR RIVER
SPORTS
GROUND
WAREHOUSE PRODUCTION FLOOR
MAIN ROAD - TANJUNG AGAS
ROAD
TO TANGKAK / MELAKA
TANJONG AGASINDUSTRIAL AREA
CAR
PARK
MOTOCYCLE
PARKING
AREA
SPORTS
CENTRE
Build g Space :24,271m (6.0Acres)2
Land Space : 56,656m (14.0 Acres)2
INTRODUCTION
OPERATION STARTED
4

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5
P I O NE E R P RO DU CT R A N G E
INTRODUCTION

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P I O NE E R P RO DU CT R A N G E
INTRODUCTION
6

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7
PIONEER TECHNOLOGY (MALAYSIA) SDN.BHD.RECOGNITION
1 Companyin
MalaysiaAttained
ISO/TS 16949
- 29th April 2003-
st
INTRODUCTION

PE DIVISION
8
(Open Category Electronic Sector)
The Winnerof
National 5S
Organization
Competition2003
PERSEKITARAN BERKUALITI
5S
INTRODUCTION

PE DIVISION
9
Winnerof NPC
ProductivityAward
was hand over by YB Dato Hj. Ahmad
Husni Mahamad Hanadzlah (Deputy
Minister of International Trade & Industry)
to MPT Managing Director Mr. Miyamura
- 15th July2004 -
INTRODUCTION

PE DIVISION
10
3 in National ICC
Convention 2004
ElectronicSector
[ NEURON TEAM ]
rd
3rd
Winner
Top 10
Winner
3 Star
Award
INTRODUCTION

PE DIVISION
11
Winnerof Johor Industry
QualityAward 2004
(Electronicsector)
Prize were hand over
by Chief Minister or Johor
Dato Hj. Abd. Ghani bin Osman
- 22nd March2005 -
INTRODUCTION

PE DIVISION
12
Most PromisingICC
Award
Mini Convention
[ Supernova TEAM ]
- 12th April 2005 -
INTRODUCTION

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13
INTRODUCTION
Awarded Caring
Organization
(IndustrialSector)
Prize were hand over
by Muar District Officer wife
Datin Hajah Rokiah Binti Karim
- 9th November 2006 -

PE DIVISION
14
O R G A N I Z A T I O N C H A R T
MALAYSIA PIONEER TECHNOLOGY
INTRODUCTION
21
Departments
PRODCONTROL DIV
GENERAL DIV
Effective Date :01/04/2007
Human Res.
Admin Dept
Finance Dept
A/I Production
A/I Material
A/I Cont.
Production 1
ME
QC
ECD
QE
PTE
Prod Control
Info System
Material Control
Procurement
FINANCE DIV
PRODUCTION 1 DIV
PRODUCTION 2 DIV
PROCESS INNOVATION
DEPT
QUALITY ENG. DIV
CORPORATE
MANAGEMENT
GROUP
8
Divisions
ENGINEERING&
PRODUCTION
GROUP
MANAGING
DIRECTOR
MR. MIYAMURA
PE1
PE2
PE3
PRODUCTION ENG. DIV
Production 2
IP Dept
PRODUCTION ENG. DIV
PE1
PE2
PE3

PE DIVISION
15
NATURE OF WORK
INTRODUCTION
- Introduce new model in
production line.
- Control new model activity
from Proto to Mass Prod. stage
NEW MODEL INTRODUCTION
PROCESS & JIG DEVELOPEMENT
DOCUMENTATION CONTROL
PRODUCTION SUPPORT
- Designprocess for new model
designed by Japan orSingapore
- Designelectrical and
mechanical jig
- Windows of Engineering documents
for Pioneer world wide
- Support Engineering Section
- Technical support -Problem analysis
- Pass rateimprovement study

PE DIVISION
16
1
WE ARE
HERE
Production
Division 1
Quality Engineering
Division
Production
Division 2
Warehouse
NATURE OF WORK
INTRODUCTION

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17
PEDIVISION
OFFICE SPACE
371.7m
PE =PRODUCTION ENGINEERING
PE DIVISON LAYOUT
INTRODUCTION
WAREHOUSE 3
PE DIVISION PROFILE
Total manpower
Male / Female
Local
Japanese
73
50 / 23
2
71
2.74%
97.26%
2

PE DIVISION
18
TEAM NAME AND MOTTO
INTRODUCTION
Lovely evergreen Bunga Tanjungtree,
with its smallshiny,thicknarrow,
pointed leave, straight trunkand
spreading branches. Mediumlining
andlarge canopy shape. Strong root
base, non-spreading andnon-
collapse. Pale Yellow essential oil of
Bunga Tanjungproduce a sweet and
extremely tenacious floral odour.
TEAM MOTTO

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19
TEAM LOGO
INTRODUCTION
Strong tree to show our strength as a team.
Floral odour smells to show our commercial values.
Whitein colour to show our clean and tidiness.

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20
Engineer
Mechanical Eng.
CO LEADER SECRETARY
IDAYU
TECHNICAL
RAZIF
JOHAN
Engineer
Process Eng.
LEADERExecutive Engineer
PE Division
ITHNAIN
FACILITATOR
Supervisor
AIP Dept
NAJIB
ADVISOR
TEAM ORGANIZATION CHART
MIZAN
Engineer
Industrial Eng.
Engineer
Process Eng.
GROUP PROCEEDING
UMI
FACILITY
RIZAL
FACILITY
FALIQ
SOFTWARE
Engineer
F/C Designer
Engineer
Process Eng.
Engineering Clerk
Doc. Clerk
Production
Engineering Division
OCCUPATIONAL BACKGROUND
Main Section :
Member consist :
Education Level :
Working Hour :
6 Engineers&
1 Engineering Clerk
SPM ~ Degree
Normal Shift

PE DIVISION
TEAM PROFILE
JOHAN
MIZAN
IDAYU
FALIQ
RAZIF
RIZAL
UMI
* Experience in Function Checker and CA design
* Experience in Computer skill for 10 years
* Expert in Group Facilitation Skills
* Degree in Electronic Engineering (IE) (2005)
* Diploma in Electronic Computer (2001)
* MOST trainer (2005)
* Degree in Eng(Hons) Electronics majoring in Computer
* CCNA – Cisco level 1
* Certified in Hi-Pot setting level 2
* Degree in Mechanical Engineering (2005)
* Diploma in Mechanical Engineering (1999)
* Certified in Microsoft Access 2000
* Degree in Electrical (Control and Instrumentations)
* Diploma in Electrical Communication ( 2000 )
* Certified in Excellent Clerical Course
* Sijil Pelajaran Malaysia (SPM 1993)
* Certified in Microsoft Access 2000 Advance
* Certificate in LCCI
* Degree in Mechanical Engineering Hons) (2005)
* Diploma in Mechanical Engineering (2001)
* Certificate in PLC (2006)
* Experience as Mechanical Designer
* Experience in Computer Skill for years
* Expert in CAD/CAM
* Expert in technical drawing
* Experience as Software Development
* Experience in Computer Skill for 7 years
* Experience in Pilot Run Coordinator
* Experience in Flash Rom download
* Experience in Computer skills for over 10 years
* Experience in Process Design
* Experience in Java Programming (J2SE &
J2ME)
* Expert in data communication and networking
* Experience as Documentation Clerk
* Expert in Work Reference Documentation
Coordinator
* Expert in Main Process Skill & Training
* Experience in troubleshooting and calibration
* Experience in process design
* Experience as a Documentation
* Expert in Main Process Skill & Training
* Degree in Electrical&Electronics Engineering (Hons)
* Certificate in Microsoft SQL server
* LabView Basic 1 & 2
* Certificate in SPC and 8D Problem Solving
21
GROUP PROCEEDING

PE DIVISION
BUNGA TANJUNG S JOURNEY
MPT- CHAMPION
Gold Award
INTRODUCTION
REGIONAL - GOLD AWARD
BE THE
BEST !
22

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23
TEAM ACTIVITIES
GROUP PROCEEDING
OCT 05 Effective Presentation Skills
MAR 07
Statistical Process Control
(SPC)
AUG 06
21 Habits In Becoming Effective
Supervisor
NOV 05 Most Training
JUN 07 Basic / Advance PLC Training
MAY 06 Basic Fire Safety Training
MAR 07 Inventor Professional Training
DATE
ACTIVITIES
TRAINEE
MAR 07
Advanced Product Quality
Planning (APQP)
REEMOS MIZAN IDAYU JOHAN RAZIF RIZAL UMI

PE DIVISION
TEAM CONT RIBUTIO N
ALLIGNED TO COMPANY S OBJECTIVE
LEGEND BSC : BALANCE SCORE CARD
To integrate everyone s
capability and pursue a
complete QECD with a
customer view point.
VISION
MISSION
CORPORATE CORE VALUE
D I V I S I O N T A R G E T ( B S C )
To become a company that
encourages all its members to
work as a team, with everyone
customer-focused, integrating
each one s professionalism in
pursuing innovations one after
another.
Fair & Reasonable.
Positive & Active.
Speedy & Flexible.
Financial Customer Job Process
Human
Engineering
24
GROUP PROCEEDING

PE DIVISION
25
HEALTHY ATTENDANCE PERFORMANCE
40
50
60
70
80
90
100
W1 W3 W5 W7 W9 W11 W13 W15 W17 W19 W21 W23 W25 W27 W29 W31
Week of meeting (Apr 06 - Apr 07)
Attendance%
Minute OfMeeting
Bunga Tanjung s Target = > 94%
WEEKLY ATTENDANCE GRAPH
Average Attendance
= 98 %
Attendance Sheet
GROUP PROCEEDING

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26
TEAM MEMBERSJOB DISTRIBUTION
Method : MATRIX DIAGRAM
ACTIVITIES Materials /Tools
PROJECT PLANNING Brainstorming ,PDCA activity,
Milestone Chart, Job Distribution
PROJECT SELECTION
& DEFINITION
Brainstorming, BSC,
Historical Data
Dept Objective/focus
Brainstorming, Fish Bone Diagram,
Graphical chart, Check Sheet
MONITORING
Check Sheet, Trend Chart,
Review Meeting
STANDARDIZATION
SOP maintenance , Check Sheet,
Training, Trend Chart, Audits,
Reports
ACHIEVEMENT & VALUE
CREATION
ROI data, Respond,
Graphical chart,
Questionnaire,
PRESENTATION
Brainstorming,
presentation facility
Main
Coordinator
Supporter100 % MEMBERS INVOLVEMENT ANDCOMMITMENT !
IMPROVEMENT
OPPORTUNITIES ANALYSIS
CREATIVES & INNOVATIVE
SOLUTIONS/IMPLEMENTATION
Brainstorming, Solution flow,
Decision Matrix table,reports
RIZAL
FALIQ
MIZAN
IDAYU
GROUP PROCEEDING

PE DIVISION
Brainstorming
Discussion
Ideas
Suggestion
Concentrate
BUNGA TANJUNG AT A GLANCE
Data Compilation
27
GROUP PROCEEDING

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28
EFFECTIVE COMMUNICATION AMONG MEMBERS
Social LinkageEvents from JUN 2006 – JUN 2007
MPT
GUNUNGLEDANG
PENGKALANBALAK
BABA NYONYACAFE
MITC FUNG SENG
GROUP PROCEEDING
Date
19/6/2006
04/08/2006
18/11/2006
03/02/2007
10/03/2007
21/07/2007
23/03/2007
15/05/2007
11/06/2007
Activities
Family Day at
Gunung Ledang
MPT Sport’s Day
Dinner at Classic
Hotel
Birthday Celebration
at Fung Seng
Group Binding
at MPT
Dinner at Baba
Nyonya Cafe
AnnualDinner at
MITC
Dinner at Sabak
Aur
Picnic at Pengkalan
Balak
Coordinator
Umi
Faliq
Idayu
Syahmizan
Rizal
Idayu
Faliq
Razif
Johan

PE DIVISION
29
P D C A C Y C L E
P L A N
SOLUTION &
IMPLEMENTATIONMONITORING
STANDARDIZATION
STANDARDIZATION
MONITORING
DATA COLLECTION
AND GOAL SETTING
PROBLEM/PROJECT
SELECTION
ANALYSIS &
ALTERNATIVE SOLUTION
GROUPFORMATION
A C T I O N
C H E C K D O
GROUP PROCEEDING

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30
M I L E S T O N E C H A R T
Plan Actual
GROUP PROCEEDING
TARGET COMPLETED
ON SCHEDULE

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31
PROBLEM SELECTION APPROACH
PROBLEM SELECTION
S T EP 1
COMPANY FOCUS
S T EP 2
AREA OF IMPROVEMENT
S T EP 4
PROBLEM SELECTION
S T EP 3
PROBLEM IDENTIFICATION

PE DIVISION
STEP 1 STEP 2 STEP 3 STEP 4Company
Focus CORPORATE FOCUS
P R O B L E M S E L E C T I O N
32
MPT Mission
To integrate everyone s capability and
pursue a complete QECD with a customer
view point
COMPANY FOCUS
MPT Vision
To become a company that encourages all
its members to work as a team, with
everyone customer-focused, integrating
each one s professionalism in pursuing
innovations one after another
PROBLEM SELECTION
uality ost eliverynvironmentE

PE DIVISION
STEP 1 STEP 2 STEP 3 STEP 4Area of
Improvement
Sources for
brainstorming
33
PROBLEM SELECTION
CARR Report Data
Engineering
Analysis Report
OQC Reject
Data
Problem Min. of
Meeting
Production Reject
Data
Customer
Feedback

PE DIVISION
STEP 1 STEP 2 STEP 3 STEP 4Problem
Identification
Common problems related to QECD
B R A I N S T O R M I N G
High
Solder
Wastage
7
Dipping
Solder
Quality
9
Auto
insert
problem
10
Dust on
production
14
Part
distribution
delay
4
Workman
-ship
problem
2
Use
different
part
12
Additional
process
request
5
Change
model time
too long
1
Spare
part
receive
late
20Non value
Added
process
19
Incoming
Part NG
15
Shipment
Delay
16
Line layout
not suitable
18
Part
received
not good
13
Sub
material
difficult
to control
3 Equipment
not
reliable
6
Wrong
use
of Part
8
Spare part
cost high
21
Process
design
lead time
too long
22
Sub Material
high cost
11
Rework
cost
17
34
PROBLEM SELECTION

PE DIVISION
35
High
Solder
Wastage
7
Dipping
Solder
Quality
9
Auto
insert
problem
10
Dust on
production
14
Part
distribution
delay
4
Workman
-ship
problem
2
Use
different
part
12
Additional
process
request
5
Change
model time
too long
1
Spare
part
receive
late
20Non value
Added
process
19
Incoming
Part NG
15
Shipment
Delay
16
Line layout
not suitable
18
Part
received
not good
13
Sub
material
difficult
to control
3 Equipment
not
reliable
6
Wrong
use
of Part
8
Spare part
cost high
21
Process
design
lead time
too long
22
Sub Material
high cost
11
Rework
cost
17
SIMILAR
PROBLEMS
Identification Common problems related to QECD
PROBLEM SELECTION

PE DIVISION
36
High
Solder
Wastage
7
Dipping
Solder
Quality
9
Auto
insert
problem
10
Dust on
production
14
Part
distribution
delay
4
Workman
-ship
problem
2
Use
different
part
12
Change
model time
too long
1
Spare
part
receive
late
20Non value
Added
process
19
Incoming
Part NG
15
Shipment
Delay
16
Line layout
not suitable
18
Part
received
not good
13
Sub
material
difficult
to control
3 Equipment
not
reliable
6
Wrong
use
of Part
8
Spare part
cost high
21
Process
design
lead time
too long
22
Sub Material
high cost
11
Rework
cost
17
Additional
process
request
5
8
8SIMILAR
PROBLEMS
Identification
Common problems related to QECD
PROBLEM SELECTION

PE DIVISION
QUALITYCOST ENVIRONMENTDELIVERY
Workman
-ship
problem
Auto
insert
problem
Wrong
use of
part
Non value
Added
process
Dipping
solder
quality
Incoming
part NG
15
10 2
8
19
9
Rework
cost
17
High
solder
wastage
Spare part
cost high
Change
model time
too long
Sub
material
difficult
to control
Additional
process
request
7 3
21 5
1
Process
design
lead time
too long
Part
distribution
delay
Shipment
delay
Spare part
receive
late
22 4
20 16
Dust on
production
Line layout
not suitable
Equipment
not
reliable
14
6
18
TOTAL DATA CARD : 8 TOTAL DATA CARD : 5 TOTAL DATA CARD : 4
TOTAL DATA
CARD : 3
A F F I N I T Y D I A G R A M
Sub
Material
High cost
11 1
37
Identification Common problems related to QECD
PROBLEM SELECTION

PE DIVISION
After analyze
the Pareto
chart,
BUNGA
TANJUNG
decided to
focus on
department
COST issues.
100
80
60
40
20
0
40%
65%
85%
No. of Cards
Cost Delivery Environment
%
Quality
8
5
4
3
0
2
4
6
8
10
12
14
16
18
20
38
P A R E T O C H A R T
40%
PROBLEM SELECTION
Identification

PE DIVISION
STEP 1
3
7
8
1
5
2
4
6
CRITERIA
High solder wastage
Sub material difficult
to control
Sub material high cost
Additional process request
Change model time too long
Non value added process
Spare part costhigh
Reworkcost
4x 5x 5x 4x
3
3
4 3
3
23
2
1
2 2
5
3
3
2
3
2
3
23
3
3 2
3
4
3 2 3
2233
12 25 20 12
8 10 10 12
4 15 15 8
8 15 15 8
12 15 15 8
12 20 15 8
12 15 10 12
12 15 10 8
42
40
69
46
50
55
49
45
A
B
LEGEND
A = Votes
B = Ax Weight
Scale
STEP 3 STEP 4Problem
Selection
STEP 2
1
Rank
Within Member
Influence
Customer
Impact
Urgency Lead
Time
Total
Weight
Within Member
Influence
Customer
Impact
Lead
Time
COST PROBLEM
SUB MATERIAL COST
NOTACHIEVED
Urgency
39
PROJECT SELECTION MATRIX
PROBLEM SELECTION

PE DIVISION
40
SUB-MATERIAL is the Supporting material s use at production assembly
exclude part such as liquid, glue, tape etc . Usually we purchase from some
vendor around the world in order to support production .
Example of sub material use at production line:
Flux
Solder Wire
Solder Paste
Used at soldering machine
Used for manualsoldering
Used at solder printingmachine
Solder Bar Used at soldering machine
PROBLEM SELECTION

PE DIVISION
51000
51500
52000
52500
53000
53500
54000
Apr May June July Aug Sept Oct Nov Dec Jan Feb Mar
41
Monthly Sub-Materials Cost (Apr 05 ~ Mar 06)
Total Cost of Sub-Material Purchase inPioneer
PROBLEM SELECTION

PE DIVISION
Antenna
jack
Graph showing usage of top 4 of sub-materials
42
PROBLEM SELECTION
Solder Bar is the highest
usage sub-material in
production line

PE DIVISION
43
Based on production forecast the order willbe increasing due to high demand,so the
usage of solder bar is expected to be increased, thus BUNGA TANJUNGconsider to find a
method to reduce the solder bar cost.
PROBLEM SELECTION
P R O J E C T T A R G E T

PE DIVISION
44
PROBLEM SELECTION
P R O B L E M D E F I N I T I O N
What isSolder Bar?
Why we choose Solder Bar?
Why Solder Bar usage too high?
What are the impact of high usage
of Solder Bar to MPT?
• Fusible metal alloy that take a shape of bar,
• Melting point = 210 C,
• Melted in solderingmachine
• Use to join metallicsurfacesof PCBand electronic
components.
• High usage compare to the other
sub-materials.
• MPT production requirement due to high
production
• Cost will be increased.

PE DIVISION
CONCLUSION OF PROJECT SELECTION
45
To promote reduction of sub-
material cost by minimizing
high solder bar cost
PROBLEM SELECTION

PE DIVISION
DIVISION STOP TARGET
< Balance Score Card(BSC) >
The balanced scorecard is a management system (not only a measurement system) that
enables organizations to clarify their vision and strategy and translate them into action. It
provides feedback around both the internal business processes and external outcomes in
order to continuously improve strategic performance and results. When fully deployed, the
balanced scorecard transforms strategic planning from an academic exercise into the nerve
center of an enterprise._ Drs Robert Kaplan
What is Balance Score Card(BSC) ?
Balance Score Card ( VISION & STRATEGY )
PROBLEM SELECTION
46

PE DIVISION
RELATION TO DIVISION S TOP TARGET
( B re a kd o w n of B SC St r at eg y M ap )
2HM MBH
TRSN DQ
J ob
process
Q HMHMF
1WO MRHNM DR NTMS DRDQ SHNM NE OQNEHSR 4MOQN D DMS NE B R ENV
MPT
4 OQN D DMS HM BTRSN DQ R SHRE BSHNM MC
5 8 H FD
8 QN NSHNM NE BNRS QDCTBSHNM 4 OQN D DMS NE PT HS 7 ARDQ MBD 143 - 6
4 OQN D DMS HM D O N DD
R SHRE BSHNM
HEC
4MCDODMCDMBD
R 3 1 TA E BSNQ
Q MREDQ NE 8 1 INA 8 TQB RD NODQ SHMF DWO MRHNM
8 QN NSHNM NE QD N TSHNM NE BSH HS
ENQ PT HS
8 8 QNIDBS
1M HQNM DMS BNQQDRONMCDMBD
RSQDMFS DMHMF
OEM
1WO MRHM ATRHMDRR 4M DMSNQ BTQS H DMS
T HS MC OQNCTBSHNM DMFHMDDQ
QDHMENQBD DMS
S ESD 1- 3- 5FB
- BSH HS NE ) 1 0 MC
) EDDCA B R RSD
Q HMHMF NE TCHS RS EE
4MSQNCTBSHNM NE M FD DMS
QD SHNM MC HMSQNCTBSHNM NE
DM HQNM DMS HCC D O M
Q HMHMF NE R RSD DMFHMDDQ
2T MDRR NE RRDRR DMS
R DR , H HNM 5
2 *
OQNEHS ( H HNM 5
2 *
NB R DR H HNM 5
7 1 5 R DR H HNM 5
2 *
TRSN DQ D T SHNM ONHMS
AN D
2 *
1WO MRHNM OQNCTBSHNM
NE MDV B SDFNQ OQNCTBSR
5 DCH DBHD DQ
0 0 R RSD
DHMENQBD DMS NE
Promotion of cost
reduction!
through
Reduce solder barcost
47
PROBLEM SELECTION
BSC – BalanceScore Card

PE DIVISION
48
TO REDUCE 10% COST OF
SOLDER BAR BY AUGUST
2006.
TARGET BASE ON DIVISION
BSC REQUIREMENT & TEAM
MEMBER CAPABILITY.
Balance Score Card
PROBLEM SELECTION
P R O J E C T T A R G E T

PE DIVISION
49
WHAT ?
Solder Bar cost
too high
WHO ?
Production Engineer
METHOD : 5W 1H
WHEN ?
During DIPSoldering
process
WHY ?
Solder bar usage too high
WHERE ?
At production
line
PROBLEM DEFINITION
HOW ?
Due to uncontrolled usage
and no evaluation
P R O B L E M D E F I N I T I O N

PE DIVISION
BENCHMARK ON SOLDER BAR COST REDUCTION
PSG
Legend:
PEM : Pioneer Europe Manufacturing
PEP : Pioneer Europe Portugal
PTM : Pioneer Thailand Manufacturing
PSG : Pioneer Shanghai
PAC : Pioneer Asia Center
PEP
PEM
MPT
PTM
MPT
5.1%
MALAYSIA
PAC PTMPSG PEM
SINGAPORE THAILANDCHINA BELGIUMPORTUGAL
15% 16%18% 13%14%
PEP
Location
Company
Reduction
Benchmark between MPT &Sister company
MPT : Pioneer Malaysia
PAC
50
PROBLEM DEFINITION
E-mail from HQ Japan

PE DIVISION
PROJECT SELECTION PROPOSAL TOMANAGEMENT
Team Project Selection Proposal Approval From Management
51
APPROVED ON 04TH May 2006
PROBLEM DEFINITION
PROPOSED ON 03TH May 2006

PE DIVISION
A N A L Y S I S A P P R O A C H
BRAINSTORMING SESSION
S T E P 1
PRELIMINARY SCREENING
S T E P 2
MOST PROBABLE ROOT CAUSE
VERIFICATION
S T E P 3
52
PROBLEM DEFINITION

PE DIVISION
C A U S E S & E F F E C T S A N A LY S I S
53
MANMETHOD
Technician unaware
Man
Power
Instruction not clear
Maintenance
Settings
Dipping MachineSolder
PCB design
MACHINEMATERIAL
ANALYSIS

PE DIVISION
54
ANALYSIS
MAN
Technician
unaware
Man Power
WHY
WHY
No enough
skills
WHY
Seldom go
for training
Factor 1
Brainstorming
Not
understand
1
No
knowledge on
solder
2
Fresh
graduates
Attitude
3
Lack of
discipline
4
New
technician

PE DIVISION
55
ANALYSIS
METHOD
Instruction
not clear
Maintenance
WHY
WHY
Process not
clearly
mention
WHY
Not familiar
with process
Factor 2
No
standardization
5
No process
indication
6
Limited
time
No periodic
checking
7
No
monitoring
Job
overload
No
rules
8 9
Brainstorming

PE DIVISION
56
ANALYSIS
MACHINE
Dipping Machine Setting
WHY
WHY
Running
years
WHY
Old
machine
Factor 3
Conveyor
not stable
10
Conveyor
stop
11
No proper
airflow
No
observation
12
High
temperature
Finger speed
13
Finger speed
not in spec
Temperature
14
Brainstorming

PE DIVISION
ANALYSIS
57
MATERIAL
Solder PCB design
WHY
WHY
Expired
solder bar
WHY
Old
stocks
Factor 4
Solder
quality
15
16
Solder
high price
17
Unlimited
use
18
Not consider
solder quality
Brainstorming

PE DIVISION
58
MANMETHOD
Technician
unaware
Man
Power
Instruction
not clear
Maintenance
Settings
Dipping Machine
Solder
PCB design
MACHINEMATERIAL
Process not
clearly mention
Job overload
No periodic checking
Expired solder bar
Not consider
solder quality
Finger speed
Not understand
Attitude
No enough skills
New technician
No standardization
Temperature
Conveyor
Not stable
No proper airflow
Running
years
Seldom go for
training
High
temperature
No
observation
Old
machine
Old stocks
Unlimited
use
Limited time
No
monitoring
Not familiar
with process
No process
indication
Lack of
discipline
Fresh
graduates
No rules
Not enough
knowledge
Conveyor
stop
Solder
Machine
Finger
speed not
in spec
ANALYSIS
Solder quality
Solder High Price

PE DIVISION
59
ANALYSIS
P R E L I M I N A R Y S C R E E N I N G
9. No observation Legend : Accepted Eliminate
Observation//Finding Result
2. Not enough
skills
1. Not enough
knowledge
Training Result
3. Lack of discipline
4. Fresh graduates
Basedupon
Supervisor
MAN
MACHINE Result
5. High temperature Based on check
sheet and
standard
6. Solder machine
finger speed not in
spec
8. Old machine
7. Conveyor stop
Observation//Finding
Production
maintenance record
Basedon Asset
Label
Maintenance
Engineer
MATERIAL Result
Basedon material
due date and label.
15. Unlimited use Base on Process
Engineer
Basedon Industrial
Engineer analysis
16. Old stock/materials
12. Solder quality
12. No rules
METHOD Result
10. No process indication
Basedon check
sheet
13. Limited time
11. Not familiar with
process
14. No monitoring
Base on standard &
regulations
Base on SOP
17. Solder quality
9. No observation

PE DIVISION
60
MANMETHOD
Technician
unaware
Man
Power
Instruction
not clear
Maintenance
Settings
Dipping Machine
Solder
PCB design
MACHINEMATERIAL
Process not
clearly mention
Job overload
No periodic checking
Expired solder bar
Not consider
solder quality
Finger speed
Not understand
Attitude
No enough skills
New technician
No standardization
Temperature
Conveyor
Not stable
No proper airflow
Running
years
Seldom go for
training
High
temperature
No
observation
Old
machine
Old stocks
Unlimited
use
Limited time
No
monitoring
Not familiar
with process
No process
indication
Lack of
discipline
Fresh
graduates
No rules
Not enough
knowledge
Conveyor
stop
Solder
Machine
Finger
speed not
in spec
ANALYSIS
Solder quality
Solder High Price

PE DIVISION
61
5432
Method : 5 WHY ANALYSIS
1 Why? Why? Why? Why?
Not enough
knowledge
Lack of
experience
Not
enough
exposure
No
proper
training
given
The
training
system
not
efficient
Analysis 1
FINDING
FINDING DATA
FURTHER
ACTION?
NOT
REQUIRED
ANALYSIS
MOST PROBABLE ROOT CAUSE VERIFICATION
Training manual
has been
issued
Basic knowledge
on solder is
been provided

PE DIVISION
62
Too much
waste
Due to
solder dross
Due to
oxidization
Solder
quality
Because
of the
solder
composition
Analysis 2
FINDING
FINDING DATA
According to observation
and analysis by engineer
and technician when
cleaning the dross 2 times
per day
Too many dross
have been
produced during
soldering
process
FURTHER
ACTION?
ANALYSIS
REQUIRED

PE DIVISION
63
Solder machine
Finger speed
not in spec
No frequent
monitoring
Technician fail
to set finger
speed
Analysis 3
FINDING
FINDING DATA
Dipping time in spec
due to availability of
automatic soldering
machine control list
FURTHER
ACTION?
NOT
REQUIRED
Not
mentioned
in
standard
working
procedure
ANALYSIS
By referring to check
sheet, finger speed data
is well-maintained
Technician
not aware

PE DIVISION
64
FACTOR MOST PROBABLE CAUSE FINDINGS
~ Summaryof Most Probable Root Cause ~
PROBLEM
FURTHER
ACTION
7
Machine Finger speed not in
spec
Automating Soldering
Control List 7
Man No knowledge on
solder
Training provided
4 REQUIRED 7 NOT REQUIRED
Material Part quality
Too many wetdross
produced 4Material Solder quality
Too manydross
produced 4
ANALYSIS

PE DIVISION
Inside soldering machine Solder dross
Solder dross
PROBLEM DEFINITION
WHAT IS SOLDER DROSS?
65
Dross is a mass of solid impurities floating on a molten solder
inside soldering machine.

PE DIVISION
PROBLEM DEFINITION
HOW DOES SOLDER DROSSOCCURS ?
D I P S O L D E R I N G M A C H I N E
Inner View
66

PE DIVISION
PROBLEM DEFINITION
DIP SOLDERING MACHINE - INNER VIEW
EXHAUST
PREHEATING
PREHEATING
FLUXER
CONVEYOR
PRIMARY
WAVE
SECONDARY
WAVE
AIR KNIFE
COOLING FAN
67

PE DIVISION
PROBLEM DEFINITION
EXHAUST
PREHEATING
PREHEATING
FLUXER
CONVEYOR
PRIMARY
WAVE
SECONDARY
WAVE
AIR KNIFE
COOLING FAN
68

PE DIVISION
PRIMARY
WAVE
SECONDARY
WAVE
PROBLEM DEFINITION
PREHEATING
69

PE DIVISION
Primary
Wave
Secondary Wave
Melted solder
PROBLEM DEFINITION
PCB = Printed circuit board
70

PE DIVISION
Secondary Wave
Melted solder
Primary
Wave
PROBLEM DEFINITION
71

PE DIVISION
Secondary WavePrimary
Wave
Melted solder
PROBLEM DEFINITION
O2
72

PE DIVISION
Wave
Melted solder
PROBLEM DEFINITION
O2
73

PE DIVISION
Wave
Melted solder
PROBLEM DEFINITION
O2
74

PE DIVISION
Wave
Melted solder
PROBLEM DEFINITION
PCB = Printed circuit board75

PE DIVISION
Wave
Melted solder
PROBLEM DEFINITION
PCB = Printed circuit board76
Solder Dross

PE DIVISION
BUNGA TANJUNG implemented ECRS Checklist as a tool to
measure and decide various ALTERNATIVE solutions
Note: This tools complies to
Productivity Improvement Through Work Study Method
PROBABLE
CAUSE
ALTERNATIVE
SOLUTION
TECHNICAL
ASSESSMENT
PROPOSAL
SELECT
SOLUTION
MATERIAL
EVALUATION
DIFFICULTIES
77
ALTERNATIVE
SOLUTIONS
Interrogate DecisionSolution No
Cover soldering machine
to avoid surrounding air flow
to pot.
Possible to implement# 1
Eliminate cooling fan Possible to implement# 2
YES
YES
Evaluate new vendor Based on IE opinion# 4 YES
Machine best setting
Based on ME information,
this already include in
monthly activities
# 3
Study process - batch
production
Need to consider cost
and production
efficiency
# 5
NO
NO
CORRECTIVE ACTION
Cover soldering machine
to avoid surrounding air flow
to pot.
Possible to implement# 1
Eliminate cooling fan Possible to implement# 2
YES
YES
Evaluate new vendor Based on IE opinion# 4
YES

PE DIVISION
PROBABLE
CAUSE
ALTERNATIVE
SOLUTION
TECHNICAL
ASSESSMENT
PROPOSAL
SELECT
SOLUTION
MATERIAL
EVALUATION
DIFFICULTIES
78
CORRECTIVE ACTION
ALTERNATIVE SOLUTION WHAT?
#1
#3
No
Evaluate new solder
composition
Cover soldering machine to
avoid surrounding air flow to
pot
Cover solder
pot
Study and analyze other products
and solder composition
#2 Eliminate cooling fan Delete
cooling fan

PE DIVISION
Selection Criteria:
PROBABLE
CAUSE
ALTERNATIVE
SOLUTION
TECHNICAL
ASSESSMENT
PROPOSAL
SELECT
SOLUTION
MATERIAL
EVALUATION
DIFFICULTIES
79
CORRECTIVE ACTION
Cost
Solder Quality
Merit/Demerit Higher merit
Expected Result Reduce solder dross
Cheapest
Satisfactory

PE DIVISION
To prevent solder layer to oxidize:
1. Oxygen from surrounding air will re-act
With the material of solder.
2. The reaction between solder and oxygen
will produce dross.
Objective:
PROBABLE
CAUSE
ALTERNATIVE
SOLUTION
TECHNICAL
ASSESSMENT
PROPOSAL
SELECT
SOLUTION
MATERIAL
EVALUATION
DIFFICULTIES
80
CORRECTIVE ACTION
O2
O2
O2
O2
O2
O2
Theoretical
explanation
ADVANTAGES DISADVANTAGESSELECTION
CRITERIA
Not very effective-
-
-
-
Cost
Expected Result
Solder Quality
Merit/Demerit
Remain the same
RM150.00
Cannot totally eliminate
air from entering
PREVENTAIR FROM
ENTERING POT

PE DIVISION
To eliminate cooling fan inside the solder pot
1. Cooling fan will contribute for extra air
inside solder pot
2. Since lead-free soldering implement in MPT,
this cooling fan can be eliminate because
no re-materialization issue
Objective:
PROBABLE
CAUSE
ALTERNATIVE
SOLUTION
TECHNICAL
ASSESSMENT
PROPOSAL
SELECT
SOLUTION
MATERIAL
EVALUATION
DIFFICULTIES
81
CORRECTIVE ACTION
Result – No change
Oxygen from
cooling fan help to
supply oxygen, thus
will contribute on
oxidization process.
Theoretical
explanation
ADVANTAGES DISADVANTAGESSELECTION
CRITERIA
Expected Result
Solder Quality
Not very effective
Remain the same
-
-
Cost RM0.00
-
Result – No changeMerit/Demerit -

PE DIVISION
To introduce new solder composition:
1. Search for alternatives solder composition
by evaluating other vendors.
2. To protect solder surface layer from oxidize.
Objective:
PROBABLE
CAUSE
ALTERNATIVE
SOLUTION
TECHNICAL
ASSESSMENT
PROPOSAL
SELECT
SOLUTION
MATERIAL
EVALUATION
DIFFICULTIES
82
CORRECTIVE ACTION
Alternative composition
Are expected to
Act as a protective layer
To prevent solder from
oxidize
ADVANTAGES DISADVANTAGES
SELECTION
CRITERIA
Less dross-effective
Improve
RM0.00Cost
Solder Quality
Cheaper priceMerit/Demerit
-
-
-
-Expected Result
New composition will act
as protection layer
Theoretical
explanation

PE DIVISION
SELECTION
CRITERIA
ALTERNATIVE
SOLUTIONS
Expected
Results
Solder
Quality
Cost Merit/
demerit
1. Not Improve
2. Improve
1. High cost
2. Low cost
1. Low merit
2. High Merit
1. Not effective
2. Effective
Total
Weight
Cover Solder
Machine Not Effective
Score:
Not Improve RM150.00 Demerit
1
Eliminate
cooling fan
Score:
Not Improve RM0.00 Demerit
Evaluate New
Vendor
Effective
Score:
Improve MeritRM0.00
PROBABLE
CAUSE
ALTERNATIVE
SOLUTION
TECHNICAL
ASSESSMENT
PROPOSAL
SELECT
SOLUTION
MATERIAL
EVALUATION
DIFFICULTIES
Not Effective
Evaluate New
Solder Composition
BEST SOLUTION
SELECT SOLUTION
83
CORRECTIVE ACTION

PE DIVISION
PROPOSAL
84
PROBABLE
CAUSE
ALTERNATIVE
SOLUTION
TECHNICAL
ASSESSMENT
PROPOSAL
SELECT
SOLUTION
MATERIAL
EVALUATION
DIFFICULTIES
Letter For TRIAL RUN
Proposal Letter to
Management
Acknowledgement
Letter
CORRECTIVE ACTION
REQUESTED ON 25TH
Jul 2006
APPROVED ON 26TH
Jul 2006

PE DIVISION
85
TECHNICAL ASSESSMENT
1 Solder Must Be RoHS Compliance
What is RoHS : the restriction of the use of certain hazardous
substances in electrical and electronic equipment
RoHS is often referred to as the lead-free directive,
but it restricts the use of the following six substances:
• Lead (Pb)
• Cadmium (Cd)
• Mercury (Hg)
• Hexavalent chromium (Hex-Cr)
• Polybrominated biphenyls (PBB)
• Polybrominated diphenyl ethers (PBDE)
WHEN DID RoHS COME INTO force?
The RoHS Directive and the UK RoHS regulations came
into force on 1 July 2006
CORRECTIVE ACTION
PROBABLE
CAUSE
ALTERNATIVE
SOLUTION
TECHNICAL
ASSESSMENT
PROPOSAL
SELECT
SOLUTION
MATERIAL
EVALUATION
DIFFICULTIES

PE DIVISION
86
PROBABLE
CAUSE
ALTERNATIVE
SOLUTION
TECHNICAL
ASSESSMENT
PROPOSAL
SELECT
SOLUTION
MATERIAL
EVALUATION
DIFFICULTIES
2 Solder Bar Price Must Be Cheaper than current vendor
Currently MPT only use 1 vendor to supply solder bar :
Current Vendor
CORRECTIVE ACTION

PE DIVISION
PROBABLE
CAUSE
ALTERNATIVE
SOLUTION
TECHNICAL
ASSESSMENT
PROPOSAL
SELECT
SOLUTION
MATERIAL
EVALUATION
DIFFICULTIES
87
3 SnCu base
FAIL
Sn + Ag + Cu + x
Sn, Cu Base Solder
OK Other elements
Sn + Cu + x
2 most common Pb-Free solder is SnCu Base and SAC
base. We require SnCu base solder bar.
Other elements
SAC Base Solder
CORRECTIVE ACTION
• MPT requirement for solder is Sn, Cu base
due to PCB and cell design requirement.
• SnCu base will produce less dross
• Relatively Low Cost
• Good temperature cycling resistance
WHY SHOULD WE USE
SN+CU BASE???

PE DIVISION
88
CORRECTIVE ACTION
Bismuth
Phosphorus
Silicone
Antimony
Dematerialization
issue will cause
solder crack
Phosphorus act as
protection layer from
oxidize
Chemical reaction
from silicon may
reduce oxidization
High melting point
and bad wetting
DecisionCharacteristicElement
PROBABLE
CAUSE
ALTERNATIVE
SOLUTION
TECHNICAL
ASSESSMENT
PROPOSAL
SELECT
SOLUTION
MATERIAL
EVALUATION
DIFFICULTIES

PE DIVISION
89
CORRECTIVE ACTION
Phosphorus Silicone
Phosphorus will act
as a protected layer
after re-act with
oxygen at the
surface.
This layer will
protect other
contents, thus less
dross produce.
Silicone characteristic will
reduce the chemical
reaction for oxidization.
Thus, solder dross is less
produce.
PROBABLE
CAUSE
ALTERNATIVE
SOLUTION
TECHNICAL
ASSESSMENT
PROPOSAL
SELECT
SOLUTION
MATERIAL
EVALUATION
DIFFICULTIES

PE DIVISION
90
PROBABLE
CAUSE
ALTERNATIVE
SOLUTION
TECHNICAL
ASSESSMENT
PROPOSAL
SELECT
SOLUTION
MATERIAL
EVALUATION
DIFFICULTIES
CORRECTIVE ACTION
From our result, we find 2suitable vendor for our further analysis.
Sn+Cu+Ni+P
Sn + Cu + Si

PE DIVISION
91
MATERIAL EVALUATION
Find new vendor
Testing Requirement spec
Reliability Test
Request for Approval
PR Evaluation
Standardization
Solder Ability Test
Judgement
PR (mass pro)
OK
FAIL
End
CORRECTIVE ACTION
PROBABLE
CAUSE
ALTERNATIVE
SOLUTION
TECHNICAL
ASSESSMENT
PROPOSAL
SELECT
SOLUTION
MATERIAL
EVALUATION
DIFFICULTIES

PE DIVISION
92
CORRECTIVE ACTION
MATERIAL EVALUATION
PROBABLE
CAUSE
ALTERNATIVE
SOLUTION
TECHNICAL
ASSESSMENT
PROPOSAL
SELECT
SOLUTION
MATERIAL
EVALUATION
DIFFICULTIES
Testing Requirement
Specification:
1. Vendor Part Spec
2. Technical Data Spec
3. MSDS Data
4. RoHS Compliance
5. ICP Test Data
6. Quotation
1. Cross section
2. Heat Cycle
3. Pull-up Test
4. Sound Quality Test
5. Solderability Test
Testing Process:

PE DIVISION
93
PROBABLE
CAUSE
ALTERNATIVE
SOLUTION
TECHNICAL
ASSESSMENT
PROPOSAL
SELECT
SOLUTION
DIFFICULTIES
MATERIAL EVALUATION
CORRECTIVE ACTION
Cut-off in the middle
of leg
CROSS SECTION TEST
Cross section of
Solderability at pin or
leg Is captured using
high Resolution
microscope
RESULT
MATERIAL
EVALUATION

PE DIVISION
94
TECHNICAL
ASSESSMENT
PROPOSAL
SELECT
SOLUTION
DESIGNOF EXPERIMENT
CORRECTIVE ACTION
CHAMBER MACHINE
PROBABLE
CAUSE
ALTERNATIVE
SOLUTION
DIFFICULTIES
MATERIAL
EVALUATION
HEAT CYCLE TEST
Heat Cycle Test Specification
Temperature : -30
o
C ~ +80
o
C
Timing : 30 min/cycle
No of Cycle : 500

PE DIVISION
95
PROBABLE
CAUSE
ALTERNATIVE
SOLUTION
TECHNICAL
ASSESSMENT
PROPOSAL
SELECT
SOLUTION
DIFFICULTIES
CORRECTIVE ACTION
SHEAR TEST
MATERIAL
EVALUATION
200µm
Push
Chip
Solder
Measurement speed
0.12 mm/sec
Measurement speed
0.5 mm/sec
PCB
MATERIAL EVALUATION

PE DIVISION
96
PROBABLE
CAUSE
ALTERNATIVE
SOLUTION
TECHNICAL
ASSESSMENT
PROPOSAL
SELECT
SOLUTION
DIFFICULTIES
CORRECTIVE ACTION
PULL UP TEST
MATERIAL
EVALUATION
MATERIAL EVALUATION
PCB
SOLDER
PART
PULL UP
GAUGE
45
SURFACE
PULL UP EQUIPMENT

PE DIVISION
97
PROBABLE
CAUSE
ALTERNATIVE
SOLUTION
TECHNICAL
ASSESSMENT
PROPOSAL
SELECT
SOLUTION
DIFFICULTIES
CORRECTIVE ACTION
PULL UP TEST
MATERIAL
EVALUATION
MATERIAL EVALUATION
PCB
SOLDER
PART
PULL UP
GAUGE
45
SURFACE
DURINGTHIS
PROCESS,
THE GAUGE
WILL BE
PUSHED DOWN
AT THE IC LEG

PE DIVISION
98
PROBABLE
CAUSE
ALTERNATIVE
SOLUTION
TECHNICAL
ASSESSMENT
PROPOSAL
SELECT
SOLUTION
DIFFICULTIES
CORRECTIVE ACTION
9.8 N
PULL UP TEST
MATERIAL
EVALUATION
Measurement speed
0.12 mm/sec
MATERIAL EVALUATION
PCB
SOLDER
PART
PULL UP
GAUGE
45
SURFACE
PUSH UP

PE DIVISION
99
PROBABLE
CAUSE
ALTERNATIVE
SOLUTION
TECHNICAL
ASSESSMENT
PROPOSAL
SELECT
SOLUTION
DIFFICULTIES
CORRECTIVE ACTION
To check how new solder affect sound quality
MATERIAL
EVALUATION
SOUND QUALITY TEST
MATERIAL EVALUATION

PE DIVISION
100
PROBABLE
CAUSE
ALTERNATIVE
SOLUTION
TECHNICAL
ASSESSMENT
PROPOSAL
SELECT
SOLUTION
DIFFICULTIES
CORRECTIVE ACTION
MATERIAL
EVALUATION
SOUND QUALITY TEST
MATERIAL EVALUATION
ACTUAL TEST
VENUE :
PAC LISTENING
ROOM
DATE :
31 MARCH
2006
ATTENDEES:
K.TAKAYAMA
T.KIMURA
A.KATO
ONG B. H.
JOHAN
MIZAN
IDAYU
RIZAL
Evaluation models:
VSX-516/KUXJ
VSX-916/MYXJ

PE DIVISION
101
PROBABLE
CAUSE
ALTERNATIVE
SOLUTION
TECHNICAL
ASSESSMENT
PROPOSAL
SELECT
SOLUTION
MATERIAL
EVALUATION
DIFFICULTIES
MATERIAL EVALUATION
CORRECTIVE ACTION
SOLDERABILITY TEST
We checked solder ability at PCBs for solder short and reject solder pin

PE DIVISION
PROBABLE
CAUSE
ALTERNATIVE
SOLUTION
TECHNICAL
ASSESSMENT
PROPOSAL
SELECT
SOLUTION
MATERIAL
EVALUATION
DIFFICULTIES
102
Test:
Cross Section
Heat Cycle
Pull-up Test
Sound Test
7
4
4
4
Result 25%
improved
4
4
4
4
54%
improved
CORRECTIVE ACTION
Y VENDORX VENDOR
4
4
4
4
54%
improved
X VENDOR
FROM RELIABILITY AND SOLDER ABILITY
TEST RESULTS
X SOLDER BAR VENDOR
IS SELECTED
MATERIAL EVALUATION

PE DIVISION
103
REQUEST NEW SUB-MATERIAL APPROVAL FOR X
SOLDER BAR VENDOR TO PIONEER HQ JAPAN
CORRECTIVE ACTION
MATERIAL EVALUATION
PROBABLE
CAUSE
ALTERNATIVE
SOLUTION
TECHNICAL
ASSESSMENT
PROPOSAL
SELECT
SOLUTION
MATERIAL
EVALUATION
DIFFICULTIES

PE DIVISION
Carry-out through implementation of
PILOT RUN(PR) procedure (Internal Control)
5
Judging
PR Result
6 PR Report
2
Scheduling
Arrangement
3 Run PR
7 Documentation
Sampling Check4
Raise PR Request
Form1
CORRECTIVE ACTION
104
MATERIAL EVALUATION
PROBABLE
CAUSE
ALTERNATIVE
SOLUTION
TECHNICAL
ASSESSMENT
PROPOSAL
SELECT
SOLUTION
MATERIAL
EVALUATION
DIFFICULTIES

PE DIVISION
105
Process
PR Qty
Target
Testing
Tools
Confirm dross quantity, top-up frequency and solder ability
100 pcs
Improve Solder ability (100%)
1. Performance 2. Reliability Test
Soldering machine
CORRECTIVE ACTION
MATERIAL EVALUATION
PROBABLE
CAUSE
ALTERNATIVE
SOLUTION
TECHNICAL
ASSESSMENT
PROPOSAL
SELECT
SOLUTION
MATERIAL
EVALUATION
DIFFICULTIES

PE DIVISION
106
CORRECTIVE ACTION
Outgoing Quality
Control
RESULTS
Production 1
RESULTS
MATERIAL EVALUATION
PROBABLE
CAUSE
ALTERNATIVE
SOLUTION
TECHNICAL
ASSESSMENT
PROPOSAL
SELECT
SOLUTION
MATERIAL
EVALUATION
DIFFICULTIES

PE DIVISION
107
PROBABLE
CAUSE
ALTERNATIVE
SOLUTION
TECHNICAL
ASSESSMENT
PROPOSAL
SELECT
SOLUTION
MATERIAL
EVALUATION
DIFFICULTIES
CORRECTIVE ACTION
MATERIAL EVALUATION
Solder dross less produce due to solder composition:
Sn + Cu + Ni + P
Phosphorus will act as a protected
layer after
Re-act with oxygen at the surface.
This layer will protect other
contents, thus less dross produce.

PE DIVISION
Difficulties Action How Who Result
Difficult to fix
schedule
Prod. Confuse
on new solder
usage
calculation
Arrange meeting
with MPT Prod.
Control, to
discuss on
re-adjusting the
Prod. schedule Solved
Carry-out short
training
session to
clarify the
solder usage
quantity Solved
1.
2.
PROBABLE
CAUSE
ALTERNATIVE
SOLUTION
TECHNICAL
ASSESSMENT
PROPOSAL
SELECT
SOLUTION
MATERIAL
EVALUATION
DIFFICULTIES
DIFFICULTIES
CORRECTIVE ACTION
108

PE DIVISION
PROBABLE
CAUSE
ALTERNATIVE
SOLUTION
TECHNICAL
ASSESSMENT
PROPOSAL
SELECT
SOLUTION
MATERIAL
EVALUATION
DIFFICULTIES
DIFFICULTIES
CORRECTIVE ACTION
109
???Production confuse on
new solder usage calculation
•Phosphorus level difficult to
maintain during high production
volume.
•Two type of solder bar were
introduced with different
content of phosphorus inside
the composition.
•Training was conducted on
how to balance out phosphorus
level inside solder pot.

PE DIVISION
MONITORING
FLOW
DAILY
SAMPLING DATA
DATA
ASSESSMENT
TEAM MEMBER
WEEKLY REVIEW
RESPONSE
110
MONITORING OF RESULT
MONITORING
PE
MCD
PD1
PD1
PC
PICStart
New vendor
New order
Line selection
Incoming material control
Monitoring
B
PE
ME
ME
PE
PIC
END
Implement check sheet
Top up solderevery 1 hour
Resultmonitoring
Solder dross collection 3 times
B

PE DIVISION
111
MONITORING
FLOW
DAILY
MONITORING
DATA
DATA
ASSESSMENT
TEAM MEMBER
WEEKLY REVIEW
RESPONSE
--- DAILY MONITORING DATA ---
Prod DIV 1,
Line P10
Apr 21 ~ May10
Check sheet
tomeasure Dross
& top up
100 % check for
all production lot.
WHERE WHENMETHOD
MEASURED
WEIGHT WHO
Check Sheet
TOTAL DROSS
IN (KG)
ME/PE
TOTAL TOP UP
SOLDER IN (KG) –
EVERY 1 HOUR
MONITORING

PE DIVISION
MONITORING
FLOW
DAILY
SAMPLING DATA
DATA
ASSESSMENT
TEAM MEMBER
WEEKLY REVIEW
RESPONSE
112
Monthly top up & total solder dross
reduced when using new type of
solder bar (X-Vendor)
Compare to current type (Current-Vendor)
MONITORING
Month
Vendor X- (P37) Y- (P36)
Price/KG (RM) 38.33 48.50
Production Date 7/8 - 29/8 1/8 - 29/8
Production Qty 18620 17800
Monthly Top up/Bar 1200 2311
Monthly Top up/KG 624.00 1150.87
Solder Dross (KG) 114.00 280.50
Monthly Total cost (RM) 23917.92 55817.20
August

PE DIVISION
113
MONITORING
FLOW
DAILY
SAMPLING DATA
DATA
ASSESSMENT
TEAM MEMBER
WEEKLY REVIEW
RESPONSE 0
10000
20000
30000
40000
50000
60000
Cost(RM)
August September October November December January February March April May
Month
X-Vendor (P37)
Current-Vendor (P36)
MONITORING

PE DIVISION
114
MONITORING
FLOW
DAILY
SAMPLING DATA
DATA
ASSESSMENT
TEAM MEMBER
WEEKLY REVIEW
RESPONSE 0
50
100
150
200
250
300
Dross(kg)
Month
X-Vendor (P37)
MONITORING

PE DIVISION
115
MONITORING
FLOW
DAILY
SAMPLING DATA
DATA
ASSESSMENT
TEAM MEMBER
WEEKLY REVIEW
RESPONSE 0
5000
10000
15000
20000
25000
ProductionQuantity(pcs)
Month
X-Vendor (P37)
MONITORING

PE DIVISION
116
MONITORING
FLOW
DAILY
SAMPLING DATA
DATA
ASSESSMENT
TEAM MEMBER
WEEKLY REVIEW
RESPONSE
MONITORING
Production
Quantity
Total
Top Up / Bar
Total
Top Up / KG
Solder Dross
(KG)
Total Cost
(RM)
Current Vendor X Vendor
134,709.00
119,874.00
9,268.00
12,247.00
6,497.00
4,934.36
983.09
1,695.60
315,108.67
175,974.02
MONITORING RESULT AUGUST 2006 – MAY 2007
Total Cost
(RM)
315,108.67
175,974.02
REDUCE COST

PE DIVISION
MONITORING
FLOW
DAILY
SAMPLING DATA
DATA
ASSESSMENT
TEAM MEMBER
WEEKLY REVIEW
RESPONSE
Team Weekly Review Meeting
Bunga Tanjung done weekly meeting to review line P37 solder bar usage. This is to
evaluate the effectiveness of using new solder bar to improve the solder ability and
reduce 10% of solder bar cost.
Solder bar usage isclosely monitored
during each meeting to identify any
abnormality in production.
117
MONITORING

PE DIVISION
118
C U S T O M E R R E S P O N S E
No more hassle for touch-up
Cost reduction
Supervisor
Procurement General Manager
OQC pass rate increased Excellent !!!
OQC
Operator
MONITORING
FLOW
DAILY
SAMPLING DATA
DATA
ASSESSMENT
TEAM MEMBER
WEEKLY REVIEW
RESPONSE
Productivity increase Less maintenance
Technician
MONITORING

PE DIVISION
IMPLEMENTATION APPROVAL
STANDARDIZATION
119
DOCUMENT
& STORAGE
TRAINING FOLLOW-UP
EVIDENCE
STANDARDI
ZATION
MEETING
IMPLEMENT
APPROVAL
Implementation Letter
Acknowledgement LetterLetter to Management
Dated: 09/08/06 Dated: 10/08/06

PE DIVISION
OUR AGENDA
DATE: 11/05/07
MANAGEMENT
STAFF
MANAGEMENT REVIEW MEETING
STANDARDIZATION
120
MEETING
DOCUMENT
& STORAGE
TRAINING
FOLLOW-UP
EVIDENCE
IMPLEMENT
APPROVAL
STANDARDI
ZATION

PE DIVISION
MEETING DOCUMENT
& STORAGE
TRAINING FOLLOW-UP
EVIDENCE
IMPLEMENT
APPROVAL
VISUAL MANAGEMENT & TRAINING
STANDARDIZATION
Basic Solder Training
A training on solder was conducted to ensure
the knowledge of members in related
departments are up to an expected level
Participants: Production Engineering,
Manufacturing Engineering, Machine
maintenance technician.
Contents :
• Basic of solder
• Solder composition,
•Chemical reaction between solder and other
elements
•Temperature and maintenance
121
STANDARDI
ZATION

PE DIVISION
MEETING
DOCUMENT
& STORAGE
TRAINING FOLLOW-UP
EVIDENCE
IMPLEMENT
APPROVAL
DOCUMENTATION& STORAGE
STANDARDIZATION
122
Solder sample
taken and sent
for analysis
Results issued
and filing
STANDARDI
ZATION

PE DIVISION
MEETING
DOCUMENT
& STORAGE
TRAINING FOLLOW-UP
EVIDENCE
IMPLEMENT
APPROVAL
DOCUMENTATION& STORAGE
STANDARDIZATION
123
STANDARDI
ZATION

PE DIVISION
DOCUMENT
& STORAGE
TRAINING FOLLOW-UP
EVIDENCE
MEETINGIMPLEMENT
APPROVAL
PPT= PROCESS PATROLTEAM
FOLLOW UP EVIDENCE
STANDARDIZATION
124
10 months monitoring result
STANDARDI
ZATION

PE DIVISION
DOCUMENT
& STORAGE
TRAINING FOLLOW-UP
EVIDENCE
MEETINGIMPLEMENT
APPROVAL
MONITORING
STANDARDIZATION
125
Standardization implementation
Line P36 & P38 for
standardization and
implementation
STANDARD-
IZATION

PE DIVISION
DOCUMENT
& STORAGE
TRAINING FOLLOW-UP
EVIDENCE
MEETINGIMPLEMENT
APPROVAL
MONITORING
STANDARDIZATION
126
STANDARD-
IZATION
Sample of Solder Top-up & Total Dross Checksheet

PE DIVISION
RECOGNITION LETTER
MANAGEMENT RECOGNITION
ACHIEVEMENT
127
ATTAINED ON:
16th MAY 2007

PE DIVISION
TANGIBLE RESULT
X-Vendor 134709
Current-Vendor 119874
Increasing 14835
PRODUCTION QUANTITY
X-vendor 4934.36
Current-Vendor 6497.09
Decreasing 1562.73
TOP UP (KG)
X-Vendor 983.09
Decreasing 712.51
DROSS QUANTITY (KG)
X-Vendor 175974.02
Decreasing 39134.65
COST (RM)
ACHIEVEMENT
128
Verified by MPT
Finance
Dept Head

PE DIVISION
INTANGIBLE RESULT
ACHIEVEMENT
129
0
1
2
3
4
5
Before
After
1 2 3 4 5
AveragePoor Weak Good Excellent
[ Rating Scale ]
Source : Self Examination Form
2.1 3.8
NO EVALUATION ITEM
Knowledge of QC
Method & Tools
Understanding of
PDCA Concept
Problem Analysis
Method
BEFORE AFTER
1.9 3.5
1.6 3.5
2.0 3.9
2.0 3.9
2.4 4.0
Planning & Time
management
Problem Solving
Approach
1
2
3
4
5
AVERAGE : 2.0 3.8
6
Communication &
Teamwork
Knowledge of ICC
Method & Tools
Planning
&Time
Management
Communication
& Teamwork Understanding
of PDCA
Concept
Problem
Analysis
Approach
Problem Solving
Approach
Target Achieved!!!
76%
(Actual target = 50%)
SELF ASESSMENT DATA

PE DIVISION
130

PE DIVISION
131

Bunga Tanjung - National ICC Convention 2017

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