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RAMPAGE V EXTREME 
•12 x SATA 6Gb/s (4 shared w/ SATA-E) 
•2 x SATA Express 
•KeyBot 
•BIOS Switch 
•14 x USB 3.0 (4@F; 10@B) 
•6 x USB 2.0 (4@F; 2@B) 
•Intel® Ethernet 
•GameFirst III 
•LANGaurd
RAMPAGE V EXTREME
CPU 
New Intel® Core™ i7 Processors on LGA 2011-v3 Socket; Supports 22nm CPU, Intel® Turbo Boost Technology 2.0 
Chipset 
Intel® X99 Express Chipset 
Memory 
Quad channel memory architecture; 8 x DIMMs, up to max. 64GB, DDR4 3300MHz+(O.C.) 
Intel® Extreme Memory Profile (XMP) 
Expansion slot 
4* x PCIe 3.0 x16 slots (40-lane CPU @ x16, x16/x16, x16/x8/x8 or x16/x8/x8/x8; 28-lane CPU @ x16, x16/x8, x8/x8/x8) 
1 x PCIe 2.0 x16 slot (Max. at x4 mode) 
1 x PCIe 2.0 x1 slot 
*The last PCIe 3.0 X16 slot (PCIE_X8_X4) shares X4 lanes with M.2 
Multi-GPU 
NVIDIA® 4-Way SLI™ and AMD 4-Way CrossFireX™ Technology ( 28-lane CPU supports up to 3-Way SLI/CFX) 
Storage 
12 x SATA 6.0 Gb/s (4 ports shared with 2 x SATA Express) 
2 x SATA Express 
1 x M.2 Socket 3 with M Key, support type 2260/2280/22110 storage devices 
USB 
14 x USB 3.0 ports (10 at back panel, 4 at mid-board); 6 x USB 2.0 ports (2 at back panel, 4 at mid-board) 
Wireless & Bluetooth 
Wi-Fi 802.11 a/b/g/n/ac 3T3R supports dual frequency band 2.4/5 GHz; 
Up to 1300Mbps transfer speed 
Bluetooth v4.0 
LAN 
Intel® I218-V Gigabit LAN 
Anti-surge LANGuard 
GameFirst III 
Audio 
ROG SupremeFX 2014 8-Channel High Definition Audio 
-SupremeFX Shielding Technology 
-ELNA® Premium Audio Capacitors 
Advanced audio features: Sonic SoundStage, Sonic SenseAmp, Sonic Studio, Sonic Radar II, DTS Connect 
Optical S/PDIF out port at back panel 
Jack-detection, Multi-streaming, Front Panel Jack-retasking 
Form Factor 
ATX Form Factor, 12”x 10.7” (30.5cm x 27.2cm) 
Rich bundles 
OC Panel 
RAMPAGE V EXTREME
The PCIe lanes (GEN 3.0) on the R5E can be divided into: 
Slot # 
Single VGA 
SLI/CFX 
3-Way 
SLI/CFX 
4-Way 
SLI/CFX 
1 
X16 
X16 
X16 
X16 
2 
X8 
X8 
3 
X16 
X8 
X8 
4 
X8 
This motherboard is ready to support PCIe 3.0 SPEC. Functions will be available when using PCIe 3.0-compliant devices. Please refer to www.asus.com for updated details. 
•The last PCIe 3.0 X16 slot (PCIE_X8_X4) shares X4 lanes with M.2 
•The PCIe 2.0 x16 slot (grey, max. X4 mode) compatible with X1/X4 devices 
•The PCIe 2.0 x16 slot shares bandwidth with SATA Express_E1, USB3.0_E910 at rear, and the PCIe 2.0 x1 slot. 
Slot # 
Single VGA 
SLI/CFX 
3-Way 
SLI/CFX 
1 
X16 
X16 
X8 
2 
X8 
3 
X8 
X8 
4 
40-lane processors: 
28-lane processors: 
READY FOR THE NEXT GEN. ENTHUSIAST PLATFORM
Normal mode gives you full info on CPU Temps, Ratios, BCLKs, and Fan RPMs. 
* Only works in-OS 
OVERCLOCKING COMMAND CENTER
OVERCLOCKING COMMAND CENTER
OVERCLOCKING COMMAND CENTER
PRIMED FOR YOUR POT 
Rampage V Extreme’s X-Socket II makes easy work of mounting existing LN2 pots to the latest O.C. socket. Use the supplied Star Key to replace LGA2011-v3 backplate with X-Socket II and you’re ready to super-cool with your existing evaporator! 
Mounting your existing LN2 pot to the latest LGA2011-v3 socket can be tricky.
When the BIOS settings are too extreme to allow proper boot up, overclockers need to reset the BIOS to default settings to get system boot up. However, reset BIOS means the previous experimental settings are cleaned out and you need to recall your memory and key in all the settings to try again. 
All BIOS settings are cleaned out !! 
WE’VE GOT YOUR BACK 
Clr CMOS
Just one quick tap of the Safe Boot button powers off your system and launches it into Safe Mode, with previous overclocking settings retained so you are ready to try again! 
Safe Boot Button 
*Safe Boot button resets the system, enabling it to boot at stock settings. 
Then, when you go into the BIOS it re- load the last known settings for you to adjust and try again. 
WE’VE GOT YOUR BACK
No Response!! 
One click to force a reboot right away. 
ROG ReTry Button 
*Safe Boot & ReTry function very similarly. Once triggered, the system would immediately shutdown and power on by itself. The difference is that the Safe Boot would power up the system in Safe mode, while the ReTry button powers up according to the settings set in the BIOS. 
Long press start button or switch off the PSU and wait for system shut down. 
or 
Traditional Forced Reboot 
Sometimes, extreme overclocking causes as system to hang during the boot process and even tapping the reset button doesn't help. When this happens, OCers usually shut down the system and switch off or unplug the power supply to completely kill the power. However, this takes a lot of time, so ROG came up with a better solution! 
CAN’T REBOOT? RETRY WILL!
An all-in-one driver and high & low side MOSFETs with built in RDS (Resistance Drain to Source) On Sensing Technology. 
Introducing new components: 
UNWAVERING POWER 
custom designed for 
•High Permeability 
•Reduced Inductance Roll-off 
•Large Current Capacity 
•High Efficiency* 
*The high efficiency is achieved by reducing 
Hysteresis loss occurs as the core is magnetized in opposite directions as the PWM switches on and off. 
Eddy current loss occurs when a varying electric or magnetic field present generates tiny currents that circulate within the individual granules.
ASUS Custom Designed PWM Controller 
MOSFET Driver 
High -side 
Low -side 
MOSFETs 
MicroFine Alloy Choke 
10K Black Metallic Cap 
DIGI+ 
E P U 
PWM Controller 
MOSFET Driver 
High -side 
Low -side 
MOSFETs 
Choke 
Capacitor 
*The photos above are for reference only. 
TOTAL DESIGN IS EVERYTHING
**The photos above are for reference only. 
TOTAL DESIGN IS EVERYTHING 
PWM Controller 
High-side 
+ 
Low-side 
MOSFETs 
Choke 
Capacitor 
MOSFET Driver 
Extra Resistor 
Extra Capacitor 
5% Tolerance 
10% Tolerance 
10% Tolerance 
Measured at the Choke 
+ 
**DCR is the Direct Current Resistance of the Inductor and is the traditional method of current sensing.
+ 
*RDS is the internal drain to source resistance within the MOSFET. 
TOTAL DESIGN IS EVERYTHING 
High-side 
+ 
Low-side 
MOSFETs 
MOSFET Driver 
ASUS Custom PWM Controller 
MicroFine Alloy Choke 
10K Black Metallic Cap 
DIGI+ E P U 
Extra Resistor 
Extra Capacitor 
Built-In Current Sense Amplifier 
5% Tolerance 
10% Tolerance 
5% Tolerance 
2% Tolerance 
10% Tolerance 
Measured at the Choke 
RDS* 
*RDS is actually internal to the MOSFET. 
Measured at the Choke 
Current Sensing Amplifier
*2000X magnification 
*2000X magnification 
SMALL DESIGN TWEAK—MASSIVE PERFORMANCE GAINS 
Significantly smaller granules not only generate more normal shapes, but also allow for more densely packed powder 
Smaller and more evenly distributed air gaps increase the over permeability of the choke. 
Highly irregular shapes are harder to properly coat with insulator material. 
Since the permeability of air is very low, having large air gaps lowers the overall permeability of the alloy
*2000X magnification 
*2000X magnification 
SMALL DESIGN TWEAK—MASSIVE PERFORMANCE GAINS 
MicroFine Granules 
Standard Granules 
Permeability 
High 
Low 
Percent Initial Permeability (%μ0) 
DC Magnetizing Force (Oersteds) 
Percent Saturation 
Permeability vs. DC Magnetizing Force 
Maintains High Permeability for much longer! 
Permeability is defined as the magnitude to which a material can become magnetized. A larger permeability means that material can be magnetized to a higher potential. Increasing permeability in an inductor (the choke) will reduce the number of windings needed to achieve the same inductance, and ultimately reduce power lost in the windings (copper loss)
*2000X magnification 
*2000X magnification 
MicroFine Granules 
Standard Granules 
Permeability 
High 
Low 
Hysteresis Loss 
Less (75% Smaller Eye) 
More 
Magnetic field 
Magnetization 
Hysteresis loss occurs as the core is magnetized in opposite directions as the PWM switches on and off. It is clear that as the granules shrink in size, so does the hysteresis eye. The smaller the area (of the hysteresis eye), the less hysteresis loss. 
SMALL DESIGN TWEAK—MASSIVE PERFORMANCE GAINS
*2000X magnification 
*2000X magnification 
MicroFine Granules 
Standard Granules 
Permeability 
High 
Low 
Hysteresis Loss 
Less (75% Smaller Eye) 
More 
Eddy Current Loss 
Less 
More 
Eddy currently loss can be reduced by decreasing the size of the granules. Despite the quantity of generated fields increasing, the overall power loss will still decrease. Large granules generally have rougher surfaces due to the manufacturing process. This can cause the insulating layer to be applied unevenly. Areas where the insulation is too thinly applied can allow large eddy current to develop and circulate through multiple granules. 
SMALL DESIGN TWEAK—MASSIVE PERFORMANCE GAINS
0 
10 
20 
30 
40 
50 
60 
70 
80 
90 
100 
0 
4 
8 
12 
16 
20 
24 
28 
32 
36 
40 
45 
50 
55 
60 
%Change in Inductance 
Direct Current (A) 
Fine Granules @ 85°C 
Med Granules @ 85°C 
*2000X magnification 
*2000X magnification 
MicroFine Granules 
Standard Granules 
Permeability 
High 
Low 
Hysteresis Loss 
Less (75% Smaller Eye) 
More 
Eddy Current Loss 
Less 
More 
Rate of Inductance Loss 
Slower (50% Slower Loss) 
Faster 
All chokes suffer from inductance de-rating as current increases. The amount of energy the choke can store decreases as current increases. This is a critical specification, as complete loss of inductance causes VRM failure. This is the direct result of ROG engineer’s efforts to produce a higher permeability alloy—a more stable, effective choke. 
SMALL DESIGN TWEAK—MASSIVE PERFORMANCE GAINS
0 
20 
40 
60 
80 
100 
120 
0 
4 
8 
12 
16 
20 
24 
28 
32 
36 
40 
45 
50 
55 
60 
Temperature (°C) 
DIrect Current (A) 
Fine Granules 
Large Granules 
*2000X magnification 
*2000X magnification 
MicroFine Granules 
Standard Granules 
Permeability 
High 
Low 
Hysteresis Loss 
Less (75% Smaller Eye) 
More 
Eddy Current Loss 
Less 
More 
Rate of Inductance Loss 
Slower 
(50% Slower Loss) 
Faster 
Temperature @ 60A 
Cooler (31% Lower Temperature) 
Hotter 
SMALL DESIGN TWEAK—MASSIVE PERFORMANCE GAINS 
As switching frequencies increase, eddy current loss and hysteresis loss occupy an increasing portion of total power loss in a choke—eventually becoming the primary cause of power loss. Since power loss is dissipated as heat, the results of the reduction of eddy current and hysteresis loss can tangibly be seen as a 31% drop in operating temperature.
ROG Engineers have integrated a Pulse-Width- Modulator (PWM) that allows the memory VRM to run at 1000kHz. The increase in frequency allows the DC ripple to be reduced by as much as 40%. 
REDUCED DC RIPPLE TO MEMORY
DirectCU thermal design 
Standard thermal design 
Heat disspation 
Heat dissipation 
copper heatpipe 
Exclusive DirectCU cooling technology puts the copper heatpipe in direct contact with the VRM zone to provide incomparable heat dissipation. Other designs merely prevent overheating — Rampage V Extreme with DirectCU keeps everything cooler than ever! 
DIRECTCU THERMAL SOLUTION
provides a huge thermal mass for the heat to dissipate into, providing great performance with the added benefit of aesthetic beauty. 
*Similar heatsink cover to the R4BE. 
DIRECTCU THERMAL SOLUTION
RAMPAGE V EXTREME
Rampage V Extreme is ready and even upgraded with the all-new features available on ROG Z97 series motherboards. 
and plenty more… 
VALUE-ADDED UTILITIES & RICH BUNDLES
ASUS ROG
ASUS ROG
Apply the best settings for different game genres in real time on any OS, via the onboard Sonic SoundStage button. The debug LED displays the mode – FPS(01), racing (02), fighting (03) or sports (04). 
Sonic SenseAmp detects headphone impedance (below 65, 65~150, above 150 ohms) and adjusts the built-in amp automatically for pitch-perfect listening right away! 
PRECISION-ENGINEERED AUDIO THAT’S AS GREAT AS A DEDICATED SOUND CARD 
Physical PCB isolation 
EMI 
Stainless steel black nickel EMI cover 
EMI 
*Sonic SenseAmp and Sonic SoundStage supports only analog-audio front-panel (AAFP) connections.
•GAMER-FRIENDLY DESIGN INSIDE AND OUT 
Smartly detects the headphone impedance and automatically amp up your headphone. 
SoundStage button and amp 
Sonic SoundStage settings in software 
Load the ROG fine-tuned preset game genre profile via an onboard button or software and enjoy the vivid gaming sound on the fly. 
EASY-TO-USE AND IMMERSIVE AUDIO
Sonic Studio is a brand-new audio-tuning suite that provides an aural treat. Use the one-click Virtual Surround to bring 7.1 channels to a stereo (2-ch) headset. 
Superb audio controls, including Reverb, Bass Boost, Equalizer, Voice Clarity and Smart EQ, ensures that everything you hear sounds amazing! 
BRILLIANT ONE-CLICK VIRTUAL SOUND!
With Sonic Radar II, you can test and improve your ability to accurately pinpoint sounds. This keeps you more aware of the battlefield and lets you get the jump on your opponents before they even see you. 
PINPOINT THE SOUND AND YOUR ENEMIES
Instantly boost your system 
Enable Extreme Memory Profiles (XMP) 
Just one tap to launch the UEFI BIOS 
That’s what KeyBot gives you. Just plug your existing keyboard into the dedicated USB socket to activate the exclusive KeyBot microprocessor on your ROG motherboard! 
You can use KeyBot to wake your PC, to boot into a specific mode: 
YOUR KEYBOARD INSTANTLY UPGRADED
Program up to 15 sequential keyboard 
combinations. 
Assign any application or folder to launch. 
Assign to everyday functions, like mail, browsing or multimedia functions 
YOUR KEYBOARD INSTANTLY UPGRADED
STABLE SUPPLY OF 5V – FRONT AND BACK! 
ROG’s TrueVolt USB design delivers a rock-steady 5V supply to both the front and back USB sockets – no drop-outs! 
*5V output varies from PSUs to PSUs 
•Low noise, low loss. 
•Stable 5V* supply to provide clean 5V USB power to minimize potential fluctuations 
•All connected equipment (e.g. USB DAC or thumb drivers) benefits from the clean, stable 5V supply at the same time.
Online game packets are generally small — typically fewer than 256 bytes. With small packet sizes, Intel Ethernet performs up to two times (2X) faster than other gaming-LAN technologies. 
IxChariot* Application Buffer Size (Bytes) 
Throughput (Mb/s) 
IxChariot is an independent network-assessment test tool used to test performance and reliability. 
Throughput: higher is better CPU usage: lower is better 
MORE THROUGHPUT, LESS CPU USAGE AND THE BEST GAMING EXPERIENCE!
ROG has reinvented the LAN port. Advanced signal-coupling technology and premium surface-mounted capacitors improve throughput, while surge-protected and electrostatically-guarded components (ESD Guards) protect your motherboard from lightning strikes and static electricity! 
*ESD result is undertaken by individual LANDGuard 
PUMPED-UP THROUGHPUT. BEST SURGE PROTECTION.
Exclusive GameFirst III has been upgraded with even more gamer-centric features, and an interface that’s even more intuitive. GameFirst III helps you to assign top priority to gaming packets and allocate more bandwidth to game throughput, ensuring the best online gaming experience. 
ULTIMATE BANDWIDTH-MANAGEMENT SOFTWARE FOR MINIMUM LAG AND MAXIMUM FRAGS!
Easy to use, with no confusing jargon! 
Optimization Mode – Both game packets and other packets are optimized 
Game Mode – Game packets given top priority 
Media Streaming Mode – Media-streaming packets given top priority 
File Sharing Mode – File-sharing packets given top priority 
4 Preset packet-priority modes 
Priority Settings 
Manual Bandwidth Control 
Individual settings with 5 Levels 
INTUITIVE AND ADVANCED USER INTERFACE.
•ENJOY LIGHTNING FAST GAME LOADING AND EFFICIENT SYSTEM OPERATION 
Typical game load times among different devices: 
RAM 
SSD 
HDD 
< 1 sec. 
20~30 secs. 
~5 secs. 
The ROG RAMDisk dynamically releases unused memory in RAMDisk to system for better system operating efficiency and ensures a smooth user experience. 
Fast game loading with ROG RAMDisk 
Forget patience; the junction of ROG RAMDisk loads games virtually instantly. 
ENJOY LIGHTNING FAST GAME LOADING AND EFFICIENT SYSTEM OPERATION
Model 
RAMPAGE V EXTREME (R5E) 
RAMPAGE IV EXTREME (R4E) 
Platform 
X99-chipset + Intel® LGA 2011-v3 (OC Socket) 
X79-chipset + Intel® LGA 2011 
Form Factor 
E-ATX (305X272 mm) 
E-ATX (305X272 mm) 
VRM/PWM 
Extreme Engine Digi+ IV 
Extreme Engine Digi+ II 
Memory 
8*DDR4, 3300MHz+ (OC) 
8*DDR3, 2400MHz+ (OC) 
Multiple GPU 
4-Way SLI / CFX 
4-Way SLI / CFX 
PCI-E 3.0 x16 
4 
5 
PCI-E 2.0 slots 
1 x PCIe x16 (max@x4 mode), 1 x PCIe x1 
1 x PCIe x1 
SATA Express 
2 
N/A 
SATA 6Gb/s 
10 (4 to share with dual SATA-E) 
4 + 2 (2*eSATA) 
SATA 3Gb/s 
0 
4 
USB 3.0 (F/R) 
4 / 10 
4 / 4 
USB 2.0 (F/R) 
4 / 2 
8 / 4 
PS2 
1 
1 
M.2 
Yes, 2260/2280/22110 (PCIe X4 Gen 3.0) 
N/A 
Wireless / Bluetooth 
802.11AC (3T3R) / Bluetooth v4.0 
Bluetooth v2.1 + EDR 
LAN 
Intel® Ethernet I218-v, GameFirst III 
Intel® Ethernet 
RJ45 
Anti-surge LANGuard 
Traditional 
Audio 
SupremeFX 2014 
HD 8-Channel Audio (ALC898) 
Audio features 
Sonic SenseAmp, Sonic SoundStage, 
Sonic Studio, Sonic Radar II, DTS Connect 
N/A 
Gold-plated Jacks 
Yes 
No 
Onboard Buttons 
START, RESET, MemOK!, Safe Boot, ReTry button, BIOS Switch, SoundStage, KeyBot 
START, RESET, MemOK! 
Thunderbolt 
1*Thunderbolt 2 header 
N/A 
External OC device 
OC Panel bundled 
OC Key 
Fan headers 
8 x 4-Pin, FanXpert3 
8 x 4-Pin, FanXpert 
Note: Specifications subject to change without notice

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Rog rampage v extreme

  • 1.
  • 2.
  • 3.
  • 4. *The photos above are for reference only.
  • 5.
  • 6.
  • 7. RAMPAGE V EXTREME •12 x SATA 6Gb/s (4 shared w/ SATA-E) •2 x SATA Express •KeyBot •BIOS Switch •14 x USB 3.0 (4@F; 10@B) •6 x USB 2.0 (4@F; 2@B) •Intel® Ethernet •GameFirst III •LANGaurd
  • 9. CPU New Intel® Core™ i7 Processors on LGA 2011-v3 Socket; Supports 22nm CPU, Intel® Turbo Boost Technology 2.0 Chipset Intel® X99 Express Chipset Memory Quad channel memory architecture; 8 x DIMMs, up to max. 64GB, DDR4 3300MHz+(O.C.) Intel® Extreme Memory Profile (XMP) Expansion slot 4* x PCIe 3.0 x16 slots (40-lane CPU @ x16, x16/x16, x16/x8/x8 or x16/x8/x8/x8; 28-lane CPU @ x16, x16/x8, x8/x8/x8) 1 x PCIe 2.0 x16 slot (Max. at x4 mode) 1 x PCIe 2.0 x1 slot *The last PCIe 3.0 X16 slot (PCIE_X8_X4) shares X4 lanes with M.2 Multi-GPU NVIDIA® 4-Way SLI™ and AMD 4-Way CrossFireX™ Technology ( 28-lane CPU supports up to 3-Way SLI/CFX) Storage 12 x SATA 6.0 Gb/s (4 ports shared with 2 x SATA Express) 2 x SATA Express 1 x M.2 Socket 3 with M Key, support type 2260/2280/22110 storage devices USB 14 x USB 3.0 ports (10 at back panel, 4 at mid-board); 6 x USB 2.0 ports (2 at back panel, 4 at mid-board) Wireless & Bluetooth Wi-Fi 802.11 a/b/g/n/ac 3T3R supports dual frequency band 2.4/5 GHz; Up to 1300Mbps transfer speed Bluetooth v4.0 LAN Intel® I218-V Gigabit LAN Anti-surge LANGuard GameFirst III Audio ROG SupremeFX 2014 8-Channel High Definition Audio -SupremeFX Shielding Technology -ELNA® Premium Audio Capacitors Advanced audio features: Sonic SoundStage, Sonic SenseAmp, Sonic Studio, Sonic Radar II, DTS Connect Optical S/PDIF out port at back panel Jack-detection, Multi-streaming, Front Panel Jack-retasking Form Factor ATX Form Factor, 12”x 10.7” (30.5cm x 27.2cm) Rich bundles OC Panel RAMPAGE V EXTREME
  • 10. The PCIe lanes (GEN 3.0) on the R5E can be divided into: Slot # Single VGA SLI/CFX 3-Way SLI/CFX 4-Way SLI/CFX 1 X16 X16 X16 X16 2 X8 X8 3 X16 X8 X8 4 X8 This motherboard is ready to support PCIe 3.0 SPEC. Functions will be available when using PCIe 3.0-compliant devices. Please refer to www.asus.com for updated details. •The last PCIe 3.0 X16 slot (PCIE_X8_X4) shares X4 lanes with M.2 •The PCIe 2.0 x16 slot (grey, max. X4 mode) compatible with X1/X4 devices •The PCIe 2.0 x16 slot shares bandwidth with SATA Express_E1, USB3.0_E910 at rear, and the PCIe 2.0 x1 slot. Slot # Single VGA SLI/CFX 3-Way SLI/CFX 1 X16 X16 X8 2 X8 3 X8 X8 4 40-lane processors: 28-lane processors: READY FOR THE NEXT GEN. ENTHUSIAST PLATFORM
  • 11.
  • 12. Normal mode gives you full info on CPU Temps, Ratios, BCLKs, and Fan RPMs. * Only works in-OS OVERCLOCKING COMMAND CENTER
  • 15. PRIMED FOR YOUR POT Rampage V Extreme’s X-Socket II makes easy work of mounting existing LN2 pots to the latest O.C. socket. Use the supplied Star Key to replace LGA2011-v3 backplate with X-Socket II and you’re ready to super-cool with your existing evaporator! Mounting your existing LN2 pot to the latest LGA2011-v3 socket can be tricky.
  • 16. When the BIOS settings are too extreme to allow proper boot up, overclockers need to reset the BIOS to default settings to get system boot up. However, reset BIOS means the previous experimental settings are cleaned out and you need to recall your memory and key in all the settings to try again. All BIOS settings are cleaned out !! WE’VE GOT YOUR BACK Clr CMOS
  • 17. Just one quick tap of the Safe Boot button powers off your system and launches it into Safe Mode, with previous overclocking settings retained so you are ready to try again! Safe Boot Button *Safe Boot button resets the system, enabling it to boot at stock settings. Then, when you go into the BIOS it re- load the last known settings for you to adjust and try again. WE’VE GOT YOUR BACK
  • 18. No Response!! One click to force a reboot right away. ROG ReTry Button *Safe Boot & ReTry function very similarly. Once triggered, the system would immediately shutdown and power on by itself. The difference is that the Safe Boot would power up the system in Safe mode, while the ReTry button powers up according to the settings set in the BIOS. Long press start button or switch off the PSU and wait for system shut down. or Traditional Forced Reboot Sometimes, extreme overclocking causes as system to hang during the boot process and even tapping the reset button doesn't help. When this happens, OCers usually shut down the system and switch off or unplug the power supply to completely kill the power. However, this takes a lot of time, so ROG came up with a better solution! CAN’T REBOOT? RETRY WILL!
  • 19. An all-in-one driver and high & low side MOSFETs with built in RDS (Resistance Drain to Source) On Sensing Technology. Introducing new components: UNWAVERING POWER custom designed for •High Permeability •Reduced Inductance Roll-off •Large Current Capacity •High Efficiency* *The high efficiency is achieved by reducing Hysteresis loss occurs as the core is magnetized in opposite directions as the PWM switches on and off. Eddy current loss occurs when a varying electric or magnetic field present generates tiny currents that circulate within the individual granules.
  • 20. ASUS Custom Designed PWM Controller MOSFET Driver High -side Low -side MOSFETs MicroFine Alloy Choke 10K Black Metallic Cap DIGI+ E P U PWM Controller MOSFET Driver High -side Low -side MOSFETs Choke Capacitor *The photos above are for reference only. TOTAL DESIGN IS EVERYTHING
  • 21. **The photos above are for reference only. TOTAL DESIGN IS EVERYTHING PWM Controller High-side + Low-side MOSFETs Choke Capacitor MOSFET Driver Extra Resistor Extra Capacitor 5% Tolerance 10% Tolerance 10% Tolerance Measured at the Choke + **DCR is the Direct Current Resistance of the Inductor and is the traditional method of current sensing.
  • 22. + *RDS is the internal drain to source resistance within the MOSFET. TOTAL DESIGN IS EVERYTHING High-side + Low-side MOSFETs MOSFET Driver ASUS Custom PWM Controller MicroFine Alloy Choke 10K Black Metallic Cap DIGI+ E P U Extra Resistor Extra Capacitor Built-In Current Sense Amplifier 5% Tolerance 10% Tolerance 5% Tolerance 2% Tolerance 10% Tolerance Measured at the Choke RDS* *RDS is actually internal to the MOSFET. Measured at the Choke Current Sensing Amplifier
  • 23. *2000X magnification *2000X magnification SMALL DESIGN TWEAK—MASSIVE PERFORMANCE GAINS Significantly smaller granules not only generate more normal shapes, but also allow for more densely packed powder Smaller and more evenly distributed air gaps increase the over permeability of the choke. Highly irregular shapes are harder to properly coat with insulator material. Since the permeability of air is very low, having large air gaps lowers the overall permeability of the alloy
  • 24. *2000X magnification *2000X magnification SMALL DESIGN TWEAK—MASSIVE PERFORMANCE GAINS MicroFine Granules Standard Granules Permeability High Low Percent Initial Permeability (%μ0) DC Magnetizing Force (Oersteds) Percent Saturation Permeability vs. DC Magnetizing Force Maintains High Permeability for much longer! Permeability is defined as the magnitude to which a material can become magnetized. A larger permeability means that material can be magnetized to a higher potential. Increasing permeability in an inductor (the choke) will reduce the number of windings needed to achieve the same inductance, and ultimately reduce power lost in the windings (copper loss)
  • 25. *2000X magnification *2000X magnification MicroFine Granules Standard Granules Permeability High Low Hysteresis Loss Less (75% Smaller Eye) More Magnetic field Magnetization Hysteresis loss occurs as the core is magnetized in opposite directions as the PWM switches on and off. It is clear that as the granules shrink in size, so does the hysteresis eye. The smaller the area (of the hysteresis eye), the less hysteresis loss. SMALL DESIGN TWEAK—MASSIVE PERFORMANCE GAINS
  • 26. *2000X magnification *2000X magnification MicroFine Granules Standard Granules Permeability High Low Hysteresis Loss Less (75% Smaller Eye) More Eddy Current Loss Less More Eddy currently loss can be reduced by decreasing the size of the granules. Despite the quantity of generated fields increasing, the overall power loss will still decrease. Large granules generally have rougher surfaces due to the manufacturing process. This can cause the insulating layer to be applied unevenly. Areas where the insulation is too thinly applied can allow large eddy current to develop and circulate through multiple granules. SMALL DESIGN TWEAK—MASSIVE PERFORMANCE GAINS
  • 27. 0 10 20 30 40 50 60 70 80 90 100 0 4 8 12 16 20 24 28 32 36 40 45 50 55 60 %Change in Inductance Direct Current (A) Fine Granules @ 85°C Med Granules @ 85°C *2000X magnification *2000X magnification MicroFine Granules Standard Granules Permeability High Low Hysteresis Loss Less (75% Smaller Eye) More Eddy Current Loss Less More Rate of Inductance Loss Slower (50% Slower Loss) Faster All chokes suffer from inductance de-rating as current increases. The amount of energy the choke can store decreases as current increases. This is a critical specification, as complete loss of inductance causes VRM failure. This is the direct result of ROG engineer’s efforts to produce a higher permeability alloy—a more stable, effective choke. SMALL DESIGN TWEAK—MASSIVE PERFORMANCE GAINS
  • 28. 0 20 40 60 80 100 120 0 4 8 12 16 20 24 28 32 36 40 45 50 55 60 Temperature (°C) DIrect Current (A) Fine Granules Large Granules *2000X magnification *2000X magnification MicroFine Granules Standard Granules Permeability High Low Hysteresis Loss Less (75% Smaller Eye) More Eddy Current Loss Less More Rate of Inductance Loss Slower (50% Slower Loss) Faster Temperature @ 60A Cooler (31% Lower Temperature) Hotter SMALL DESIGN TWEAK—MASSIVE PERFORMANCE GAINS As switching frequencies increase, eddy current loss and hysteresis loss occupy an increasing portion of total power loss in a choke—eventually becoming the primary cause of power loss. Since power loss is dissipated as heat, the results of the reduction of eddy current and hysteresis loss can tangibly be seen as a 31% drop in operating temperature.
  • 29. ROG Engineers have integrated a Pulse-Width- Modulator (PWM) that allows the memory VRM to run at 1000kHz. The increase in frequency allows the DC ripple to be reduced by as much as 40%. REDUCED DC RIPPLE TO MEMORY
  • 30. DirectCU thermal design Standard thermal design Heat disspation Heat dissipation copper heatpipe Exclusive DirectCU cooling technology puts the copper heatpipe in direct contact with the VRM zone to provide incomparable heat dissipation. Other designs merely prevent overheating — Rampage V Extreme with DirectCU keeps everything cooler than ever! DIRECTCU THERMAL SOLUTION
  • 31. provides a huge thermal mass for the heat to dissipate into, providing great performance with the added benefit of aesthetic beauty. *Similar heatsink cover to the R4BE. DIRECTCU THERMAL SOLUTION
  • 33.
  • 34. Rampage V Extreme is ready and even upgraded with the all-new features available on ROG Z97 series motherboards. and plenty more… VALUE-ADDED UTILITIES & RICH BUNDLES
  • 35.
  • 36.
  • 39. Apply the best settings for different game genres in real time on any OS, via the onboard Sonic SoundStage button. The debug LED displays the mode – FPS(01), racing (02), fighting (03) or sports (04). Sonic SenseAmp detects headphone impedance (below 65, 65~150, above 150 ohms) and adjusts the built-in amp automatically for pitch-perfect listening right away! PRECISION-ENGINEERED AUDIO THAT’S AS GREAT AS A DEDICATED SOUND CARD Physical PCB isolation EMI Stainless steel black nickel EMI cover EMI *Sonic SenseAmp and Sonic SoundStage supports only analog-audio front-panel (AAFP) connections.
  • 40. •GAMER-FRIENDLY DESIGN INSIDE AND OUT Smartly detects the headphone impedance and automatically amp up your headphone. SoundStage button and amp Sonic SoundStage settings in software Load the ROG fine-tuned preset game genre profile via an onboard button or software and enjoy the vivid gaming sound on the fly. EASY-TO-USE AND IMMERSIVE AUDIO
  • 41. Sonic Studio is a brand-new audio-tuning suite that provides an aural treat. Use the one-click Virtual Surround to bring 7.1 channels to a stereo (2-ch) headset. Superb audio controls, including Reverb, Bass Boost, Equalizer, Voice Clarity and Smart EQ, ensures that everything you hear sounds amazing! BRILLIANT ONE-CLICK VIRTUAL SOUND!
  • 42. With Sonic Radar II, you can test and improve your ability to accurately pinpoint sounds. This keeps you more aware of the battlefield and lets you get the jump on your opponents before they even see you. PINPOINT THE SOUND AND YOUR ENEMIES
  • 43. Instantly boost your system Enable Extreme Memory Profiles (XMP) Just one tap to launch the UEFI BIOS That’s what KeyBot gives you. Just plug your existing keyboard into the dedicated USB socket to activate the exclusive KeyBot microprocessor on your ROG motherboard! You can use KeyBot to wake your PC, to boot into a specific mode: YOUR KEYBOARD INSTANTLY UPGRADED
  • 44. Program up to 15 sequential keyboard combinations. Assign any application or folder to launch. Assign to everyday functions, like mail, browsing or multimedia functions YOUR KEYBOARD INSTANTLY UPGRADED
  • 45. STABLE SUPPLY OF 5V – FRONT AND BACK! ROG’s TrueVolt USB design delivers a rock-steady 5V supply to both the front and back USB sockets – no drop-outs! *5V output varies from PSUs to PSUs •Low noise, low loss. •Stable 5V* supply to provide clean 5V USB power to minimize potential fluctuations •All connected equipment (e.g. USB DAC or thumb drivers) benefits from the clean, stable 5V supply at the same time.
  • 46. Online game packets are generally small — typically fewer than 256 bytes. With small packet sizes, Intel Ethernet performs up to two times (2X) faster than other gaming-LAN technologies. IxChariot* Application Buffer Size (Bytes) Throughput (Mb/s) IxChariot is an independent network-assessment test tool used to test performance and reliability. Throughput: higher is better CPU usage: lower is better MORE THROUGHPUT, LESS CPU USAGE AND THE BEST GAMING EXPERIENCE!
  • 47. ROG has reinvented the LAN port. Advanced signal-coupling technology and premium surface-mounted capacitors improve throughput, while surge-protected and electrostatically-guarded components (ESD Guards) protect your motherboard from lightning strikes and static electricity! *ESD result is undertaken by individual LANDGuard PUMPED-UP THROUGHPUT. BEST SURGE PROTECTION.
  • 48. Exclusive GameFirst III has been upgraded with even more gamer-centric features, and an interface that’s even more intuitive. GameFirst III helps you to assign top priority to gaming packets and allocate more bandwidth to game throughput, ensuring the best online gaming experience. ULTIMATE BANDWIDTH-MANAGEMENT SOFTWARE FOR MINIMUM LAG AND MAXIMUM FRAGS!
  • 49. Easy to use, with no confusing jargon! Optimization Mode – Both game packets and other packets are optimized Game Mode – Game packets given top priority Media Streaming Mode – Media-streaming packets given top priority File Sharing Mode – File-sharing packets given top priority 4 Preset packet-priority modes Priority Settings Manual Bandwidth Control Individual settings with 5 Levels INTUITIVE AND ADVANCED USER INTERFACE.
  • 50. •ENJOY LIGHTNING FAST GAME LOADING AND EFFICIENT SYSTEM OPERATION Typical game load times among different devices: RAM SSD HDD < 1 sec. 20~30 secs. ~5 secs. The ROG RAMDisk dynamically releases unused memory in RAMDisk to system for better system operating efficiency and ensures a smooth user experience. Fast game loading with ROG RAMDisk Forget patience; the junction of ROG RAMDisk loads games virtually instantly. ENJOY LIGHTNING FAST GAME LOADING AND EFFICIENT SYSTEM OPERATION
  • 51. Model RAMPAGE V EXTREME (R5E) RAMPAGE IV EXTREME (R4E) Platform X99-chipset + Intel® LGA 2011-v3 (OC Socket) X79-chipset + Intel® LGA 2011 Form Factor E-ATX (305X272 mm) E-ATX (305X272 mm) VRM/PWM Extreme Engine Digi+ IV Extreme Engine Digi+ II Memory 8*DDR4, 3300MHz+ (OC) 8*DDR3, 2400MHz+ (OC) Multiple GPU 4-Way SLI / CFX 4-Way SLI / CFX PCI-E 3.0 x16 4 5 PCI-E 2.0 slots 1 x PCIe x16 (max@x4 mode), 1 x PCIe x1 1 x PCIe x1 SATA Express 2 N/A SATA 6Gb/s 10 (4 to share with dual SATA-E) 4 + 2 (2*eSATA) SATA 3Gb/s 0 4 USB 3.0 (F/R) 4 / 10 4 / 4 USB 2.0 (F/R) 4 / 2 8 / 4 PS2 1 1 M.2 Yes, 2260/2280/22110 (PCIe X4 Gen 3.0) N/A Wireless / Bluetooth 802.11AC (3T3R) / Bluetooth v4.0 Bluetooth v2.1 + EDR LAN Intel® Ethernet I218-v, GameFirst III Intel® Ethernet RJ45 Anti-surge LANGuard Traditional Audio SupremeFX 2014 HD 8-Channel Audio (ALC898) Audio features Sonic SenseAmp, Sonic SoundStage, Sonic Studio, Sonic Radar II, DTS Connect N/A Gold-plated Jacks Yes No Onboard Buttons START, RESET, MemOK!, Safe Boot, ReTry button, BIOS Switch, SoundStage, KeyBot START, RESET, MemOK! Thunderbolt 1*Thunderbolt 2 header N/A External OC device OC Panel bundled OC Key Fan headers 8 x 4-Pin, FanXpert3 8 x 4-Pin, FanXpert Note: Specifications subject to change without notice