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INSTALLATION
Step-1
open the box 1 gently and take out all the equipments. Remove the air
compressor from the top of the machine. Remove the other accessories
from storage area on the left side of the machine.
step-2
fix the indicator light
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step-4
fix the moving glass table frame and put the glass sheet on it.
step-5
Fix the pcb platform
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step-6
Move the machine to desired location and transfer the machine from
wheel to fix stand
Step-7
install compressor
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Bonding Technology of FPD(Flat Panel Display)
LCD (Liquid Crystal Display) which is the representation of FPD could not do solder junction
that is generally used in the world, because it has used ITO (Indium Tin Oxide) electrode
formed on the glass substrate since it was the early simple matrix (passive matrix).
So, a zebra, heat sealing, etc. are used for circuits’ design of LCD of a segment display,
such as a calculator and a clock.
Now, LCD of a dot-matrix display widely used for a PC or LCD television have been used
ACF (Anisotropic Conductive Film) junction because there are many terminals, the terminal
pitch is fine and high precision junction is required. ACF whose connection resistance is low
and which excels in heat resistance and connection reliability is used for other FPDs(Flat
Panel Display), such as PDP(Plasma Display Panel) and OLED(Organic LED).
Zebra rubber: It is the thing that laminates the conductive rubber which added carbon
and others as an electric conduction object and insulated rubber mutually.
Heat sealing: It is the thing that carries out printing formation of the circuit with
thermoplastic conductive adhesives at a film base material.
What’s ACF(Anisotropic Conductive Film)?
ACF is the matter that applied the adhesives of 10 to 50 micrometer thickness which
disperses the electric conduction particle uniformly on the support film (separator) of PET
(Polyethylene Terephthalate) etc., and is wound around the reel by the shape of a tape with
a width of 1 to 3mm and a length 50 to 200 meter.
The true ball-like resin with Ni-Au gild is used for the connection with a glass substrate, and
with Ni particles is used for PWB (Printed Wiring Board).
By arranging between the circuits which counter and applying heat and force, it is the
connection material which can perform electric junction and mechanical adhesion for many
electrodes below a 100-micrometer pitch.
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Bonding mechanism
If around 180 to 210 degree heat is applied to a bonding head, the adhesion of ACF falls
rapidly. As the mobilized resin flows out of the crevice between up-and-down electrodes, it
satisfies the up-and-down electrode circumference, and it is hardens rapidly.
Moreover, electric conduction particles are confined between up-and-down electrodes by
the pressure applied simultaneously.
This metal skin film of the electric conduction particle surface enables the electrical
connection between up and down electrodes (anisotropy conductive connection), and make
it possible to connect.
Fine control of heat and pressure is important for this process, and it is greatly influenced by
the rigid conditions of the equipment supporting the kind of ACF to be used, a panel
electrode, and a bonding tool etc.
The example of a profile of pressure and a temperature setup in an ACF method
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The connection process of ACF
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TAB (Tape Automated Bonding) and COF (Chip On Film)
There are TAB, COF, etc. in the driver circuit joined to the terminal on the glass substrate of
LCD by ACF.
TAB has been widely used as a package of a LCD driver. However, conversion to COF is
progressing quickly by progress of enlargement of the display of a cellular phone, and
colorization.
Compared with TAB, COF bonding enables detailed correspondence of a bonding pitch and
free arrangement of it.
VD Intellisys Technologies Pvt. Ltd offers reliable bonding machine that can solve the
characteristic problems of COF such as badness of the mark recognition caused by the
thinness of COF.
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Bonding process :
1. ACF Pre attaching
2. Prebonding
3. Final bonding
1. ACF pre attaching :
ACF cut at a designated length is laminated onto the electrode of LCD or TAB/COF, and
then the separator film is peeled off. Before peeling off , it is pressed by T bit solder iron
2. Prebonding & Final bonding :
We have to bond COF on glass side and PCB side . So you can see in the HMI , there are two
parameters: GLASS & another is PCB . The most importance is Glass side. We divide glass side
bonding into two stages:
(a) Prebonding or manual stage
(b) Final Bonding or automatc
But before we do bonding we have to do following two things :
But before you do this , apply IPA on crystal and head so that no dust remains .
(a) Head alignment : For doing head alignment , you have to press the "manual alignment " button
on panel . When you press the head will come down , and ou can move head up and down with your
hand . So align the head so the head come completely on the glass track .When you press manual
alignment again head will go up. you can use this steps repeatedly once you are sure its aligned
well. This is just done once to ensure it is aligned well. When you have enough practiceyou dont
need this in repetition.
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(b) Cof alignment : We have to align the cof tracks with the Panel(Glass) tracks .Insert the cof in
the Cof plucker.( before that you have to apply acf tape on the cof, 1.2 mtr tape on glass side, 2.0
mtr tape on pcb side) . There are 3 knobs .one is for left and right alignment . second is for top and
bottom . Third is for balancing . Every glass have some kind of marks. Some may have + , - or O
this knd of symbols. So we have to match these two symbols on both side of screen.
(c) After cof alignment , now we have to do prebonding (manualbonding) : So press manual
bonding/prebonding on the HMI , head will come down .you can see you can not move up and down
with your hand . But if you think head is not aligned , and you want to move head, press cutter head
parameter,then you can move head up and down. After you head comes down ,you can apply little
heat to head (Press cutter head heating , 1-2 times) . after doing this you can apply little manual
cooling , and you can check if your cof is aligned and .you can move it little bit with knobs to align in
this stage . After you are sure now enter final bonding
(d) Final bonding : For final bonding , click automatic and press two (start buttons together on
machine panel) : head will come down automatically, it will follow its profile automatically, will bond
and cool automatically and move up automatically. Now you bonding is complete.
Follow the above procedure for PCB side : but its lot easier to pcb side , since one side is already
connected, so you dont have to do alignment , Just align once and press automatic .
VIDEOS :
.
1. COF Cleaning : https://www.youtube.com/watch?v=dfWReDxhMb0&t=5s
2. Bonding machine operation manual : https://www.youtube.com/watch?v=cigJIZ6CMXI&t=3s
3. Complete Bonding process : https://www.youtube.com/watch?v=oGvXy_-kuwY
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Description about pressure meter
About Pressure meters : There are 4 pressure meters . Two on the right side and Two on the left
side . The two pressure meters on the right side determine the value of force that will be applie d by
the head in bonding stage on cof. Normally values of Upper Knife will be close to 60 , and value of
total pressure little more than 60 .
The two pressure meters on the left side determine the movement of head up and down. We have
used a special mechanism to move head up an down. it is based on pressure difference . So the
value of upper knife will be set to : 60 and lower knife set to Zero (0) . These values need to be just
set one time during machine installation.